WO2015145855A1

WO2015145855A1 - Spot lighting apparatus

Info

Publication number: WO2015145855A1
Application number: PCT/JP2014/079538
Authority: WO
Inventors: 裕之大島
Original assignee: 三菱化学株式会社
Priority date: 2014-03-24
Filing date: 2014-11-07
Publication date: 2015-10-01
Also published as: JP2015195170A

Abstract

This spot lighting apparatus is provided with: a semiconductor light emitting apparatus; a heat dissipating plate having the semiconductor light emitting apparatus mounted thereon; a heat dissipating body, which includes a first opening positioned on the semiconductor light emitting apparatus mounting surface side, and a second opening that communicates with the first opening by facing the first opening, said second opening having an opening diameter larger than that of the first opening, and which is formed of a heat conductive material that transmits at least a part of light emitted from the semiconductor light emitting apparatus; a driver housing, which houses a circuit board for lighting the semiconductor light emitting apparatus, and which is disposed on a heat dissipating plate surface on the reverse side of the semiconductor light emitting apparatus mounting surface; and a ferrule, which is connected to the driver housing and which supplies power to the circuit board. On the semiconductor light emitting apparatus mounting surface side of the heat dissipating plate, a heat dissipating body end portion on the first opening side is directly connected to the heat dissipating plate, and a heat dissipating path that dissipates heat from the heat dissipating body by conducting the heat to the heat dissipating body through the heat dissipating plate is formed, said heat having been generated from the semiconductor light emitting apparatus.

Description

Spot lighting equipment

The present invention relates to a spot lighting device including a semiconductor light emitting device such as an LED (Light Emitting Diode).

Conventionally, halogen lamps equipped with filaments and spot lighting devices using the halogen lamps have been widely used as general lighting fixtures. However, with the recent needs for power saving, downsizing, and long life, LED bulbs or LED lamps that use light emitting elements such as LEDs as light sources have been developed and manufactured. The LED bulb has been widely used. For example, Patent Document 1 discloses a spot light source that replaces a halogen bulb with a reflector.

The spot light source disclosed in Patent Document 1 includes a bowl-shaped radiator having a bottom part and a side part, a light-emitting element provided at the bottom part in the radiator, and light for controlling light emitted from the light-emitting element. A control member, a base containing a circuit for lighting the light emitting element, and a base for supplying power to the circuit are provided. And in the spot light source of the said patent document 1, since the side part of a radiator has light transmittance, the light guide | induced to the side part of a radiator leaks to the side of the spot light source. For this reason, a form in which leakage light is actively used is realized.

Japanese Patent No. 4745467

However, in the spot lighting device having the structure disclosed in Patent Document 1, the heat generated from the semiconductor light emitting device cannot be sufficiently dissipated, and the input power is increased to increase the brightness and the brightness of the semiconductor light emitting device. When the amount of light or the like is increased, the characteristics of the semiconductor light emitting device are deteriorated, and there is a concern that it may hinder the desired light emission. In addition, heat generated from the semiconductor light emitting device is conducted to the circuit board for the semiconductor light emitting device, and in some cases, there is a concern that the circuit board may be broken and the life of the spot lighting device itself may be reduced. .

The present invention has been made in view of the above problems, and an object of the present invention is to provide a small-sized and high-beam spot illumination device that has excellent heat dissipation and can achieve a long life. There is to do.

In order to achieve the above object, a first aspect of the present invention includes a semiconductor light emitting device, a heat sink on which the semiconductor light emitting device is mounted, a first opening located on the mounting surface side of the semiconductor light emitting device, and Heat conduction that includes a second opening that communicates with the first opening and has a larger opening diameter than the first opening and that transmits at least a portion of the light emitted from the semiconductor light emitting device. A heat sink made of a material and a circuit board for lighting the semiconductor light emitting device are incorporated, and a driver housing disposed on a surface of the heat sink opposite to the semiconductor light emitting device mounting surface, and connected to the driver housing A base for supplying power to the circuit board, and an end of the radiator on the first opening side is directly connected to the radiator plate on a semiconductor light emitting device mounting surface side of the radiator plate, Generated from the light emitting device Which is a said radiator plate spot lighting device heat dissipation path for dissipating it is formed from the heat radiating body and conducted to the radiator through.

By forming such a heat dissipation path, the heat generated in the semiconductor light emitting device is conducted to the heat radiator via the heat dissipation plate and is well radiated to the outside of the spot lighting device. Failure of the apparatus and the spot illumination device itself can be suppressed, and a long life of the spot illumination device itself can be realized.

A second aspect of the present invention is that, in the first aspect, the heat radiator is a cylindrical heat radiation cylinder. Thereby, the aesthetics of the external appearance of a spot lighting apparatus can be improved, and the spot lighting apparatus more excellent in the design property adapted to the installation environment can be provided.

A third aspect of the present invention is that, in the first or second aspect, the thermal conductivity of the radiator plate is higher than the thermal conductivity of the radiator. Thereby, the selectivity of the material of a heat sink increases and it can aim at the cost reduction of a spot illuminating device easily.

A fourth aspect of the present invention is that in any one of the first to third aspects, the heat radiating plate is made of a metal or metal alloy having a thermal conductivity of 100 W / (m · K) or more. With such a structure of the heat sink, heat generated in the semiconductor light emitting device is conducted well in the heat radiating body and is radiated from the heat radiating body to the outside of the spot lighting device. Due to such a heat dissipation effect, failure of the semiconductor light emitting device and the spot lighting device itself can be suppressed, and a long life of the spot lighting device itself can be realized. Further, by selecting such a member of the heat sink, it is possible to easily relieve stress at the connection portion between the heat radiator and the driver housing via the heat sink.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the thermal expansion coefficient of the radiator plate is higher than the thermal expansion coefficient of the radiator, and the thermal expansion coefficient of the driver housing. Is lower than that. In this way, by adjusting the thermal expansion coefficient of each member, it is possible to relieve stress at the connection portion between the radiator and the driver housing via the radiator plate, and suppress the failure of the spot lighting device itself, Long life can be realized.

A sixth aspect of the present invention is that in any one of the first to fifth aspects, the radiator is made of at least one material selected from the group of glass, resin, and ceramic. With such a configuration of the heat radiating body, the heat generated in the semiconductor light emitting device is favorably conducted in the heat radiating body and is radiated well to the outside of the spot lighting device. Due to such a heat dissipation effect, failure of the semiconductor light emitting device and the spot lighting device itself can be suppressed, and a long life of the spot lighting device itself can be realized. Further, by selecting such a heat radiating member, it is possible to easily relieve stress at the connecting portion between the heat radiating body and the driver housing via the heat radiating plate.

A seventh aspect of the present invention is that in any one of the first to sixth aspects, the driver housing is made of resin. By selecting such a member of the driver casing, it is possible to easily relieve stress at the connection portion between the radiator and the driver casing via the radiator plate.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the radiator is made of glass, the radiator plate is made of aluminum, the driver casing is made of polycarbonate resin, The plate is to relieve stress at a connection portion between the heat radiating body and the driver housing via the heat radiating plate. In this way, if each member of the radiator, the radiator plate, and the driver housing is selected and stress relaxation at the connection portion between the radiator and the driver housing via the radiator plate can be achieved, the spot illumination device itself It is possible to provide a spot illuminating device that suppresses a failure and has a longer lifetime.

According to a ninth aspect of the present invention, in any one of the first to eighth aspects, the heat dissipation path extends toward a side opposite to an arrangement direction of the driver housing and the base. is there. By forming such a heat dissipation path A, the heat generated from the semiconductor light emitting device is conducted toward the circuit board provided on the mounting surface side of the semiconductor light emitting device and the side opposite to the side where the heat dissipating member is provided. The circuit board is not affected by the heat. Therefore, the failure of the circuit board is less likely to occur, and the lifetime of the circuit board and the spot lighting device itself can be extended.

According to a tenth aspect of the present invention, in any one of the first to ninth aspects, the radiator includes a reflecting member that reflects at least a part of the light emitted from the semiconductor light emitting device. . With such a configuration of the radiator, the light emitted from the semiconductor light emitting device can be collected and emitted, and the light that has not been reflected by the reflecting member can be emitted to the side of the spot illumination device. Thereby, the spot illumination device of this aspect functions as a good LED type dichroic halogen bulb.

An eleventh aspect of the present invention is that, in the tenth aspect, the reflecting member is a metal thin film or a dielectric multilayer film. Thereby, the balance of the light condensed and emitted from the spot illumination device and the light emitted from the side can be easily adjusted, and an LED type dichroic halogen bulb having better optical characteristics is realized. be able to.

A twelfth aspect of the present invention is that, in any one of the first to ninth aspects, a lens for condensing light emitted from the semiconductor light emitting device is further provided inside the radiator. By providing such a lens, the light emitted from the semiconductor light emitting device can be collected and emitted, and the light not collected by the lens can be emitted to the side of the spot illumination device. Thereby, the spot illumination device of this aspect functions as a good LED type dichroic halogen bulb.

A thirteenth aspect of the present invention is the reflection lens according to the twelfth aspect, in which the light incident on the lens is reflected by a side surface. Thereby, the balance of the light condensed and emitted from the spot illumination device and the light emitted from the side can be easily adjusted, and an LED type dichroic halogen bulb having better optical characteristics is realized. be able to.

A fourteenth aspect of the present invention is that, in any one of the first to thirteenth aspects, a heat insulating member is sandwiched between the heat radiating plate and the driver housing. With such a heat insulating member, the circuit board is not affected by heat, the failure of the circuit board is prevented, and the life of the circuit board and the spot lighting device itself can be extended.

According to a fifteenth aspect of the present invention, in any one of the first to fourteenth aspects, the semiconductor light emitting device is mounted in the vicinity of a central region on one side of the radiator plate, and the radiator is a peripheral region of the radiator plate. Is connected to. With such a configuration, the light emitted from the semiconductor light emitting device can be collected well and emitted to the outside of the spot illumination device.

According to a sixteenth aspect of the present invention, in any one of the first to fifteenth aspects, the heat-radiating plate is mounted on the semiconductor light-emitting device on the heat-radiating plate as compared with a connection portion of the heat-radiating body on the heat-radiating plate. It has a level | step difference which makes a site | part approach the said 2nd opening part. Such a shape of the heat sink improves the degree of freedom of mounting the semiconductor light emitting device and the degree of freedom of installation of the circuit board, and further facilitates light emitted from the semiconductor light emitting device to be radiated to the outside through the heat sink. . Therefore, the spot lighting device according to this aspect functions as a good LED-type dichroic halogen bulb with more excellent heat dissipation.

From the above, according to the present invention, it is possible to provide a small spotlight illumination device having a large luminous flux that has excellent heat dissipation and can achieve a long life. In addition, since the heat dissipation is excellent, it is possible to reduce the size of the driver housing, and it is possible to provide a spot lighting device in which the entire device is reduced in weight. Furthermore, by using the spot illumination device according to the present invention, it is possible to replace a conventional filament type dichroic halogen bulb (halogen bulb with a reflector) with a dichroic halogen bulb equipped with a semiconductor light emitting device.

It is a partially notched front view which shows the whole spot lighting apparatus which concerns on an Example in a partial longitudinal cross section. It is a front view of the light emitting module which comprises the spot illuminating device which concerns on an Example. It is a top view of the light emitting module which comprises the spot illuminating device which concerns on an Example. FIG. 4 is a cross-sectional view of the light emitting module taken along line IV-IV in FIG. 3. It is a principal part enlarged view of sectional drawing shown by FIG. It is a side view of the lens which comprises the spot illuminating device which concerns on an Example. It is a top view of the lens which comprises the spot illuminating device which concerns on an Example. FIG. 8 is a sectional view of the lens taken along line VIII-VIII in FIG. 7. It is a partially notched front view which shows the whole spot illuminating device which concerns on the modification 1 in a partial longitudinal cross section. It is sectional drawing of the LED package apparatus which comprises the spot illuminating device which concerns on the modification 1. It is an electric circuit diagram which shows the outline of the electric circuit structure of the spot illuminating device which concerns on the modification 1. FIG. 12 is a time chart showing an example of an operating state of each transistor and a current value of a driving current of each LED in the circuit configuration of FIG. 11. 12 is a time chart showing an example of an operating state of each transistor and a current value of a driving current of each LED in the circuit configuration of FIG. 11. It is a partially notched front view which shows the whole spot illuminating device which concerns on the modification 2 in a partial longitudinal cross section.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings based on examples and modifications. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. In addition, the drawings used for explaining the embodiments and the respective modifications schematically show the spot illumination device and the structural members thereof according to the present invention, and are partially emphasized, enlarged, and reduced for better understanding. In some cases, the spot lighting device and the structural members thereof are not accurately represented in scale, shape, or the like. Furthermore, various numerical values and quantities used in the examples and the modifications are only examples, and can be appropriately changed as necessary.

<< Example >>
Hereinafter, the spot illumination device and its constituent members according to this embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a partially cutaway front view showing a part of the entire spot lighting device according to the present embodiment in a longitudinal section. FIG. 2 is a front view of the light emitting module constituting the spot illumination device according to the present embodiment. FIG. 3 is a top view of the light emitting module constituting the spot lighting device according to the present embodiment. 4 is a cross-sectional view of the light emitting module taken along line IV-IV in FIG. 3, and FIG. 5 is an enlarged view of a main part of the cross-sectional view shown in FIG. 6 is a side view of a lens constituting the spot illumination device according to the present embodiment, FIG. 7 is a top view of the lens constituting the spot illumination device according to the present embodiment, and FIG. 8 is a line VIII in FIG. It is sectional drawing of the lens along -VIII.

<Configuration of spot lighting device>
As shown in FIG. 1, a spot lighting device 1 includes a driver housing 2, a light emitting module (semiconductor light emitting device) 3 that functions as a light source, and two openings having different sizes (first opening 4a and second opening). 4b) and a heat dissipating cylinder 4 which is an embodiment of a heat dissipating body disposed so as to surround the side of the light emitting module 3, a lens 5 disposed in a cavity 4c of the heat dissipating cylindrical body 4, and a driver housing 2, a heat radiating plate 6 disposed between the light emitting module 3 and the heat radiating cylindrical body 4, a heat insulating member 7 disposed between the driver housing 2 and the heat radiating plate 6, and the driver housing 2. It comprises a base 8. In the spot lighting device 1 according to the present embodiment, power supplied from the outside is fed to the light emitting module 3 through the base 8, and light emitted by driving the light emitting module 3 is the heat radiating cylinder 4 or the lens. 5 is emitted to the outside. That is, the spot lighting device 1 according to the present embodiment has the same external shape and function as a general dichroic halogen bulb (halogen bulb with a reflector).

(Driver housing)
The driver housing 2 of the spot lighting device 1 is formed so that the vicinity of the heat sink 6 is formed in a substantially truncated cone shape, and the vicinity of the base 8 is formed in a substantially quadrangular prism shape. The cavity 2a is formed. Here, as various components, there is a circuit board 9 including a driver circuit for lighting the light emitting module 3, as shown in FIG. The driver housing 2 is formed of a relatively strong material that is not damaged by an external force. Furthermore, it is preferable to use a material having a relatively low thermal conductivity as the material of the driver housing 2. This is because heat generated in the light emitting module 3 is suppressed from being conducted to the driver housing 2 side through the heat radiating plate 6 and heat generated by the driver circuit in the driver housing 2 is radiated to the outside. As the material of the driver housing 2, for example, a material such as resin, ceramic, metal, and the like can be used. In particular, from the viewpoints of heat dissipation, thermal conductivity, durability, and the like, polybutylene terephthalate, polyethylene terephthalate, polycarbonate, Resins such as polyethylene, polypropylene, ABS resin, phenol resin, epoxy resin, silicone resin, and nylon are preferable.

The thermal conductivity of the driver housing 2 may be, for example, 30 W / (m · K) or less, and preferably 5.0 W / (m · K) or less. For example, the thermal conductivity of polycarbonate which is an example of the material of the driver housing 2 is about 0.19 W / (m · K).

The thermal expansion coefficient of the driver housing 2 may be, for example, in the range of 10 × 10 ⁻⁶ / ° C. to 300 × 10 ⁻⁶ / ° C., and preferably 50 × 10 ⁻⁶ / ° C. to 150 × 10 ⁻ Within the range of ⁶ / ° C. The thermal expansion coefficient of the driver housing 2 is particularly preferably as close as possible to the thermal expansion coefficient of the heat sink 6. By adjusting the coefficient of thermal expansion, the difference in coefficient of thermal expansion between the driver housing 2 and the heat sink 6 can be further reduced, and distortion at the connection portion between the driver housing 2 and the heat sink 6 can be reduced. To relieve stress. That is, a physical failure at the connection portion between the driver housing 2 and the heat sink 6 can be suppressed. For example, the thermal expansion coefficient of polycarbonate, which is an example of the material of the driver housing 2, is about 70 to 80 × 10 ⁻⁶ / ° C.

(Light emitting module)
As shown in FIG. 1, the light emitting module 3 is mounted on the central region of one side of the heat sink 6. The light emitting module 3 includes a module main body 3a and a wavelength conversion member 3b stored in the module main body 3a. The module main body 3a is provided to protect the wavelength conversion member 3b from externally applied impacts, etc., and the material of the module main body 3a is a material such as a relatively hard metal (for example, iron, aluminum, copper, ceramic). Is used. The module main body 3a is provided with a screw hole 12 for screwing a screw 11 used for mounting the light emitting module 3 on the heat radiating plate 6, and the module main body 3a attaches the screw 11 to the heat radiating plate 6. It will be fixed via. Furthermore, the module main body 3a is provided with a circular opening for emitting light, and for example, light that has been whitened inside can be taken out from the opening. On the other hand, in another case, a glass plate or the like may be installed in the opening, and a phosphor may be applied to the inside of the module on the glass surface, and light may be extracted by whitening at this portion. In addition, the said opening is not restricted to circular, Polygons, such as a rectangle, or other shapes may be sufficient. That is, the shape of the opening can be appropriately changed according to the required shape of the light emitting surface of the light emitting module 3.

As can be seen from FIGS. 2 to 4, the module main body 3 a has a rectangular outer shape and functions as a wiring board, and is located on the chip mounting surface 21 a of the flat plate portion 21 and has a cylindrical shape. And a side wall portion 22. As can be seen from FIGS. 2 and 3, twelve LED chips 23 as semiconductor light emitting elements are regularly arranged on the chip mounting surface 21 a of the flat plate portion 21 and inside the side wall portion 22. Yes. Specifically, four LED chips 23 are arranged at equal intervals in the central portion of the flat plate portion 21, and eight LED chips 23 are arranged so as to surround four sides of the four LED chips 23. Each of the four LED chips 23 arranged in the central portion is arranged at a position separated by an equal distance from the center of the flat plate portion 21, and similarly, eight LED chips arranged so as to surround the four sides. Each of 23 is arrange | positioned in the position spaced apart from the center of the flat plate part 21 by equal distance. In other words, each of the four LED chips 23 and the eight LED chips are concentrically arranged to form a substantially circular LED chip mounting area as a whole of the twelve LED chips 23. Although not shown in FIGS. 2 to 4, a wiring pattern for supplying electric power to each of these LED chips 23 is formed on the flat plate portion 21.

In this embodiment, the LED chip 23 is an LED chip that emits blue light having a peak wavelength of 450 nm. Specifically, as such an LED chip, for example, there is a GaN-based LED chip in which an InGaN semiconductor is used for a light emitting layer. Note that the type and emission wavelength characteristics of the LED chip 23 are not limited thereto, and various semiconductor light emitting elements such as LED chips can be used without departing from the gist of the present invention. In this embodiment, the peak wavelength of light emitted from the LED chip 23 is preferably in the wavelength range of 360 nm to 480 nm, and more preferably in the wavelength range of 440 nm to 470 nm.

In addition, the material of the module main body 3a is not limited to the above-described material, and for example, as a material having excellent electrical insulation, the material is selected from a resin, a glass epoxy, a composite resin containing a filler in the resin, and the like. Materials may be used. Alternatively, in order to improve the light reflectivity on the chip mounting surface 21a of the flat plate portion 21 and improve the light emission efficiency of the wavelength conversion member 3b, silicone containing a white pigment such as alumina powder, silica powder, magnesium oxide, titanium oxide or the like. It is preferable to use a resin. In order to obtain better heat dissipation, the module body 3a may be made of a metal such as aluminum, an interlayer insulating film such as a resin is formed on the metal such as aluminum, and the wiring pattern of the flat plate portion 21 is formed. It may be electrically insulated from the metal body.

As shown in FIG. 5, a p-electrode 26 and an n-electrode 27 are provided on the surface of the LED chip 23 facing the flat plate portion 21 side. In the LED chip 23, the p electrode 26 is bonded to the wiring pattern 28 formed on the chip mounting surface 21a of the flat plate portion 21, and the n electrode 27 is bonded to the wiring pattern 29 also formed on the chip mounting surface 21a. Has been. The p electrode 26 and the n electrode 27 are connected to the wiring pattern 28 and the wiring pattern 29 through a metal bump (not shown) or by soldering. Other LED chips 23 (not shown) have the same p electrodes 26 and n electrodes 27 as the

wiring patterns

28 and 29 formed on the chip mounting surface 21a of the flat plate portion 21 corresponding to the respective LED chips 23. Are joined together.

Note that the method of mounting the LED chip 23 on the flat plate portion 21 is not limited to this, and an appropriate method can be selected according to the type and structure of the LED chip 23. For example, after the LED chip 23 is bonded and fixed to a predetermined position of the flat plate portion 21, two electrodes of each LED chip 23 may be connected to a corresponding wiring pattern by wire bonding, or one electrode may be connected as described above. While joining to a corresponding wiring pattern, you may make it connect the other electrode to a corresponding wiring pattern by wire bonding.

As can be seen from FIGS. 2 to 4, a wavelength conversion member 3 b that converts the wavelength of the blue light emitted from the LED chip 23 is provided in the inner region surrounded by the side wall portion 22. In the light emitting module 3 according to the present embodiment, the blue light emitted from the LED chip 23 and the light emitted by wavelength conversion of the blue light by the wavelength conversion member 3b are combined, and the combined light is combined with the module main body. The light is emitted from the opening 3a. Note that the wavelength conversion member 3b may be configured such that a glass plate or the like is installed in the opening of the module storage case and applied to the inside of the module on the glass surface, and light is extracted by whitening at this portion. .

Further, as shown in FIG. 5, the wavelength conversion member 3b absorbs at least part of the blue light incident from the LED chip 23 and emits emitted light having a wavelength different from that of the blue light, and the fluorescent light It is comprised from the base material 25 which hold | maintains the body 24. FIG. In the wavelength conversion member 3b according to the present embodiment, the LED chip 23 that emits blue light is used as a semiconductor light emitting element, so that a part of the blue light can be converted into yellow light to synthesize white light. It is. Accordingly, the phosphor 24 in this embodiment is a yellow phosphor that absorbs blue light and is excited to emit light having a wavelength different from that of the blue light when returning to the ground state.

The emission peak wavelength of a specific yellow phosphor is usually 530 nm or more, preferably 540 nm or more, more preferably 550 nm or more, and usually 620 nm or less, preferably 600 nm or less, more preferably 580 nm or less. Is preferred. Among them, as the yellow phosphor, for example, Y ₃ Al ₅ O ₁₂ : Ce [YAG phosphor], (Y, Gd) ₃ Al ₅ O ₁₂ : Ce, (Sr, Ca, Ba, Mg) ₂ SiO ₄ : Eu, (Ca, Sr) Si ₂ N ₂ O ₂ : Eu, α-sialon, La ₃ Si ₆ N ₁₁ : Ce (however, a part thereof may be substituted with Ca or O) is preferable.

As the base material 25, a material having translucency such as resin or glass can be used. In this embodiment, resin is used. In this embodiment, the wavelength conversion member 3b is formed by kneading the phosphor 24 into a base material 25 that is a resin.

Specific resins include polycarbonate resin, polyester resin (for example, polyethylene terephthalate resin, polybutylene terephthalate resin), acrylic resin (for example, polymethyl methacrylate resin), polyurethane resin, epoxy resin, and silicone resin. It is preferable to use it. The resin preferably does not absorb light emitted from the LED chip (for example, ultraviolet light, near ultraviolet light, or blue light) or visible light emitted from the wavelength conversion member. Furthermore, it is preferable to have sufficient transparency and durability against blue light emitted from the LED chip 23.

These resins may be used alone or in combination of two or more. Moreover, the copolymer of these resin may be sufficient and it may use it, laminating | stacking 2 or more types.

As the resin, polycarbonate resin is most preferably used because it is excellent in transparency, heat resistance, mechanical properties, and flame retardancy.

Further, the light emitted from the light emitting module 3 is not limited to white light, and colored light such as blue light, red light, and yellow light may be emitted.

(Heatsink)
As shown in FIG. 1, the heat sink 6 is disposed between the driver housing 2 and the light emitting module 3 and functions as a module mounting board on which the light emitting module 3 is mounted. More specifically, screw holes 6 a are formed in the heat sink 6, communicated with the screw holes 12 of the light emitting module 3, and the light emitting module 3 is attached to the light emitting module mounting surface 6 b of the heat sink 6 using the screws 11. It will be firmly mounted in the central area. The outer edge of the heat sink 6 is firmly connected to the outer edge of one end of the driver housing 2 (the end located on the side opposite to the end where the base 8 is disposed). In addition, a general adhesive agent may be used for the connection between the driver housing 2 and the heat sink 6, or a joining member such as a screw may be used.

Further, the heat radiating plate 6 is preferably made of a material having a relatively high thermal conductivity and a hard material, for example, a metal such as aluminum, iron, or copper, or an alumina-based ceramic. Aluminum is particularly preferable from the viewpoints of thermal conductivity, ease of processing, and cost. With such a configuration, the heat radiating plate 6 can conduct heat generated in the light emitting module 3 satisfactorily, and can suppress the temperature rise of the light emitting module 3 favorably. That is, the heat sink 6 functions as a heat sink.

The heat conductivity of the heat sink 6 may be, for example, 20 W / (m · K) or more, and preferably 150 W / (m · K) or more. For example, the thermal conductivity of aluminum which is an example of the material of the heat sink 6 is about 250 W / (m · K).

The thermal expansion coefficient of the heat radiating plate 6 may be in the range of, for example, 2.0 × 10 ⁻⁶ / ° C. to 100 × 10 ⁻⁶ / ° C., and preferably 10 × 10 ⁻⁶ / ° C. to 50 × 10 ^-6 / ° C. The thermal expansion coefficients of the driver housing 2 and the radiating cylinder 4 are within a range in which the thermal expansion coefficient of the heat radiating plate 6 does not exceed the thermal expansion coefficient of the driver housing 2 and does not become smaller than the thermal expansion coefficient of the radiating cylinder 4. It is particularly preferable that the coefficient be as close as possible. That is, the thermal expansion coefficient of the heat radiating plate 6 is higher than the thermal expansion coefficient of the heat radiating cylindrical body 4 and lower than the thermal expansion coefficient of the driver housing 2. As described above, the members surrounding the light emitting module 3 (the heat radiating cylindrical body 4 and the heat radiating plate 6 of this embodiment) are not integrally formed, and the thermal expansion coefficient is adjusted as described above. Such a connection portion between the driver housing 2 and the heat radiating plate 6 and a connection portion between the heat radiating cylindrical body 4 and the heat radiating plate 6 (that is, a connection portion between the heat radiating cylindrical body 4 and the driver housing 2 via the heat radiating plate 6). ) Can be reduced to relieve stress and suppress physical failure at each connecting portion. In other words, the spot illuminating device 1 according to the present embodiment is less likely to be distorted and has a longer life as compared with an illuminating device in which members surrounding a light source are integrally formed. Become. For example, the thermal expansion coefficient of aluminum which is an example of the material of the heat sink 6 is about 23 × 10 ⁻⁶ / ° C.

Further, in this embodiment, since the heat radiating cylinder 4 and the heat radiating plate 6 which are members surrounding the light emitting module 3 are not integrally formed, different materials are selected for the heat radiating cylindrical body 4 and the heat radiating plate 6. be able to. Thereby, in a present Example, the optimal structure can be implement | achieved regarding the characteristics of the spot illuminating device 1, such as heat dissipation and light transmittance.

And as shown in FIG. 1, the convex part 6c is formed in the center part (part which mounts the light emitting module 3) of the heat sink 6. As shown in FIG. Thereby, the light emitting module mounting surface 6b is shifted to the lens 5 side from the interface between the heat radiating cylindrical body 4 and the heat radiating plate 6. In other words, the heat radiating plate 6 has a step that brings the mounting portion of the light emitting module 3 on the heat radiating plate 6 closer to the second opening 4b of the heat radiating cylindrical body 4 than the connection portion of the heat radiating plate 6 on the heat radiating plate 6. Have. Such a shape of the heat radiating plate 6 improves the degree of freedom for mounting the light emitting module 3 and the degree of freedom for installing the circuit board 9, and further, the light emitted from the light emitting module 3 is transmitted to the outside via the heat radiating cylindrical body 4. It becomes easy to radiate. Therefore, the spot lighting device 1 according to the present example functions as a good LED type dichroic halogen bulb with better heat dissipation.

(Heat dissipation cylinder)
As shown in FIG. 1, the heat radiating cylindrical body 4 includes a first opening 4a and a second opening 4b having an opening diameter larger than that of the first opening 4a, and the light emitting module 3 and the lens 5 therein. A cavity 4c that can be disposed is formed. That is, the first opening 4a and the second opening 4b communicate with each other through the cavity 4C. The heat radiating cylindrical body 4 is disposed so that the first opening 4 a having a small opening diameter is located on the mounting side of the light emitting module 3 and surrounds the side of the light emitting module 3. And the edge part by the side of the 1st opening part 4a of the thermal radiation cylinder 4 is directly connected to the peripheral area | region (outer edge part) by the side of the light emitting module mounting surface 6b of the heat sink 6. Here, the direct connection is not limited to the case where the heat radiating cylinder 4 and the heat radiating plate 6 are connected in contact with each other without interposing other members. It is defined as including that the heat radiating cylinder 4 and the heat radiating plate 6 are substantially in contact with each other through an adhesive that hardly affects the heat conduction between the heat radiating cylinder 4 and the heat radiating plate 6.

When the heat radiating cylindrical body 4 directly reflects a part of the light or has a reflecting member that reflects the light, the shape of the heat radiating cylindrical body 4 collects the light emitted from the light emitting module 3, and the spot illumination device It is necessary to have a shape capable of irradiating spot light from 1. In this embodiment, in order to irradiate the spot light, the side surface of the heat radiating cylindrical body 4 is formed in a parabolic shape. That is, the outer shape of the heat radiating cylindrical body 4 is such that the bottom of the ridge is removed. Moreover, the external shape of the thermal radiation cylindrical body 4 is not limited to this, For example, the cone shape with a hollow inside (namely, hollow cone shape) may be sufficient. In other words, the side surface of the heat radiating cylindrical body 4 may be formed flat without being curved.

The heat radiating cylinder 4 may be formed with a member (so-called wavelength-selective reflecting member) that reflects light only at a certain wavelength on the inner surface thereof. For example, the heat radiating cylinder 4 may be formed of a member that reflects light having a short wavelength and may transmit a part of red light having a long wavelength. In such a case, the spot lighting device 1 can emit red light from the side, and can exhibit a reddish color.

As a member that reflects light only at a certain wavelength, a reflecting member may be formed on the inner surface of the heat radiating cylinder 4. For example, a metal thin film or a dielectric multilayer film that functions as a reflecting member is formed using a known film forming technique such as vapor deposition or sputtering. As the dielectric multilayer film, for example, ceramic or tantalum can be used. Thereby, at least a part of the light reaching the heat radiating cylindrical body 4 is reflected by the reflecting member of the heat radiating cylindrical body 4 and guided to the second opening 4 b side of the heat radiating cylindrical body 4.

The heat radiating cylinder 4 is made of a material that transmits at least a part of the light emitted from the light emitting module 3. In this embodiment, since the light emitted from the light emitting module 3 is condensed using the lens 5, the material of the heat radiating cylinder 4 and the light transmittance that transmits all incident light may be provided. . And it is preferable that the thermal radiation cylinder 4 is comprised from the comparatively high and hard material of heat conductivity. For example, at least one material selected from the group of glass, resin, and ceramic can be used for the heat radiating cylinder 4. Since the heat radiating cylindrical body 4 is composed of such a material, the light emitted from the light emitting module 3 is transmitted through the heat radiating cylindrical body 4 and also radiated to the side of the spot illumination device 1. Such a spot illumination device 1 functions as a good LED type dichroic halogen bulb.

The thermal conductivity of the heat radiating cylindrical body 4 may be, for example, 0.5 W / (m · K) or more, and preferably 10 W / (m · K) or more. For example, the thermal conductivity of glass as an example of the material of the heat radiating cylinder 4 is about 1.05 W / (m · K).

The thermal expansion coefficient of the radiating cylindrical body 4 may be, for example, in the range of 0.5 × 10 ⁻⁶ / ° C. to 10 × 10 ⁻⁶ / ° C., preferably 1.0 × 10 ⁻⁶ / ° C. It is in the range of 10 × 10 ⁻⁶ / ° C. The thermal expansion coefficient of the heat radiating cylinder 4 is particularly preferably as close as possible to the thermal expansion coefficient of the heat radiating plate 6. By adjusting the coefficient of thermal expansion as described above, the strain at the connecting portion between the heat radiating cylinder 4 and the heat radiating plate 6 as described above can be reduced to relieve stress. It is possible to suppress physical failure in the connection part. For example, the thermal expansion coefficient of glass which is an example of the material of the heat radiating cylinder 4 is about 9 × 10 ⁻⁶ / ° C.

Depending on the shape, connection position, and material of the heat dissipation cylinder 4 as described above, the heat generated in the light emitting module 3 is conducted to the heat dissipation cylinder 4 via the heat dissipation plate 6. Furthermore, the heat conducted to the heat radiating cylindrical body 4 is radiated to the outside while being conducted from the first opening 4a side toward the second opening 4b side. That is, the heat radiation path A (the broken line arrow A in FIG. 1) conducts heat generated from the light emitting module 3 to the heat radiation cylinder 4 through the heat radiation plate 6 and dissipates heat from the heat radiation cylinder 4 by the heat radiation cylinder 4 and the heat radiation plate 6. Will be formed). The heat dissipation path A extends toward the side opposite to the direction in which the driver housing 2 and the base 8 are disposed. By forming such a heat radiation path A, heat generated from the light emitting module 3 can be radiated well to the outside of the spot lighting device 1. The heat generated from the light emitting module 3 is not conducted toward the circuit board 9 provided on the side opposite to the mounting surface side of the light emitting module 3 and the side where the heat radiating cylindrical body 4 is disposed. 9 is not affected by the heat. That is, the failure of the circuit board 9 is less likely to occur, and the life of the circuit board 9 and the spot lighting device 1 itself can be extended.

In this embodiment, the cylindrical heat radiating cylindrical body 4 is used as the heat radiating body constituting the heat radiating path A. However, the outer shape of the cylinder (that is, the cross-sectional shape in the direction orthogonal to the extending direction of the cylinder) ) Is not limited to a circle, but may be square or elliptical. That is, instead of the heat radiating cylindrical body 4, a heat radiating cylindrical body such as a rectangular shape or an elliptical shape may be used. The heat radiating cylindrical body is a concept including a heat radiating cylindrical body having a circular cross-sectional shape, and the cross-sectional shape is any of a circle, an ellipse, an oval, a triangle, a quadrangle, five or more polygons, etc. including. In addition to the above shape, the cross-sectional shape of the heat radiating cylindrical body includes one formed by a combination of a plurality of curves and one formed by a combination of one or more curves and one or more straight lines. In such a case, it is necessary to match the shape of various constituent members such as the driver housing 2, the lens 5, the heat radiating plate 6, and the heat insulating member 7 with the shape of the heat radiating cylindrical body 4.

(lens)
As can be seen from FIG. 1 and FIGS. 6 to 8, the lens 5 condenses the light incident from the light emitting module 3 and the lid 5 a that functions as a lid that closes the second opening 2 b of the heat radiating cylinder 4. It is comprised from the condensing part 5b to do. The lid portion 5 a is formed in a disc shape, and an outer edge portion thereof is fixed to the inner side surface of the heat radiating cylindrical body 4. Moreover, the condensing part 5b is formed in the substantially truncated cone shape, and the recessed part 5c is formed in the end. Further, the lens 5 is disposed so that the concave portion 5c faces the light emitting module 3 in order to introduce the light emitted from the light emitting module 3 into the lens 5 from the concave portion 5c. The fixing method of the lens 5 is not limited to an adhesive. For example, the diameter of the lid portion 5a of the lens 5 is set slightly larger than the opening diameter of the second opening portion 4b of the heat radiating cylindrical body 4, and the lens 5 May be fitted without using an adhesive. In this way, the lens can be easily attached and detached.

The lens 5 in this embodiment is a reflective lens that reflects incident light by the inner surface 5d of the light condensing part 5b and condenses it. In addition, from the structure of such a condensing part 5b, the cover part 5a which concerns on a present Example has a structure which permeate | transmits light simply, However, Even if the structure which condenses light is further formed in the cover part 5a Good. With such a structure of the lens 5, the light emitted from the second opening 2 b of the heat radiating cylindrical body 4 is collected, and the object to be irradiated is spot-like using the spot illumination device 1 according to the present embodiment. Can be irradiated. And the light (light which permeate | transmitted the inner surface 5d) which was not reflected in the inner surface 5d of the condensing part 5b of the lens 5 reaches | attains the thermal radiation cylindrical body 4, permeate | transmits the thermal radiation cylinder 4, and the spot illuminating device 1 Will be emitted to the side.

(Insulation member)
The heat insulating member 7 is provided on the opposite side of the heat radiating plate 6 from the light emitting module mounting surface 6b. That is, the heat insulating member 7 is disposed between the heat sink 6 and the driver housing 2. The heat insulating member 7 may be any of a fiber material and a foam material. Here, it is preferable that the heat insulating member 7 is provided in the vicinity of the cavity 2 a of the driver housing 2 so that the heat radiating plate 6 is not exposed as much as possible. By doing so, heat is prevented from being radiated into the cavity 2a of the driver housing 2 from the surface opposite to the light emitting module mounting surface 6b of the heat radiating plate 6, and the temperature rise of the circuit board 9 is suppressed. can do. Therefore, the failure of the circuit board 9 is less likely to occur, and the life of the circuit board 9 and the spot lighting device 1 itself can be extended.

If most of the heat generated from the light emitting module 3 is conducted along the heat radiation path A and is radiated well from the heat radiating cylinder 4, the temperature rise of the circuit board 9 can be sufficiently suppressed. May not be provided, or the installation area of the heat insulating member 7 may be reduced.

(Base)
As shown in FIG. 1, the base 8 is formed in a pin shape so that it can be fitted into a power supply socket (pin hole) provided in the power supply source of the spot lighting device 1. The base 8 is electrically connected to a circuit board 9 built in the driver housing 2 via wiring (not shown). Therefore, when the base 8 is inserted into the power supply socket of the power supply source, desired power is supplied from the power supply source to the circuit board 9 via the base 8 and the wiring.

The base 8 is not limited to the pin type as shown in FIG. 1 and can be appropriately changed according to the shape of the power supply socket of the power supply source. For example, when the power supply socket is a general screw-type socket in Japan, the shape of the base 8 is the same size as the substantially quadrangular columnar portion of the driver housing 2 and the surface thereof is threaded. It may be. In such a case, the base 8 is detachable by being screwed into the power supply socket.

<Operation of spot lighting device>
Next, the operation of the spot lighting device 1 according to the present embodiment will be described.

First, the base 8 is inserted into a power supply socket (not shown) of an illumination system provided indoors or outdoors, and the spot illumination device 1 is attached to the illumination system. In such a state, the power supply switch of the lighting system is shifted to the on state, and power is supplied to the spot lighting device 1. The electric power is supplied to the light emitting module 3 through the base 8 and the circuit board 9, and the LED chip 23 of the light emitting module 3 emits light, and desired light is emitted from the light emitting module 3.

The light emitted from the light emitting module 3 enters the lens 5 from the concave portion 5 c of the lens 5. At this time, since the concave portion 5 c of the lens 5 is disposed so as to surround the light emitting surface of the light emitting module 3, all the light emitted from the light emitting module 3 enters the lens 5.

Most of the light incident on the lens 5 is collected by being reflected by the inner surface 5d of the light condensing part 5b of the lens 5, and passes through the lid part 5a to be emitted from the spot illumination device 1 as spot light. become. On the other hand, of the light incident on the lens 5, the light transmitted without being reflected on the inner surface 5 d of the light condensing part 5 b of the lens 5 is transmitted through the heat radiating cylindrical body 4 and radiated to the side of the spot illumination device 1. Is done. The spot illumination device 1 according to the present embodiment functions as an LED-type dichroic halogen bulb due to such light emission.

The heat generated by driving the light emitting module 3 is conducted along the heat radiation path A formed by the heat radiating plate 6 and the heat radiating cylindrical body 4 without affecting the circuit board 9 of the driver housing 2. Then, heat is radiated from the heat radiating cylinder 4. Thereby, the heat dissipation of the spot illumination device 1 is improved, the failure of the light emitting module 3 and the circuit board 9 can be prevented, and the life of the spot illumination device 1 itself can be extended.

<Comparison between Example and Comparative Example>
Illumination device having a heat dissipation path A in this embodiment (a heat dissipation path is formed by a heat dissipation cylinder and a heat dissipation plate) and an illumination device not having such a heat dissipation path A (for example, a light-transmitting bowl-shaped radiator) (Hereinafter referred to as “comparative example”) is compared with a simulation of the heat dissipation state under the following conditions.

As the first condition, since the heat dissipation state changes depending on the shape of the lighting device, the shape of the lighting device in this embodiment and the comparative example is the same as that of the spot lighting device 1 shown in FIG. As the second condition, out of the power consumption 3.8 W, the heat generation power 0.7 W by the power supply circuit, the heat generation power 0.62 W by the light emitting element, and the power consumed for light emission 2.48 W. As a third condition, in this embodiment, the thermal conductivity of the material used in the heat radiating cylindrical body 4 is 1.2 W / m · K, and the thermal conductivity of the material used in the heat radiating plate 6 is 92 W / m · K. In the comparative example, a portion corresponding to the heat radiating cylindrical body 4 and the heat radiating plate 6 of the embodiment is a light-transmitting bowl-shaped heat radiator integrally formed of the same material. The thermal conductivity is 1.2 W / m · K. As a fourth condition, the thermal conductivity of the casing that houses the power supply circuit is 0.19 W / m · K. As a fifth condition, the emissivity of all members is 0.95.

When the temperature of the ground plane of the light emitting element was compared under the above conditions, this example was 80.8 ° C. and the comparative example was 90.5 ° C. Moreover, in the illuminating device in the present embodiment, heat is radiated through the heat dissipation path A, and the temperature in the heat radiating plate and the circuit board is also about 80 ° C. However, in the lighting device in the comparative example, the temperature in the heat radiating plate and the circuit board is Was about 90 ° C. That is, the temperature of the peripheral region of the light emitting element was lower by about 10 ° C. in the lighting device in this example than in the lighting device in the comparative example. In general, since the lifetime of the light emitting element and the electronic component is doubled when the temperature is lowered by 10 ° C., assuming that the lifetime of the spot illumination of the comparative example is 20000 hours, the lifetime of the spot illumination of this embodiment is 40000. Increase in time.

From the above, in the spot lighting device 1 according to the present embodiment, since the heat radiation path A is formed by the heat radiation cylinder 4 and the heat radiation plate 6, the heat generated from the light emitting module 3 is radiated through the heat radiation plate 6. It was confirmed that the heat radiated from the heat radiating cylindrical body 4 was reliably radiated. And compared with the comparative example which does not form the heat radiation path A as in this embodiment, the spot illumination device 1 can be expected to reduce its temperature by 10 ° C. to 20 ° C. And while the lifetime of the said comparative example is about 10,000 hours, the spot lighting apparatus 1 in a present Example implement | achieves a long life of about 25000 hours by such a thermal radiation characteristic, and fully satisfy | fills the request | requirement in a market. Is able to. This is because the lifetime is generally halved when the temperature of the spot illumination device 1 itself is increased by 10 ° C., so that the spot illumination device 1 in this embodiment is twice or more compared to the comparative example. It shows that it has a lifetime.

<< Modification 1 >>
In the embodiment described above, the chip-on-board (COB) type light emitting module 3 including a plurality of LED chips 23 is fixed to the heat sink 6 as a semiconductor light emitting device. It is not limited to COB as described above. For example, a package type LED package device in which an LED chip is embedded in a wavelength conversion member may be used as the semiconductor light emitting device. Hereinafter, a spot illumination device 1 ′ using such an LED package device will be described as a modification 1 with reference to FIGS. 9 and 10. FIG. 9 is a partially cutaway front view showing the entire spot illumination device 1 ′ according to the first modification in a partially longitudinal section. FIG. 10 is a cross-sectional view of the LED package device constituting the spot lighting device according to the first modification. In addition, about the structure similar to the Example mentioned above, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

<Configuration of spot lighting device>
The difference between the configuration of the spot illumination device 1 ′ according to this modification and the configuration of the spot illumination device 1 according to the above-described embodiment is the first LED package device 41 (hereinafter also referred to as the first LED 41) instead of the light emitting module 3. ), And the second LED package device 42 (hereinafter also referred to as the second LED 42) is fixed to the heat sink 6 only. Therefore, in the spot lighting device 1 ′ according to this modification, the light emitted from the first LED 41 and the second LED 42 is emitted from the lens 5 or the heat radiating cylinder 4.

(LED package device)
Next, the configuration of the first LED 41 according to a modification of the present invention will be described with reference to FIG. In the present modification, the first LED 41 is a light source that emits white light. As shown in FIG. 10, the first LED 41 according to this modification includes a package 43, an LED chip 44 that is a semiconductor light emitting element mounted in the package 43, and at least a part of light emitted from the LED chip 44. It is comprised from the wavelength conversion member 45 which has the function to convert.

Therefore, in the first LED 41 according to this modification, white light that is a combined light of light emitted from the LED chip 44 and light having different wavelengths that have been wavelength-converted by the function of the wavelength conversion member 45, or wavelength conversion. The white light, which is the combined light of only the light having different wavelengths that has been wavelength-converted by the function of the member 45, is emitted from the wavelength conversion member 45 to the outside. Below, each member which comprises 1st LED41 is demonstrated in detail.

〔package〕
The package 43 is made of an alumina-based ceramic having excellent electrical insulation, good heat dissipation, and high reflectivity (preferably a reflectivity of 80% or more). The package 43 has an opening 43a for accommodating the LED chip 44, and the LED chip 44 is mounted on the bottom surface of the opening 43a. Furthermore, a wiring pattern (not shown) for mounting the LED chip 44 and supplying current to the LED chip 44 is formed on the mounting surface of the package 43 (that is, on the bottom surface of the opening 43a).

The material of the package 43 is not limited to alumina-based ceramics. For example, a material selected from resin, glass epoxy resin, composite resin containing a filler in the resin, etc. as a material having excellent electrical insulation. The body of the package 43 may be formed using Alternatively, in order to improve the light emission efficiency of the first LED 41 by improving the light reflectivity on the chip mounting surface of the package 43, a silicone resin containing a white pigment such as alumina powder, silica powder, magnesium oxide, or titanium oxide is used. Is preferred. On the other hand, in order to obtain better heat dissipation and reflectivity, the package 43 may be made of a metal such as aluminum whose body is covered with an insulator. In such a case, it is necessary to electrically insulate the wiring pattern of the package 43 from the metal main body.

[LED chip]
In the present modification, one LED chip 44 functions as a semiconductor light source that is a light source of the first LED 41. In this modification, the LED chip 44 has a blue light emitting diode that emits blue light having a peak wavelength in the range of 430 nm to 480 nm, or a purple that emits ultraviolet to purple light having a peak wavelength in the range of 360 nm to 430 nm. Light emitting diodes can be used. In the case of a blue light emitting diode, the peak wavelength is preferably in the wavelength range of 430 nm to 480 nm, and particularly preferably 450 nm. In the case of a violet light emitting diode, the peak wavelength is preferably in the wavelength range of 360 nm to 430 nm, particularly preferably 400 to 415 nm.

The number of LED chips 44 is not limited to one, and a plurality of LED chips 44 that emit light having the same peak wavelength may be used as the semiconductor light emitting source. Further, the type and emission wavelength characteristics of the LED chip 44 are not limited thereto, and various semiconductor light emitting elements such as LED chips can be used without departing from the gist of the present invention.

The LED chip 44 has an electrode (not shown) on the surface side facing the bottom surface (that is, the chip mounting surface) of the opening 43a of the package 43. The electrodes are electrically connected to the wiring pattern on the package 43 described above. The electrical connection between the electrode and the wiring pattern is performed by soldering, for example, via a metal bump. The method for mounting the LED chip 44 on the package 43 is not limited to this, and an appropriate method can be selected according to the type and structure of the LED chip 44. For example, after the LED chip 44 is bonded and fixed to a predetermined position of the package 43, the electrodes of the LED chip 44 may be connected to a corresponding wiring pattern by wire bonding.

(Wavelength conversion member)
The wavelength conversion member 45 absorbs at least a part of incident light incident from the LED chip 44 and emits emitted light having a wavelength different from the incident light, and a base material that holds the plurality of phosphors. It consists of and. That is, the wavelength conversion member 45 is a member containing a plurality of phosphors.

In the first LED 41 of this modification, when a blue light emitting diode that emits blue light is used as the LED chip 44, in order to obtain white light from the first LED 41, at least a part of the blue light is converted into green light and red light. It is necessary to synthesize white light by wavelength conversion and mixing blue light that has not been wavelength-converted by either the green light or red light (that is, transmitted through the wavelength conversion member 45) with the green light and red light. is there. In such a case, the phosphor in the present modification includes a green phosphor that can absorb and excite blue light and emit green light having a wavelength different from that of the blue light when returning to the ground state, and A red phosphor is used that is excited by absorbing blue light and can emit red light having a wavelength different from that of the blue light when returning to the ground state.

On the other hand, when a violet light emitting diode that emits ultraviolet to violet light is used as the LED chip 44, in order to obtain white light from the first LED 41, at least part of the ultraviolet to violet light is blue light, green light, and red light. It is necessary to synthesize the white light by mixing the blue light, the green light and the red light. In such a case, the phosphor in this modification is excited by absorbing ultraviolet to violet light, and can emit blue light having a wavelength different from that of ultraviolet to violet light when returning to the ground state. Phosphor, absorbs ultraviolet to violet light, excites and emits green light having a wavelength different from ultraviolet to violet light when returning to the ground state, and absorbs ultraviolet to violet light In this case, a red phosphor that can emit red light having a wavelength different from ultraviolet to violet light when excited and returned to the ground state is used.

In the following, specific examples of each phosphor will be shown.

The green phosphor in the first LED 41 according to this modification has an emission peak wavelength of usually 510 nm or more, preferably 530 nm or more, more preferably 535 nm or more, usually less than 570 nm, preferably 550 nm or less, more preferably 545 nm or less. Those in the wavelength range are preferred. As specific green phosphors, for example, (Y, Lu) ₃ Al, Ga) ₅ O ₁₂ : Ce, CaSc ₂ O ₄ : Ce, Ca ₃ (Sc, Mg) ₂ Si ₃ O ₁₂ : Ce, (Sr , Ba) ₂ SiO ₄ : Eu (BSS), (Si, Al) ₆ (O, N) ₈ : Eu (β-sialon), (Ba, Sr) ₃ Si ₆ O ₁₂ N ₂ : Eu (BSON), SrGa ₂ S ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, Mn, (Ba, Sr, Ca, Mg) Si ₂ O ₂ N ₂ : Eu are preferably used. Among these, BSS, β-sialon, BSON, SrGa ₂ S ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, Mn are more preferably used, BSS, β-sialon, and BSON are more preferably used, and β- Sialon and BSON are particularly preferably used, and β-sialon is most preferably used. In this modification, β-sialon is used as the green phosphor.

The red phosphor in the first LED 41 according to this modification has an emission peak wavelength of usually 570 nm or more, preferably 580 nm or more, more preferably 600 nm or more, further preferably 630 nm or more, particularly preferably 645 nm or more, and usually 780 nm. Hereinafter, those having a wavelength range of preferably 700 nm or less, more preferably 680 nm or less are suitable. As a specific red phosphor, for example, CaAlSi (N, O) ₃ : Eu, (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Ca, Sr, Ba) Si (N, O) ₂ : Eu, (Ca, Sr, Ba) AlSi (N, O) ₃ : Eu, (Sr, Ba) ₃ SiO ₅ : Eu, (Ca, Sr) S: Eu, SrAlSi ₄ N ₇ : Eu (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Sr, Ca) AlSi (N, O) ₃ : Eu, and SrAlSi ₄ N ₇ : Eu are preferable. Among these, (Sr, Ca) AlSi (N, O) ₃ : Eu and SrAlSi ₄ N ₇ : Eu are more preferable, and (Sr, Ca) AlSi (N, O) ₃ : Eu is more preferable. In this modification, CaAlSi (N, O) ₃ : Eu (hereinafter also referred to as CASN) is used as the red phosphor.

As the red phosphor, for example, CaAlSi (N, O) ₃ : Eu, (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Ca, Sr, Ba) Si (N, O) ₂ : Eu, (Ca, Sr, Ba) AlSi (N, O) ₃ : Eu, (Sr, Ba) ₃ SiO ₅ : Eu, (Ca, Sr) S: Eu, SrAlSi ₄ N ₇ : Eu, Eu (di) Β-diketone Eu complexes such as benzoylmethane) ₃ · 1,10-phenanthroline complex and carboxylic acid Eu complexes are preferred, and (Ca, Sr, Ba) ₂ Si ₅ (N, O) ₈ : Eu, (Sr, Ca) AlSi (N, O) ₃ : Eu and SrAlSi ₄ N ₇ : Eu are preferably used. Among these, (Sr, Ca) AlSi (N, O) ₃ : Eu and SrAlSi ₄ N ₇ : Eu are more preferable, and (Sr, Ca) AlSi (N, O) ₃ : Eu is more preferable.

The emission peak wavelength of the blue phosphor in the first LED 41 according to this modification is usually 420 nm or more, preferably 430 nm or more, more preferably 440 nm or more, usually less than 500 nm, preferably 490 nm or less, more preferably 480 nm or less, More preferred are those in the wavelength range of 470 nm or less, particularly preferably 460 nm or less. As specific blue phosphors, (Ca, Sr, Ba) MgAl ₁₀ O ₁₇ : Eu, (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ₆ (Cl, F) ₂ : Eu, (Ba, Ca , Mg, Sr) ₂ SiO ₄ : Eu, (Ba, Ca, Sr) ₃ MgSi ₂ O ₈ : Eu are preferred, and (Ba, Sr) MgAl ₁₀ O ₁₇ : Eu, (Ca, Sr, Ba) ₁₀ (PO ₄ ) ₆ (Cl, F) ₂ : Eu, Ba ₃ MgSi ₂ O ₈ : Eu is more preferable, Sr ₁₀ (PO ₄ ) ₆ C ₁₂ : Eu, BaMgAl ₁₀ O ₁₇ : Eu is more preferable, and (Sr, Ba , Ca) ₅ (PO ₄ ) ₃ Cl: Eu (more specifically, Sr ₅ (PO ₄ ) ₃ Cl: Eu (hereinafter also referred to as SCA)) or (Sr _1-x Ba _x ) ₅ (PO _{_{4) 3 Cl: Eu (x}} > 0, preferably 0.4>x> 0.12 (hereinafter, referred to as SBCA That.)) In the particularly preferred. This modification, SBCA is used as a blue phosphor.

The base material used for the wavelength conversion member 45 of this modification can be the same material as the base material 25 of the wavelength conversion member 3b according to the above-described embodiment. Here, the description of the base material is omitted.

In the first LED 41 according to this modification, the color temperature of the emitted white light is adjusted to about 1900K by changing the mixing ratio of the phosphors described above.

The second LED 42 according to this modification has substantially the same structure as the first LED 41 described above, but a plurality of phosphors are mixed at a mixing ratio different from the mixing ratio of the phosphors in the first LED 41, and the color of the emitted white light The temperature is adjusted to about 2700K.
<Electric circuit configuration of spot lighting device>
Next, the electric circuit configuration of the spot illumination device 1 ′ and the light emission control of the spot illumination device 1 ′ according to this modification will be described. FIG. 11 is an electric circuit diagram showing an outline of the electric circuit configuration of the spot illumination device 1 ′ according to the present modification. 12 and 13 are time charts showing an example of the operating state of each transistor and the current value of the drive current of each LED in the circuit configuration of FIG.

As can be seen from FIG. 11, in the light emitting module 3 of the spot lighting device 1 ′, in addition to one first LED 41 and two second LEDs 42, a current limiting resistor R1 and resistor R2, and a drive for driving the LEDs. A transistor Q1 and a transistor Q2 for supplying current are provided. Here, the resistor R1 is provided to adjust the current flowing through the corresponding first LED 41 to an appropriate magnitude, and the resistor R2 is provided to adjust the current flowing through the corresponding two second LEDs 42 to an appropriate magnitude. It has been.

Specifically, the first LED 41 is connected in series with the resistor R1, and the anode of the first LED 41 is connected to the positive electrode of the power source 51a via the resistor R1. The cathode of the first LED 41 is connected to the collector of the transistor Q1, and the emitter of the transistor Q1 is connected to the negative electrode of the power source 51a. On the other hand, the two second LEDs 42 have the same polarity and are connected in parallel to each other. Like the first LED 41, the anode is connected to the positive electrode of the power source 51b via the resistor R2, and the cathode is connected via the transistor Q2. And connected to the negative electrode of the power source 51b.

Here, the power source 51a is a DC power source including a conversion circuit that converts an AC voltage supplied from the outside of the spot illumination device 1 ′ through the base 8 into a DC voltage, and is applied to the circuit board 9 of the spot illumination device 1 ′. Is provided. Similarly, the power source 51b is a direct current power source including a conversion circuit that converts an alternating voltage supplied from the outside of the spot illumination device 1 ′ through the base 8 into a direct current voltage, and is applied to the circuit board 9 of the spot illumination device 1 ′. Is provided. Further, although not shown in FIG. 11, the

power sources

51a and 51b are connected to an external power source of the spot illumination device 1 '.

In addition, the transistors Q1 and Q2 can both be switched on / off according to the respective base signals, and the base signals are individually sent from the current control unit 52 to the respective bases. Yes. More specifically, the constant current control circuit 52a constituting the current control unit 52 is connected to the base of the transistor Q1, and the duty ratio control circuit constituting the current control unit 52 is connected to the base of the transistor Q2. 52b is connected.

Furthermore, the spot illumination device 1 ′ is connected to an operation unit 53 for externally adjusting light emission characteristics such as luminance of light emitted from the spot illumination device 1 ′. Specifically, the operation unit 53 is connected to the current control unit 52, and a drive signal corresponding to the set luminance according to an operation for setting light emission characteristics such as the luminance of light emitted from the spot illumination device 1 ′. Is transmitted to the current control unit 52. Then, the current control unit 52 controls the operation of the transistor Q1 and the transistor Q2 according to the drive signal, and controls the drive current supplied to the first LED 41 and the drive current supplied to the second LED 42.

Next, specific control in the current control unit 52 will be described. As described above, the current control unit 52 includes the constant current control circuit 52a and the duty ratio control circuit 52b. The constant current control circuit 52a supplies a base signal to the transistor Q1, and the duty ratio control circuit 52b includes the transistor Q2. To supply the base signal.

That is, the first LED 41 is controlled by the constant current control circuit 52a. More specifically, when the transistor Q1 is turned ON, a constant driving current is always supplied to the first LED 41, and the first LED 41 is supplied to the first LED 41. The actual driving current that flows (that is, the amount of power supplied to the second LED 42) is constant.

On the other hand, the second LED 42 is controlled by the duty ratio control circuit 52b. More specifically, although the magnitude of the base signal supplied to the transistor Q2 does not change, the ratio between the supply time and non-supply time of the base signal is controlled. ing. That is, by intermittently driving the transistor Q2 on and off at a predetermined cycle, the ratio of the supply time and non-supply time of the drive current supplied to the second LED 42 is controlled, and the actual drive current flowing through the second LED 42 (i.e., The amount of power supplied to the second LED 42) is controlled by the duty ratio control circuit 52b. In other words, the drive current supplied to the second LED 42 is controlled by the variable current according to the drive signal described above by the duty ratio control circuit 52b.

Note that the current control unit 52 may include a storage unit (for example, a memory) that stores control content corresponding to the electrical signal supplied from the operation unit 53. In such a case, the current control unit 52 reads the control content corresponding to the electrical signal supplied from the operation unit 53 from the storage unit, and controls the operation of the transistor Q1 and the transistor Q2 according to the read control content. become.

Next, the control of the drive current by the constant current control circuit 52a and the duty ratio control circuit 52b will be specifically described with reference to FIGS.

First, FIG. 12 shows a case where synthetic white light that is relatively dark and reddish is emitted from the spot lighting device 1 ′. In the state shown in FIG. 12, when the transistor Q1 is turned on, a driving current having a current value A0 flows through the first LED 41, and 1900K white light is emitted from the first LED 41. On the other hand, the transistor Q2 is turned on only during the on period t1 (for example, 3 ms) during the period t0 (for example, 20 ms), and the driving current of the current value A0 flows through the first LED 41 during the on period t1, and the second LED 42 2700K white light is emitted.

As described above, when the ON period t1 of the transistor Q2 is shorter than the period t0, the current value of the drive current that flows instantaneously (that is, the period of t1) through the second LED 42 when the transistor Q2 is ON is A0. However, the current value of the drive current actually supplied to the second LED 42 in the state where the spot illumination device 1 ′ is actually used (that is, the state where the period of t0 is repeated a plurality of times) is as follows. Less than half of A0. Accordingly, in the state shown in FIG. 12, the 1900K light emitted from the second LED 42 becomes brighter than the 2700K light emitted from the first LED 41, and the color temperature of the synthesized white light emitted from the spot illumination device 1 ′ is Approaching 1900K, synthetic white light of a reddish color as a whole is emitted.

In order to brighten the light emitted from the spot illumination device 1 ′ from the above-described state (that is, dimming), for example, as shown in FIG. 13, the on period of the transistor Q2 is longer than the on period t1 (for example, the on period t2). 18 ms), and the driving time of the transistor Q2 is lengthened.

Thus, when the ON period of the transistor Q2 is brought close to the cycle t0, the second LED 42 is actually used in the state where the spot illumination device 1 ′ is actually used (that is, the cycle of t0 is repeated a plurality of times). The current value of the drive current supplied to is closer to the current value (A0) of the drive current that flows instantaneously (that is, during the period t2) in the second LED 42 as compared to the state of FIG. Accordingly, in the state shown in FIG. 13, the brightness of the 1900K light emitted from the second LED 42 and the light of 2700K emitted from the first LED 41 are substantially the same, and the synthesized white light emitted from the spot illumination device 1 ′. The color temperature is closer to 2700K, and light of a color closer to daylight is emitted.

In this way, by adjusting the supply time and non-supply time of the drive current supplied to the second LED 42 by the duty ratio control circuit 52b while making the actual drive current flowing to the first LED 41 constant by the constant current control circuit 52a, It is possible to freely adjust the intensity of 2700K light while emitting 1900K light at a constant intensity, and to change the color temperature according to the change in the intensity of the synthetic white light emitted from the spot illumination device 1 ′. Is possible. That is, when the intensity of the synthetic white light emitted from the spot illumination device 1 ′ is small (that is, the synthetic white light is relatively dark), the color temperature of the synthetic white light can be brought close to 1900K. When the intensity of the synthetic white light emitted from 'is large (that is, the synthetic white light is relatively bright), the color temperature of the synthetic white light can be close to 2700K.

In the above-described modification, the timing at which the transistor Q2 is turned on and the drive current is supplied to the second LED 42 may be a case where the drive current supplied to the transistor Q1 becomes a predetermined value (for example, 200 mA) or more. By adjusting in this way, in a state where the value of the drive current is small, light can be emitted only from the first LED 41 and white light of 1900K can be emitted, and when the value of the drive current becomes large, The 2LED 42 can also emit white light of 2700 K, and the color temperature of the synthetic white light can be adjusted according to the intensity of the synthetic white light (that is, the value of the drive current).

The first LED 41 is controlled by the constant current control circuit 52a, and the second LED 42 has a structure controlled by the duty ratio control circuit 52b. However, the first LED 41 also has a structure controlled by the duty ratio control circuit, When the drive current supplied to the first LED 41 is stopped, the drive current supplied to the first LED 41 may be controlled with a variable current according to the drive signal. Thereby, the behavior until the spot illumination device 1 ′ is turned off can be made closer to that of a filament type dichroic halogen bulb. Note that the drive current supplied to the first LED 41 being stopped means that the supply of the drive current is completely stopped, not a period in which the drive current periodically becomes zero.

The first LED 41 is controlled by the constant current control circuit 52a, and the second LED 42 has a structure controlled by the duty ratio control circuit 52b. However, when the driving current supplied to the second LED 42 is stopped, the first LED 41 is controlled. The drive current supplied to one LED 41 may be stopped. Thereby, when the drive current supplied to the first LED 41 is stopped, the spot illumination device 1 ′ can be turned off, and the behavior of the spot illumination device 1 ′ can be made closer to that of a filament-type dichroic halogen bulb. .

In addition, the color temperature of the white light radiated from the first LED 41 and the second LED 42 is not limited to the above-described numerical values, and can be appropriately changed according to the use environment, the use application, and the like of the spot lighting device 1 ′. In the above-described modification, one first LED 41 and two second LEDs 42 are fixed to the heat sink 6. However, the first LEDs 41 and the second LEDs 42 are arranged in a matrix and fixed to the heat sink 6. May be. Further, when fixing a plurality of LED package devices to the heat sink 6, it is not necessary that the color temperatures of all the LED package devices be different, and at least one set selected from the plurality of LED package devices is light having a different color temperature. May be emitted.

For the light emitted from at least one of the first LED 41 and the second LED 42, the parameters of the first LED 41 and the second LED 42 are adjusted by adjusting parameters such as the wavelength, the distance from the black body radiation locus, the spectral distribution, and the normalized spectral distribution. White light having a natural color from at least one and having excellent saturation in green, yellow, and red may be emitted. By using the semiconductor light emitting device adjusted in this way, even when the color of the irradiated object to be irradiated is different, it is possible to irradiate the irradiated object with various colors with the optimum white light. It is possible to illuminate the irradiated object more vividly and clearly.

In the spot illumination device 1 ′ according to the above-described embodiment, the transistors Q1 and Q2 which are bipolar transistors are used as switching elements. However, a MOS field effect transistor (Metal-Oxide-Semiconductor-Field-Effect-Transistor) is used. May be used in place of the bipolar transistor.

Also in this modified example, the heat generated in the first LED 41 and the second LED 42 is conducted along the heat radiation path A formed by the heat radiating plate 6 and the heat radiating cylindrical body 4 and affects the circuit board 9 of the driver housing 2. Instead, the heat is radiated from the heat radiating cylinder 4. Thereby, the heat dissipation of the spot lighting device 1 ′ is improved, the failure of the light emitting module 3 and the circuit board 9 can be prevented, and the life of the spot lighting device 1 ′ itself can be extended.

<< Modification 2 >>
In the above-described embodiment and modification example 1, the light emitting module 3, the first LED 41, or the second LED 42, which is a semiconductor light emitting device, is directly mounted on the heat radiating plate 6. Therefore, in the vicinity of the second opening 4b of the heat radiating cylindrical body 4, Light was emitted from the semiconductor light emitting device. In such a structure, the lens 5 is necessary because of the relationship between the focal position of the light of the

spot illumination devices

1, 1 ′ and the position of the semiconductor light emitting device that is a point light source. However, a structure in which light is emitted from the semiconductor light emitting device at the center of the heat radiating cylinder 4 and a lens is not provided in the heat radiating cylinder 4 may be employed. In the following, referring to FIG. 14, a spot illumination device 1 ″ that does not require such a lens will be described as a modification 2. FIG. 14 shows a part of the entire spot illumination device 1 ″ according to the modification 2. It is a partially cutaway front view shown in a longitudinal section. In addition, about the structure same as the Example mentioned above and the modification 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

<Configuration of spot lighting device>
The difference between the configuration of the spot illumination device 1 ″ according to the present modification and the configuration of the spot illumination device 1 according to the above-described modification 1 ′ is that the plurality of first LEDs 41, the plurality of second LEDs 42, and the support member 61 emit semiconductor light. The point which comprises the LED light source 62 which is an apparatus, the point which has replaced the lens 5 with the cover body 63 which obstruct | occludes the 2nd opening part 2b of a thermal radiation cylindrical body, and the reflection member is formed in the inner surface. The heat radiating cylindrical body 4 ″ is provided. The other structures and members are the same.

More specifically, the LED light source 62 according to this modification includes a columnar support member 61 fixed to the heat radiating plate 6, a plurality of (for example, four) first LEDs 41 fixed to the side surface of the support member 61, and a plurality of first LEDs 41. It is composed of (for example, four) second LEDs 42. The support member 61 is preferably composed of a member having a relatively high thermal conductivity. For example, the support member 61 is composed of at least one material selected from the group of glass, resin, and ceramic. The first LED 41 and the second LED 42 are supported by the support member 61 using a joining member such as solder so that the first LED 41 and the second LED 42 are positioned at the center of the cavity 4 ″ c of the heat radiating cylinder 4 ″. Accordingly, light is emitted from the first LED 41 and the second LED 42 (that is, the LED light source 62) at the central portion of the heat radiating cylindrical body 4 ″. Here, a wiring pattern (on the surface or inside of the support member 61 is provided. The first LED 41 and the second LED 42 are electrically connected to the circuit board 9 through the wiring pattern.

Further, a reflection member that reflects a part of the light emitted from the LED light source 62 is formed on the inner side surface of the heat radiating cylinder 4 ″. For example, a known film formation technique such as vapor deposition or sputtering is used. Thus, a metal thin film or a dielectric multilayer film functioning as a reflecting member is formed.For example, ceramic or tantalum can be used as the dielectric multilayer film. At least a part of the light is reflected by the reflecting member of the heat radiating cylindrical body 4 ″ and guided to the lid 63. That is, in this modification, the lens 5 in the above-described embodiment and modification 1 is used. Without focusing, the light is condensed by using a reflecting member formed on the inner surface of the heat radiating cylindrical body 4 ″. The light that has not been reflected by the metal thin film or the dielectric multilayer film is emitted from the heat radiating cylindrical body 4 ″ toward the side of the spot illumination device 1 ″.

The lid 63 is made of a member having high light transmittance such as glass or resin. Thereby, the light that has reached the lid 63 is emitted outside the spot illumination device 1 ″ without being reflected by the lid 63.

Due to the structure of the LED light source 62, the heat radiating cylindrical body 4 ″, the ridge, and the lid body 63, the light focus of the spot illumination device 1 ″ is aligned with the position of the LED light source 62 functioning as a point light source and emitted from the LED light source 62 Light can be emitted to the outside of the spot illuminating device 1 "while concentrating the light toward the lid 63. That is, spot light is irradiated from the spot illuminating device 1" without using a condensing lens. The spot illumination device 1 "can function as an LED-type dichroic halogen bulb. Further, since the support member 61 is composed of a member having a relatively high thermal conductivity, the first LED 41 and the first LED 41 The heat generated in the 2LEDs 42 is conducted to the heat radiating plate 6 through the support member 61, and further conducted to the heat radiating cylinder 4 "through the heat radiating path A. It will be dissipated to the outside of the spot lighting device 1 '. That is, the heat dissipation of the spot lighting device 1 "is improved, the failure of the LED light source 62 and the circuit board 9 can be prevented, and the life of the spot lighting device 1" itself can be extended.

1, 1 ', 1 "spot illumination device 2 driver housing 2a cavity 3 light emitting module (semiconductor light emitting device)
3a Module body 3b

Wavelength conversion member

4, 4 "Heat radiation cylinder (heat radiation body)
4a 1st opening part 4b

2nd opening part

4c, 4 "c Cavity 5 Lens

5a Cover part

5b Condensing part 5c Concave part 5d Inner side surface 6 Heat sink 6a Screw hole 6b Light emitting module mounting surface 6c Convex part 7 Thermal insulation member 8 Base 9 Circuit board 11 Screw 12 Screw hole 21 Flat plate part 22 Side wall part 23 LED chip 24 Phosphor 25 Base material 26 P electrode 27

N electrode

28, 29 Wiring pattern 41 First LED package device (first LED)
42 Second LED package device (second LED)
43 Package 44 LED chip 45

Wavelength conversion member

51a, 51b Power supply 52 Current control unit 52a Constant current control circuit 52b Duty ratio control circuit 53 Operation unit 61 Support member 62 LED light source 63 Lid R1, R2 Resistor Q1, Q2 Transistor

Claims

A semiconductor light emitting device;
A heat sink mounting the semiconductor light emitting device;
A first opening located on the mounting surface side of the semiconductor light emitting device, and a second opening that communicates with and faces the first opening and has a larger opening diameter than the first opening, A radiator made of a heat conductive material that transmits at least part of the light emitted from the semiconductor light emitting device;
A circuit board for lighting the semiconductor light emitting device is built in, and a driver housing disposed on the surface opposite to the semiconductor light emitting device mounting surface of the heat sink,
A base connected to the driver housing and supplying power to the circuit board,
An end of the radiator on the first opening side is directly connected to the heat sink on the semiconductor light emitting device mounting surface side of the heat sink, and heat generated from the semiconductor light emitting device is radiated through the heat sink. A spot illuminating device in which a heat radiation path for conducting heat to a body and radiating heat from the heat radiator is formed.
The spot illuminating device according to claim 1, wherein the heat radiating body is a cylindrical heat radiating cylindrical body.
The spot lighting device according to claim 1 or 2, wherein the thermal conductivity of the heat radiating plate is higher than the thermal conductivity of the heat radiating body.
The spot illuminator according to any one of claims 1 to 3, wherein the heat radiating plate is made of a metal or metal alloy having a thermal conductivity of 100 W / (m · K) or more.
The spot illumination device according to any one of claims 1 to 4, wherein a thermal expansion coefficient of the heat radiating plate is higher than a thermal expansion coefficient of the radiator and lower than a thermal expansion coefficient of the driver housing.
The spot illuminating device according to any one of claims 1 to 5, wherein the radiator is made of at least one material selected from the group consisting of glass, resin, and ceramic.
The spot illumination device according to any one of claims 1 to 6, wherein the driver housing is made of resin.
The radiator is made of glass,
The heat sink is made of aluminum,
The driver housing is made of polycarbonate resin,
The spot illuminating device according to claim 1, wherein the heat radiating plate relieves stress at a connection portion between the heat radiating body and the driver housing via the heat radiating plate.
The spot illuminating device according to any one of claims 1 to 8, wherein the heat radiation path extends toward a side opposite to a direction in which the driver housing and the base are arranged.
The spot illuminating device according to any one of claims 1 to 9, wherein the heat radiator includes a reflecting member that reflects at least a part of light emitted from the semiconductor light emitting device.
The spot illumination device according to claim 10, wherein the reflecting member is a metal thin film or a dielectric multilayer film.
The spot illumination device according to any one of claims 1 to 9, further comprising a lens for condensing light emitted from the semiconductor light emitting device, inside the heat radiating body.
The spot illumination device according to claim 12, wherein the lens is a reflective lens that reflects incident light on a side surface.
The spot lighting device according to any one of claims 1 to 13, wherein a heat insulating member is sandwiched between the heat radiating plate and the driver housing.
The semiconductor light emitting device is mounted near the central region of one side of the heat sink,
The spot illuminating device according to any one of claims 1 to 14, wherein the radiator is connected to a peripheral region of the radiator plate.
16. The heat sink according to claim 1, wherein the heat sink has a step that brings the mounting portion of the semiconductor light emitting device on the heat sink closer to the second opening compared to a connection portion of the heat sink on the heat sink. The spot illumination device described.