CN213340373U - Fluorescent powder-free multi-primary-color LED packaging structure - Google Patents
Fluorescent powder-free multi-primary-color LED packaging structure Download PDFInfo
- Publication number
- CN213340373U CN213340373U CN202022186552.XU CN202022186552U CN213340373U CN 213340373 U CN213340373 U CN 213340373U CN 202022186552 U CN202022186552 U CN 202022186552U CN 213340373 U CN213340373 U CN 213340373U
- Authority
- CN
- China
- Prior art keywords
- packaging adhesive
- adhesive layer
- packaging
- led
- led chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a fluorescent powder-free multi-primary color LED packaging structure, which comprises a packaging substrate, a plurality of LED chips arranged at intervals, a solid crystal layer, a lead and a composite packaging adhesive structure; the packaging substrate is provided with a plurality of LED chips which are bonded through a die bonding layer, the LED chips are connected with a substrate circuit through leads, the multi-primary LED chips are provided with a composite packaging adhesive structure, the composite packaging adhesive structure is composed of a first packaging adhesive layer of pure packaging adhesive and a second packaging adhesive layer doped with micro-nano scattering particles, and the second packaging adhesive layer is located around the first packaging adhesive layer. Therefore, most of light is directly emitted from the first packaging adhesive layer, and the light with large angle is scattered with the micron nano particles in the second packaging adhesive layer doped with the micron nano particles, so that the uniformity of light emitted by different LED chips in each direction is improved, light mixing at large visual angle is realized, and the high light extraction efficiency is ensured.
Description
Technical Field
The utility model belongs to the technical field of the LED encapsulation technique and specifically relates to a phosphor powder-free multi-primary-color LED packaging structure is related to.
Background
LED (light Emitting diodes) is a semiconductor light Emitting device based on P-N junction electroluminescence principle, has the advantages of high electro-optical conversion efficiency, long service life, environmental protection, energy saving, small volume, etc., and has begun to be widely applied in many fields such as backlight, street lamps, automobile headlights, head lamps and indoor lighting, etc., with the continuous improvement of LED efficiency and the popularization of application products, the demand of people for LED lighting has been gradually changed from "lighting" to "lighting comfort", so the spatial color uniformity becomes one of the important evaluation indexes of LED lighting quality.
The current white light LED synthesis method mainly comprises two methods, one is to use a blue LED chip to excite fluorescent powder to synthesize white light; another is to synthesize white light by multi-color LED chips (e.g., blue, cyan, green, yellow, and red LED chips). The blue light chip is combined with the yellow fluorescent powder to synthesize white light, and the problems of excessive blue light, lack of blue light and insufficient red light exist in the spectrum of the white light. More and more researches show that the problem of serious blue light leakage exists along with the time when the white light LED light source is synthesized by the method, and due to the fact that the blue light accounts for a large amount in the spectrum, a non-visual biological effect is generated on a user, melatonin secretion is influenced, a biological clock disorder is caused, the sleep quality is poor, and the like. In addition, the yellow fluorescent powder can age with the use time, which causes the problems of the LED such as the reduction of luminous efficiency and the color temperature drift, therefore, the method of synthesizing white light by combining the blue light chip and the yellow fluorescent powder has serious defects.
The white light synthesized by the multicolor LED chip has the advantages of long service life, continuously adjustable spectrum, high light quality and the like, and has wider prospects in the fields of intelligent illumination, health illumination, visible light communication and the like. The multi-primary-color white light LED can effectively solve the problems of color temperature drift, blue light leakage and the like caused by fluorescent powder aging of the fluorescent powder conversion LED in the using process. According to the prediction of the LED illumination plan issued by the U.S. department of energy, the limiting efficiency of the phosphor-converted white LED is about 250lm/W, and the limiting efficiency of the multi-primary color white LED is about 350lm/W, so that the multi-primary color white LED with high quality, high reliability and high light efficiency is the inevitable trend of the next generation of green healthy illumination.
In LED packaging, optical regulation and control are indispensable parts, directly influence the light emitting efficiency and the light mixing efficiency of an LED, and are key links for realizing the application requirements of multi-primary-color LED illumination. The traditional packaging structure such as the lumen-imitating package, the SMD package and the like can not meet the requirements of uniform light mixing and high extraction efficiency of the multi-primary-color LED. The white light is directly synthesized by adopting multi-primary-color LEDs, and LED chips with different colors are different in spatial distribution position. Due to the fact that the light intensities of the light emitted by the LED chips with different colors at different angles are not matched, the color temperature of the light emitted by the LED packaging module at each visual angle in space is not consistent, and color temperature deviation exists. Moreover, when the multi-primary-color LED packaging module is applied to a lamp, the secondary lens of the lamp aggravates color temperature deviation of different spatial viewing angles, and particularly, a color separation phenomenon can occur even at a large viewing angle, so that a target plane obtains regional color spots instead of white light synthesized by a multi-primary-color chip, the illumination quality is greatly reduced, and the requirement of high-quality illumination cannot be met.
Disclosure of Invention
An object of the utility model is to provide a no phosphor powder many primary colors LED packaging structure, this packaging structure utilize the encapsulation colloid layer of scattering particle doping to solve the inhomogeneous problem of different colour LED chip light-emitting, have not only improved space color homogeneity, have guaranteed highlight extraction efficiency simultaneously moreover.
The purpose of the utility model is realized like this:
a phosphor-free multi-primary color LED packaging structure is characterized in that: the LED packaging structure comprises a packaging substrate, a plurality of LED chips arranged at intervals, a solid crystal layer, a lead and a composite packaging adhesive structure; the packaging substrate is provided with a plurality of LED chips which are bonded through a die bonding layer, each LED chip is connected with a substrate circuit through a lead, the LED chips are provided with a composite packaging adhesive structure, the composite packaging adhesive structure is composed of a first packaging adhesive layer of pure packaging adhesive and a second packaging adhesive layer doped with micro-nano scattering particles, and the second packaging adhesive layer is positioned around the first packaging adhesive layer. So guarantee most light and directly follow first encapsulation glue film outgoing, and the scattering effect takes place with micro-nano scattering particle in the second encapsulation glue film that micro-nano scattering particle mixes for the light of wide angle to improve the homogeneity of each direction of different LED chip light-emitting, realize the mixed light of wide visual angle, guarantee highlight extraction efficiency simultaneously.
Further, the composite packaging adhesive structure realizes light extraction and light mixing of the multi-primary-color LED chip, wherein the first packaging adhesive layer is one of a hemispherical cap lens structure, a segment lens structure, a ball table lens structure, a circular table lens structure, a free-form surface lens structure, a trapezoidal structure lens structure, a square lens structure, a cylindrical lens structure or a polygonal lens structure.
Further, the height h of the first packaging adhesive layer in the vertical direction is 1 mm-50 mm, the characteristic length s of the first packaging adhesive layer in the horizontal direction is 2 mm-100 mm, and the ratio s1/s3 of the characteristic length s1 of the first packaging adhesive layer in the top horizontal direction to the characteristic length s3 of the first packaging adhesive layer in the bottom horizontal direction is 0-1.
Further, the horizontal direction thickness s2 of second encapsulation glue film is 0mm ~50mm, horizontal direction thickness be invariable or gradual change in the vertical direction, the vertical direction height of second encapsulation glue film is the same with the vertical direction height of first encapsulation glue film, or is less than the vertical direction height of first encapsulation glue film.
Further, the material of the first packaging adhesive layer is one of silica gel, polyurethane or epoxy resin. Because the refractive index of the LED light emergent surface material is relatively large (for example, the refractive index of GaP is 3.32, and the refractive index of GaN is 2.5), light can generate total reflection at the packaging adhesive-air boundary, so that only light with partial angles can be emitted from the device, light with other larger angles is reflected back to the inside of the chip and cannot be extracted, the refractive index of the packaging adhesive is between that of the LED device material and air, and the critical total reflection angle can be increased by utilizing the difference of the refractive indexes of different materials, so that light extraction is realized.
Further, the second packaging adhesive layer is one of silica gel, polyurethane or epoxy resin doped with micro-nano scattering particles, the micro-nano scattering particles are organic micro-nano scattering particles of silicone resin, polycarbonate or polymethyl methacrylate, or the micro-nano scattering particles are inorganic micro-nano scattering particles of silicon dioxide, titanium dioxide, aluminum nitride, zirconium dioxide, barium sulfate or calcium carbonate, the particle size of the micro-nano scattering particles is 0.005-20 μm, and the doping concentration of the micro-nano scattering particles is 0.001-20%.
Furthermore, at least two LED chips with different wavelengths are arranged on the packaging substrate, the LED chips are GaN binary material chips or AlGaNP quaternary material chips, and the LED chips are distributed in a circular or polygonal arrangement. According to the colorimetry theory, the LED chips with different wavelengths can realize light with different color temperatures, for example, the LED chips with yellow light and red light with different wavelengths can synthesize golden yellow light with low color temperature; the high-color-rendering-index five-primary-color LED white light can be synthesized by using the LED chips with the five different wavelengths of blue light, cyan light, green light, yellow light and red light.
Furthermore, one of packaging glue, high-reflectivity reflective paint or high-concentration scattering particle doped packaging glue is coated around the LED chip. The purpose is to reduce the side-wall absorption of the chip and increase the light extraction.
Further, the packaging substrate is one of a copper substrate, an aluminum substrate, a silicon substrate, a ceramic substrate or a PCB, and the reflective layer on the surface of the packaging substrate is a high-reflectivity reflective paint layer or a high-reflectivity reflective glue layer. Due to the total reflection and Fresnel reflection of the packaging adhesive-air interface, part of light is reflected back to the packaging substrate, and light extraction is increased through the substrate high-reflectivity coating.
Compared with the prior art, the above technical scheme provided by the utility model, have following advantage: the utility model provides a no phosphor powder polybase color LED packaging structure, the compound encapsulation colloid layer that utilizes scattering particle doping has solved different colours LED chip light-emitting inhomogeneous, polybase color LED encapsulation mixes the light and draws the problem, the scattering effect who utilizes micro-nano particle improves the homogeneity that has not only improved space color, and guaranteed the highlight simultaneously and drawn efficiency, and improved the problem of the light loss that brings because micro-nano particle's backscattering, and simultaneously, adopt many primary colors LED chip direct synthesis white light, full gloss register for easy reference light-emitting has more ideal photochromic quality, the LED illumination of green healthy high-quality has been realized to the true meaning.
Drawings
Fig. 1 is a schematic view of a package structure in embodiment 1 of the present invention;
fig. 2 is a schematic view of the distribution of multi-primary LED chips on a substrate according to embodiment 1 of the present invention;
fig. 3 is a schematic view of a three-dimensional structure of a package module according to embodiment 1 of the present invention;
FIG. 4 is a comparison graph of color temperature of a conventional ball cap package structure and a package structure of the embodiment 1 of the present invention varying with the spatial viewing angle;
FIG. 5 is a comparison graph of color temperature of a conventional ball cap package structure and a package structure of the embodiment 2 of the present invention varying with spatial viewing angle;
fig. 6 is a schematic view of a package structure according to embodiment 3 of the present invention;
fig. 7 is a schematic view of the distribution of multi-primary LED chips on a substrate according to embodiment 3 of the present invention;
fig. 8 is a schematic view of a package structure according to embodiment 4 of the present invention;
fig. 9 is a schematic view of a package structure according to embodiment 5 of the present invention;
fig. 10 is a schematic view of a package structure according to embodiment 6 of the present invention;
fig. 11 is a schematic view of the distribution of golden yellow LED chips on the substrate according to embodiment 6 of the present invention;
fig. 12 is a schematic view of a package structure according to embodiment 7 of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples.
Example 1:
as shown in fig. 1, a phosphor-free multi-primary-color LED package structure includes a ceramic substrate 11, four LED chips 13 arranged at intervals, a die attach layer 12, leads 14, and composite package glue layers 16 and 17; four LED chips 13 which are arranged at intervals are bonded on the ceramic substrate 11 through the solid crystal layer 12, the LED chips 13 are connected with the substrate circuit 15 through leads 14, composite packaging adhesive layers 16 and 17 are arranged on the LED chips 13, each composite packaging adhesive layer is composed of a first packaging adhesive layer 16 and a second packaging adhesive layer 17 doped with micro-nano scattering particles, and the second packaging adhesive layer 17 is positioned around the first packaging adhesive layer 16.
The first packaging adhesive layer 16 is made of silica gel, the first packaging adhesive layer 16 is in a spherical frustum shape, the height h of the first packaging adhesive layer 16 in the vertical direction is 4mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 16 in the horizontal direction are 12mm and 15mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 to the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0.8. The height h of the second packaging adhesive layer 17 in the vertical direction is 4mm, the thickness of the second packaging adhesive layer 17 in the horizontal direction is constant, the thickness s2 in the horizontal direction is 1.5mm, the material of the second packaging adhesive layer 17 is silica gel doped with scattering particles, the scattering particles are organic silicon resin particles, the doping concentration is 0.6wt%, and the average particle size of the scattering particles is 2 micrometers.
As shown in fig. 1, a fluorescent powder-free multi-primary color packaging method improves spatial color uniformity of a multi-primary color LED by a second packaging layer doped with micro-nano particles, and includes the following specific steps:
1. firstly, bonding an LED chip 13 on a ceramic substrate 11 through a silver glue solid crystal layer 12 to realize the electrical connection between a lower electrode of the chip 13 and a circuit 15 on the ceramic substrate 11; the arrangement of the 4 LED chips 13 on the ceramic substrate 11 is shown in fig. 2, where the 4 LED chips 13 are composed of a blue LED chip 131 with a dominant wavelength of 460nm, a green LED chip 132 with a dominant wavelength of 520nm, a yellow LED chip 133 with a dominant wavelength of 560nm, and a red LED chip 134 with a dominant wavelength of 620nm, and are distributed on the ceramic substrate 11 at intervals in a square arrangement;
2. the upper electrode of the chip 13 is connected with a circuit 15 on the ceramic substrate 11 through a lead 14 by adopting a lead bonding process to realize electric connection;
3. manufacturing a spherical first packaging adhesive layer 16 on a ceramic substrate 11 by adopting a die-top process to realize light extraction of different LED chips, heating and curing the first packaging adhesive layer 16, and baking and heating the first packaging adhesive layer by using a baking oven at the heating temperature of 150 ℃ for 0.5 hour;
4. the micro-nano particles and the packaging adhesive are uniformly mixed, a second packaging adhesive layer 17 doped with the micro-nano particles is manufactured around the first packaging adhesive layer 16 by adopting a die-jacking process, so that light mixing of different LED chips is realized, the whole packaging module is heated and cured, the heating temperature is 150 ℃, and the heating time is 1 hour.
Fig. 3 is a schematic diagram of a three-dimensional structure of a package module with a composite package structure, which includes a ceramic substrate 11, a chip 13, a first package adhesive layer 16 and a second package adhesive layer 17. According to the method, the micro-nano particles are doped with the packaging adhesive layer to improve the light emitting distribution of different colors of the LED chip, so that the uniformity of spatial color is improved.
As shown in fig. 4, a comparison graph of color temperature variation with spatial viewing angle of the conventional ball cap package structure and the package structure of the present embodiment shows that by using the package structure of the present embodiment, high spatial color uniformity of light emitted from the multi-primary LED package structure is achieved.
Example 2:
the structure of example 2 is substantially the same as that of example 1, and differs from example 1 in that: the scattering particles used in example 2 were an inorganic material, TiO2, TiO2 doped with 0.6wt%, TiO2 having a particle size of 2 μm.
As shown in fig. 5, a comparison graph of color temperature of the conventional ball cap package structure and the package structure of embodiment 2 along with the change of the spatial viewing angle shows that the package structure of the present embodiment realizes high spatial color uniformity of light emitted from the multi-primary LED package structure.
Example 3:
as shown in fig. 6, a phosphor-free multi-primary-color LED package structure includes an aluminum substrate 61, five LED chips 63 arranged at intervals, a die attach layer 62, leads 64, and composite package glue layers 66 and 67; five LED chips 63 which are arranged at intervals are bonded on the aluminum substrate 61 through the solid crystal layer 62, the LED chips 63 are connected with the substrate circuit 65 through leads 64, composite packaging adhesive layers 66 and 67 are arranged on the LED chips 63, each composite packaging adhesive layer is composed of a first packaging adhesive layer 66 and a second packaging adhesive layer 67 doped with micro-nano scattering particles, and the second packaging adhesive layers 67 are located around the first packaging adhesive layer 66.
The first packaging adhesive layer 16 is made of epoxy resin, the first packaging adhesive layer 66 is of a cylindrical structure, the height h of the first packaging adhesive layer 66 in the vertical direction is 10mm, the characteristic length s of the first packaging adhesive layer 66 is 30mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 66 in the horizontal direction are both 30 mm. The ratio s1/s3 of the top horizontal characteristic length s1 and the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 1. The height h of the second packaging adhesive layer 67 in the vertical direction is 10mm, the thickness of the second packaging adhesive layer 67 in the horizontal direction is constant, and the thickness s2 in the horizontal direction is 5 mm. The second packaging adhesive layer 67 is made of epoxy resin doped with scattering particles, the scattering particles are zirconium dioxide, the doping concentration is 5wt%, and the average particle size of the scattering particles is 5 μm.
As shown in FIG. 7, the arrangement of the 5 LED chips 63 on the aluminum substrate 61 is that the 5 LED chips 63 are composed of a blue LED chip 631 having a dominant wavelength of 460nm, a cyan LED chip 632 having a dominant wavelength of 485nm, a green LED chip 633 having a dominant wavelength of 520nm, a yellow LED chip 634 having a dominant wavelength of 560nm, and a red LED chip 635 having a dominant wavelength of 620nm, and are distributed on the aluminum substrate 61 at intervals in an annular arrangement manner.
Example 4:
as shown in fig. 8, a phosphor-free multi-primary-color LED package structure includes a copper substrate 81, a plurality of LED chips 83 disposed at intervals, a die attach layer 82, leads 84, and composite package glue layers 86 and 88; a plurality of LED chips 83 which are arranged at intervals are bonded on the copper substrate 81 through the die bonding layer 82, the LED chips 83 are connected with the substrate circuit 85 through leads 84, composite packaging adhesive layers 86 and 87 are arranged on the LED chips 83, each composite packaging adhesive layer is composed of a first packaging adhesive layer 86 and a second packaging adhesive layer 87 doped with micro-nano scattering particles, and the second packaging adhesive layers 87 are positioned around the first packaging adhesive layers 86.
The first packaging adhesive layer 16 is made of polyurethane, the first packaging adhesive layer 86 is of a ball cap structure, the height h of the first packaging adhesive layer 86 in the vertical direction is 6mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 86 in the horizontal direction are 0mm and 20mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 and the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0. The height h of the second packaging adhesive layer 87 in the vertical direction is 4mm, the thickness s2 of the second packaging adhesive layer 87 in the horizontal direction is gradually changed, and the thickness s2 in the horizontal direction is gradually changed from 0 to 2mm from top to bottom in the vertical direction. The material of the second packaging adhesive layer 87 is epoxy resin doped with scattering particles, the scattering particles are polycarbonate, the concentration is 10wt%, and the average particle size of the scattering particles is 8 μm.
Example 5:
as shown in fig. 9, a phosphor-free multi-primary color LED package structure includes a silicon substrate 91, four LED chips 93 spaced apart from each other, a die attach layer 92, leads 94, and composite package glue layers 96 and 97; four LED chips 93 which are arranged at intervals are bonded on the silicon substrate 91 through the solid crystal layer 92, the LED chips 93 are connected with the substrate circuit 95 through the leads 94, composite packaging adhesive layers 96 and 97 are arranged on the LED chips 93, each composite packaging adhesive layer is composed of a first packaging adhesive layer 96 and a second packaging adhesive layer 97 doped with micro-nano scattering particles, and the second packaging adhesive layer 97 is positioned around the first packaging adhesive layer 96.
Wherein, first encapsulation glue film 96 material is silica gel, and first encapsulation glue film 96 is the cylindrical structure of top curved surface, and first encapsulation glue film 96 vertical direction height h is 35mm, and first encapsulation glue film 96 top and bottom horizontal direction characteristic length s1 and s3 are 0mm and 50mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 and the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0. The height h of the second packaging adhesive layer 97 in the vertical direction is 25mm, the thickness s2 of the second packaging adhesive layer 97 in the horizontal direction is gradually changed, and the thickness s2 in the horizontal direction is gradually changed from 0 to 10mm from top to bottom in the vertical direction. The second packaging adhesive layer 77 is made of silica gel doped with scattering particles, the scattering particles are silicon dioxide, the concentration is 10wt%, and the average particle size of the scattering particles is 1 μm.
Example 6:
as shown in fig. 10, a phosphor-free multi-primary color LED package structure includes a ceramic substrate 101, four LED chips 103 arranged at intervals, a die attach layer 102, leads 104, and composite package glue layers 106 and 107; four LED chips 103 which are arranged at intervals are bonded on the ceramic substrate 101 through the solid crystal layer 102, the LED chips 103 are connected with the substrate circuit 105 through leads 104, composite packaging adhesive layers 106 and 107 are arranged on the LED chips 103, each composite packaging adhesive layer is composed of a first packaging adhesive layer 106 and a second packaging adhesive layer 107 which is doped with micro-nano scattering particles, and the second packaging adhesive layers 107 are located around the first packaging adhesive layers 106.
The surface of the packaging substrate 101 is provided with a white glue layer 109 with high diffuse reflectance, white glue 108 with high diffuse reflectance is coated on the periphery of the LED chip 103, and the thickness of the white glue 108 with high diffuse reflectance, which is coated on the periphery of the LED chip 103, is consistent with that of the LED chip and is 0.2 mm. The arrangement of the 4 LED chips 103 on the ceramic substrate 101 is shown in fig. 11, and the 4 LED chips 103 are composed of two yellow LED chips 1031 having a dominant wavelength of 560nm and two red LED chips 1032 having a dominant wavelength of 620nm, and are distributed at intervals on the ceramic substrate 101 in a rectangular arrangement. The first encapsulant layer 106 is made of silicon gel, the first encapsulant layer 106 is in a shape of a frustum of a sphere, the height h of the first encapsulant layer 106 in the vertical direction is 4mm, and the characteristic lengths s1 and s3 of the top and bottom of the first encapsulant layer 106 in the horizontal direction are 12mm and 15mm, respectively. The ratio s1/s3 of the top horizontal characteristic length s1 to the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0.8. The height h of the second packaging adhesive layer 107 in the vertical direction is 4mm, the thickness of the second packaging adhesive layer 107 in the horizontal direction is constant, the thickness s2 in the horizontal direction is 1.5mm, the material of the second packaging adhesive layer 107 is silica gel doped with scattering particles, the scattering particles are barium sulfate particles, the doping concentration is 1wt%, and the average particle size of the scattering particles is 2 micrometers.
Example 7:
as shown in fig. 12, a phosphor-free multi-primary color LED package structure includes a ceramic substrate 121, four LED chips 123 disposed at intervals, a die attach layer 122, leads 124, and composite package glue layers 126 and 127; four LED chips 123 which are arranged at intervals are bonded on the ceramic substrate 121 through the solid crystal layer 122, the LED chips 123 are connected with the substrate circuit 125 through leads 124, composite packaging adhesive layers 126 and 127 are arranged on the LED chips 123, each composite packaging adhesive layer is composed of a first packaging adhesive layer 126 and a second packaging adhesive layer 127 doped with micro-nano scattering particles, and the second packaging adhesive layer 127 is positioned around the first packaging adhesive layer 126.
The surface of the ceramic substrate 121 is vapor-plated with a high-reflectivity silver layer 128, the first packaging adhesive layer 126 is made of silica gel, the first packaging adhesive layer 126 is in a spherical frustum shape, the height h of the first packaging adhesive layer 126 in the vertical direction is 4mm, and the characteristic lengths s1 and s3 of the top and bottom of the first packaging adhesive layer 126 in the horizontal direction are 12mm and 15mm respectively. The ratio s1/s3 of the top horizontal characteristic length s1 to the bottom horizontal characteristic length s3 of the first encapsulating glue layer is 0.8. The height h of the second encapsulating adhesive layer 127 in the vertical direction is 4mm, the thickness of the second encapsulating adhesive layer 127 in the horizontal direction is constant, the thickness s2 in the horizontal direction is 1.5mm, the material of the second encapsulating adhesive layer 127 is silica gel doped with scattering particles, the scattering particles are barium sulfate particles, the doping concentration is 1wt%, and the average particle size of the scattering particles is 2 μm.
The above description is only for the preferred embodiment of the present invention, but the present invention should not be limited to the disclosure of the embodiment and the accompanying drawings. Therefore, all the equivalents and modifications which are not disclosed in the present invention are within the scope of the present invention.
Claims (5)
1. The utility model provides a do not have many primary colors LED packaging structure of phosphor powder which characterized in that: the LED packaging structure comprises a packaging substrate, a plurality of LED chips arranged at intervals, a solid crystal layer, a lead and a composite packaging adhesive structure; the packaging substrate is provided with a plurality of LED chips which are bonded through a die bonding layer, each LED chip is connected with a substrate circuit through a lead, the LED chips are provided with a composite packaging adhesive structure, the composite packaging adhesive structure is composed of a first packaging adhesive layer of pure packaging adhesive and a second packaging adhesive layer doped with micro-nano scattering particles, and the second packaging adhesive layer is positioned around the first packaging adhesive layer.
2. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the composite packaging adhesive structure realizes light extraction and light mixing of the multi-primary-color LED chip, wherein the first packaging adhesive layer is one of a hemispherical cap lens structure, a segment lens structure, a ball table lens structure, a circular table lens structure, a free-form surface lens structure, a trapezoid structure lens structure, a square lens structure, a cylindrical lens structure or a polygonal lens structure.
3. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the height h of the first packaging adhesive layer in the vertical direction is 1 mm-50 mm, the characteristic length s of the first packaging adhesive layer in the horizontal direction is 2 mm-100 mm, and the ratio s1/s3 of the characteristic length s1 of the first packaging adhesive layer in the top horizontal direction to the characteristic length s3 of the first packaging adhesive layer in the bottom horizontal direction is 0-1.
4. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the horizontal direction thickness s2 of second encapsulation glue film is 0mm ~50mm, horizontal direction thickness be invariable or gradual change in the vertical direction, the vertical direction height of second encapsulation glue film is the same with the vertical direction height of first encapsulation glue film, or is less than the vertical direction height of first encapsulation glue film.
5. The phosphor-free multi-primary LED package structure according to claim 1, wherein: the packaging substrate is provided with at least two LED chips with different wavelengths, and the LED chips are arranged and distributed in a circular or polygonal shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022186552.XU CN213340373U (en) | 2020-09-29 | 2020-09-29 | Fluorescent powder-free multi-primary-color LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022186552.XU CN213340373U (en) | 2020-09-29 | 2020-09-29 | Fluorescent powder-free multi-primary-color LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213340373U true CN213340373U (en) | 2021-06-01 |
Family
ID=76068942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022186552.XU Active CN213340373U (en) | 2020-09-29 | 2020-09-29 | Fluorescent powder-free multi-primary-color LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213340373U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335305A (en) * | 2021-11-09 | 2022-04-12 | 南昌大学 | Fluorescent powder-free multi-primary color LED side light emitting module and side light emitting device |
-
2020
- 2020-09-29 CN CN202022186552.XU patent/CN213340373U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335305A (en) * | 2021-11-09 | 2022-04-12 | 南昌大学 | Fluorescent powder-free multi-primary color LED side light emitting module and side light emitting device |
| CN114335305B (en) * | 2021-11-09 | 2024-04-16 | 南昌大学 | Fluorescent powder-free multi-primary-color LED side light-emitting module and side light-emitting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20180076368A1 (en) | Light emitting diodes and methods | |
| CN112234134A (en) | Fluorescent powder-free multi-primary-color LED packaging structure and packaging method thereof | |
| JP6041450B2 (en) | Light source module, lighting device and lighting system | |
| CN106783821B (en) | Full-spectrum LED packaging structure without fluorescent powder and packaging method thereof | |
| CN201539737U (en) | LED lamp | |
| CN102980065B (en) | LED (Light-emitting Diode) light source, LED display module and LED illumination device | |
| CN103872225A (en) | Light-emitting film used for LED lighting and provided with micro-mirror structure and preparing method thereof | |
| CN101338865A (en) | Low attenuation high light efficiency LED illuminating apparatus and preparation method | |
| CN103050615A (en) | High-color-rendering white light LED (light emitting diode) device | |
| CN111081691A (en) | Module structure for realizing light mixing and light extraction of multi-primary-color LED light source | |
| CN209104189U (en) | A kind of width colour gamut COB device | |
| CN103325926B (en) | LED packaging structure used in on-board chip and fluorescent powder coating method thereof | |
| CN213340373U (en) | Fluorescent powder-free multi-primary-color LED packaging structure | |
| US10957736B2 (en) | Light emitting diode (LED) components and methods | |
| CA3007011C (en) | Led apparatus employing tunable color filtering using multiple neodymium and fluorine compounds | |
| US20150048394A1 (en) | Light emitting device package and method of manufacturing the same | |
| CN103456871B (en) | Improve the fluorescent coating structure of pc-LEDs spatial light uniformity of chromaticity | |
| CN102148321A (en) | LED (Light Emitting Diode) white light fluorescent cap and manufacturing method thereof | |
| CN116565101A (en) | Fluorescent powder-free multi-primary-color LED planar packaging structure and preparation method thereof | |
| CN101893168A (en) | White light luminous diode packaging unit, illuminator and manufacturing method thereof | |
| CN203607407U (en) | White light LED structure with adjustable color temperature | |
| CN102569558A (en) | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application | |
| CN101968169A (en) | Warm white LED lamp with high brightness and high color rendering index | |
| CN101684924B (en) | LED lighting module and preparation method | |
| CN110429167A (en) | Realize the LED encapsulation method of high spatial color homogeneity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220718 Address after: 999 No. 330031 Jiangxi province Nanchang Honggutan University Avenue Patentee after: Nanchang University Address before: 999 No. 330031 Jiangxi province Nanchang Honggutan University Avenue Patentee before: Nanchang University Patentee before: NANCHANG GUIJI SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221116 Address after: 341000 No. 164, Qimin Road, shangou industrial community, Gongjiang Town Industrial Park, Yudu County, Ganzhou City, Jiangxi Province Patentee after: Jiangxi Yuming intelligent photoelectric Co.,Ltd. Address before: 999 No. 330031 Jiangxi province Nanchang Honggutan University Avenue Patentee before: Nanchang University |