CN102569558A - Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application - Google Patents
Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application Download PDFInfo
- Publication number
- CN102569558A CN102569558A CN2012100061025A CN201210006102A CN102569558A CN 102569558 A CN102569558 A CN 102569558A CN 2012100061025 A CN2012100061025 A CN 2012100061025A CN 201210006102 A CN201210006102 A CN 201210006102A CN 102569558 A CN102569558 A CN 102569558A
- Authority
- CN
- China
- Prior art keywords
- lens
- led
- packing
- packaging
- secondary lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention belongs to the light emitting diode (LED) packaging technology, and relates to a packaging method for realizing separation of fluorescent powder glue away from coating in LED package and an application of the method. The method is characterized in that: fluorescent powder glue is filled inside a gap between a primary lens and a secondary lens in the LED package, the thickness of the fluorescent powder glue is adjusted according to the size of the gap between the primary lens and the secondary lens to realize the uniform or nonuniform thickness. The primary lens can be semispherical or rectangular, or can be a free curved surface with internal top being a plane; and the outer surface of the secondary lens can be a free curved surface, and the inner surface of the secondary lens can be a semispherical shape, a rectangular shape, a trapezoid shape or other shapes with the top part being a plane. The packaging method can be used for controlling the geometric shape of the fluorescent powder layer in the LED package. Due to the adoption of the packaging method, the fluorescent powder glue can be away from the coating, and at the same time, the LED can satisfy the optical requirements such as brightness uniformity, high light emission efficiency, and uniformity of color temperature control and color control.
Description
Technical field
The invention belongs to the LED encapsulation technology, relate to a kind of phosphor gel that in LED encapsulation, realizes, be applied to phosphor gel in the LED encapsulation especially away from the control of the phosphor powder layer pattern that applies away from the method for packing and the application thereof that apply.
Background technology
LED (Light Emitting Diode) is a kind of light emitting semiconductor device of processing based on P-N junction electroluminescence principle; Have advantages such as electro-optical efficiency height, long service life, environmental protection and energy saving, volume be little; Be described as the 21 century green illumination light source; If can be applied to the traditional lighting field and will obtain very obvious energy-saving effect, this is significant now what be becoming tight global energy day.Along with the breakthrough that with the nitride is the third generation semi-conducting material technology of representative; Semiconductor lighting industry based on high-power and high-luminance light-emitting diode (LED) is risen rapidly in the whole world; Just becoming semi-conductor photoelectronic industry new growth engines, and causing a revolution in the traditional lighting field.LED has begun to be used widely in a lot of fields because its unique advantages, is thought the main developing direction of following lighting technology to have huge market potential by industry.
A normally traditional hemispherical lens of lens of large power white light LED, its advantage are that the simple and precision of processing is easy to control.But only adopt the illuminating effect of large power white light LED of lens of traditional hemisphere undesirable; Hot spot is generally circle and uneven illumination is even; Be not suitable for the application of large power white light LED,, need obtain the hot spot of the uniform illumination of rectangle such as in the application of large power white light LED street lamp.To this problem, the solution that industrial quarters is general is outside lens, to adopt secondary lens to improve illuminating effect, and secondary lens adopts free-form surface lens usually, realizes the even illumination of specific hot spot through control light and light distribution.But secondary lens only improves the Illumination Distribution of illumination, improves little for optical properties such as the colour temperature of LED, color homogeneities.The distribution situation of the more phosphor powder layer with during LED encapsulates of optical properties such as the light extraction efficiency of large power white light LED, colour temperature, color homogeneity is relevant.
Large power white light LED is normally mixed by two wavelength light (blue light+sodium yellow) or three-wavelength light (blue light+green light+red light).The white light LEDs that extensively adopts at present is to form through blue led chip (GaN) and yellow fluorescent powder (YAG or TAG).How much patterns of fluorescent material have a strong impact on the important optical properties such as light extraction efficiency, colour temperature, spatial color uniformity of LED in LED encapsulation; The phosphor powder layer pattern of in the LED encapsulation process, realizing ideal is most important.
The most frequently used fluorescent material coating method of LED encapsulation is through point gum machine the phosphor gel in the syringe to be coated in around the led chip, and fluorescent material presents ball crown type, yellow hot spot in the use of reality, usually can occur.In order to improve spatial color inhomogeneities that the fluorescent material spot printing brings and the light extraction efficiency that improves LED, the conformal of fluorescent material applies and is comparatively desirable coating method among the LED away from coating.Compare conformal and apply, the light extraction efficiency away from applying of fluorescent material is higher, but it realizes relatively difficulty.Both at home and abroad, confirm effectively to improve the light extraction efficiency of LED through optical analog, and proposed multiple desirable fluorescent material geometry away from applying to the studying of fluorescent material among the LED away from coating; But these work all only be through the means of simulation or before encapsulation the phosphor powder layer through the Mold Making design geometries; The mature technology that applicable industry LED encapsulation also do not occur at present; So seek a kind of simply, LED fluorescent material is most important for the LED encapsulation away from paint-on technique cheaply.
Summary of the invention
One object of the present invention is to provide a kind of and in the LED encapsulation, realizes phosphor gel away from the method for packing that applies, and can effectively realize the morphology control away from coating of fluorescent material.
Another object of the present invention is to provide a kind of method of utilizing above-mentioned method for packing control phosphor powder layer geometry in the LED encapsulation.
A kind of method for packing of phosphor gel of in the LED encapsulation, realizing provided by the invention away from coating; It is characterized in that; Lens in LED encapsulation and the gap between the secondary lens are filled with phosphor gel; The thickness of phosphor gel is adjusted according to the gap length between lens and the secondary lens, realizes thickness even or heterogeneous.
As the improvement of technique scheme, lens can be that hemisphere or rectangle or inside top are the free form surface on plane; The outer surface of secondary lens can be free form surface, and inner surface can be other shapes on plane for hemisphere or rectangle or trapezoidal or top.
The method of above-mentioned method for packing control phosphor powder layer geometry in the LED encapsulation is characterized in that this method comprises the steps:
1. led chip is fixed on the base plate for packaging, and with forming the circuit that is communicated with between led chip and the base plate for packaging;
2. lens are installed on the base plate for packaging;
3. silica gel is filled in the space that lens and led chip, base plate for packaging constitute deaeration;
4. secondary lens is installed on the base plate for packaging;
5. phosphor gel is filled into the gap between secondary lens and the lens; After reaching poised state in the gap of phosphor gel between lens and secondary lens, solidify, accomplish fluorescent material away from applying operation.
Compared with prior art, the present invention has following technical characterstic:
(1) fills phosphor gel at lens of LED encapsulation and the gap between the secondary lens; The shape of phosphor gel can be according to colour temperature and the color homogeneity to white light LEDs; Gap length through adjusting between lens and the secondary lens is realized, can is that uniform thickness also can be a uneven gauge.
(2) after accomplishing fixed L ED chip and circuit is connected operation, install a traditional hemispherical lens, install the corresponding secondary lens of specific illumination then, the outer surface of secondary lens is a free form surface, is used for controlling light and realizes even lighting requirement.Inner surface is used for realizing colour temperature and the color homogeneity that specific illumination requires, can is hemisphere, elliposoidal and other shapes.Phosphor gel is filled in gap between lens and secondary lens, and the thickness of phosphor gel and shape once the gap shape between lens and the secondary lens decide.Carry out the curing of phosphor gel behind the end-of-fill, can under baking box or normal temperature, carry out.According to this method for packing, can realize phosphor gel away from coating, reach optics requirements such as illuminance uniformity, high light-emitting efficiency, colour temperature control and color homogeneity control simultaneously.
(3) fill phosphor gel between lens and the secondary lens of the present invention in LED encapsulation; Utilizing this method can add simple modes such as syringe point glue or spraying through point gum machine just can realize with other complicacies away from the effect of the identical fluorescent material of paint-on technique away from coating; And this method can also realize different-shape away from coating, reach higher optics and require and performance.Because this method only designs the conventional package technology among the LED; Only change the LED packaging process; So can be applied to large-scale LED encapsulation in the industry soon, important optical properties such as the light extraction efficiency of lifting led light source, colour temperature, spatial color uniformity, Illumination Distribution.
Description of drawings
Fig. 1 is the first embodiment sketch map;
Fig. 2, Fig. 3 are for filling the process sketch map of phosphor gel;
Fig. 4 is for adopting the processing step flow chart of said method for packing;
Fig. 5 and Fig. 6 are the second embodiment sketch map;
Fig. 7 and Fig. 8 are the 3rd embodiment sketch map;
Symbol description among the figure: 1LED chip, 2 gold threads, 3 base plate for packaging, 4 silica gel, No. 5 lens, 6 phosphor gel, 7 secondary lens, 8 gum-injecting ports, 9 syringes.
Embodiment
Below through by embodiment the present invention being described in further detail, but following examples only are illustrative, and protection scope of the present invention does not receive the restriction of these embodiment.
Referring to Fig. 1, led chip 1 is fixed on the base plate for packaging 3 through scolder, gold thread 2 links to each other led chip 1 with base plate for packaging 3, form the circuit that is communicated with.After lens 5 of traditional hemisphere are installed to substrate, fill full silica gel 4.Secondary lens 7 is installed on the base plate for packaging 3, between lens 5 and secondary lens 7, fills phosphor gel 6 then.The inner surface of secondary lens 7 also is a hemisphere, and then the thickness of phosphor gel 4 is the difference of radius of outer surface of radius and lens of secondary lens inner surface, therefore can obtain thickness uniformly away from the fluorescent material glue-line that applies.
Referring to Fig. 2 and Fig. 3; The process of between lens 5 and secondary lens 7, filling phosphor gel 6 is: through point gum machine the phosphor gel in the syringe 96 is injected from the gum-injecting port 8 on secondary lens 7 or the base plate for packaging 3, flowed out from the gum-injecting port 8 on other one side up to phosphor gel 6 and then stop injecting glue.This filling mode can effectively squeeze the air in the gap, prevents to cause situation such as the gap increase that clearance air expands and causes, lens come off owing to generate heat in the great power LED course of work.
Participate in Fig. 4, adopt described method for packing to realize that the technological process away from applying of phosphor gel is: the first step, led chip 1 is fixed on the base plate for packaging 3 through scolder, gold thread 2 links to each other led chip 1 with base plate for packaging 3, form the circuit that is communicated with; In second step, lens 5 are installed on the base plate for packaging; In the 3rd step, silica gel 4 is filled in the space that lens 5 and led chip 1, base plate for packaging 3 constitute deaeration; In the 4th step, secondary lens 7 is installed on the base plate for packaging substrate 3; In the 5th step, phosphor gel 6 is filled into the gap between secondary lens 7 and the lens 5.After reaching poised state in the gap of phosphor gel 6 between lens 5 and secondary lens 7, put under baking box or the normal temperature and solidify, accomplish fluorescent material away from applying operation.
Being used for the encapsulated LED chip and can being quaternary materials such as binary material such as GaN or AlGaNP forms and other chip.
Fluorescent material in the phosphor gel can be the fluorescent material that all LED encapsulation such as YAG and TAG are adopted.
It can be that glue materials such as silica gel, epoxy resin and liquid glass are formed that the configuration phosphor gel is used the glue material.
Fluorescent material can be adjusted according to lighting requirement in the phosphor gel, and its concentration can be 0.01g/ml～5.0g/ml.
Described lens are hemispheres, and the inner surface of secondary lens is that spherical outer surface is the free form surface shape.
Described base plate for packaging can be led support, printed circuit board (PCB), ceramic substrate or silicon substrate etc.
LED packing forms such as described method for packing can stent-type, chip on board, array and system in package.
Referring to Fig. 5 and Fig. 6, the difference of present embodiment and embodiment 1 is: the inner surface of secondary lens 7 is not a hemisphere, but semielliptical shape, in uneven thickness away from the phosphor gel that applies that obtains, but the phosphor gel top thickness is little, bottom thickness is big.The benefit of doing like this is: according to the principle of luminosity of white light LEDs; When the blue light that comes out from led chip 1 passes phosphor gel 6; The part blue light can and change into gold-tinted by the fluorescent material absorption, and the blue light that passes phosphor gel 6 obtains white light with the yellow light mix that is transformed by fluorescent material.But the blue light of led chip 1 emission meets the lambertian distribution characteristic; The top light intensity is maximum; Reduce gradually along with the increase of angle; And fluorescent powder grain has scattering properties, carries out the scattering of gold-tinted to each direction, and the result who causes thus is that phenomenons such as yellow circle or blue circle can appear in the hot spot of partial L ED.Through changing away from the thickness that applies, can control the ratio of gold-tinted and blue light, thereby reach the appearance that alleviates or eliminate yellow circle or blue circle, improve the color homogeneity and the consistency of LED product.
Referring to Fig. 7 and Fig. 8, the difference of present embodiment and embodiment 1 is: the inner surface of secondary lens 7 is not a hemisphere, and its cross section is rectangle or other shapes trapezoidal or that other inner surface end faces are the plane; The outer surface of lens 5 is that hemisphere or end face are other shapes on plane.The benefit of doing like this is: can realize that the even or uneven plane phosphor gel of thickness is away from coat.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the disclosed content of this embodiment and accompanying drawing.So everyly do not break away from the equivalence of accomplishing under the disclosed spirit of the present invention or revise, all fall into the scope of the present invention's protection.
Claims (9)
1. realize that in the LED encapsulation phosphor gel is away from the method for packing that applies for one kind; It is characterized in that; Phosphor gel is filled in lens in LED encapsulation and the gap between the secondary lens; The thickness of phosphor gel is adjusted according to the gap length between lens and the secondary lens, realizes thickness even or heterogeneous.
2. method for packing according to claim 1 is characterized in that, lens are that hemisphere or rectangle or inside top are the free form surface on plane.
3. method for packing according to claim 1 is characterized in that, the outer surface of secondary lens is a free form surface, and inner surface is that hemisphere or rectangle or trapezoidal or top are other shapes on plane.
4. the described method for packing of claim 1 is characterized in that, the concentration of fluorescent material is 0.01g/ml～5.0g/ml in the phosphor gel.
5. the method for arbitrary described method for packing control phosphor powder layer geometry in the LED encapsulation in the claim 1 to 4 is characterized in that this method comprises the steps:
1. led chip is fixed on the base plate for packaging, and with forming the circuit that is communicated with between led chip and the base plate for packaging;
2. lens are installed on the base plate for packaging;
3. silica gel is filled in the space that lens and led chip, base plate for packaging constitute deaeration;
4. secondary lens is installed on the base plate for packaging;
5. phosphor gel is filled into the gap between secondary lens and the lens; After reaching poised state in the gap of phosphor gel between lens and secondary lens, solidify, accomplish fluorescent material away from applying operation.
6. the method for the described method for packing of claim 5 control phosphor powder layer geometry in LED encapsulation is characterized in that, the fluorescent material in the phosphor gel comprises that the LED that is useful on of institute of YAG and TAG encapsulates the fluorescent material of employing.
7. the method for the described method for packing of claim 6 control phosphor powder layer geometry in the LED encapsulation is characterized in that it is silica gel, epoxy resin or liquid glass that the configuration phosphor gel is used the glue material.
8. the method for the described method for packing of claim 7 control phosphor powder layer geometry in the LED encapsulation is characterized in that described base plate for packaging is led support, printed circuit board (PCB), ceramic substrate or silicon substrate.
9. the method for the described method for packing of claim 8 control phosphor powder layer geometry in the LED encapsulation is characterized in that described method for packing is the various LED packing forms that comprise stent-type, chip on board, array and system in package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100061025A CN102569558A (en) | 2012-01-06 | 2012-01-06 | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100061025A CN102569558A (en) | 2012-01-06 | 2012-01-06 | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102569558A true CN102569558A (en) | 2012-07-11 |
Family
ID=46414494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100061025A Pending CN102569558A (en) | 2012-01-06 | 2012-01-06 | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102569558A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104821360A (en) * | 2014-02-05 | 2015-08-05 | Lg伊诺特有限公司 | Light emitting device package and lighting apparatus including the same |
| CN107068815A (en) * | 2017-04-11 | 2017-08-18 | 安徽芯瑞达科技股份有限公司 | A kind of quantum dot powder filled cavity lens and preparation method thereof |
| CN107195763A (en) * | 2017-05-08 | 2017-09-22 | 安徽芯瑞达科技股份有限公司 | A kind of cavity lens of quantum dot solution filling and preparation method thereof |
| CN117276424A (en) * | 2023-11-17 | 2023-12-22 | 江西斯迈得半导体有限公司 | LED packaging method and LED packaging structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101404317A (en) * | 2008-11-12 | 2009-04-08 | 鹤山丽得电子实业有限公司 | High-power white light LED packaging method |
| US20100060157A1 (en) * | 2008-09-10 | 2010-03-11 | Wei Shi | Phosphor layer arrangement for use with light emitting diodes |
| CN102176505A (en) * | 2011-01-13 | 2011-09-07 | 天津科技大学 | Integrated LED light source system |
-
2012
- 2012-01-06 CN CN2012100061025A patent/CN102569558A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100060157A1 (en) * | 2008-09-10 | 2010-03-11 | Wei Shi | Phosphor layer arrangement for use with light emitting diodes |
| CN101404317A (en) * | 2008-11-12 | 2009-04-08 | 鹤山丽得电子实业有限公司 | High-power white light LED packaging method |
| CN102176505A (en) * | 2011-01-13 | 2011-09-07 | 天津科技大学 | Integrated LED light source system |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104821360A (en) * | 2014-02-05 | 2015-08-05 | Lg伊诺特有限公司 | Light emitting device package and lighting apparatus including the same |
| CN104821360B (en) * | 2014-02-05 | 2019-07-12 | Lg伊诺特有限公司 | Light emitting device packaging piece and lighting apparatus including the light emitting device packaging piece |
| CN107068815A (en) * | 2017-04-11 | 2017-08-18 | 安徽芯瑞达科技股份有限公司 | A kind of quantum dot powder filled cavity lens and preparation method thereof |
| CN107195763A (en) * | 2017-05-08 | 2017-09-22 | 安徽芯瑞达科技股份有限公司 | A kind of cavity lens of quantum dot solution filling and preparation method thereof |
| CN117276424A (en) * | 2023-11-17 | 2023-12-22 | 江西斯迈得半导体有限公司 | LED packaging method and LED packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102130227B (en) | Encapsulation process for white light LED with optical lens | |
| US20120025214A1 (en) | Led packaging structure and packaging method | |
| CN104253194A (en) | Structure and method for packaging of chip-size white LED (light emitting diode) | |
| CN101452986A (en) | Encapsulation structure and method for white light emitting diode device | |
| CN105720164B (en) | A kind of preparation method of white light LEDs | |
| CN204088306U (en) | A kind of white light LEDs module | |
| CN102437273B (en) | LED packaging device capable of realizing lens-free packaging by utilizing surface modification and method thereof | |
| CN104393145A (en) | Ceramic-substrate-contained white-light LED with low thermal resistance and high brightness | |
| CN102569558A (en) | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application | |
| CN202058783U (en) | LED encapsulated reflecting cup | |
| CN103325926B (en) | LED packaging structure used in on-board chip and fluorescent powder coating method thereof | |
| CN104409607A (en) | High color rendering index 360 DEG light emitting LED filament lamp | |
| CN102227011B (en) | Reflector cup and method for controlling geometric shape of fluorescent powder layer in LED (light-emitting diode) packaging by using same | |
| CN204732409U (en) | A kind of encapsulating structure of LED silk | |
| CN202487663U (en) | Free-form surface lens | |
| CN104465965B (en) | A kind of fluorescent powder film preparation method for white light LEDs wafer-level packaging | |
| CN103117352B (en) | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it | |
| CN105575957A (en) | COB light source for white light LED | |
| CN202972699U (en) | Parabolic aluminum reflector (PAR) lamp | |
| CN213340373U (en) | Fluorescent powder-free multi-primary-color LED packaging structure | |
| CN102569615B (en) | Free-form surface lens and method of realizing shape-preserving coating for same | |
| CN110767792A (en) | COB light source and preparation method thereof | |
| CN203055985U (en) | LED packaging structure | |
| CN108019630B (en) | High-power LED bulb | |
| CN206546830U (en) | A kind of LED encapsulation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |