CN102176505A - Integrated LED light source system - Google Patents
Integrated LED light source system Download PDFInfo
- Publication number
- CN102176505A CN102176505A CN2011100065055A CN201110006505A CN102176505A CN 102176505 A CN102176505 A CN 102176505A CN 2011100065055 A CN2011100065055 A CN 2011100065055A CN 201110006505 A CN201110006505 A CN 201110006505A CN 102176505 A CN102176505 A CN 102176505A
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- CN
- China
- Prior art keywords
- light source
- led chip
- substrate
- free form
- collector lens
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention relates to an integrated LED light source system, comprising a substrate, an LED chip, a silica gel, a free-form curve condenser lens and a lead, wherein the LED chip is fixedly installed on the substrate and electrically connected with the substrate through a welding pad through a pad; the free-form curve condenser lens covers the LED chip and the lead; the free-form curve condenser lens is cured on the substrate; and the silica gel is filled between the LED chip and the free-form curve condenser lens. The integrated LED light source obtained in the invention has the advantages of increasing the light emission efficiency without needing a secondary optical design, reducing the design complexity of a lighting system, and decreasing the volume; besides, the condenser lens is replaced with the traditional epoxy resin encapsulation, the integrated LED light source system has the advantages of high light utilization rate, high integration degree, simple structure and convenience for use, can be directly applied to various lighting devices such as streetlamps, decorative lamps, advertisement boards, indoor lights and indoor decorations to satisfy lighting demands of people.
Description
Technical field
The present invention relates to semiconductor lighting and optical technical field, relate to led light source, especially a kind of free form surface collector lens control led light source rising angle, light utilization efficiency height, integrated LED light source system that integrated level is high of using.
Background technology
Light-emitting diode (Light emitting diode-LED) is a kind of novel semiconductor illuminating light source, and it has antidetonation, good impact resistance, and volume is little, light ray energy concentration degree height, and the life-span is long, and the response time is fast, advantages such as environmental protection.These advantages of led light source make it surmount conventional light source such as incandescent lamp, fluorescent lamp greatly at aspects such as performance and manufacturings, therefore are widely used in a plurality of fields such as daily life and industrial production.The maximum value of led light source is embodied in lighting field, and it is widely used in the multiple lighting apparatus such as street lamp, decorative lamp, billboard, room lighting, interior decoration, has satisfied the various lighting demands of people.Extensive use along with led light source, people have proposed requirement to the light utilization efficiency of led light source, because LED is a planar light source, its lighting angle is ± 90 °, but in a lot of lighting apparatus, be merely able to use the light in the certain angle scope, the light outside angular range has just been lost so, and the utilance of light will reduce greatly like this.For example, when led light source is applied to street lamp, only have an appointment ± light in 60 ° of scopes can shine on the road surface, and the utilance of light is not high.Therefore just need provide a kind of led light source that can control rising angle, to improve the light utilization efficiency of led light source.
By retrieval, found one piece of one piece patent close: a kind of integrated LED light source assembly (CN201103857) with patent of the present invention, comprise led light source, the heat dissipation metal base plate, be coated with a heat radiation glue-line on the described heat dissipation metal base plate face, the thermal paste aspect is provided with a light source layer of being made up of several led chips that are connected in parallel, be packaged with a layer of silica gel on the described light source aspect, one or both sides are provided with the led chip lead and just are electrically connected on the described heat dissipation metal base plate face, negative terminal pad is owing to adopted the integrated LED light source assembly of said structure to have the brightness height, good heat dissipation effect, volume is small and exquisite, advantages such as long service life.
The problem problem solved by the invention just that the patent that retrieves exists.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art part, provide a kind of and can control rising angle, light utilization efficiency height and collector lens and led chip integrates, integrated level is high integrated LED light source system.
The object of the present invention is achieved like this:
A kind of integrated LED light source system, constitute by substrate, led chip, silica gel, free form surface collector lens and lead-in wire, on substrate, install led chip, this led chip adopts lead-in wire and substrate to electrically connect by its weld pad, led chip and lead-in wire are covered with free form surface collector lens cover, this free form surface collector lens is solidificated on the substrate, filling gel between led chip and free form surface collector lens.
And described led chip is bonded and fixed on the substrate by elargol, and adopts terminal conjunction method will go between respectively and chip pad and substrate bonding.
And described led chip is selected for use red/green/blue monochromatic light chip is perhaps selected surface applied yellow fluorescent powder blue-light LED chip for use.
And the refractive index of described silica gel is in 1.4～1.7 scopes.
And the free form surface form is all adopted on the upper and lower surface of described free form surface collector lens, perhaps adopts the combining form of free form surface/sphere, and this free form surface collector lens is solidificated on the substrate by AB glue or UV glue bond.
Advantage of the present invention and good effect are:
1, the present invention at first utilizes the rising angle of a slice collector lens control led light source: collector lens utilizes the converge effect of free form surface to light, expeditiously led chip is sent ± 90 ° light pools as required ± light in 10 °～± 80 ° scopes, improved the utilance of light greatly.
2, the present invention is packaged together collector lens and led chip again, and collector lens is covered on led chip and the lead-in wire, and this part is shielded, and makes that also the led light source integrated level is the highest simultaneously.
3, the integrated LED light source that obtains of the present invention need not to utilize the secondary optics design to improve light extraction efficiency, has reduced the design complexities of illuminator, has reduced volume; And the traditional epoxy encapsulation of collector lens replacement, have the light utilization efficiency height, the integrated level height, simple in structure, advantage easy to use can directly be applied in the multiple lighting apparatus such as street lamp, decorative lamp, billboard, room lighting, interior decoration, satisfies people's lighting demand.
Description of drawings
Fig. 1 is an integrated LED light source system configuration schematic diagram of the present invention;
Fig. 2 is the vertical view of Fig. 1.
Embodiment
The invention will be further described below by specific embodiment, and following examples are descriptive, is not determinate, can not limit protection scope of the present invention with this.
A kind of integrated LED light source system, referring to Fig. 1,2, by substrate 1, led chip 2, silica gel 3, free form surface collector lens 4 with go between and 5 constitute, substrate plays a part to support and conduction, led chip is selected for use red/green/blue monochromatic light chip also is bonded and fixed on the substrate by elargol, and adopting terminal conjunction method (wire-bonding) will go between respectively and chip pad and substrate bonding, chip pad is connected with substrate, has realized conducting of integrated LED light source inside; Substrate is connected on the metal core printed board (MCPCB) by outer lead, is connected with external circuit by MCPCB again, has realized conducting of integrated LED light source outside.
Led chip and lead-in wire are covered with free form surface collector lens cover, this free form surface collector lens cover is solidificated on the substrate by AB glue or UV glue bond, the free form surface design is all adopted on the upper and lower surface of free form surface collector lens, control ability to light is strong, receipts optical efficiency height, collector lens prepares material selection polymethyl methacrylate (acrylic), and transmitance is higher, and light loss is less relatively; Filling gel between led chip and the free form surface collector lens, the refractive index of this silica gel are in 1.4～1.7 scopes, and it reduces the reflection of light loss by refractive index match (index-matching), also plays the effect of protection led chip simultaneously.
The free form surface collector lens converges the light that led chip sends by its upper and lower surface; with led chip send ± 90 ° light converges to as required ± 10 °～± 80 ° scopes in, the free form surface collector lens also plays a protective role to led chip and lead-in wire simultaneously.
In addition, led chip also can be selected blue-light LED chip surface applied yellow fluorescent powder for use, and blue light and gold-tinted are by spacing color mixed generation white light; The upper and lower surface of free form surface collector lens also can be adopted free form surface design and sphere design respectively, all adopt the collector lens of free form surface design to compare with upper and lower surface, the receipts optical efficiency decreases, but because the sphere preparation method is simple, preparation cost has so just reduced the cost of whole system to a certain extent far below the preparation cost of free form surface; Collector lens prepares material also can select Merlon (polycarbonate) for use, and refractive index is higher, stronger relatively to the control ability of light, can improve the receipts optical efficiency to a certain extent.
Parts such as the substrate that adopts among the present invention, led chip, silica gel and lead-in wire have been prior art, therefore do not provide the concrete structure of these parts.
The present invention has adopted the rising angle of a slice collector lens control led light source: collector lens utilizes the effect of converging to light of free form surface or sphere, with led chip send ± 90 ° light pools as required ± light in 10 °～± 80 ° scopes, improved the utilance of light greatly; Simultaneously, the present invention is packaged together collector lens and led chip, and collector lens is covered on led chip and the lead-in wire, and this part is shielded, and makes that also the led light source integrated level is the highest.
The present invention both can obtain the monochromatic light integrated LED light source, also can obtain the white light integrated LED light source; If the free form surface design is all adopted on the upper and lower surface of collector lens, and is stronger to the control ability of light, therefore the integrated LED light source that can obtain having higher receipts optical efficiency; If the upper and lower surface of collector lens is adopted free form surface design and sphere design respectively, to the control ability of light a little less than, but preparation simply, can reduce the cost of whole system.As seen the integrated LED light source that led light source of the present invention all is rising angle may command, light utilization efficiency height, integrated level is high.
The present invention utilizes the free form surface collector lens to improve the utilance of light, and collector lens replaces traditional epoxy encapsulation, has the light utilization efficiency height, the integrated level height, simple in structure, advantage easy to use can directly be applied in the multiple lighting apparatus such as street lamp, decorative lamp, billboard, room lighting, interior decoration, satisfies people's lighting demand.
Need to prove: the fundamental curve of free form surface does not have the degree of freedom constraint of specific analytic expression, and its every bit is to come according to the best spotlight effect optimization of all light of light source, so this kind design can reach the theoretical limit of optical concentration efficient.
Operation principle of the present invention is:
The present invention combines the semiconductor lighting technology with optical technology, with a slice free form surface collector lens control led chip send ± 90 ° light, as required it is pooled ± 10 °～light in ± 80 ° of scopes; The present invention covers on collector lens on led chip and the lead-in wire again and is packaged together, and makes that the led light source integrated level is the highest.
Scope of the present invention is not limited to the execution mode of the above, also comprises substrate, led chip, silica gel, free form surface collector lens and lead-in wire etc. are made up formed integrated LED light source according to different modes.The variation that all shapes according to the present invention, structure are done all is included in protection scope of the present invention.
Claims (5)
1. integrated LED light source system, it is characterized in that: constitute by substrate, led chip, silica gel, free form surface collector lens and lead-in wire, on substrate, install led chip, this led chip adopts lead-in wire and substrate to electrically connect by its weld pad, led chip and lead-in wire are covered with free form surface collector lens cover, this free form surface collector lens is solidificated on the substrate, filling gel between led chip and free form surface collector lens.
2. integrated LED light source according to claim 1 system, it is characterized in that: described led chip is bonded and fixed on the substrate by elargol, and adopts terminal conjunction method will go between respectively and chip pad and substrate bonding.
3. integrated LED light source according to claim 1 and 2 system, it is characterized in that: described led chip is selected red/green/blue monochromatic light chip for use, perhaps selects surface applied yellow fluorescent powder blue-light LED chip for use.
4. integrated LED light source according to claim 1 system, it is characterized in that: the refractive index of described silica gel is in 1.4～1.7 scopes.
5. integrated LED light source according to claim 1 system, it is characterized in that: the free form surface form is all adopted on the upper and lower surface of described free form surface collector lens, perhaps adopt the combining form of free form surface/sphere, this free form surface collector lens is solidificated on the substrate by AB glue or UV glue bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065055A CN102176505A (en) | 2011-01-13 | 2011-01-13 | Integrated LED light source system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065055A CN102176505A (en) | 2011-01-13 | 2011-01-13 | Integrated LED light source system |
Publications (1)
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| CN102176505A true CN102176505A (en) | 2011-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100065055A Pending CN102176505A (en) | 2011-01-13 | 2011-01-13 | Integrated LED light source system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569558A (en) * | 2012-01-06 | 2012-07-11 | 华中科技大学 | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application |
| CN106195668A (en) * | 2016-08-30 | 2016-12-07 | 华南理工大学 | A kind of optical system of ultraviolet LED face solidification and preparation method thereof |
| CN108807359A (en) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | A kind of LED component and manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201103857Y (en) * | 2007-11-21 | 2008-08-20 | 江珏 | Integrated LED light source component |
| CN101382251A (en) * | 2007-09-07 | 2009-03-11 | 胡晓兵 | LED lamp |
| JP2009087785A (en) * | 2007-09-28 | 2009-04-23 | Stanley Electric Co Ltd | Lighting fixture for vehicle |
| CN101452987A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for applying guidance type light emitting diode device |
| CN201964190U (en) * | 2011-01-13 | 2011-09-07 | 天津科技大学 | Integral LED light source system |
-
2011
- 2011-01-13 CN CN2011100065055A patent/CN102176505A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101382251A (en) * | 2007-09-07 | 2009-03-11 | 胡晓兵 | LED lamp |
| JP2009087785A (en) * | 2007-09-28 | 2009-04-23 | Stanley Electric Co Ltd | Lighting fixture for vehicle |
| CN201103857Y (en) * | 2007-11-21 | 2008-08-20 | 江珏 | Integrated LED light source component |
| CN101452987A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for applying guidance type light emitting diode device |
| CN201964190U (en) * | 2011-01-13 | 2011-09-07 | 天津科技大学 | Integral LED light source system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569558A (en) * | 2012-01-06 | 2012-07-11 | 华中科技大学 | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application |
| CN106195668A (en) * | 2016-08-30 | 2016-12-07 | 华南理工大学 | A kind of optical system of ultraviolet LED face solidification and preparation method thereof |
| CN108807359A (en) * | 2018-07-26 | 2018-11-13 | 中山市光圣半导体科技有限责任公司 | A kind of LED component and manufacturing method |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110907 |