CN108036243B

CN108036243B - LED ground lamp

Info

Publication number: CN108036243B
Application number: CN201711219128.7A
Authority: CN
Inventors: 张亮
Original assignee: Yangzhou Weihe Photoelectric Co Ltd
Current assignee: Yangzhou Weihe photoelectric Co., Ltd
Priority date: 2017-11-28
Filing date: 2017-11-28
Publication date: 2020-10-02
Anticipated expiration: 2037-11-28
Also published as: CN108036243A

Abstract

The invention relates to an LED floor lamp, which comprises: the LED lamp comprises an inner lamp holder (1), an intelligent control module (2), a substrate (3), a light source (4) and a light-transmitting cover (5); the inner lamp holder (1) is arranged at the upper end of the base plate (3), the base plate (3) is buried under the ground, the intelligent control module (2) is arranged in the base plate (3) and connected with an external power supply, and the light source (4) is arranged at the top of the base plate (3) and is flush with the ground; the light-transmitting cover (5) is arranged in the substrate (3) and fixed on the side wall of the substrate (3) and the lower end of the light source (4). The LED ground lamp provided by the invention has the advantages of high light-emitting rate, high light-emitting efficiency, good heat dissipation effect and simple structure.

Description

LED ground lamp

Technical Field

The invention belongs to the technical field of LED light emitting, and particularly relates to an LED ground lamp.

Background

The Light-Emitting Diode (LED) has the characteristics of long service life, high luminous efficiency, good color rendering, safety, reliability, rich color and easy maintenance. Under the background of today's increasingly serious environmental pollution, climate warming and energy shortage, the semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21 st century. This is a major leap in the history of human lighting since gas lighting, incandescent lamps and fluorescent lamps, and has rapidly improved the lighting quality of human life.

Because of the advantages of LEDs, LEDs are rapidly replacing traditional light sources as the primary light source for commercial and home lighting. Various lighting fixtures based on LEDs are emerging. The LED ground lamp is widely used for illumination of lawns, landscapes and parks. Because the LED floor lamp is buried under the ground and the lamp body structure is designed to bear the weight of pedestrians and even vehicles, the lamp body structure of the floor lamp is usually made into a small and firm enclosure. Therefore, there are also higher demands for light sources among them, which must be small, long-life, low in heat generation, and stable in performance, and LEDs just satisfy the above-mentioned demands.

However, due to the limitation of the heat productivity of the LED ground lamp, the existing LED ground lamp has small power, small volume and limited luminous brightness, and can not meet the requirements of practical use in many occasions; therefore, how to improve the luminance of the LED floor lamp and control the amount of heat generated by the LED floor lamp are more and more important.

Disclosure of Invention

In order to improve the working performance of the LED ground lamp, the invention provides the LED ground lamp; the technical problem to be solved by the invention is realized by the following technical scheme:

an embodiment of the present invention provides an LED floor lamp, including: the intelligent control system comprises an inner lamp holder 1, an intelligent control module 2, a substrate 3, a light source 4, a light-transmitting cover 5, a reflector 6 and a cover plate 7; wherein, the base plate 3 set up in the lighting fixture 1, intelligent control module 2 set up in the space that lighting fixture 1 and base plate 3 formed, light source 4 set up in on the base plate 3, printing opacity cover 5 set up in the lighting fixture 1 and be fixed in the lateral wall of interior lighting fixture 1 with apron 7 lower extreme, reflector panel 6 set up in the lateral wall of interior lighting fixture 1, apron 7 set up in 1 top of interior lighting fixture.

In one embodiment of the present invention, the light-transmissive cover 5 is a hemispherical light-transmissive cover; two end points of the light-transmitting cover 5 are fixed on the side wall of the inner lamp holder 1, and the hemispherical circular arc vertex of the light-transmitting cover 5 is fixed at the lower end of the cover plate 7.

In one embodiment of the present invention, the reflector 6 is a mirror or an aluminum sheet.

In one embodiment of the present invention, the intelligent control module 2 includes: a communication unit 21, a drive unit 22, and a control unit 23; the communication unit 21 is communicatively connected to a control terminal, the driving unit 22 is electrically connected to the light source 4, and the control unit 23 is electrically connected to the communication unit 21 and the driving unit 22.

In one embodiment of the present invention, the cover plate 7 is a high-strength glass plate and the lower surface is a concave lens structure.

In one embodiment of the present invention, a plurality of circular holes are provided in the substrate 3.

In one embodiment of the invention, the LED floor lamp further comprises an outer lamp holder 8; wherein, there is the isolation cavity between outer lighting fixture 8 and interior lighting fixture 1.

In one embodiment of the present invention, the upper part of the outer lamp holder 8 is provided with a pressure sensor 9; wherein, the pressure sensor 9 is electrically connected with the intelligent control module 2.

In one embodiment of the invention, one or more high power LED lamps 40 are arranged on the light source 4.

In an embodiment of the present invention, the high power LED lamp 40 sequentially includes, from bottom to top: a heat dissipation substrate 401, a lower layer of silica gel 402, a hemispherical silica gel lens 403 and an upper layer of silica gel 404; an RGB three-primary-color LED chip is disposed between the heat dissipation substrate 401 and the lower layer of silica gel 402.

Compared with the prior art, the invention has the following beneficial effects:

1. the LED ground lamp provided by the invention has the advantages of high luminous efficiency, good heat dissipation effect and simple structure.

2. The LED ground lamp provided by the invention can better transmit the light of the LED light source, and the luminous efficiency of the LED ground lamp is improved; meanwhile, the LED ground lamp provided by the invention has stable structure, can save stable structure components such as a cross-shaped protective bracket of the LED ground lamp, prevent the components with stable structures such as the cross-shaped protective bracket from blocking light, improve the light-emitting rate and simplify the structure of the LED ground lamp.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Other aspects and features of the present invention will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.

Fig. 1 is a schematic structural diagram of an LED floor lamp according to an embodiment of the present invention;

fig. 2 is a schematic view of an operating principle of an LED floor lamp according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an RGB three-primary-color LED chip according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a heat dissipation substrate according to an embodiment of the invention;

FIG. 6a is a schematic cross-sectional view of a hemispherical silica gel lens according to an embodiment of the invention;

FIG. 6b is a schematic cross-sectional view of another hemispherical silicone lens according to an embodiment of the invention;

fig. 7 is a schematic flow chart of a method for manufacturing an LED lamp according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.

Example one

Referring to fig. 1, fig. 1 is a schematic structural diagram of an LED floor lamp according to an embodiment of the present invention, including: the intelligent control system comprises an inner lamp holder 1, an intelligent control module 2, a substrate 3, a light source 4, a light-transmitting cover 5, a reflector 6 and a cover plate 7; wherein, the base plate 3 set up in the lighting fixture 1, intelligent control module 2 set up in the space that lighting fixture 1 and base plate 3 formed, light source 4 set up in on the base plate 3, printing opacity cover 5 set up in the lighting fixture 1 and be fixed in the lateral wall of interior lighting fixture 1 with apron 7 lower extreme, reflector panel 6 set up in the lateral wall of interior lighting fixture 1, apron 7 set up in 1 top of interior lighting fixture.

The intelligent control module is arranged between the inner lamp holder and the substrate, so that a certain cavity area is formed between the inner lamp holder and the substrate, and the heat dissipation of the LED ground lamp is facilitated.

Preferably, the light-transmitting cover 5 is a hemispherical light-transmitting cover; two end points of the light-transmitting cover 5 are fixed on the side wall of the inner lamp holder 1, and the hemispherical circular arc vertex of the light-transmitting cover 5 is fixed at the lower end of the cover plate 7.

Specifically, the reflector 6 is a reflector or an aluminum sheet.

Wherein, through set up reflector panel 6 between 5 covers of printing opacity and apron 7, can utilize reflector panel 6's reflex action, go out more light reflection for the floor lamp light-emitting rate is higher, can be brighter.

Preferably, please refer to fig. 2, fig. 2 is a schematic view illustrating an operating principle of an LED floor lamp according to an embodiment of the present invention; the intelligent control module 2 may include: a communication unit 21, a drive unit 22, and a control unit 23; the communication unit 21 is communicatively connected to a control terminal, the driving unit 22 is electrically connected to the light source 4, and the control unit 23 is electrically connected to the communication unit 21 and the driving unit 22.

The communication unit is connected with the control terminal in a wireless or wired mode, the control terminal sends the control command to the communication unit, the communication unit sends the received control command to the control unit, and the control unit drives the LED ground lamp to emit light or not to emit light according to the control command.

Preferably, the cover plate 7 is a high-strength glass plate, and the lower surface of the cover plate is of a concave lens structure, so that the irradiation range of the ground lamp can be enlarged by adopting the concave lens structure, and the light can be more effectively utilized.

Preferably, a plurality of circular holes are arranged in the substrate 3; wherein, the mode of setting up the round hole in the base plate is adopted, when its intensity does not change almost, manufacturing cost has been reduced to utilize the mode of round hole, can increase the passageway of circulation of air, make full use of the heat convection between the air, improved the radiating effect of LED ground lamp.

Preferably, in one embodiment of the present invention, the LED floor lamp further comprises an outer lamp holder 8; wherein, an isolation cavity is arranged between the outer lamp holder 8 and the inner lamp holder 1; through outer lighting fixture 8 with the isolation cavity between the interior lighting fixture 1, can effectively block moisture and aqueous vapor on ground, improved LED ground lamp's life.

In one embodiment of the present invention, the upper part of the outer lamp holder 8 is provided with a pressure sensor 9; the pressure sensor 9 is electrically connected with the intelligent control module 2; the intelligent control module can drive the LED ground lamp to emit light or not according to information fed back by the pressure sensor, so that the LED ground lamp can emit light according to automatic control of passing vehicles or pedestrians and the like, and the LED ground lamp is more intelligent and energy-saving.

Preferably, one or more LED lamps 40 are disposed on the light source 4.

According to the LED ground lamp provided by the embodiment, the hemispherical light-transmitting cover is arranged between the LED light source and the cover plate, so that light rays of the LED light source can be better transmitted out, and the light-emitting rate of the LED ground lamp is improved; meanwhile, the top point and the two end points of the hemispherical light-transmitting cover are respectively fixed with the cover plate and the lamp body, so that the structural stability of the LED ground lamp is improved, stable structural components of the LED ground lamp such as a cross protective support can be omitted, the components of stable structures such as the cross protective support are prevented from blocking light, the light-emitting rate is improved, and the structure of the LED ground lamp is simplified.

Example two

This embodiment describes in detail the structure of the LED lamp 40 of the present invention on the basis of the above-described embodiments, as follows.

In the above embodiment, the LED lamp 40 is a high-power LED lamp, and the heat generated by the high-power LED lamp is large, so that a novel high-transmittance high-power LED lamp is needed to be provided in order to improve the light emitting efficiency of the high-power LED lamp and reduce the heat dissipation of the high-power LED lamp, and to select as few high-power LED lamps as possible without reducing the brightness.

Specifically, referring to fig. 3, fig. 3 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention, where the LED lamp 40 sequentially includes, from bottom to top: a heat dissipation substrate 401, a lower layer of silica gel 402, a hemispherical silica gel lens 403 and an upper layer of silica gel 404; an RGB three-primary-color LED chip is disposed between the heat dissipation substrate 401 and the lower layer of silica gel 402.

Referring to fig. 4, fig. 4 is a schematic diagram illustrating a structural principle of an RGB three-primary-color LED chip according to an embodiment of the present invention, the RGB three-primary-color LED chip avoids a problem of uneven light emission caused by uneven doping of phosphor, and simultaneously improves a problem of reduced light emission rate caused by the phosphor being in a granular form.

Preferably, referring to fig. 5, fig. 5 is a schematic cross-sectional view of a heat dissipation substrate according to an embodiment of the present invention, the heat dissipation substrate 401 is made of aluminum, the thickness D of the heat dissipation substrate 401 is 0.5-10 mm, a circular through hole is disposed in the heat dissipation substrate 401, and the circular through hole is arranged in the heat dissipation substrate 401 along a width direction and forms a certain included angle with a plane of the heat dissipation substrate 401; wherein the number of the circular through holes is n, n is more than or equal to 2, the diameter is 0.1-0.3 mm, and the included angle between the circular through holes and the plane of the radiating substrate 401 is 1-10^oAnd the distance A between the circular through holes is 0.5-10 mm.

The aluminum heat dissipation substrate adopted by the heat dissipation substrate 401 has the characteristics of large heat capacity, good heat conduction effect, difficult deformation and close contact with a heat dissipation substrate device; set up circular through-hole in aluminium radiating basal plate inside, make LED when its intensity does not change almost, reduced the aluminum product cost to utilize the mode of middle oblique through-hole, can increase the passageway of circulation of air, utilize the chimney effect to promote the heat convection rate of air, improved LED's radiating basal plate's radiating effect.

Specifically, the lower layer of silica gel 403 does not contain phosphor and is made of a high temperature resistant material.

Preferably, the material of the lower layer silicone gel 403 may be modified epoxy resin or silicone material.

The silica gel in contact with the LED chip is high-temperature-resistant silica gel, so that the problem of light transmittance reduction of the silica gel due to aging and yellowing of the silica gel under a high-temperature condition is solved.

Preferably, the hemispherical silicone lens 403 is formed on the upper surfaces of the heat dissipation substrate 401 and the RGB three primary color LED chips; the material of the hemispherical silica lens 403 may be polycarbonate, polymethyl methacrylate, or glass.

Specifically, the diameter of the hemispherical silica gel lenses 403 is 40-200 μm, the distance between the hemispherical silica gel lenses 403 is 40-200 μm, and the hemispherical silica gel lenses 403 do not contain fluorescent powder; the refractive index of the hemispherical silica gel lens 403 is greater than the refractive index of the lower silica gel 402 and the upper silica gel 404; the refractive index of the upper layer silica gel 404 is greater than the refractive index of the lower layer silica gel 402.

The refractive index of the adopted lower layer silica gel is smaller than that of the upper layer silica gel, the refractive index of the material of the spherical silica gel lens is larger than that of the lower layer silica gel and the upper layer silica gel, and the arrangement mode can improve the light transmittance of the LED chip and enable the light emitted by the LED chip to irradiate more.

Preferably, referring to fig. 6a to 6b, fig. 6a is a schematic cross-sectional view of a hemispherical silica gel lens according to an embodiment of the invention, and fig. 6b is a schematic cross-sectional view of another hemispherical silica gel lens according to an embodiment of the invention; the hemispherical silica gel lenses 403 are uniformly arranged in a rectangular or rhombic shape.

Further, an upper layer of silicone rubber 404 is formed on the upper surfaces of the hemispherical silicone lens 403 and the lower layer of silicone rubber 402; the thickness of the upper layer silica gel 405 is 50-500 μm, the refractive index is less than or equal to 1.5, the upper layer silica gel 405 does not contain fluorescent powder, and the refractive index of the upper layer silica gel 404 is greater than that of the lower layer silica gel 402.

Preferably, the material of the upper layer silicone rubber 404 can be epoxy resin, modified epoxy resin, silicone material, methyl silicone rubber, phenyl silicone rubber.

Preferably, the upper layer of silicone 404 has a hemispherical shape, which maximizes the light exit angle of the LED.

Preferably, the upper layer of silicone rubber 404 can also be in two shapes, namely a flat surface and a paraboloid.

The LED lamp provided by the embodiment utilizes the characteristic that different types of silica gel have different refractive indexes, and the lens is formed in the silica gel, so that the problem of light emission dispersion of the LED lamp is solved, and light emitted by a light source can be more concentrated; through the mode of arranging that changes the hemisphere silica gel lens in the LED structure, can guarantee the light of light source and distinguish evenly distributed in the concentration, very big improvement the luminous efficacy of LED lamp.

EXAMPLE III

In this embodiment, a method for manufacturing an LED lamp according to the present invention is described in detail below on the basis of the above embodiments.

Specifically, please refer to fig. 7, and fig. 7 is a schematic flow chart illustrating a method for manufacturing an LED lamp according to an embodiment of the present invention. On the basis of the above embodiments, the present embodiment will describe the process flow of the present invention in more detail. The method comprises the following steps:

s1, preparing a heat dissipation substrate;

s11, preparing a support/heat dissipation substrate;

specifically, a heat dissipation substrate 401 with a thickness of 0.5-10 mm and made of aluminum is selected, and the heat dissipation substrate 401 is cut;

s12, cleaning the support/heat dissipation substrate;

specifically, stains, especially oil stains, on the radiating substrate 401 and the support are cleaned;

s13, baking the support/heat dissipation substrate;

specifically, the cleaned heat dissipating substrate 401 and the rack are baked, and the heat dissipating substrate 401 and the rack are kept dry.

Preferably, a circular through hole which is along the width direction and forms a certain included angle with the plane of the heat dissipation substrate 401 is formed inside the heat dissipation substrate 401; wherein the diameter of the circular through hole is 0.1-0.3 mm, and the included angle between the circular through hole and the plane of the radiating substrate 401 is 1-10 mm^oAnd the distance between the circular through holes is 0.5-10 mm.

Preferably, the circular through-hole in the heat dissipation substrate 401 is formed by a direct casting process or directly slotting in the width direction on the heat dissipation substrate 401.

Preferably, the bracket is used for fixing the RGB three-primary-color LED chip and the lead-out wires;

s2, preparing a chip;

s21, selecting an RGB three-primary-color LED chip;

s22, printing solder on the RGB three-primary-color LED chip;

s23, carrying out die bonding inspection on the RGB three-primary-color LED chip printed with the solder;

s24, soldering the RGB three-primary-color LED chip onto the heat dissipation substrate 401 by using a reflow soldering process.

S3, preparing the lower layer silica gel 402;

specifically, a lower layer of silica gel 402 is coated on the RGB three primary color LED chip, and the preparation of the lower layer of silica gel 402 is completed.

Preferably, the lower layer of silica gel 403 does not contain phosphor.

S4, preparing a hemispherical silica gel lens 403;

s41, coating a first silica gel layer on the upper surface of the lower silica gel 403;

s42, arranging a first hemispherical mold on the first silica gel layer, and forming a first hemispherical silica gel with a hemispherical shape on the first silica gel layer by using the first hemispherical mold;

s43, baking the first hemispherical silica gel provided with the first hemispherical mold, wherein the baking temperature is 90-125 ℃, and the baking time is 15-60 min, so that the first hemispherical silica gel is solidified;

s44, after the baking is completed, the first hemispherical mold disposed in the first silicone rubber layer is removed, and the preparation of the hemispherical silicone lens 403 is completed.

Preferably, the hemispherical silicone lens 403 does not contain phosphor.

S5, preparing upper-layer silica gel 404;

s51, coating a second silica gel layer on the lower silica gel 402 and the hemispherical silica gel lens 403;

s52, arranging a second hemispherical mold on the second silica gel layer, and forming a second hemispherical silica gel with a hemispherical shape on the second silica gel layer by using the second hemispherical mold;

s53, baking the second hemispherical silica gel provided with the first hemispherical mold, wherein the baking temperature is 90-125 ℃, and the baking time is 15-60 min, so that the second hemispherical silica gel is solidified;

and S54, removing the second hemispherical mold arranged in the second silica gel layer to finish the preparation of the upper silica gel 404.

Preferably, the upper layer of silica gel 405 does not contain phosphor.

S6, long-time baking;

specifically, the heat dissipation substrate 401, the RGB three-primary-color LED chip, the lower layer of silica gel 402, the hemispherical silica gel lens 403 and the upper layer of silica gel 404 are integrally baked, the baking temperature is 100-150 ℃, the baking time is 4-12 hours, and the LED packaging is completed.

And S7, testing and sorting the packaged LEDs.

And S8, packaging the LED packaging structure qualified by the test.

The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims

1. An LED floor lamp, comprising: the LED lamp comprises an inner lamp bracket (1), an intelligent control module (2), a base plate (3), a light source (4), a light-transmitting cover (5), a reflector (6) and a cover plate (7); the light source (4) is arranged on the substrate (3), the light-transmitting cover (5) is arranged in the inner lamp holder (1) and fixed on the side wall of the inner lamp holder (1) and the lower end of the cover plate (7), the reflector (6) is arranged on the side wall of the inner lamp holder (1), and the cover plate (7) is arranged at the top of the inner lamp holder (1); wherein the content of the first and second substances,

one or more high-power LED lamps (40) are arranged on the light source (4);

the high-power LED lamp (40) sequentially comprises from bottom to top: the LED display panel comprises a heat dissipation substrate (401), lower-layer silica gel (402), a hemispherical silica gel lens (403) and upper-layer silica gel (404); an RGB (red, green and blue) tricolor LED chip is arranged between the heat dissipation substrate (401) and the lower layer silica gel (402); wherein the content of the first and second substances,

the refractive index of the lower layer silica gel (402) is smaller than that of the upper layer silica gel (404), and the refractive index of the material of the spherical silica gel lens (403) is larger than that of the lower layer silica gel (402) and the upper layer silica gel (401);

the lower layer silica gel (402) is made of a high-temperature resistant material; the hemispherical silica gel lenses (403) are uniformly arranged in a rectangular or rhombic shape, the diameter of each hemispherical silica gel lens (403) is 40-200 mu m, and the distance between every two hemispherical silica gel lenses (403) is 40-200 mu m.

2. The LED floor lamp according to claim 1, characterized in that the light-transmitting cover (5) is a hemispherical light-transmitting cover; two end points of the light-transmitting cover (5) are fixed on the side wall of the inner lamp holder (1), and the hemispherical circular arc top point of the light-transmitting cover (5) is fixed at the lower end of the cover plate (7).

3. The LED floor lamp of claim 1, characterized in that the reflector plate (6) is a reflector or an aluminum sheet.

4. LED floor lamp according to claim 1, characterized in that said intelligent control module (2) comprises: a communication unit (21), a drive unit (22), and a control unit (23); wherein the communication unit (21) is in communication connection with a control terminal, the driving unit (22) is electrically connected with the light source (4), and the control unit (23) is electrically connected with the communication unit (21) and the driving unit (22).

5. The LED floor lamp according to claim 1, characterized in that the cover plate (7) is a high-strength glass plate and the lower surface is a concave lens structure.

6. The LED floor lamp according to claim 1, characterized in that a plurality of circular holes are provided in the base plate (3).

7. LED floor lamp according to claim 1, characterized in that it further comprises an outer lamp holder (8); wherein, an isolation cavity is arranged between the outer lamp holder (8) and the inner lamp holder (1).

8. The LED floor lamp according to claim 7, characterized in that the upper part of the outer lamp holder (8) is provided with a pressure sensor (9); wherein the pressure sensor (9) is electrically connected with the intelligent control module (2).