CN108019669B

CN108019669B - Intelligent LED ground lamp

Info

Publication number: CN108019669B
Application number: CN201711215681.3A
Authority: CN
Inventors: 张亮
Original assignee: Xian Cresun Innovation Technology Co Ltd
Current assignee: Guangzhou Zhenxiong Decorative Engineering Co ltd
Priority date: 2017-11-28
Filing date: 2017-11-28
Publication date: 2020-10-30
Anticipated expiration: 2037-11-28
Also published as: CN108019669A

Abstract

The invention relates to an intelligent LED ground lamp, which comprises: the LED lamp comprises an LED light source (1), a substrate (2), a lamp body (3), an outer layer light-transmitting plate (4) and a light-transmitting cover (5); the LED lamp is characterized in that the lamp body (3) is buried under the ground, the LED light source (1) is arranged at the upper end of the substrate (2), the substrate (2) is arranged in the lamp body (3) and connected with an external power supply, the outer layer light-transmitting plate (4) is arranged at the top of the lamp body (3), and the light-transmitting cover (5) is arranged in the lamp body (3) and fixed on the side wall of the lamp body (3) and the lower side of the outer layer light-transmitting plate (4). The intelligent LED ground lamp provided by the invention has the advantages of high light-emitting rate, high light-emitting efficiency, good heat dissipation effect and simple structure.

Description

Intelligent LED ground lamp

Technical Field

The invention belongs to the technical field of LED light emitting, and particularly relates to an intelligent LED ground lamp.

Background

Currently, as a new Light source, a Light Emitting Diode (LED) has the following advantages compared with a conventional Light source:

the volume is small: the basic structure of the LED is that a chip with a small volume is encapsulated in epoxy resin, so that the overall volume is small.

Low power consumption: the LED has low power consumption, the power consumption of a single LED is below 0.05 watt, and the electro-optic power conversion is high and can reach 30%. Compared with the traditional light source, the energy is saved by more than 50%.

Long service life, the sound construction: the LED is a solid cold light source and is encapsulated by epoxy, which can have a lifetime of up to 10 ten thousand hours. The epoxy vertically provides effective protection for the LED chip inside, and the LED is not easy to damage due to no loose parts.

Just because of the advantages of LEDs, LEDs are rapidly replacing traditional light sources as the primary light source for commercial and household lighting. Various lighting fixtures based on LEDs are emerging. The ground lamp has wide application in areas such as squares, roads and the like. Since the floor lamp is buried under the ground and the lamp body structure is designed to bear the weight of pedestrians and even vehicles, the lamp body structure of the floor lamp is usually made into a small and firm enclosure. Therefore, there is a demand for a light source which is small, has a long life, generates less heat, and has stable performance.

Due to the limitation of the structure and the reduction of the heat productivity of the LED ground lamp, the existing LED ground lamp has small volume and limited luminous brightness, and can not meet the requirements of practical use in many occasions; therefore, it is more and more important to improve the luminance of the LED floor lamp without increasing power consumption and heat dissipation.

Disclosure of Invention

In order to improve the working performance of the intelligent LED ground lamp, the invention provides the intelligent LED ground lamp; the technical problem to be solved by the invention is realized by the following technical scheme:

the embodiment of the invention provides an intelligent LED ground lamp, which comprises: the LED lamp comprises an LED light source 1, a substrate 2, a lamp body 3, an outer layer light-transmitting plate 4 and a light-transmitting cover 5; the LED lamp comprises a lamp body 3, an LED light source 1, a base plate 2, an outer light-transmitting plate 4, a light-transmitting cover 5 and a light-transmitting cover, wherein the lamp body 3 is buried under the ground, the LED light source 1 is arranged at the upper end of the base plate 2, the base plate 2 is arranged in the lamp body 3 and is connected with an external power supply, the outer light-transmitting plate 4 is arranged at the top of the lamp body 3, and the light-transmitting cover 5 is arranged in the.

In one embodiment of the present invention, the light-transmitting cover 5 is a circular arc-shaped light-transmitting cover; two end points of the light-transmitting cover 5 are fixed on the side wall of the lamp body 3, and the arc vertex of the light-transmitting cover 5 is fixed on the lower side of the outer layer light-transmitting plate 4.

In one embodiment of the present invention, the lamp further comprises a light reflecting plate 6 disposed inside the sidewall of the lamp body 3.

In one embodiment of the present invention, the reflector 6 is a mirror or an aluminum sheet.

In one embodiment of the present invention, the intelligent control module 7 is further included and is disposed on the lower side of the substrate 3.

In one embodiment of the present invention, the intelligent control module 7 includes: a communication unit 71, a drive unit 72, and a control unit 73; the communication unit 71 is in communication connection with a control terminal, the driving unit 72 is electrically connected with the LED light source 1, and the control unit 73 is electrically connected with the communication unit 71 and the driving unit 72.

In an embodiment of the present invention, the outer light-transmitting plate 4 is a high-strength glass plate and the lower surface is a concave lens structure.

In one embodiment of the present invention, one or more LED lamps 11 are disposed on the LED light source 1.

In one embodiment of the present invention, the LED lamp 11 includes: the LED lamp comprises a heat dissipation substrate 101, a blue light lamp wick, a first hemispherical silica gel lens 102, lower silica gel 103, a second hemispherical silica gel lens 104 and upper silica gel 105; the blue light lamp wick is arranged on the upper surface of the heat dissipation substrate 101, the first hemispherical silica gel lenses 102 are arranged on the blue light lamp wick and the upper surface of the heat dissipation substrate 101 at intervals, the lower layer silica gel 103 is arranged on the blue light lamp wick and the upper surface of the first hemispherical silica gel lenses 102, and the second hemispherical silica gel lenses 104 are arranged on the upper surface of the lower layer silica gel 103 at intervals; the upper layer of silica gel 105 is disposed on the upper surfaces of the lower layer of silica gel 103 and the second hemispherical silica gel lens 104.

In one embodiment of the present invention, the refractive index of the upper layer silica gel 105 is greater than that of the lower layer silica gel 103; the refractive index of the first spherical silica gel lens 102 is greater than that of the lower silica gel 103; the refractive index of the second hemispherical silica gel lens 104 is greater than that of the upper silica gel 105.

Compared with the prior art, the invention has the following beneficial effects:

1. the intelligent LED ground lamp provided by the invention has the advantages of high luminous efficiency, good heat dissipation effect and simple structure.

2. The intelligent LED ground lamp provided by the invention can better transmit the light of the LED light source, and the luminous efficiency of the LED ground lamp is improved; meanwhile, the LED ground lamp provided by the invention has stable structure, can save stable structure components such as a cross-shaped protective bracket of the LED ground lamp, prevent the components with stable structures such as the cross-shaped protective bracket from blocking light, improve the light-emitting rate and simplify the structure of the LED ground lamp.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Other aspects and features of the present invention will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.

Fig. 1 is a schematic structural diagram of an intelligent LED floor lamp according to an embodiment of the present invention;

fig. 2 is a schematic diagram illustrating a control principle of an intelligent LED ground lamp according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an LED light source according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a heat dissipation substrate according to an embodiment of the invention;

FIG. 6 is a schematic cross-sectional view of a blue light wick according to an embodiment of the present invention;

FIG. 7a is a schematic cross-sectional view of a hemispherical silica gel lens according to an embodiment of the invention;

FIG. 7b is a schematic cross-sectional view of another hemispherical silica gel lens according to an embodiment of the invention;

fig. 8 is a schematic flow chart of a method for manufacturing an LED lamp according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.

Example one

Referring to fig. 1, fig. 1 is a schematic structural diagram of an intelligent LED floor lamp according to an embodiment of the present invention, including: the LED lamp comprises an LED light source 1, a substrate 2, a lamp body 3, an outer layer light-transmitting plate 4 and a light-transmitting cover 5; the LED lamp comprises a lamp body 3, an LED light source 1, a base plate 2, an outer light-transmitting plate 4, a light-transmitting cover 5 and a light-transmitting cover, wherein the lamp body 3 is buried under the ground, the LED light source 1 is arranged at the upper end of the base plate 2, the base plate 2 is arranged in the lamp body 3 and is connected with an external power supply, the outer light-transmitting plate 4 is arranged at the top of the lamp body 3, and the light-transmitting cover 5 is arranged in the.

Preferably, the light-transmitting cover 5 is an arc-shaped light-transmitting cover; two end points of the light-transmitting cover 5 are fixed on the side wall of the lamp body 3, and the arc vertex of the light-transmitting cover 5 is fixed on the lower side of the outer layer light-transmitting plate 4.

Further, the intelligent LED ground lamp also comprises a reflector 6; the reflector 6 is disposed on the inner side of the sidewall of the lamp body 3 and located between the light-transmitting cover 5 and the outer light-transmitting plate 4.

Preferably, the light reflecting plate 6 may be a mirror or an aluminum sheet.

Wherein, through set up reflector panel 6 between 5 covers of printing opacity and outer light-passing board 4, can utilize the reflex action of reflector panel 6, with more light reflection to outer light-passing board department for the ground lamp can be brighter.

Further, the intelligent LED ground lamp also comprises an intelligent control module 7; wherein, the intelligent control module 7 is arranged at the lower end of the substrate 3.

Preferably, referring to fig. 2, fig. 2 is a schematic view of an operating principle of an intelligent LED floor lamp provided in an embodiment of the present invention, where the intelligent control module 7 may include: a communication unit 71, a drive unit 72, and a control unit 73; the communication unit 71 is in communication connection with a control terminal, the driving unit 72 is electrically connected with the LED light source 1, and the control unit 73 is electrically connected with the communication unit 71 and the driving unit 72.

The communication unit 71 is connected with the control terminal in a wireless or wired mode, the control terminal sends a control command to the communication unit 71, the communication unit 71 sends the received control command to the control unit 73, and the control unit 73 drives the LED ground lamp to emit light or not according to the control command.

Preferably, the outer layer light-transmitting plate 4 can be a high-strength glass plate and the lower surface is a concave lens structure.

Wherein, the lower surface of outer layer light-passing board 4 is concave lens structure, can enlarge the irradiation range of ground lamp, utilizes light more effectively.

Further, referring to fig. 3, fig. 3 is a schematic structural diagram of an LED light source according to an embodiment of the present invention, where one or more LED lamps 11 are disposed on the LED light source 1.

Specifically, the LED lamp 11 is a high-power LED lamp.

According to the intelligent LED ground lamp provided by the embodiment, the arc-shaped light-transmitting cover 5 is arranged between the LED light source 1 and the outer layer light-transmitting plate 4, so that light rays of the LED light source can be transmitted out better, and the light-emitting efficiency of the LED ground lamp is improved; meanwhile, the top point and the two end points of the arc-shaped light-transmitting cover 5 are respectively fixed with the outer layer light-transmitting plate and the lamp body, so that the structural stability of the LED ground lamp is improved, stable structural components of the LED ground lamp such as a cross protective support can be omitted, the components of stable structures such as the cross protective support are prevented from blocking light, the light-emitting rate is improved, and the structure of the LED ground lamp is simplified.

Example two

This embodiment describes in detail the structure of the LED lamp 11 of the present invention on the basis of the above-described embodiments, as follows.

In the above embodiments, the LED lamp may select a part of the LED lamps to be turned on and off according to the illumination intensity of the external environment or an external control signal, and in order to provide a sufficient illumination intensity when the part of the LED lamps is turned off, an LED lamp with higher light emitting efficiency needs to be provided.

Specifically, referring to fig. 4, fig. 4 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention, where the LED lamp 11 includes:

a heat dissipation substrate 101;

the blue light lamp wick is arranged on the upper surface of the heat dissipation substrate 101;

the first hemispherical silica gel lenses 102 are arranged on the upper surfaces of the blue light lamp core and the heat dissipation substrate 101 at intervals;

the lower layer of silica gel 103 is arranged on the blue light lamp wick and the upper surface of the first hemispherical silica gel lens 102;

second hemispherical silica gel lenses 104 arranged on the upper surface of the lower silica gel 103 at intervals;

and an upper layer of silica gel 105 disposed on the upper surfaces of the lower layer of silica gel 103 and the second hemispherical silica gel lens 104.

Specifically, please refer to fig. 5, fig. 6 and fig. 7a to fig. 7b together, in which fig. 5 is a schematic cross-sectional view of a heat dissipation substrate according to an embodiment of the present invention, fig. 6 is a schematic cross-sectional view of a blue light wick according to an embodiment of the present invention, fig. 7a is a schematic cross-sectional view of a hemispherical silica gel lens according to an embodiment of the present invention, and fig. 7b is a schematic cross-sectional view of another hemispherical silica gel lens according to an embodiment of the present invention.

Preferably, as shown in fig. 5, the heat dissipation substrate 101 is made of iron, the thickness D of the heat dissipation substrate 101 is 0.5 to 10mm, circular through holes are formed in the heat dissipation substrate 101, and the circular through holes are arranged in the heat dissipation substrate 101 along the width direction and form a certain included angle with the plane of the heat dissipation substrate 101; the number of the circular through holes is n, n is larger than or equal to 2, the diameter (radius R) is 0.1-0.3 mm, the included angle between the circular through holes and the plane of the radiating substrate 101 is 1-10 degrees, and the distance A between the circular through holes is 0.5-10 mm.

The iron radiating substrate has the characteristics of large heat capacity, good heat conducting effect, difficulty in deformation and close contact with a radiating device, and improves the radiating effect of the LED lamp; in addition, the oblique through holes are formed in the iron radiating substrate in the LED lamp, so that the LED lamp has almost no change in strength, the manufacturing cost is reduced, channels for air circulation can be increased by means of the middle oblique through holes, heat convection among air is fully utilized, and the radiating effect of the LED lamp is improved.

Preferably, as shown in fig. 6, the blue light wick structure includes: a substrate material 201, a GaN buffer layer 202 on the substrate material 201, a GaN layer 203 on the GaN buffer layer 202, a P-type GaN quantum well wide band gap layer 204 on the GaN layer 203, an InGaN layer 205 on the P-type GaN quantum well wide band gap layer 204, a P-type GaN quantum well wide band gap layer 206 on the InGaN layer 205, an AlGaN barrier layer 207 on the P-type GaN quantum well wide band gap layer 206, a P-type GaN layer 208 on the AlGaN barrier layer 207, an anode electrode 209 on the P-type GaN layer 208, and a cathode electrode 210 on the GaN layer 203.

Furthermore, the diameter of the first hemispherical silica gel lenses 102 is 10 to 200 μm, and the distance between the first hemispherical silica gel lenses 102 is 10 to 200 μm.

Further, the diameter of the second hemispherical silica gel lenses 104 is 10 to 200 μm, and the distance between the second hemispherical silica gel lenses 104 is 10 to 200 μm.

The first hemispherical silica gel lens 102 does not contain fluorescent powder, and the lower silica gel 103 does not contain fluorescent powder and is made of high-temperature-resistant silica gel; the second hemispherical silica gel lens 104 and the upper layer silica gel 105 contain yellow fluorescent powder; through the form of separating the fluorescent powder from the LED chip in the LED lamp structure, the problem of light transmittance reduction of the silica gel caused by aging and yellowing of the silica gel under the high-temperature condition is solved; meanwhile, the content of the yellow fluorescent powder in the silica gel is changed, so that the color of light can be continuously adjusted to be changed into white light, and the color temperature of a light source can be adjusted.

Specifically, the wavelength of the yellow fluorescent powder is 570 nm-620 nm.

Preferably, as shown in fig. 7a to 7b, the first hemispherical silicone lenses 102 and the second hemispherical silicone lenses 104 may be uniformly arranged in a rectangular or rhombic shape, and the first hemispherical silicone lenses 102 and the second hemispherical silicone lenses 104 may be aligned or staggered.

Preferably, the first hemispherical silicone lens 102 and the second hemispherical silicone lens 104 are plano-convex lenses, and the focal length f is R/(n2-n1), then the distance between the first hemispherical silicone lens 102 and the second hemispherical silicone lens 104 is 0 ≦ x ≦ 2R/(n2-n1), and for simple calculation, let n be set as₁Is the refractive index of the lower silica gel 103, n₂Is the refractive index of the first hemispherical silicone lens 102, and R is the radius of the first hemispherical silicone lens 102.

Preferably, the upper layer of silica gel 105 is hemispherical, has a thickness of 50-500 μm and a refractive index of less than or equal to 1.5, wherein the upper layer of silica gel is hemispherical, so that the light-emitting angle of the LED can be maximized.

Specifically, the refractive index of the upper layer silica gel 105 is greater than that of the lower layer silica gel 103; the refractive index of the first spherical silica gel lens 102 is greater than that of the lower silica gel 103; the refractive index of the second hemispherical silica gel lens 104 is greater than that of the upper silica gel 105.

The refractive index of the upper silica gel layer is larger than that of the lower silica gel layer, the refractive index of the silica gel layer is sequentially increased from bottom to top to inhibit total reflection, emergent light of the LED is improved, and useless heat generated by absorption of the light totally reflected to the inside is reduced.

Preferably, the material of the first hemispherical silicone lens 102 may be polycarbonate, polymethylmethacrylate, glass; the material of the lower layer silica gel 103 can be modified epoxy resin and organic silicon material; the second hemispherical silicone lens 104 may be made of polycarbonate, polymethyl methacrylate, or glass; the upper layer of silicone rubber 105 can be epoxy resin, modified epoxy resin, silicone material, methyl silicone rubber, phenyl silicone rubber.

The LED lamp provided by the embodiment utilizes the characteristic that different types of silica gel have different refractive indexes, and the lens is formed in the silica gel, so that the problem of light emission dispersion of the LED lamp is solved, and the light emitted by the LED lamp can be more concentrated; through the mode of arranging that changes the hemisphere silica gel lens in the LED lamp structure, can guarantee the light of LED lamp and in the district evenly distributed of concentrating, very big improvement the luminous efficacy of LED lamp.

EXAMPLE III

In this embodiment, a method for manufacturing an LED lamp according to the present invention is described in detail below on the basis of the above embodiments.

Specifically, please refer to fig. 8, and fig. 8 is a schematic flow chart of a method for manufacturing an LED lamp according to an embodiment of the present invention. On the basis of the above embodiments, the present embodiment will describe the process flow of the present invention in more detail. The method comprises the following steps:

s1, preparing a heat dissipation substrate;

s11, preparing a support/heat dissipation substrate;

specifically, a heat dissipation substrate 101 with the thickness of 0.5-10 mm and made of iron is selected, and the heat dissipation substrate 101 is cut;

s12, cleaning the support/heat dissipation substrate;

specifically, stains, especially oil stains, on the radiating substrate 101 and the support are cleaned;

s13, baking the support/heat dissipation substrate;

specifically, the cleaned heat dissipation substrate 101 and the rack are baked, and the heat dissipation substrate 101 and the rack are kept dry.

Preferably, a circular through hole which is along the width direction and forms a certain included angle with the plane of the heat dissipation substrate 101 is formed inside the heat dissipation substrate 101; the number of the circular through holes is n, n is larger than or equal to 2, the diameter of the circular through holes is 0.1-0.3 mm, the included angle between the circular through holes and the plane of the radiating substrate 101 is 1-10 degrees, and the distance between the circular through holes is 0.5-10 mm.

Preferably, the circular through-hole in the heat dissipation substrate 101 is formed by a direct casting process or directly slotting in the width direction on the heat dissipation substrate 101.

S2, chip welding;

s21, printing solder on the blue light lamp wick;

s22, carrying out die bonding inspection on the blue light lamp wick printed with the solder;

and S23, soldering the blue light lamp wick above the heat dissipation substrate 101 by using a reflow soldering process.

S3, preparing fluorescent powder glue;

s31, preparing fluorescent powder glue;

specifically, yellow fluorescent powder is prepared and mixed in the second silica gel layer and the third silica gel layer respectively;

s32, carrying out color test on the mixed second silica gel layer and the mixed third silica gel layer;

and S33, baking the third silica gel layer qualified in the color test.

Preferably, the material of the yellow phosphor is (YGd)₃(Al,Ga)₅O₁₂:Ce、(Ca,Sr,Ba)₂SiO₄:Eu、AESi₂O₂N₂Eu or M-alpha-SiAlON, Eu, and the wavelength range of the yellow fluorescent powder is 570 nm-620 nm.

S4, preparing a first hemispherical silica gel lens 102;

s41, coating a first silica gel layer on the heat dissipation substrate 101 provided with the blue light chip, providing a first hemispherical mold on the first silica gel layer, and forming a first hemispherical silica gel having a hemispherical shape on the first silica gel layer by using the first hemispherical mold;

s42, baking the first hemispherical silica gel provided with the first hemispherical mold, wherein the baking temperature is 90-125 ℃, and the baking time is 15-60 min, so that the first hemispherical silica gel is solidified;

s43, after the baking is completed, the first hemispherical mold disposed in the first silicone rubber layer is removed, and the first hemispherical silicone rubber lens 102 is completed.

Preferably, the first hemispherical silica lens 102 does not contain phosphor;

s5, preparing the lower layer silica gel 103;

specifically, the lower layer silicone rubber 103 is coated on the first hemispherical silicone rubber lens 102, completing the preparation of the lower layer silicone rubber 103.

Preferably, the lower layer of silica gel 103 does not contain phosphor;

s6, preparing a second hemispherical silica gel lens 104;

s61, coating a second silica gel layer on the upper surface of the lower silica gel layer 103, arranging a second hemispherical mold on the second silica gel layer, and forming a second hemispherical silica gel with a hemispherical shape on the second silica gel layer by using the second hemispherical mold;

s62, baking the second hemispherical silica gel provided with the second hemispherical die at the baking temperature of 90-125 ℃ for 15-60 min to solidify the second hemispherical silica gel;

s63, after the baking is completed, the second hemispherical mold disposed in the second silicone layer is removed, and the second hemispherical silicone lens 104 is completed.

Preferably, the second hemispherical silica lens 104 contains yellow phosphor;

s7, preparing upper-layer silica gel 105;

s71, coating a third silicone gel layer on the second hemispherical silicone lens 104;

s72, arranging a third hemispherical mold on the third silica gel layer, and forming a third hemispherical silica gel with a hemispherical shape on the third silica gel layer by using the third hemispherical mold;

s73, baking the third hemispherical silica gel provided with the third hemispherical die at the baking temperature of 90-125 ℃ for 15-60 min to solidify the third hemispherical silica gel;

and S74, after baking, removing the third hemispherical mold arranged in the third silica gel layer, and finishing the preparation of the upper silica gel layer 105.

Preferably, the upper layer silica gel 105 contains yellow phosphor, and the color temperature of light can be continuously adjusted by changing the content of the yellow phosphor in the upper layer silica gel 105.

S8, long-time baking;

specifically, the heat dissipation substrate 101, the blue light lamp wick, the lower layer silica gel 103 of the first hemispherical silica gel lens 102, the second hemispherical silica gel lens 104 and the upper layer silica gel 105 are integrally baked, the baking temperature is 100-150 ℃, the baking time is 4-12 hours, and the LED packaging is completed;

and S9, testing and sorting the packaged LED lamps.

And S10, packaging the LED lamp which is qualified in the test.

According to the method of the embodiment, the LED lamp having the multi-layered hemispherical silica gel lens can be prepared, and the LED lamp having the multi-layered hemispherical silica gel lens prepared by the preparation method of the present invention should not be understood as a new invention.

Example four

On the basis of the above embodiments, the present embodiment will describe a multilayer LED lamp including:

a heat-dissipating substrate;

the blue light chip is formed on the upper surface of the heat dissipation substrate;

the first hemispherical silica gel lens is formed on the upper surfaces of the heat dissipation substrate and the blue light chip;

the first layer of silica gel is formed on the upper surfaces of the first hemispherical silica gel lens and the blue light chip;

the Nth hemispherical silica gel lens is formed on the upper surface of the Nth-1 layer of silica gel;

wherein N is more than or equal to 2, the diameter of the Nth hemispherical silica gel lens is 10-200 μm, the distance between the Nth hemispherical silica gel lenses is 10-200 μm, the Nth hemispherical silica gel lens does not contain fluorescent powder, and the refractive index of the Nth hemispherical silica gel lens is greater than that of the Nth layer of silica gel.

The Nth layer of silica gel is formed on the upper surfaces of the Nth-1 layer of silica gel and the Nth hemispherical silica gel lens;

the Nth layer of silica gel does not contain fluorescent powder and is made of high-temperature-resistant materials.

Preferably, the material of the nth layer of silica gel can be modified epoxy resin or organosilicon material.

The (N + 1) th hemispherical silica gel lens is formed on the upper surface of the Nth layer of silica gel;

the diameter of the (N + 1) th hemispherical silica gel lens is 10-200 mu m, the distance between the (N + 1) th hemispherical silica gel lenses is 10-200 mu m, the (N + 1) th hemispherical silica gel lens 104 contains yellow fluorescent powder, and the refractive index of the (N + 1) th hemispherical silica gel lens is greater than that of the (N + 1) th layer of silica gel.

Preferably, the material of the N +1 th hemispherical silicone lens may be polycarbonate, polymethylmethacrylate, glass.

Preferably, the first to (N + 1) th hemispherical silicone lenses may be uniformly arranged in a rectangular or rhombic shape, and the first to (N + 1) th hemispherical silicone lenses may be aligned or staggered.

Preferably, the nth-1 th and nth hemispherical silicone lenses are plano-convex lenses, and the focal length f is R/(N2-N1), then the distance between the nth-1 th and nth hemispherical silicone lenses is 0 ≦ x ≦ 2R/(N2-N1), and for simple calculation, let N be set₁Is the refractive index of the silica gel of the N-1 th layer, N₂Is the refractive index of the (N-1) th hemispherical silica gel lens, and R is the radius of the (N-1) th hemispherical silica gel lens.

The (N + 1) th layer of silica gel is formed on the upper surfaces of the (N + 1) th hemispherical silica gel lens and the Nth layer of silica gel;

the thickness of the (N + 1) th layer of silica gel is 50-500 mu m, the refractive index is less than or equal to 1.5, the (N + 1) th layer of silica gel contains yellow fluorescent powder, and the refractive index of the (N + 1) th layer of silica gel is greater than that of the (N) th layer of silica gel.

Preferably, the material of the (N + 1) th layer of silicone rubber can be epoxy resin, modified epoxy resin, silicone material, methyl silicone rubber and phenyl silicone rubber.

The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims

1. An intelligent LED floor lamp, comprising: the LED lamp comprises an LED light source (1), a substrate (2), a lamp body (3), an outer layer light-transmitting plate (4) and a light-transmitting cover (5); the LED lamp comprises a lamp body (3), an LED light source (1), a substrate (2), an outer light-transmitting plate (4), a light-transmitting cover (5), a light-transmitting cover and a light-transmitting cover, wherein the lamp body (3) is buried under the ground, the LED light source (1) is arranged at the upper end of the substrate (2), the substrate (2) is arranged in the lamp body (3) and is connected with an external power supply, the outer light-transmitting plate (4) is arranged at the top of the lamp body (3), and the light-transmitting cover (5) is arranged in;

one or more LED lamps (11) are arranged on the LED light source (1); said LAn ED lamp (11) includes: the LED lamp comprises a heat dissipation substrate (101), a blue light lamp wick, a first hemispherical silica gel lens (102), lower silica gel (103), a second hemispherical silica gel lens (104) and upper silica gel (105); the blue light lamp wick is arranged on the upper surface of the heat dissipation substrate (101), the first hemispherical silica gel lenses (102) are arranged on the blue light lamp wick and the upper surface of the heat dissipation substrate (101) at intervals, the lower layer silica gel (103) is arranged on the blue light lamp wick and the upper surface of the first hemispherical silica gel lenses (102), and the second hemispherical silica gel lenses (104) are arranged on the upper surface of the lower layer silica gel (103) at intervals; the upper layer silica gel (105) is arranged on the upper surfaces of the lower layer silica gel (103) and the second hemispherical silica gel lens (104); the refractive index of the upper layer silica gel (105) is greater than that of the lower layer silica gel (103); the refractive index of the first hemispherical silica gel lens (102) is greater than that of the lower silica gel (103); the refractive index of the second hemispherical silica gel lens (104) is greater than that of the upper layer silica gel (105); the first hemispherical silica gel lens (102) and the second hemispherical silica gel lens (104) are plano-convex lenses, the focal length f = R/(n2-n1), and the distance between the first hemispherical silica gel lens (102) and the second hemispherical silica gel lens (104) is equal to or greater than 0 and equal to or less than x and equal to or less than 2R/(n2-n1), n₁Is the refractive index of the lower silica gel layer (103), n₂The refractive index of the first hemispherical silica gel lens (102) is shown, and R is the radius of the first hemispherical silica gel lens (102);

the structure of blue light wick includes by lower supreme in proper order: the GaN-based light-emitting diode comprises a substrate material (201), a GaN buffer layer (202), a GaN layer (203), a P-type GaN quantum well wide band gap layer (204), an InGaN layer (205), a P-type GaN quantum well wide band gap layer (206), an AlGaN barrier layer (207), a P-type GaN layer (208), an anode electrode (209) located on the P-type GaN layer (208) and a cathode electrode (210) located on the GaN layer (203).

2. The intelligent LED floor lamp according to claim 1, wherein the light-transmitting cover (5) is a circular arc-shaped light-transmitting cover; two end points of the light-transmitting cover (5) are fixed on the side wall of the lamp body (3), and the arc vertex point of the light-transmitting cover (5) is fixed on the lower side of the outer layer light-transmitting plate (4).

3. The intelligent LED floor lamp according to claim 1, further comprising a reflector (6) disposed inside the side wall of the lamp body (3).

4. The intelligent LED floor lamp according to claim 3, wherein the reflector (6) is a reflector or an aluminum sheet.

5. The intelligent LED floor lamp according to claim 1, further comprising an intelligent control module (7) disposed on the underside of the substrate (3).

6. The intelligent LED floor lamp according to claim 5, characterized in that the intelligent control module (7) comprises: a communication unit (71), a drive unit (72), and a control unit (73); wherein the communication unit (71) is in communication connection with a control terminal, the driving unit (72) is electrically connected with the LED light source (1), and the control unit (73) is electrically connected with the communication unit (71) and the driving unit (72).

7. The intelligent LED floor lamp according to claim 1, wherein the outer layer light-transmitting plate (4) is a high-strength glass plate and the lower surface is a concave lens structure.

8. The intelligent LED floor lamp according to claim 1, characterized in that one or more LED lamps (11) are arranged on the LED light source (1).