CN108036243A - New LED ground light - Google Patents
New LED ground light Download PDFInfo
- Publication number
- CN108036243A CN108036243A CN201711219128.7A CN201711219128A CN108036243A CN 108036243 A CN108036243 A CN 108036243A CN 201711219128 A CN201711219128 A CN 201711219128A CN 108036243 A CN108036243 A CN 108036243A
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- Prior art keywords
- lamp bracket
- substrate
- silica gel
- new led
- led ground
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- 239000000758 substrate Substances 0.000 claims abstract description 59
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 65
- 239000000741 silica gel Substances 0.000 claims description 62
- 229910002027 silica gel Inorganic materials 0.000 claims description 62
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 16
- 238000004891 communication Methods 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 229960001866 silicon dioxide Drugs 0.000 description 59
- 239000000463 material Substances 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 230000003760 hair shine Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 206010023126 Jaundice Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
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- 238000005476 soldering Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
- F21S8/022—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a floor or like ground surface, e.g. pavement or false floor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0435—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by remote control means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
- F21V5/041—Ball lenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to a kind of New LED ground light, which includes：Interior lamp bracket (1), intelligent control module (2), substrate (3), light source (4) and diffuser (5)；Wherein, the interior lamp bracket (1) is arranged at the substrate (3) upper end, the substrate (3) is embedded in subsurface, the intelligent control module (2) is arranged in the substrate (3) and connection external power supply, the light source (4) are arranged at the top of the substrate (3) and concordant with ground；The diffuser (5) is arranged in the substrate (3) and is fixed on side wall and the light source (4) lower end of the substrate (3).The light emission rate of New LED ground light provided by the invention is high, luminous efficiency is high, good heat dissipation effect, simple in structure.
Description
Technical field
The invention belongs to LED field of luminescent technology, more particularly to a kind of New LED ground light.
Background technology
Light emitting diode (Light-Emitting Diode, LED) has long lifespan, luminous efficiency height, colour rendering is good, pacifies
The characteristics of complete reliable, rich in color and easy to maintain.In current environmental pollution getting worse, climate warming and energy growing tension
Background under, be acknowledged as based on the semiconductor illumination technique that great power LED grows up before 21 century most develops
One of high-tech sector of scape.This is from after gas lighting, incandescent lamp and fluorescent lamp, and the mankind illuminate once big winged in history
Jump, improves rapidly the lighting quality of human lives.
Exactly because LED possesses above-mentioned advantage, LED rapidly substitutes conventional light source to become commercial and home lighting
Principal light source.The various illuminating equipments using LED as basic luminaire continue to bring out.Wherein, LED ground lamp be widely used in lawn,
Landscape, the illumination in park.LED ground lamp is embedded in subsurface, and lamp body structure will bear the pedestrian even weight of vehicle, because of this place
The lamp body structure of face lamp is typically fabricated as small-sized, firm obturator.Then, it is also proposed wanting for higher for light source therein
Ask, light source must be that small-sized, long-life, low fever, performance are stablized, and LED meets above-mentioned requirement just.
But the limitation of the caloric value due to LED ground lamp, existing LED ground lamp power is smaller, small volume, shines
Limited brightness, cannot meet the needs of actual use in many occasions；Therefore, the luminosity of LED ground lamp how is improved
The more and more important of the fever quantitative change of LED ground lamp is controlled at the same time.
The content of the invention
In order to improve the working performance of New LED ground light, the present invention provides a kind of New LED ground light；The present invention
Technical problems to be solved are achieved through the following technical solutions：
The embodiment provides a kind of New LED ground light, including：Interior lamp bracket 1, intelligent control module 2, substrate
3rd, light source 4, diffuser 5, reflector 6 and cover board 7；Wherein, the substrate 3 is arranged in the interior lamp bracket 1, the intelligent control
Module 2 is arranged in the space that the interior lamp bracket 1 is formed with substrate 3, and the light source 4 is arranged on the substrate 3, the printing opacity
Cover 5 is arranged in the interior lamp bracket 1 and is fixed on 7 lower end of side wall and the cover board of the interior lamp bracket 1, and the reflector 6 is set
The side wall of the interior lamp bracket 1 is placed in, the cover board 7 is arranged at the top of interior lamp bracket 1.
In one embodiment of the invention, the diffuser 5 is hemispherical diffuser；Wherein, the two of the diffuser 5
A endpoint is fixed on the side wall of the interior lamp bracket 1, and the hemispherical dome point of the diffuser 5 is fixed on 7 lower end of cover board.
In one embodiment of the invention, the reflector 6 is speculum or aluminium flake.
In one embodiment of the invention, the intelligent control module 2 includes：Communication unit 21,22 and of driving unit
Control unit 23；Wherein, the communication unit 21 communicates to connect control terminal, and the driving unit 22 is electrically connected the light source 4,
Described control unit 23 is electrically connected the communication unit 21 and the driving unit 22.
In one embodiment of the invention, the cover board 7 is high-strength glass glass plate and lower surface is concavees lens structure.
In one embodiment of the invention, multiple circular holes are provided with the substrate 3.
In one embodiment of the invention, the New LED ground light further includes outer lamp bracket 8；Wherein, the outer lamp bracket
Have between 8 and the interior lamp bracket 1 and isolate cavity.
In one embodiment of the invention, 8 top of outer lamp bracket is provided with pressure sensor 9；Wherein, the pressure
Sensor 9 is electrically connected the intelligent control module 2.
In one embodiment of the invention, one or more high-powered LED lamps 40 are provided with the light source 4.
In one embodiment of the invention, the high-powered LED lamp 40 includes successively from lower to upper：Heat-radiating substrate 401,
Lower floor's silica gel 402, semispherical silicon glue lens 403 and upper strata silica gel 404；Wherein, the heat-radiating substrate 401 and lower floor's silica gel 402
Between be provided with RGB three-primary color LED chips.
Compared with prior art, the invention has the advantages that：
1st, the luminous efficiency height of New LED ground light provided by the invention, good heat dissipation effect, it is simple in structure.
2nd, New LED ground light provided by the invention preferably can transmit away the light of LED light source, improve
The luminous efficiency of LED ground lamp；Meanwhile the structural stability of LED ground lamp provided by the invention, LED ground lamp can be saved
The rock-steady structure component of such as cross protective stent etc, it is therefore prevented that the component of the rock-steady structure such as cross protective stent is to light
Stop, the structure of LED ground lamp is also simplify while improving light emission rate.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill of field, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
By the detailed description below with reference to attached drawing, other side of the invention and feature become obvious.But it should know
Road, which is only the purpose design explained, not as the restriction of the scope of the present invention, this is because it should refer to
Appended claims.It should also be noted that unless otherwise noted, it is not necessary to which scale attached drawing, they only try hard to concept
Ground illustrates structure and flow described herein.
Fig. 1 is a kind of structure diagram of New LED ground light provided in an embodiment of the present invention；
Fig. 2 is a kind of operation principle schematic diagram of New LED ground light provided in an embodiment of the present invention；
Fig. 3 is a kind of structure diagram of LED light provided in an embodiment of the present invention；
Fig. 4 is a kind of RGB three-primary color LEDs chip structure principle schematic provided in an embodiment of the present invention；
Fig. 5 is a kind of heat-radiating substrate diagrammatic cross-section provided in an embodiment of the present invention；
Fig. 6 a are a kind of semispherical silicon glue lens diagrammatic cross-section provided in an embodiment of the present invention；
Fig. 6 b are another semispherical silicon glue lens diagrammatic cross-section provided in an embodiment of the present invention；
Fig. 7 is a kind of LED light production method flow diagram provided in an embodiment of the present invention.
Embodiment
Further detailed description is done to the present invention with reference to specific embodiment, but embodiments of the present invention are not limited to
This.
Embodiment one
Fig. 1 is referred to, Fig. 1 is a kind of structure diagram of New LED ground light provided in an embodiment of the present invention, including：
Interior lamp bracket 1, intelligent control module 2, substrate 3, light source 4, diffuser 5, reflector 6 and cover board 7；Wherein, the substrate 3 is arranged at
In the interior lamp bracket 1, the intelligent control module 2 is arranged in the space that the interior lamp bracket 1 is formed with substrate 3, the light source 4
It is arranged on the substrate 3, the diffuser 5 is arranged in the interior lamp bracket 1 and is fixed on side wall and the institute of the interior lamp bracket 1
7 lower end of cover board is stated, the reflector 6 is arranged at the side wall of the interior lamp bracket 1, and the cover board 7 is arranged at the interior lamp bracket 1 and pushes up
Portion.
Wherein, intelligent control module is arranged between interior lamp bracket and substrate, makes to be formed between interior lamp bracket and substrate certain
Cavity area, be conducive to the heat dissipation of LED ground lamp.
Preferably, the diffuser 5 is hemispherical diffuser；Wherein, two endpoints of the diffuser 5 are fixed on described
The side wall of interior lamp bracket 1, the hemispherical dome point of the diffuser 5 are fixed on 7 lower end of cover board.
Specifically, the reflector 6 is speculum or aluminium flake.
Wherein, can be using the reflex of reflector 6 by covering the setting reflector 6 between cover board 7 in printing opacity 5, will
More light reflect away so that ground light light emission rate higher, can more become clear.
Preferably, Fig. 2 is referred to, Fig. 2 shows for a kind of operation principle of New LED ground light provided in an embodiment of the present invention
It is intended to；The intelligent control module 2 can include：Communication unit 21, driving unit 22 and control unit 23；Wherein, it is described logical
Believe that unit 21 communicates to connect control terminal, the driving unit 22 is electrically connected the light source 4, and described control unit 23 is electrically connected institute
State communication unit 21 and the driving unit 22.
Wherein, the communication unit is wireless or wired connection control terminal, control terminal send control command to logical
Believe unit, communication unit sends the control command received to control unit, and control unit is according to control command driving LED
Face lamp shines or not electroluminescent lamp.
Preferably, the cover board 7 is high-strength glass glass plate and lower surface is concavees lens structure, uses concavees lens structure can be with
Expand the range of exposures of ground light, more efficiently utilize light.
Preferably, multiple circular holes are provided with the substrate 3；Wherein, by the way of circular hole is set in substrate, at it
While intensity has almost no change, manufacture cost is reduced, and using the mode of circular hole, the logical of air circulation can be increased
Road, takes full advantage of the thermal convection current between air, improves the heat dissipation effect of LED ground lamp.
Preferably, in one embodiment of the invention, the New LED ground light further includes outer lamp bracket 8；Wherein, institute
State to have between outer lamp bracket 8 and the interior lamp bracket 1 and isolate cavity；By isolating sky between the outer lamp bracket 8 and the interior lamp bracket 1
Chamber, can effectively stop the moisture and aqueous vapor on ground, improve the service life of New LED ground light.
In one embodiment of the invention, 8 top of outer lamp bracket is provided with pressure sensor 9；Wherein, the pressure
Sensor 9 is electrically connected the intelligent control module 2；Intelligent control module can drive according to pressure sensor feedack
LED ground lamp shines or not electroluminescent lamp, realizes vehicles or pedestrians that the basis of LED ground lamp passes by etc. and automatically controls hair
Light, makes LED ground lamp more intelligence more energy saving.
Preferably, one or more LED light 40 are provided with the light source 4.
New LED ground light provided in this embodiment, by setting hemispherical diffuser between LED light source and cover board,
Preferably the light of LED light source can be transmitted away, improve the light emission rate of LED ground lamp；Meanwhile by hemispherical diffuser
Vertex and two endpoints fixed respectively with cover board and lamp body, improve the structural stability of LED ground lamp, LED can be saved
The rock-steady structure component of ground light such as cross protective stent etc, it is therefore prevented that the component pair of the rock-steady structure such as cross protective stent
The stop of light, also simplify the structure of LED ground lamp while improving light emission rate.
Embodiment two
The present embodiment is described in detail 40 structure of LED light of the invention as follows on the basis of above-described embodiment.
In the above-described embodiments, LED light 40 selects high-powered LED lamp, and the caloric value of existing high-powered LED lamp is larger, because
This reduces the heat dissipation capacity of high-powered LED lamp, while not reduce brightness in order to improve the luminous efficiency of high-powered LED lamp
Select as far as possible few high-powered LED lamp, it is desirable to provide a kind of high-powered LED lamp of new high printing opacity.
Specifically, it refer to Fig. 3, Fig. 3 is a kind of structure diagram of LED light provided in an embodiment of the present invention, the LED
Lamp 40 includes successively from lower to upper：Heat-radiating substrate 401, lower floor's silica gel 402, semispherical silicon glue lens 403 and upper strata silica gel 404；
Wherein, RGB three-primary color LED chips are provided between the heat-radiating substrate 401 and lower floor's silica gel 402.
Wherein, Fig. 4 is refer to, Fig. 4 shows for a kind of RGB three-primary color LEDs chip structure principle provided in an embodiment of the present invention
It is intended to, the RGB three-primary color LED chips of use avoid the non-uniform problem of light extraction caused by fluorescent powder doping is uneven,
At the same time improve because fluorescent powder is in granular form cause light emission rate to decline the problem of.
Preferably, Fig. 5 is refer to, Fig. 5 is a kind of heat-radiating substrate diagrammatic cross-section provided in an embodiment of the present invention, and radiate base
The material of plate 401 is aluminium, and the thickness D of heat-radiating substrate 401 is 0.5~10mm, and circular through hole is provided with heat-radiating substrate 401,
Circular through hole arranges in the width direction inside heat-radiating substrate 401, and the circle in a certain angle with 401 plane of heat-radiating substrate is led to
Hole；Wherein, the quantity of circular through hole is n and n >=2, a diameter of 0.1~0.3mm, circular through hole and 401 plane of heat-radiating substrate
Angle is 1~10 °, and the spacing A between circular through hole is 0.5~10mm.
The aluminum cooling substrates that heat-radiating substrate 401 uses are big with thermal capacitance, good heat conduction effect, it is not easy to deform, with the base that radiates
The characteristics of panel assembly contact is close；Circular through hole is set inside aluminum cooling substrates, makes what LED had almost no change in its intensity
Meanwhile aluminium cost is reduced, and using the mode of middle tiltedly through hole, the passage of air circulation can be increased, utilize chimney
Effect lifts the thermal convection current speed of air, improves the heat dissipation effect of the heat-radiating substrate of LED.
Specifically, lower floor's silica gel 403 does not contain fluorescent powder and is the silica gel of high temperature resistant material.
Preferably, the material of lower floor's silica gel 403 can be modified epoxy, organosilicon material.
Wherein, the silica gel being in contact with LED chip is heat safe silica gel, solves silica gel under the high temperature conditions because of silica gel
The problem of light transmittance caused by aging jaundice declines.
Preferably, semispherical silicon glue lens 403 are formed at heat-radiating substrate 401 and RGB three-primary color LED chip upper surfaces；Half
The material of spherical silica gel lens 403 can be polycarbonate, polymethyl methacrylate, glass.
Specifically, a diameter of 40~200 μm of the semispherical silicon glue lens 403, the semispherical silicon glue lens 403 it
Between spacing be 40~200 μm, the semispherical silicon glue lens 403 do not contain fluorescent powder；The semispherical silicon glue lens 403
Refractive index is more than the refractive index of lower floor's silica gel 402 and the upper strata silica gel 404；The refractive index of the upper strata silica gel 404 is big
In the refractive index of lower floor's silica gel 402.
Wherein, the refractive index of lower floor's silica gel of use is less than the refractive index of upper strata silica gel, the material of spherical silica gel lens
Refractive index, which is more than lower floor's silica gel and upper strata silica gel refractive index, this setup, can improve the light transmittance of LED chip, make LED
The light that chip is emitted can more shine out.
Preferably, refer to Fig. 6 a~6b, Fig. 6 a is a kind of semispherical silicon glue lens section provided in an embodiment of the present invention
Schematic diagram, Fig. 6 b are another semispherical silicon glue lens diagrammatic cross-section provided in an embodiment of the present invention；The hemispherical silica gel
Lens 403 are rectangular or diamond shape is evenly distributed.
Further, upper strata silica gel 404 is formed at 402 upper surface of semispherical silicon glue lens 403 and lower floor's silica gel；Wherein,
The thickness of upper strata silica gel 405 is 50~500 μm, refractive index≤1.5, and upper strata silica gel 405 is free of fluorescent powder, and upper strata silica gel 404
Refractive index be more than lower floor's silica gel 402 refractive index.
Preferably, the material of upper strata silica gel 404 can be epoxy resin, modified epoxy, organosilicon material, methyl silicon
Rubber, phenyl organic silicon rubber.
Preferably, upper strata silica gel 404 is hemispherical shape, and the beam angle of LED can be made maximum.
Preferably, upper strata silica gel 404 can also be two kinds of shapes of flat horizontal surface and paraboloidal.
The characteristics of LED light provided in this embodiment utilizes variety classes silica gel refractive index different, forms lens in silica gel,
Improve LED light to shine the problem of scattered, the light that light source is sent more is concentrated；By varying the hemisphere in LED structure
The arrangement mode of shape silica-gel lens, it is ensured that the light of light source is uniformly distributed in concentration zones, greatly improves the hair of LED light
Light efficiency.
Embodiment three
The present embodiment is described in detail LED light production method of the invention as follows on the basis of above-described embodiment.
Specifically, Fig. 7 is referred to, Fig. 7 is a kind of LED light production method flow diagram provided in an embodiment of the present invention.
On the basis of above-described embodiment, the technological process in more detail to the present invention is introduced the present embodiment.This method bag
Include：
The preparation of S1, heat-radiating substrate；
The preparation of S11, stent/heat-radiating substrate；
Specifically, it is 0.5~10mm to choose thickness, and material is the heat-radiating substrate 401 of aluminium, cuts heat-radiating substrate 401；
The cleaning of S12, stent/heat-radiating substrate；
Specifically, the spot above heat-radiating substrate 401 and stent, especially oil stain are cleaned up；
The baking of S13, stent/heat-radiating substrate；
Specifically, the heat-radiating substrate 401 and stent that baking cleaning is completed, keep the drying of heat-radiating substrate 401 and stent.
Preferably, have inside heat-radiating substrate 401 in the width direction and in a certain angle with 401 plane of heat-radiating substrate
Circular through hole；Wherein, a diameter of 0.1~0.3mm of circular through hole, the angle of circular through hole and 401 plane of heat-radiating substrate is 1~
10 °, the spacing between circular through hole is 0.5~10mm.
Preferably, the circular through hole in heat-radiating substrate 401 by direct casting technique or on heat-radiating substrate 401 along width
Directly slot to be formed in degree direction.
Preferably, stent is used to fix RGB three-primary color LEDs chip and draws lead；
The preparation of S2, chip；
S21, choose RGB three-primary color LED chips；
S22, by solder printing to RGB three-primary color LED chips；
S23, the RGB three-primary color LEDs chip progress die bond inspection that solder will be printed with；
S24, using Reflow Soldering welding procedure be welded to the top of heat-radiating substrate 401 by RGB three-primary color LED chips.
The preparation of S3, lower floor's silica gel 402；
Specifically, above the RGB three-primary color LED chips on coat lower floor's silica gel 402, complete the preparation of lower floor's silica gel 402.
Preferably, lower floor's silica gel 403 is free of fluorescent powder.
The preparation of S4, semispherical silicon glue lens 403；
S41, lower floor's silica gel 403 upper surface coat the first layer of silica gel；
S42, set the first hemispherical in the first layer of silica gel, using the first hemispherical in the first layer of silica gel
Form the first hemispherical silica gel with hemispherical shape；
S43, baking are provided with the first hemispherical silica gel of the first hemispherical, and baking temperature is 90~125 DEG C, baking
Time is 15~60min, makes the first semispherical silicon adhesive curing；
After S44, baking are completed, the first hemispherical being arranged in the first layer of silica gel is removed, completes hemispherical
The preparation of silica-gel lens 403.
Preferably, semispherical silicon glue lens 403 are free of fluorescent powder.
The preparation of S5, upper strata silica gel 404；
S51, coat the second layer of silica gel on lower floor's silica gel 402 and semispherical silicon glue lens 403；
S52, set the second hemispherical in the second layer of silica gel, using the second hemispherical in the second layer of silica gel
Form the second hemispherical silica gel with hemispherical shape；
S53, baking are provided with the second hemispherical silica gel of the first hemispherical, and baking temperature is 90~125 DEG C, baking
Time is 15~60min, makes the second semispherical silicon adhesive curing；
S54, by the second hemispherical being arranged in the second layer of silica gel remove, complete upper strata silica gel 404 preparation.
Preferably, upper strata silica gel 405 is free of fluorescent powder.
S6, length are roasting；
Specifically, overall baking heat-radiating substrate 401, RGB three-primary color LEDs chip, lower floor's silica gel 402, hemispherical silica gel are saturating
Mirror 403 and upper strata silica gel 404, baking temperature are 100~150 DEG C, and baking time is 4~12h, completes the encapsulation of LED.
The LED that S7, test, go-no-go encapsulation are completed.
The LED encapsulation structure of S8, Package Testing qualification.
Above content is that a further detailed description of the present invention in conjunction with specific preferred embodiments, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the present invention's
Protection domain.
Claims (10)
- A kind of 1. New LED ground light, it is characterised in that including：Interior lamp bracket (1), intelligent control module (2), substrate (3), light Source (4), diffuser (5), reflector (6) and cover board (7)；Wherein, the substrate (3) is arranged in the interior lamp bracket (1), described Intelligent control module (2) is arranged in the space that the interior lamp bracket (1) is formed with substrate (3), and the light source (4) is arranged at described On substrate (3), the diffuser (5) is arranged in the interior lamp bracket (1) and is fixed on the side wall of the interior lamp bracket (1) and described Cover board (7) lower end, the reflector (6) are arranged at the side wall of the interior lamp bracket (1), and the cover board (7) is arranged at the interior lamp At the top of frame (1).
- 2. New LED ground light according to claim 1, it is characterised in that the diffuser (5) is hemispherical printing opacity Cover；Wherein, two endpoints of the diffuser (5) are fixed on the side wall of the interior lamp bracket (1), the hemisphere of the diffuser (5) Shape dome point is fixed on the cover board (7) lower end.
- 3. New LED ground light according to claim 1, it is characterised in that the reflector (6) is speculum or aluminium Piece.
- 4. New LED ground light according to claim 1, it is characterised in that the intelligent control module (2) includes：It is logical Believe unit (21), driving unit (22) and control unit (23)；Wherein, communication unit (21) the communication connection control terminal, The driving unit (22) is electrically connected the light source (4), and described control unit (23) is electrically connected the communication unit (21) and institute State driving unit (22).
- 5. New LED ground light according to claim 1, it is characterised in that the cover board (7) for high-strength glass glass plate and Lower surface is concavees lens structure.
- 6. New LED ground light according to claim 1, it is characterised in that be provided with multiple circles in the substrate (3) Hole.
- 7. New LED ground light according to claim 1, it is characterised in that further include outer lamp bracket (8)；Wherein, it is described outer Have between lamp bracket (8) and the interior lamp bracket (1) and isolate cavity.
- 8. New LED ground light according to claim 1, it is characterised in that outer lamp bracket (8) top is provided with pressure Sensor (9)；Wherein, the pressure sensor (9) is electrically connected the intelligent control module (2).
- 9. New LED ground light lamp according to claim 1, it is characterised in that be provided with the light source (4) one or Multiple high-powered LED lamps (40).
- 10. New LED ground light according to claim 9, it is characterised in that the high-powered LED lamp (40) from it is lower toward On include successively：Heat-radiating substrate (401), lower floor's silica gel (402), semispherical silicon glue lens (403) and upper strata silica gel (404)；Its In, it is provided with RGB three-primary color LED chips between the heat-radiating substrate (401) and lower floor's silica gel (402).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711219128.7A CN108036243B (en) | 2017-11-28 | 2017-11-28 | LED ground lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711219128.7A CN108036243B (en) | 2017-11-28 | 2017-11-28 | LED ground lamp |
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| CN108036243A true CN108036243A (en) | 2018-05-15 |
| CN108036243B CN108036243B (en) | 2020-10-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109373278A (en) * | 2018-10-11 | 2019-02-22 | 孟秋维 | A kind of electronic intelligence joint trimming agent |
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| CN206036832U (en) * | 2016-08-11 | 2017-03-22 | 恒祥市政园林有限公司 | Novel multi -functional municipal garden land used buries lamp |
| CN206338627U (en) * | 2016-08-30 | 2017-07-18 | 徐州爱特普电子有限公司 | A kind of High-luminance LED lamp cap |
| CN207674193U (en) * | 2017-11-28 | 2018-07-31 | 西安科锐盛创新科技有限公司 | New LED ground light |
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2017
- 2017-11-28 CN CN201711219128.7A patent/CN108036243B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270629A (en) * | 2010-06-01 | 2011-12-07 | Lg伊诺特有限公司 | Light emitting device package and lighting system |
| CN206036832U (en) * | 2016-08-11 | 2017-03-22 | 恒祥市政园林有限公司 | Novel multi -functional municipal garden land used buries lamp |
| CN206338627U (en) * | 2016-08-30 | 2017-07-18 | 徐州爱特普电子有限公司 | A kind of High-luminance LED lamp cap |
| CN207674193U (en) * | 2017-11-28 | 2018-07-31 | 西安科锐盛创新科技有限公司 | New LED ground light |
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| CN109373278A (en) * | 2018-10-11 | 2019-02-22 | 孟秋维 | A kind of electronic intelligence joint trimming agent |
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| CN108036243B (en) | 2020-10-02 |
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