CN102255035B - Multi-LED chip packaging structure on substrate - Google Patents
Multi-LED chip packaging structure on substrate Download PDFInfo
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- CN102255035B CN102255035B CN201110235184.6A CN201110235184A CN102255035B CN 102255035 B CN102255035 B CN 102255035B CN 201110235184 A CN201110235184 A CN 201110235184A CN 102255035 B CN102255035 B CN 102255035B
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- Prior art keywords
- silica
- led chip
- substrate
- packaging structure
- gel
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- 239000000758 substrate Substances 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 69
- 239000000741 silica gel Substances 0.000 claims abstract description 64
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 64
- 229960001866 silicon dioxide Drugs 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 238000005286 illumination Methods 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention belongs to the technical field of LED illumination, in particular relates to a multi-LED chip packaging structure on a substrate. A plurality of LED chips are bonded on the substrate, and transparent silica gel layers cover the LED chips. The multi-LED chip packaging structure is characterized in that an organic silica lens covers a plane where the silica gel layers are in contact with air, and the silica lens is positioned above the LED chips. The packaging structure can be used for guiding light rays reflected to silica gel from a plane where the silica gel is in contact with air to air when the angle of the light rays emitted by the chip is more than the critical angle of the silica gel and the air interface in the prior art, thereby increasing light emergence efficiency of a COB (Chip On Board) light source.
Description
Technical field
The invention belongs to LED lighting technical field, particularly relate to a kind of multi-LED chip packaging structure on substrate.
Background technology
As shown in Figure 1, COB (Chip On Board) LED light source is multiple LED (light-emitting diode) chip, is directly bonded on substrate, by gold thread or bump, multiple chips and power supply is coupled together; On chip, cover again transparent silica gel, both chip and gold thread were played a protective role, again because the refraction coefficient of silica gel is greater than 1, thus the light extraction efficiency of increase LED.If expect white light source, in transparent silica gel, answer mixed fluorescent powder to reaching white light effect; The periphery of multiple chips has loaded white box dam to stop liquid-state silicon gel to leak.After silica gel solidifies, on the upper strata of chip, can form a silica gel flat surface.On the COB assembling, load suitable voltage and current, chip will send corresponding visible ray.
The advantage of COB light source is: 1, light-emitting area is large, in theory can be as required, do infinitely greatly; 2, thermal conductivity is good, and the thermal conductivity of aluminium base is very high, can effectively derive the heat energy that LED produces when luminous; 3,, at the bottom of cost, because there is no LED chip package casing, can reduce the expense of material and processing; 4, make simply.
But due to the total reflection principle (Sell Law) of light when walking between two kinds of different mediums, plane silica gel light extraction efficiency is limited.In prior art, the surface of silica gel is a silica gel flat surface.When the light angle of the light sending when chip is greater than the critical angle of silica gel and air interface, this part light will be totally reflected and cannot derive.This part light, in layer of silica gel the inside reflection and refraction (if having fluorescent powder grain), fails enter into air if be not less than critical angle through repeatedly, will change into heat energy and loses (as shown in Figure 2).So the COB light source of plane silica gel, had the loss of a part of light, thereby light extraction efficiency is low on principle of luminosity.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention is: change COB (Chip On Board) LED light source surface silicon plastic structure, make it the more effective light that LED chip is sent, maximized exporting in air, to improve LED light extraction efficiency.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of multi-LED chip packaging structure on substrate, on substrate, be bonded with multiple LED chips, on LED chip, be coated with transparent silicon glue-line; In the plane contacting with air in layer of silica gel, be coated with silica-gel lens, the top that is positioned at LED chip of described silica-gel lens.
Wherein, in transparent silicon glue-line, be mixed with fluorescent material.
Wherein, in silica-gel lens, be mixed with fluorescent material.
Wherein, the gap in the plane of layer of silica gel and air contact, between described silica-gel lens above LED chip is also filled with little silica-gel lens, and the size of little silica-gel lens is not more than the size of the silica-gel lens of LED chip top.
Wherein, baseplate material is aluminium or copper or pottery.
Wherein, in silica-gel lens and little silica-gel lens, be all mixed with fluorescent material.
Wherein, silica-gel lens is spherical; The centre of sphere of spherical silica gel lens overlaps with its below LED chip light-emitting area.
(3) beneficial effect
Technique scheme tool has the following advantages: by silica-gel sphere lens being set above the upper strata at prior art COB light source midplane silica gel, LED chip, the light that the plane reflection that is greater than critical angle in prior art and contact with air at plane silica gel is returned to silica gel exports in air, has improved the light extraction efficiency of COB light source.
Accompanying drawing explanation
Fig. 1 is COB illuminating source packaging structure schematic diagram in prior art;
Fig. 2 is silica gel flat surface index path in prior art;
Fig. 3 is silica-gel lens index path of the present invention;
Fig. 4 is COB illuminating source packaging structure schematic diagram in the embodiment of the present invention one;
Fig. 5 is COB illuminating source packaging structure schematic diagram in the embodiment of the present invention two.
Wherein, 1: substrate; 2:LED chip; 3: box dam; 4: layer of silica gel; 5: silica-gel lens; 6: little silica-gel lens.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for illustrating the present invention, but are not used for limiting the scope of the invention.
The present embodiment multi-LED chip packaging structure on substrate as shown in Figure 4, multiple blue-light LED chips 2, is directly bonded on aluminium base 1, has silver-plated reflector, copper-clad on aluminium base 1.By gold thread or bump, multiple LED chips 2 and power supply are coupled together.At the outer box dam 3 that is with of LED chip 2.On LED chip 2 in box dam 3, be coated with layer of transparent layer of silica gel 4, in transparent silica gel, be mixed with phosphor material powder.
In the plane that transparent silicon glue-line 4 contacts with air, the top of each LED chip 2 is coated with a silica-gel lens 5.Change the refractive index of silica-gel lens 5, sphere diameter, the relative position of the centre of sphere and chip, can make COB light source obtain the angle of departure of required bright dipping.
In silica-gel lens 5 in the present embodiment, be mixed with phosphor material powder, to increase LED chip excitated fluorescent powder amount of light.
In another embodiment of the present invention, the substrate using is copper base, and silica-gel lens 5 is spherical, and the centre of sphere of silica-gel lens 5 and LED chip 2 light-emitting areas overlap, and the critical angle that now LED chip 2 emits beam disappears substantially, and it is maximum that light extraction efficiency reaches.
Gap between silica-gel lens 5, is also filled with little silica-gel lens 6, and the size of little silica-gel lens 6 is not more than the size of the silica-gel lens 5 of LED chip 2 tops.
In above embodiment, substrate also can be selected ceramic substrate or other baseplate material well-known in the art.
In equal LED chip quantity, under equal electrical power, use the COB light source of encapsulating structure of the present invention, than the COB light source of common plane silica gel, the luminous flux of bright dipping has improved 15%.
For example, in the application of the bulb lamp COB of 6W (18V, 350mA), traditional plane silica gel COB: luminous flux is 520 lumens; The COB that uses encapsulating structure of the present invention, luminous flux can reach 600 lumens.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the technology of the present invention principle; can also make some improvement and replacement, these improvement and replacement also should be considered as protection scope of the present invention.
Claims (6)
1. a multi-LED chip packaging structure on substrate, on substrate (1), be bonded with multiple LED chips (2), on LED chip (2), be coated with transparent silicon glue-line (4), it is characterized in that, in the plane contacting with air in layer of silica gel (4), be coated with silica-gel lens (5), the top that is positioned at LED chip (2) of described silica-gel lens;
In the plane of layer of silica gel (4) and air contact, described in the gap that is positioned between the silica-gel lens (5) of LED chip (2) top be also filled with little silica-gel lens (6), the size of little silica-gel lens (6) is not more than the size of the silica-gel lens (5) of LED chip (2) top.
2. multi-LED chip packaging structure on substrate as claimed in claim 1, is characterized in that, in described transparent silicon glue-line (4), is mixed with fluorescent material.
3. multi-LED chip packaging structure on substrate as claimed in claim 1, is characterized in that, described silica-gel lens is mixed with fluorescent material in (5).
4. multi-LED chip packaging structure on substrate as claimed in claim 1, is characterized in that, described baseplate material is aluminium or copper or pottery.
5. multi-LED chip packaging structure on substrate as claimed in claim 1, is characterized in that, in described silica-gel lens (5) and little silica-gel lens (6), is all mixed with fluorescent material.
6. the multi-LED chip packaging structure on substrate as described in claim 1 to 5 any one, is characterized in that described silica-gel lens (5) is for spherical; The centre of sphere of spherical silica gel lens (5) overlaps with its below LED chip (2) light-emitting area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110235184.6A CN102255035B (en) | 2011-08-16 | 2011-08-16 | Multi-LED chip packaging structure on substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110235184.6A CN102255035B (en) | 2011-08-16 | 2011-08-16 | Multi-LED chip packaging structure on substrate |
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| Publication Number | Publication Date |
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| CN102255035A CN102255035A (en) | 2011-11-23 |
| CN102255035B true CN102255035B (en) | 2014-04-16 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593323A (en) * | 2012-03-10 | 2012-07-18 | 江苏索尔光电科技有限公司 | LED (light-emitting diode) surface light source packaging piece |
| CN103375691A (en) * | 2012-04-12 | 2013-10-30 | 周海兵 | COB-packaged LED plant lamp and production method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2713647Y (en) * | 2004-07-27 | 2005-07-27 | 葛世潮 | Power type white light LED |
| CN101452982A (en) * | 2007-11-29 | 2009-06-10 | 富士迈半导体精密工业（上海）有限公司 | Solid illuminating device |
| CN201297529Y (en) * | 2008-11-15 | 2009-08-26 | 和谐光电科技（泉州）有限公司 | An encapsulation structure of a white light LED |
| CN201829498U (en) * | 2010-08-24 | 2011-05-11 | 广州南科集成电子有限公司 | Light emitting diode (LED) integrated light source panel |
| CN201829526U (en) * | 2009-12-01 | 2011-05-11 | 桂林电子科技大学 | Packaging structure of light emitting diode (LED) |
-
2011
- 2011-08-16 CN CN201110235184.6A patent/CN102255035B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2713647Y (en) * | 2004-07-27 | 2005-07-27 | 葛世潮 | Power type white light LED |
| CN101452982A (en) * | 2007-11-29 | 2009-06-10 | 富士迈半导体精密工业（上海）有限公司 | Solid illuminating device |
| CN201297529Y (en) * | 2008-11-15 | 2009-08-26 | 和谐光电科技（泉州）有限公司 | An encapsulation structure of a white light LED |
| CN201829526U (en) * | 2009-12-01 | 2011-05-11 | 桂林电子科技大学 | Packaging structure of light emitting diode (LED) |
| CN201829498U (en) * | 2010-08-24 | 2011-05-11 | 广州南科集成电子有限公司 | Light emitting diode (LED) integrated light source panel |
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| CN102255035A (en) | 2011-11-23 |
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Denomination of invention: Multi-LED chip packaging structure on substrate Effective date of registration: 20141204 Granted publication date: 20140416 Pledgee: Beijing industrial development Cci Capital Ltd. Pledgor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Registration number: 2014990001031 |
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Granted publication date: 20140416 Pledgee: Beijing industrial development Cci Capital Ltd. Pledgor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Registration number: 2014990001031 |