CN208846103U - A kind of filament - Google Patents

Abstract

The utility model provides a kind of filament; it include: substrate; substrate includes the first face and the second face; multiple concatenated light-emitting diodes are arranged in first face of substrate; it is characterized in that; second face is provided at least one protection location, one of protection location and one or more concatenated light-emitting diode reverse parallel connections.

Description

A kind of filament

Technical field

The utility model relates to a kind of LED illumination lamps, and in particular to a kind of LED filament with protection location.

Background technique

LED filament has following advantage: 360 ° of three-dimensional light angles that shine, integrated high voltage relative to traditional incandescent lamp Driving, it is at low cost；High quality light source, colour rendering index can accomplish 90 or more, light efficiency 120lm/W or more at present；Using complete Transparent substrate material cooperates completely new 360 ° of packaging technologies；Fluorescent glue moulding process, yield are high；Completely new light vision, impression are former " incandescent lamp " luminous environment of ecology.Thus extensive utilization has been obtained in LED filament.

The lamps and lanterns that LED filament is made into include one or more LED filament, and LED filament includes bar shaped substrate, two metal electricity Pole, plurality of LEDs light source, conducting wire, fluorescent glue, two metal electrodes are separately positioned on the both ends of bar shaped substrate, plurality of LEDs string of light Connection is bonded on bar shaped substrate, and metal electrode and LED light source are connected by conducting wire, the entire bar shaped substrate of fluorescent glue package, All LED light sources, conducting wire and part metals electrode.However due to plurality of LEDs light source be together in series in use, if wherein one because Failure and forming open circuit will lead to other LED light sources and stops working, therefore the service life of entire LED filament lamp can not protect Card.

Summary of the invention

In order to solve the above-mentioned technical problem, the utility model provides a kind of following filament, comprising: substrate, substrate include the On one side with the second face, multiple concatenated LED luminous components are arranged in the first face of substrate, which is characterized in that the second face is set It is equipped at least two protection locations, one of protection location and one or more adjacent light-emitting diode components are reversely simultaneously Connection.

Preferably, wherein protection location is multiple, each protection location and a light-emitting diode component reverse parallel connection.

Preferably, wherein protection location be it is multiple, each protection location and at least two adjacent LEDs are reversed It is in parallel.

Preferably, the protection component has anode and cathode.

Preferably, the substrate is provided with the through hole for being through to the second face, and the first face is provided with circuit connection layer use In each light-emitting diode component is connected in series, circuit connection layer is connected to the protection component in the second face by through hole.

Preferably, protection location is Zener diode, rectifier diode.

Preferably, the substrate is glass or ceramics or sapphire substrate.

Preferably, the substrate is flexible base board.

Preferably, the light emitting diode is inverted structure or at least one of positive assembling structure or vertical structure.

Preferably, the light emitting diode is inverted structure, and the first face of substrate is formed in by the way of covering gold.

Preferably, the filament is packaged resin layer and is coated.

Preferably, first face and the second face are provided with potting resin layer, and potting resin layer includes fluorescent powder.

Preferably, the light emitting diode is wafer-level packaging.

The utility model provides a kind of following lamps and lanterns simultaneously comprising the aforementioned filamentray structure.

Lamps and lanterns include using a filament described in the utility model or a plurality of filament serial or parallel connection.

The utility model guarantees following technical effect:

1. by reversed in the back side of filament substrate chip one protection location of setting and concatenated on one or more chips Series connection, can effectively ensure that it is part of when stopping working such as one or at least two LED light sources, still by the protection location of back side It is so electrically connected, guarantees that remaining LED light source can work normally；

2. being arranged by protection location at the positive back side, it is possible to prevente effectively from the light for extending through substrate back is absorbed；

3. realizing the reverse parallel connection design of protection location and LED light source by through hole and metallic circuit layer, and metal Line layer can increase heat dissipation area, and luminescence component light efficiency due to overheat is avoided to reduce.

Detailed description of the invention

Attached drawing 1-2 is the structural schematic diagram of specific embodiment of the present invention filament.

Fig. 3-4 is the electricity of LED light source and protection component reverse parallel connection in specific embodiment of the present invention filamentray structure Road schematic diagram.

Attached drawing 5 is the structural schematic diagram that specific embodiment of the present invention LED filament is provided with sealant.

Specific embodiment

Below with reference to schematic diagram to the filament of the utility model, illuminator and preparation method thereof is described in detail, Before being further described the utility model, it should be understood that due to that can be transformed to specific embodiment, this reality Following specific embodiments is not limited to novel.It is also understood that since the scope of the utility model is only wanted by appended right Restriction is asked, therefore used embodiment is introductory, rather than restrictive.Unless otherwise stated, institute here All technologies and scientific words are identical as the meaning that those skilled in the art are commonly understood by.

As shown in Figure 1, the utility model provides a kind of following filamentray structure, which includes substrate 1, LED light source 2, protects Protecting assembly 4, substrate include the first face and the second face, and the first face includes plurality of LEDs light source and the first envelope being arranged on the substrate Fill layer.In order to guarantee 360 ° go out light, preferably the substrate be light-transmitting substrate, such as glass or ceramics or sapphire rigid material or The flexible materials such as such as resin (FPC, BT, PE) are made, which can also be bent to form curve or meander line structure is formed Flexible filamentray structure.The structure of filament can be strip or round or helical form, and the numbers of particles of filament length and LED light source can To make as needed.The filamentray structure may finally carry out being serially connected electrical connection.

The first face and the second face of the substrate are provided with line layer 3, form line layer as covered copper foil on substrate.First face Line layer realizes the series connection of all LED light sources.The filament further includes two terminal-connecting elements that the substrate both ends are arranged in, It is electrically connected for filament and the external positive and negative anodes that formed.One end of these terminal-connecting elements is protruded into first encapsulated layer with first The line layer in face realizes electrical connection by welding, and the other end of these terminal-connecting elements is located at except encapsulated layer.

Number of LED light sources is multiple, and is formal dress, upside-down mounting or vertical chip wherein at least one, passes through this field institute Well known fixed form, if the mode of die bond or flip is fixed on the first face of substrate, the LED light source is ultraviolet, blue light, green The LED light source of a kind of chip or polychrome in light or feux rouges combines.The LED light source is equidistantly uniformly arranged, and is in line style list Row arrangement obtains good visual effect to guarantee luminous and the variations such as colour temperature and brightness uniformities.As preferable Embodiment, LED light source are the series connection of multiple flip-chips, and using flip LED chips, such as blue-light LED chip, flip-chip is without gold thread The fracture of wire of encapsulation, the sorrow to fall off, at the same can be used for flexible base board formed can coiled flexible filament, to guarantee that 360 ° go out Light, if substrate is the substrate of rigidity and light transmission, the preferably chip of formal dress routing, and chip is light transmissible substrate, to guarantee 360 ° go out light.

Shown in institute Fig. 1, the second face of the substrate is equipped with line layer, protection component 4.At least two protection components, specifically There is a protection component 4 for the back side of each chip, protection component 4 has anode and cathode, protects the anode of component 4 It is connected in inverse parallel with cathode by line layer and a LED chip in the first face.Specifically, LED component and LED are protected The circuit connecting mode of component is as shown in figure 3, a protection component 6 and 5 reverse parallel connection of LED light source.Pass through reverse parallel connection Protection component, it is ensured that once wherein some LED failure, protection component current channels can be provided, with other LED groups Part forms the circuit of connection, therefore although failure LED no longer shines, other LED can still work on.It can also be with base In the influence of cost of manufacture, complex manufacturing technology, light efficiency, by a protection component 6 concatenated LED chip adjacent at least two Reverse parallel connection, specific is as shown in Figures 2 and 45 reverse parallel connection of protection component 6 and 3 LED light source, thus one lamp of reduction The quantity of component is protected used on silk and saves the process cost.It is highly preferred that the protection component 4 can be Zener two Pole pipe or rectifier diode or chip-scale diode can be fixed in such a way that printing assembly or patch or upside-down mounting weld admittedly On the line layer in two faces.

Through hole 7 is set on substrate simultaneously, and through hole is provided with metallic circuit layer, the anode and negative pole end of protection location Connection is formed by the metallic circuit layer of through hole and the line layer in the first face respectively, thus design guarantee LED light source and Protect the reverse parallel connection of component.Meanwhile first the line layer in face and the second face can be metallic circuit layer, line layer can effectively increase Add heat dissipation area, reduces because thermal conductivity causes light efficiency decaying.

Preferably, each protection component is designed as far as possible at the positive back side for being located in one of LED light source, i.e. protection component Be symmetrical or position in the face back side with LED light source institute position, and protect component should size as far as possible it is small, to reduce to LED The absorption of the light of radiation of light source is blocked.Meanwhile substrate in order to obtain flexible filament, protects component when being flexible material The curved design of filament can not be interfered with positioned at the positive back side.

Filament as shown in Figure 5 further includes first encapsulated layer 8 in the first face, and one covers on the first face of substrate, including covers It covers in LED chip；Second encapsulated layer 9 in the second face is covered, including is covered on protection component.First and second encapsulated layer For sealing the filament light is projected from all surface of the encapsulated layer.

In order to obtain flexible filament, as a preferred embodiment, which is fabricated from a flexible material, such as silica gel tree Rouge；Fluorescent powder can also be equipped in the encapsulated layer, which can also be issued another by the light excitation that these LED chips issue A kind of light of wavelength.First, second encapsulated layer can also be separately designed according to photochromic needs as multilayered fluorescent powder encapsulated layer, from And issue the light of polychrome mixing.First, second encapsulated layer can form comprehensive 360 ° of encapsulation, and it is equal to go out light with 360 ° of guarantee It is even.First and second encapsulated layer also may include light-scattering material, so that the light source board can be used as a strip Structure continuous uniform goes out light.The LED chip is also possible to the chip of wafer-level packaging, i.e., with containing on the light-emitting surface of LED chip After the encapsulation of fluorescent powder sealant, then it is fixed on substrate.

The first face and the second face of the filament are externally bright, in this way, for the user of the LED filament For, the front and back of the filament be all it is luminous, entire filament is all bright.

The filament of the present embodiment can be further by one or more lamp according further to actual application demand Silk serial or parallel connection combination is installed in lamps and lanterns, illuminator is formed, as LED filament can be applied to crystal pendant lamp, candle lamp, ball Steep LED illuminations products such as lamp, wall lamp etc..

The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.

Claims (19)

1. a kind of filament, comprising: substrate, substrate include the first face and the second face, and multiple concatenated hairs are arranged in the first face of substrate Optical diode component, which is characterized in that the second face is provided at least one protection location, one of protection location and one or Multiple adjacent light-emitting diode component reverse parallel connections.

2. filament according to claim 1, which is characterized in that wherein protection location be it is multiple, each protection location with One light-emitting diode component reverse parallel connection.

3. filament according to claim 1, it is characterised in that: wherein protection location be it is multiple, each protection location with At least two adjacent LED modules reverse parallel connections.

4. filament according to claim 1, which is characterized in that the protection location has anode and cathode.

5. filament according to claim 1-3, which is characterized in that the substrate, which is provided with, is through to the second face Through hole, the first face and the second face be provided with line layer, and the line layer in the first face is for being connected in series each light-emitting diodes Tube assembly, for the line layer in the second face for being electrically connected protection location, the line layer in the first face is electrically connected to second by through hole The line layer of the protection location in face.

6. filament according to claim 1 or 2, which is characterized in that protection location is Zener diode, rectifier diode.

7. filament according to claim 1 or 2, which is characterized in that the substrate is glass or ceramics or sapphire substrate.

8. filament according to claim 1 or 2, which is characterized in that the substrate is flexible base board.

9. filament according to claim 1 or 2, which is characterized in that the light emitting diode is inverted structure or formal dress At least one of structure or vertical structure.

10. filament according to claim 1 or 2, which is characterized in that the lumination of light emitting diode region wavelength is purple Outside, at least one of blue and green light or feux rouges.

11. filament according to claim 1 or 2, which is characterized in that first face of filament and the second face are provided with Sealant.

12. filament according to claim 1 or 2, which is characterized in that the light emitting diode is inverted structure, is adopted The first face of substrate is formed in the mode of flip.

13. filament according to claim 1, which is characterized in that first face and the second face is packaged resin layer and is wrapped It covers.

14. 3 filament according to claim 1, which is characterized in that the potting resin layer includes fluorescent powder.

15. filament according to claim 1, it is characterised in that: the light emitting diode is wafer-level packaging.

16. filament according to claim 1, it is characterised in that: the substrate is transparent substrate.

17. according to claim 1 or 16 filaments, it is characterised in that: the protection location is located at light-emitting diode component The positive back side.

18. a kind of lamps and lanterns, it is characterised in that: including the described in any item filamentray structures of claim 1-17.

19. lamps and lanterns according to claim 18 comprising a filament or a plurality of filament, a plurality of filament serial or parallel connection.