CN201829526U

CN201829526U - Packaging structure of light emitting diode (LED)

Info

Publication number: CN201829526U
Application number: CN2009201648995U
Authority: CN
Inventors: 徐华蕊
Original assignee: Guilin University of Electronic Technology
Current assignee: Guilin University of Electronic Technology
Priority date: 2009-12-01
Filing date: 2009-12-01
Publication date: 2011-05-11
Anticipated expiration: 2019-12-01

Abstract

The utility model relates to a packaging structure of a light emitting diode (LED), which comprises an LED chip, a metal base with high heat conductivity, an attachment bracket and an LED mask, wherein the LED chip is fixed on the installation surface of the base, the electrode end of the LED chip and a circuit of the bracket are in electrical conducting connection by an electrode lead, and the LED mask is arranged on a light outlet; and the packaging structure of the LED is characterized in that a layer of sputtered fluorescent film layer is arranged on the inner face of the LED mask. Because a fluorescent film is sputtered onto the inner face of the LED mask, the assembly is convenient, the packaging operation is simplified, and the critical operations of glue mixing, coating, baking and the like of a fluorescent material in a traditional LED processing process, which influence the stability of the performance of the LED, are removed. Meanwhile, the brightness and the brilliance of the LED are enhanced, the occurrence of light spots is avoided, and the light attenuation is reduced.

Description

The encapsulating structure of a kind of LED

Technical field

The utility model relates to the encapsulating structure of semiconductor solid luminescence device, particularly a kind of LED.

Background technology

Existing LED critical piece comprises led chip, metal base, connection support, LED face shield etc., a kind of encapsulating structure of white light LEDs has been shown among Fig. 1, mainly comprise connecting support 1, high heat conductive metal pedestal 2, led chip 3, phosphor laminate 4, lens 5, its manufacture method is: the installed surface middle part, bowl chamber of a) led chip 3 being fixed in pedestal 2; B) pedestal 2 is installed on support 1; C), and finish being electrically conducted between lead-in wire and support 1 circuit at led chip 3 electrode tip connection electrode lead-in wire; D) with fluorescent material with after liquid resin or silica gel mix, be covered in 2 bowls of chambeies of pedestal with a glue or coating method again, form phosphor laminate 4 after drying; E) assembling dome-type plastic lens or directly irritate the lens 5 of transparent rubber moulding injection forming on phosphor laminate 4 is just finished white light LEDs shown in Figure 1 through baking again.The deficiency of this White-light LED package structure is: fluorescent material mixes the colloid that forms because time of repose is different with liquid resin or silica gel, cause fluorescent material precipitation capacity difference in alternately, and make the amount of phosphor laminate 4 be difficult to control evenly, cause the hot spot effect of finished product LED bad, consistency is bad during batch process.

Summary of the invention

The purpose of this utility model is that the fluorescent material that solves existing LED is arranged the improper various undesirable conditions that cause, the encapsulating structure of a kind of LED is provided, changes the layout of fluorescent material, encapsulate convenient controlled, improve the LED light extraction efficiency, reduce light loss, promote the job stability of LED significantly.

The purpose of this utility model is achieved through the following technical solutions:

The encapsulating structure of this LED, comprise led chip, metal base, connection support, LED face shield, led chip is fixed on the pedestal installed surface, do by contact conductor between led chip electrode tip and the support circuitry and be electrically conducted, the LED face shield is located on the light-emitting window, it is characterized in that: described LED face shield material is glass or quartz, profile can be flat board, convex mirror, convex lens or polygon prism, the fluorescent film layer that one deck sputter is arranged on the inner face of LED face shield, wherein fluorescence membrane does not contain organic substances such as resin or silica gel.

The utlity model has following advantage:

1, fluorescence membrane is sputtered in LED face shield inner face in advance, LED face shield and the fluorescence membrane that does not contain organic substances such as resin or silica gel are prefabricated into integrated assembly parts in advance, be convenient to thickness according to actual needs control fluorescence membrane, avoided the impregnation of fluorescent material in traditional LED production process, coating (or some glue), baking etc. influences the key operation of LED stable performance, thereby guarantee that fluorescent material is luminous evenly, sound construction, simplify packaging technology, to produce high-quality, the white light LEDs of high stability, and improve the job stability and the reliability of fluorescent material greatly, guarantee that the LED bright dipping is stable, the colour temperature unanimity.

2, because fluorescent material is sputtered in LED face shield inner face in advance, avoid hot spot to occur, reduced light decay, it can be exported the light source areflexia equably fully, at utmost improve luminous efficiency, improve more than 20% than the existing led light source illumination of common semicircle lens damascene packages of using.Make various light sources, can obtain maximum brightness.

Description of drawings

Below in conjunction with accompanying drawing the utility model is described in further detail.

Fig. 1 is the encapsulating structure schematic diagram of existing white light LEDs.

Fig. 2 is the schematic diagram of the LED encapsulating structure that provides of the utility model.

Embodiment

Embodiment 1: with reference to Fig. 2.The encapsulating structure of existing white light LEDs mainly comprises connecting support 1, metal base 2, led chip 3, LED face shield 4 and fluorescence membrane 5, transparent adhesive tape encapsulation body 6.

Design of the present utility model is with reference to Fig. 2.Pedestal 2 is fixedly mounted on the support 1, is laid with the connecting circuit (not shown) on the support 1.The end face 21 of pedestal 2 is the plane, and led chip 3 directly is fixedly mounted on flat top surface 21 middle parts of pedestal.In led chip 3 electrode tip connection electrode lead-in wires (not shown), and finish being electrically conducted between the connecting circuit on contact conductor and the support 1, form electric loop.LED face shield 4 materials are glass or quartz, are dull and stereotyped profile, and sputter has the above-mentioned fluorescence membrane 5 that does not contain organic substances such as resin or silica gel on its inner face, and the LED face shield is engaged on the light-emitting window that connects support.The fluorescence membrane 5 of LED face shield inner face and pedestal 2, be connected in the space that support 2 surrounded and be perfused with integrated transparent adhesive tape encapsulation body 6, led chip 3 and circuit package are in this transparent adhesive tape encapsulation body 6; Utilize transparent adhesive tape encapsulation body 6 that pedestal 2, support 1 and LED face shield 4 closely are fixed into one.

For satisfying the requirement that improves LED lighting angle and illumination, the appearance and modeling of above-mentioned LED face shield 4 is not limited to shown in Fig. 2, the moulding of LED face shield 4 can go out contour structures such as flat board, convex mirror, convex lens or polygon prism according to optical design, different according to led chip and fluorescent material, LED is luminous can be multicolour, does not enumerate one by one at this.

The above, it only is preferred embodiment of the present utility model, so can not limit the scope that the utility model is implemented with this, i.e. the equivalence of doing according to the utility model claim and description changes and modifies, and all should belong in the scope that the utility model patent contains.

Claims

1. the encapsulating structure of a LED comprises led chip, metal base, connection support, LED face shield, and led chip is fixed on the pedestal installed surface, does being electrically conducted between led chip electrode tip and the support circuitry by contact conductor, and the LED face shield is located on the light-emitting window; It is characterized in that: the fluorescent film layer that one deck sputter is arranged on the inner face of LED face shield.

2. the encapsulating structure of LED according to claim 1, it is characterized in that: LED face shield profile is flat board, convex mirror, convex lens or polygon prism.