CN201766102U

CN201766102U - White light light-emitting diode of SMD (surface mounted device)

Info

Publication number: CN201766102U
Application number: CN2010202748067U
Authority: CN
Inventors: 王鹏辉
Original assignee: SHENZHEN SMALITE OPTOELECTRONICS CO Ltd
Current assignee: Jiangxi Hongli Photoelectric Co ltd; Shenzhen Smart Semiconductor Ltd
Priority date: 2010-07-29
Filing date: 2010-07-29
Publication date: 2011-03-16
Anticipated expiration: 2020-07-29

Abstract

The utility model relates to a white light light-emitting diode of an SMD (surface mounted device), which comprises a support (60), an LED (light emitting diode) wafer (20), gold threads (30) and fluorescent glue (40), wherein a heat-conducting copper column (10) is arranged in the support (60), and the LED wafer (20) is fixed on the top surface of the heat-conducting copper column (10) through die bonding primer; two electrodes of the LED wafer (20) are respectively and electrically connected with conductive electrodes (50) on two sides of the support (60) with the help of the gold threads (30); the fluorescent glue (40) is covered on the surface of the LED wafer (20); and a boss (101) is arranged on the top surface of the heat-conducting copper column (10) and the area of the cross section of the boss (101) is smaller than the area of the top surface of the heat-conducting copper column (10), and the LED wafer (20) is fixed on the upper surface of the boss (101). The SMD white light light-emitting diode has the benefits that the fluorescent glue which is settled on the side surface of the LED wafer is reduced, fluorescent powder is more evenly distributed on the surface of the LED wafer, and the color temperature of the product is relatively centralized, thereby obviously improving the light spot effect and leading the light emission to be more uniform.

Description

A kind of SMD white light emitting diode

Technical field

The utility model relates to the photoemissive semiconductor device that is applicable to that has a jump in potential potential barrier or surface potential barrier at least, particularly relates to light-emitting diode, relates in particular to a kind of SMD white light emitting diode.

Background technology

SMD(Surface Mounted Devices) light-emitting diode is a kind of novel surface mounted type light emitting semiconductor device, have that volume is little, angle of scattering is big, uniformity of luminance is good, the high and low power consumption of reliability, advantages such as response speed is fast, glow color comprises the shades of colour of white light, is widely used on the various electronic products.Mainly comprise the application of the following aspects: middle-size and small-size backlight, lighting field, decorative lamp, instrument and meter display lamp etc.LED (Light Emitting Diode) encapsulation technology develops on the Discrete device packaging technical foundation and develops; being electrically connected of wafer and support both finished in the LED encapsulation; can play the operate as normal of protection tube core again, to reach the purpose of the stability that improves product.

White light LEDs is to utilize the principle of three primary colours of color to form white light, mainly is to excite yellow fluorescent powder to form with the blue light wafer, and this method technology is simple relatively, technology maturation, and has lower-cost advantage after the commercialization volume production.Prior art is made white light LEDs normally behind the solid crystalline substance of process on the support, bonding wire craft, according to certain proportioning with fluorescent glue (glue and phosphor mixture) evenly after with its blue light wafer surface that is electrically connecting, make its curing molding through baking process then, again through obtaining the white light product of each different-colour section after the packaging technology.As shown in Figure 3 and Figure 4, prior art SMD white-light LED structure comprises support 60, LED wafer 20, gold thread 30 and fluorescent glue 40, is provided with heat conduction copper post 10 in the described support 60, and described LED wafer 20 is fixed on the end face of described heat conduction copper post 10 by solid brilliant primer; Two electrodes of described LED wafer 20 electrically connect by the conductive electrode 50 of gold thread 30 with described support 60 both sides respectively; Described fluorescent glue 40 covers the surface of described LED wafer 20.Fluorescent glue is subjected to the influence of gravity in the process of baking, fluorescent glue can make fluorescent glue more in wafer side precipitation to wafer side precipitation; And the fluorescent glue that is deposited in wafer front surface is less relatively.After treating the fluorescent glue curing molding, change has then taken place in the distribution of fluorescent material, and promptly the fluorescent material of wafer side precipitation is more, and the fluorescent material that wafer front surface distributes is then less.For the blue light wafer, the little luminous intensity of its side area is more weak, and it is lower to light the back colour temperature according to the produced product of above-mentioned technology; And the front surface light-emitting area is big, and luminous quantity is also big, and the fluorescent material that wafer front surface distributes is but less relatively, and it is higher relatively to make product light the back colour temperature.Owing to the inhomogeneities of wafer side and front surface color temperature distribution, caused the difference of product local color, and the hot spot effect is bad.

Summary of the invention

The technical problems to be solved in the utility model is to avoid above-mentioned the deficiencies in the prior art part, and a kind of hot spot that can improve is provided, and luminous uniform SMD white light emitting diode.

The utility model can be realized by the following technical solutions for solveing the technical problem:

Design a kind of SMD white light emitting diode, comprise support, LED wafer, gold thread and fluorescent glue, be provided with heat conduction copper post in the described support, described LED wafer is fixed on the end face of described heat conduction copper post by solid brilliant primer; Two electrodes of described LED wafer electrically connect by the conductive electrode of gold thread and described support both sides respectively; Described fluorescent glue covers the surface of described LED wafer; The end face of described heat conduction copper post is provided with the boss of cross-sectional area less than heat conduction copper capital face area, and described LED wafer is fixed on described boss upper surface.

As further improvement of the utility model, the cross section of described boss is square.

The beneficial effects of the utility model are: the utility model is provided with the boss of fixed L ED wafer at heat conduction copper capital face, make when the LED wafer carried out a some fluorescent glue, because the relative heat conduction copper of boss top surface area capital face area diminishes, the fluorescent glue that is deposited to the LED wafer side reduces, also make fluorescent material more be evenly distributed in the LED wafer surface, make the product colour temperature relatively concentrated, thereby obviously improve the hot spot effect, make more even light emission.

Description of drawings

Fig. 1 is that the master of a kind of SMD white light emitting diode of the utility model looks the sectional structure schematic diagram;

Fig. 2 is the plan structure schematic diagram of a kind of SMD white light emitting diode of the utility model;

Fig. 3 is that the master of prior art SMD white light emitting diode looks the sectional structure schematic diagram;

Fig. 4 is the plan structure schematic diagram of prior art SMD white light emitting diode.

Embodiment

Be described in further detail below in conjunction with the preferred embodiment shown in each accompanying drawing.

A kind of SMD white light emitting diode as depicted in figs. 1 and 2, comprises support 60, LED wafer 20, gold thread 30 and fluorescent glue 40, is provided with heat conduction copper post 10 in the described support 60, and described LED wafer 20 is fixed on the end face of described heat conduction copper post 10 by solid brilliant primer; Two electrodes of described LED wafer 20 electrically connect by the conductive electrode 50 of gold thread 30 with described support 60 both sides respectively; Described fluorescent glue 40 covers the surface of described LED wafer 20; The end face of described heat conduction copper post 10 is provided with the boss 101 of cross-sectional area less than heat conduction copper post 10 top surface area, and described LED wafer 20 is fixed on described boss 101 upper surfaces.

In the utility model, the cross section of described boss 101 is square, helps solid brilliant position more accurate (because the LED wafer is square) like this.

For reaching better effect, when product is carried out baking process, the method that can adopt the front surface (light-emitting area) with LED wafer 20 to toast down, by this baking method, can make the front surface deposition of the fluorescent material of LED wafer 20 sides towards wafer, the wafer front surface luminous quantity is big, and fluorescent material can be excited fully, and wafer side luminous quantity is less, fluorescent material is also less, this part fluorescent material also can obtain exciting more fully, like this, no matter is the front surface or the side surface of wafer, fluorescent material has all obtained exciting more fully, therefore, colour temperature is more even, and hot spot has obtained better improvement.

Above content be in conjunction with concrete optimal technical scheme to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.

Claims

1. SMD white light emitting diode, comprise support (60), LED wafer (20), gold thread (30) and fluorescent glue (40), be provided with heat conduction copper post (10) in the described support (60), described LED wafer (20) is fixed on the end face of described heat conduction copper post (10) by solid brilliant primer; Two electrodes of described LED wafer (20) electrically connect by the conductive electrode (50) of gold thread (30) with described support (60) both sides respectively; Described fluorescent glue (40) covers the surface of described LED wafer (20); It is characterized in that: the end face of described heat conduction copper post (10) is provided with the boss (101) of cross-sectional area less than heat conduction copper post (10) top surface area, and described LED wafer (20) is fixed on described boss (101) upper surface.

2. SMD white light emitting diode according to claim 1 is characterized in that: the cross section of described boss (101) is square.