CN102569611A - Method for coating surface of horizontal-structure wafer of LED with fluorescent glue - Google Patents
Method for coating surface of horizontal-structure wafer of LED with fluorescent glue Download PDFInfo
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- CN102569611A CN102569611A CN2011104592404A CN201110459240A CN102569611A CN 102569611 A CN102569611 A CN 102569611A CN 2011104592404 A CN2011104592404 A CN 2011104592404A CN 201110459240 A CN201110459240 A CN 201110459240A CN 102569611 A CN102569611 A CN 102569611A
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- fluorescent glue
- structure wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The invention is applicable to the technical field of LED lighting and provides a method for coating the surface of a horizontal-structure wafer of an LED with fluorescent glue. The method comprises the following steps: firstly, fixedly arranging the horizontal-structure wafer on a lug boss on an LED support; secondly, dispensing the fluorescent glue on the upper surface of the horizontal-structure wafer and making the upper surface of the fluorescent glue arc-shaped; thirdly, laminating the fluorescent glue by using a film forming device, making the fluorescent glue flow to the lug boss and cover the whole horizontal-structure wafer, and making the upper surface of the fluorescent glue parallel to the upper surface of the horizontal-structure wafer; and finally, when the fluorescent glue is solidified, removing the film forming device, and performing the subsequent package. The fluorescent glue coated on the surface of the horizontal-structure wafer is uniform in thickness; a manufactured LED finished product is uniform in illumination and consistent in color; and the luminous flux and the luminous efficiency of the LED finished product are improved.
Description
Technical field
The invention belongs to the LED lighting technical field, relate in particular to a kind of method that applies fluorescent glue in LED horizontal structure wafer surface.
Background technology
The fluorescent powder coating technique of great power LED mainly utilizes methods such as electrophoresis, spraying, sputter to realize having effect preferably at present.But because process is complicated, apparatus expensive, the material waste is serious, causes the technology cost too high, is not suitable for low-cost batch production.Simultaneously, for the horizontal structure wafer of lateral emitting, above technology all can not well solve the problem that its side fluorescent material applies, so present technology can not well solve the fluorescent material coating problem of horizontal structure wafer.
And the form that traditional fluorescent material applies through bowl cup carrying fluorescent glue realizes, under the situation of bowl cup structure restriction, can realize low-cost batch production.But, gold-tinted spot or blue-light excited a spot of fluorescent material (blue-light excited unsaturated) causes blue light to spill the blue light circle occurring owing to appearring in blue-light excited excessive fluorescent material (fluorescent material excites unsaturated).Because of existing fluorescent material to excite insatiable hunger or blue-light excited unsaturated, reduced the luminous flux of finished product, it is all relatively poor to cause encapsulating finished product hot spot quality and light efficiency.
Summary of the invention
The purpose of the embodiment of the invention is to provide a kind of and applies the method for fluorescent glue in LED horizontal structure wafer surface, and it is in uneven thickness to be intended to solve the existing fluorescent glue that is coated on the horizontal structure wafer surface, the inferior problem of hot spot.
The embodiment of the invention is achieved in that a kind of method in LED horizontal structure wafer surface coating fluorescent glue, may further comprise the steps:
The horizontal structure wafer is fixedly arranged on the boss on the led support;
The fluorescent glue point is located at the upper surface of said horizontal structure wafer, and to make the upper surface of said fluorescent glue be cambered surface;
By the said fluorescent glue of film shaping device pressing, make said fluorescent glue flow to said boss and cover whole horizontal structure wafer, make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer simultaneously;
After treating that said fluorescent glue solidifies, remove said film shaping device.
Perhaps, the fluorescent glue point is located at said boss and is made it cover whole horizontal structure wafer, the upper surface that makes said fluorescent glue simultaneously is a cambered surface;
By the said fluorescent glue of film shaping device pressing, make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer;
After treating that said fluorescent glue solidifies, remove said film shaping device.
The embodiment of the invention is fixedly arranged on the boss on the led support with the horizontal structure wafer earlier; Then the fluorescent glue point is located at the upper surface of said horizontal structure wafer; And the upper surface that makes said fluorescent glue is cambered surface, then by the said fluorescent glue of film shaping device pressing, makes said fluorescent glue flow to said boss and covers whole horizontal structure wafer; Make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer simultaneously; After treating that said fluorescent glue solidifies, remove said film shaping device, can carry out follow-up encapsulation.So will make the fluorescent glue thickness that is coated on said horizontal structure wafer surface even, made LED finished product is luminous evenly, solid colour, has promoted the luminous flux and the light efficiency of LED finished product simultaneously.
Perhaps; The fluorescent glue point is located at said boss and is made it cover whole horizontal structure wafer, and the upper surface that makes said fluorescent glue simultaneously is a cambered surface, then by the said fluorescent glue of film shaping device pressing; Make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer; After treating that said fluorescent glue solidifies, remove said film shaping device, can carry out follow-up encapsulation.Make the fluorescent glue thickness that is coated on said horizontal structure wafer surface even equally, made LED finished product is luminous evenly, solid colour, has promoted the luminous flux and the light efficiency of LED finished product simultaneously.
Description of drawings
Fig. 1 be first embodiment of the invention provide apply the realization flow figure of fluorescent glue in LED horizontal structure wafer surface;
Fig. 2 is the structural representation (independently boss) of the led support that provides of first embodiment of the invention;
Fig. 3 is the structural representation behind led support point fluorescent glue shown in Figure 2;
Fig. 4 is the structural representation of fluorescent glue shown in Figure 3 after pressing is solidified;
Fig. 5 is the structural representation (continuous boss) of the led support that provides of first embodiment of the invention;
Fig. 6 is the structural representation behind led support point fluorescent glue shown in Figure 5;
Fig. 7 is the structural representation of fluorescent glue shown in Figure 6 after pressing is solidified;
Fig. 8 is the structural representation behind LED horizontal structure upper wafer surface point fluorescent glue that first embodiment of the invention provides;
Fig. 9 is the structural representation (during the pressing fluorescent glue) of the film shaping device that provides of first embodiment of the invention;
Figure 10 is the structural representation (elevation control mechanism therefor and laminating mechanism are one-body molded) of the film shaping device that provides of first embodiment of the invention;
Figure 11 is the structural representation (upper surface of fluorescent glue smooth and be parallel to the upper surface of LED horizontal structure wafer) of the LED that provides of first embodiment of the invention.
Figure 12 is that the fluorescent glue point that provides of second embodiment of the invention is in boss and the structural representation after covering whole horizontal structure wafer;
Figure 13 be second embodiment of the invention provide the fluorescent glue pressing time structural representation.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The embodiment of the invention is fixedly arranged on the boss on the led support with the horizontal structure wafer earlier; Then the fluorescent glue point is located at the upper surface of said horizontal structure wafer; And the upper surface that makes said fluorescent glue is cambered surface, then by the said fluorescent glue of film shaping device pressing, makes said fluorescent glue flow to said boss and covers whole horizontal structure wafer; Make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer simultaneously; After treating that said fluorescent glue solidifies, remove said film shaping device, can carry out follow-up encapsulation.So will make the fluorescent glue thickness that is coated on said horizontal structure wafer surface even, made LED finished product is luminous evenly, solid colour, has promoted the luminous flux and the light efficiency of LED finished product simultaneously.
Perhaps; The fluorescent glue point is located at said boss and is made it cover whole horizontal structure wafer, and the upper surface that makes said fluorescent glue simultaneously is a cambered surface, then by the said fluorescent glue of film shaping device pressing; Make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer; After treating that said fluorescent glue solidifies, remove said film shaping device, can carry out follow-up encapsulation.Make the fluorescent glue thickness that is coated on said horizontal structure wafer surface even equally, made LED finished product is luminous evenly, solid colour, has promoted the luminous flux and the light efficiency of LED finished product simultaneously.
Below in conjunction with specific embodiment realization of the present invention is described in detail.
Embodiment one
What Fig. 1 showed that the embodiment of the invention provides applies the realization flow of fluorescent glue in LED horizontal structure wafer surface, and details are as follows.
In step S101, the horizontal structure wafer is fixedly arranged on the boss on the led support;
The embodiment of the invention is fixedly arranged on the boss on the led support with horizontal structure wafer 27 earlier, and then welding lead 24 makes horizontal structure wafer 27 link to each other with stent electrode, and is as shown in Figure 2.Wherein, said horizontal structure wafer 27 upper surfaces and four sides are all luminous.
Should be noted that; Said led support 1 has the crystal bonding area territory 10 that sets firmly said horizontal structure wafer 27; Around said crystal bonding area territory 10, establish groove, form the boss that carries fluorescent glue thus, need not to be provided with in addition the bowl cup that carries fluorescent glue; Save human and material resources, help to promote the luminous flux of LED finished product simultaneously.Said groove is generally formed by the method (like etching) of physics or chemistry.
The boss of support described in the embodiment of the invention has two kinds of forms, a kind ofly is boss independently, and another kind is continuous boss.To introduce the formation and the advantage thereof of two kinds of boss below respectively.
Like Fig. 3, shown in 4, continuous recess 20 makes crystal bonding area territory 10 and stent electrode spaced apart, has formed independently boss 31, and promptly continuous recess 20 is separated crystal bonding area territory 10 fully from stent electrode.Fluorescent glue is a liquid, has surface tension.Point is located at the edge that horizontal structure wafer 27 surperficial fluorescent glues 50 will rest on boss 31, and boss 31 carries fluorescent glues 50 thus.Certainly, the area of said boss 31 is big than the area of consolidate wafer 27.
Usually, said stent electrode comprises positive electrode 41 and negative electrode 42, and both are by 43 isolation of groove.Said groove 20 is a continuous recess, and links to each other with said groove 43.Continuous recess 20 is independent of the sheet metal between the support both positive and negative polarity with crystal bonding area territory 10 fully like this; Make the heat passage and the electric pathway of led support 1 relatively independent; Can obtain more stable electrical property, fully independently boss 31 is easy to a little establish fluorescent glue 50 simultaneously.
Different with preceding a kind of boss is that said crystal bonding area territory 10 also can link to each other with stent electrode, forms continuous boss 32.Said groove is spaced apart by stent electrode, forms first sub-groove 21, second sub-groove 22 and the 3rd sub-groove 23, shown in Fig. 5～7.
The territory of crystal bonding area described in the embodiment of the invention 10 is the part of positive electrode 41, and promptly crystal bonding area territory 10 links to each other with positive electrode 41, is not separated by groove fully.The heat of horizontal structure wafer 27 generations this moment also can conduct excellent in heat dissipation effect downwards through whole positive electrode 41.In addition, through the thermoelectric passage of reserving on 10 4 angles, crystal bonding area territory 11, conducts liquid fluorescent glue 50 flows to here, and enclosing of fluorescent glue covered on four jiaos of the processing wafers well, obtains better packaging effect.
In step S102, the fluorescent glue point is located at the upper surface of said horizontal structure wafer, and to make the upper surface of said fluorescent glue be cambered surface;
The embodiment of the invention generally is located at the fluorescent glue point upper surface of said horizontal structure wafer, is easy to a glue like this, and is as shown in Figure 8.Because of fluorescent glue is a liquid, there is surface tension.After said fluorescent glue point was good, its upper surface was a cambered surface.
In step S103, by the said fluorescent glue of film shaping device pressing, make said fluorescent glue flow to said boss and cover whole horizontal structure wafer, make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer simultaneously;
As shown in Figure 9, the film shaping device that the embodiment of the invention provides comprises that elevation control mechanism therefor 71 and lower surface are the laminating mechanism 72 of flat face.During pressing fluorescent glue 50; Support laminating mechanism 72 by said elevation control mechanism therefor 71, said laminating mechanism 72 utilizes liquid fluorescent glue surface tension, and said fluorescent glue 50 is flowed along its lower surface; Wherein the part fluorescent glue flow to above-mentioned boss, thereby makes fluorescent glue cover whole horizontal structure wafer.After said fluorescent glue 50 solidified, its upper surface was smooth and be parallel to the upper surface of horizontal structure wafer 27, thereby makes the fluorescent glue thickness that is coated on horizontal structure wafer 27 even, promotes the hot spot quality of LED finished product.
Do not touch lead when guaranteeing pressing, make said elevation control mechanism therefor be higher than the peak of said lead, be lower than the peak of said fluorescent glue cambered surface, make simultaneously said elevation control mechanism therefor on horizontal direction away from said lead.Wherein, Fig. 4 and 7 shows the effect of fluorescent glue after the operation of this film shaping device of a little being located at horizontal structure wafer 26 upper surfaces.
Film shaping device described in the embodiment of the invention is established said fluorescent glue is heated, and makes the heating arrangements of its curing.Particularly, said heating arrangements is many and is arranged in said laminating mechanism 72 and/or in order to the heating rod 74 of the platform 73 of placing led support 1.Said platform 73 can be the optical table of supporting and fixed L ED support 1, and is as shown in Figure 9.
For making said fluorescent glue more smooth, said film shaping device is also established said laminating mechanism 72 pressurizations, makes its pressing mechanism 75 stably, can be through mechanical force or magnetic force pressurization at this.Certainly, said elevation control mechanism therefor 71 both can be one-body molded with laminating mechanism 72, can also make respectively, and was shown in figure 10.
In step S104, treat that said fluorescent glue solidifies after, remove said film shaping device.
The embodiment of the invention solidifies the fluorescent glue in the said film shaping device through heating, treat that said fluorescent glue solidifies after, remove said film shaping device, can carry out follow-up encapsulation.Shown in figure 11, lens such as mold pressing or installation silica gel, glass, perhaps filler such as filling gel, glass 54, and until processing the LED finished product, the light that made LED finished product sends is even, solid colour.
Embodiment two
Different with embodiment one is that present embodiment is put fluorescent glue in above-mentioned boss and made it cover whole horizontal structure wafer 27, and is shown in figure 12.Because of fluorescent glue 50 is a liquid, there is surface tension.Likewise, after 50 of said fluorescent glues were got well, its upper surface was a cambered surface.
Certainly, the boss of above-mentioned two kinds of forms and film shaping device are equally applicable to present embodiment.By the said fluorescent glue 50 of film shaping device pressing, make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer 27, can be cured, shown in figure 13.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. one kind applies the method for fluorescent glue in LED horizontal structure wafer surface, it is characterized in that, said method comprising the steps of:
The horizontal structure wafer is fixedly arranged on the boss on the led support;
The fluorescent glue point is located at the upper surface of said horizontal structure wafer, and to make the upper surface of said fluorescent glue be cambered surface;
By the said fluorescent glue of film shaping device pressing, make said fluorescent glue flow to said boss and cover whole horizontal structure wafer, make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer simultaneously;
After treating that said fluorescent glue solidifies, remove said film shaping device.
2. one kind applies the method for fluorescent glue in LED horizontal structure wafer surface, it is characterized in that, said method comprising the steps of:
The horizontal structure wafer is fixedly arranged on the boss on the led support;
The fluorescent glue point is located at said boss and is made it cover whole horizontal structure wafer, and the upper surface that makes said fluorescent glue simultaneously is a cambered surface;
By the said fluorescent glue of film shaping device pressing, make the upper surface of said fluorescent glue be parallel to the upper surface of said horizontal structure wafer;
After treating that said fluorescent glue solidifies, remove said film shaping device.
According to claim 1 or claim 2 apply the method for fluorescent glue in LED horizontal structure wafer surface, it is characterized in that said film shaping device comprises that elevation control mechanism therefor and lower surface are the laminating mechanism of flat face; During the said fluorescent glue of pressing, support laminating mechanism by said elevation control mechanism therefor, said laminating mechanism forces said fluorescent glue to flow along its lower surface; After said fluorescent glue solidified, its upper surface was smooth and be parallel to the upper surface of said horizontal structure wafer.
4. the method that applies fluorescent glue in LED horizontal structure wafer surface as claimed in claim 3; It is characterized in that; Said horizontal structure wafer links to each other with stent electrode via lead; Said elevation control mechanism therefor is higher than the peak of said lead, is lower than the peak of said fluorescent glue cambered surface, make simultaneously said elevation control mechanism therefor on horizontal direction away from said lead.
According to claim 1 or claim 2 apply the method for fluorescent glue in LED horizontal structure wafer surface, it is characterized in that said led support has in order to set firmly the crystal bonding area territory of said horizontal structure wafer, around said crystal bonding area territory, establishes groove.
6. as claimed in claim 5ly apply the method for fluorescent glue, it is characterized in that said crystal bonding area territory and stent electrode are spaced apart, form independently boss in LED horizontal structure wafer surface; The area that the area of said boss is consolidated wafer is big.
7. as claimed in claim 6ly apply the method for fluorescent glue in LED horizontal structure wafer surface, it is characterized in that said stent electrode comprises positive electrode and negative electrode, both are isolated by groove; Said groove is a continuous recess, and links to each other with said groove.
8. as claimed in claim 5ly apply the method for fluorescent glue, it is characterized in that said crystal bonding area territory links to each other with stent electrode, form continuous boss in LED horizontal structure wafer surface; The area that the area of said boss is consolidated wafer is big.
9. as claimed in claim 8ly apply the method for fluorescent glue in LED horizontal structure wafer surface, it is characterized in that said stent electrode comprises positive electrode and negative electrode, both are isolated by groove; Said groove is spaced apart by stent electrode, forms the first sub-groove, the second sub-groove and the 3rd sub-groove.
10. the method that applies fluorescent glue in LED horizontal structure wafer surface as claimed in claim 3; It is characterized in that; Said film shaping device is established said fluorescent glue is heated, and makes the heating arrangements of its curing and to said laminating mechanism pressurization, makes its pressing mechanism stably.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110459240.4A CN102569611B (en) | 2011-12-31 | 2011-12-31 | A kind of in the method for LED horizontal structure wafer surface coating fluorescent glue |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110459240.4A CN102569611B (en) | 2011-12-31 | 2011-12-31 | A kind of in the method for LED horizontal structure wafer surface coating fluorescent glue |
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| CN102569611A true CN102569611A (en) | 2012-07-11 |
| CN102569611B CN102569611B (en) | 2015-08-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311416A (en) * | 2013-05-13 | 2013-09-18 | 芜湖锐拓电子有限公司 | Method for coating fluorescent glue onto LED (Light-Emitting Diode) wafer and film-pressing mould thereof |
Citations (3)
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| CN100592538C (en) * | 2006-08-09 | 2010-02-24 | 广东昭信光电科技有限公司 | Encapsulation method for high-brightness white light LED |
| CN201766102U (en) * | 2010-07-29 | 2011-03-16 | 深圳市斯迈得光电子有限公司 | White light light-emitting diode of SMD (surface mounted device) |
| JP2011171357A (en) * | 2010-02-16 | 2011-09-01 | Stanley Electric Co Ltd | Light emitting device and method of manufacturing the same |
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2011
- 2011-12-31 CN CN201110459240.4A patent/CN102569611B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100592538C (en) * | 2006-08-09 | 2010-02-24 | 广东昭信光电科技有限公司 | Encapsulation method for high-brightness white light LED |
| JP2011171357A (en) * | 2010-02-16 | 2011-09-01 | Stanley Electric Co Ltd | Light emitting device and method of manufacturing the same |
| CN201766102U (en) * | 2010-07-29 | 2011-03-16 | 深圳市斯迈得光电子有限公司 | White light light-emitting diode of SMD (surface mounted device) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311416A (en) * | 2013-05-13 | 2013-09-18 | 芜湖锐拓电子有限公司 | Method for coating fluorescent glue onto LED (Light-Emitting Diode) wafer and film-pressing mould thereof |
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| CN102569611B (en) | 2015-08-19 |
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Effective date of registration: 20170512 Address after: 518000, Guangdong, Shenzhen, Baoan District Xixiang street, hang Chau Hengfeng Industrial City, B15 plant, five or six floor Patentee after: Shenzhen Lingtao Photoelectric Technology Co., Ltd. Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth. Patentee before: Shenzhen Refond Optoelectronics Co., Ltd. |
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Effective date of registration: 20201223 Address after: 518000 1401, phase I, International Students Pioneer Building, No.29, Gaoxin South Ring Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Ruizhi Intelligent Technology Co., Ltd Address before: 518000 5th and 6th floor, B15 factory building, Hezhou Hengfeng Industrial City, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN LT PHOTOELECTRICITY TECHNOLOGY Co.,Ltd. |