CN102120213B - LED fluorescent powder spraying process - Google Patents
LED fluorescent powder spraying process Download PDFInfo
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- CN102120213B CN102120213B CN 201110003999 CN201110003999A CN102120213B CN 102120213 B CN102120213 B CN 102120213B CN 201110003999 CN201110003999 CN 201110003999 CN 201110003999 A CN201110003999 A CN 201110003999A CN 102120213 B CN102120213 B CN 102120213B
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- glue
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Abstract
The invention discloses a light emitting diode (LED) fluorescent powder spraying process, which comprises the following steps: (1) uniformly mixing fluorescent powder, a glue material and a volatile solvent to prepare mixed solution of the fluorescent powder, and loading the mixed solution in a glue spraying machine; (2) fixing the bracket of an LED chip which is soldered with a wire on a clamp; (3) making a mold according to the structure of the LED bracket and the LED chip, wherein the baffle plates of the mold are positioned on the upper part of the LED chip and form a certain gap with the upper part of the LED chip, and the horizontal distances between the baffle plates and the periphery of the LED chip are equal; (4) the glue spraying machine sprays the mixed solution of the fluorescent powder onto the surface of the chip through the baffle plates, wherein the mixed solution of the fluorescent powder covers the side faces and the top part of the chip completely; and (5) violating the volatile solvent with the left fluorescent powder coated on the chip, and loading and forming the appearance glue. Compared with the prior art, the LED chip manufactured by using the LED fluorescent powder spraying process has the advantages that: the thickness of fluorescent powder is more uniform; the color zones of the product are centralized; and the consistency is easier to control.
Description
Technical field
The present invention relates to the manufacture field of LED, exactly refer to a kind of LED fluorescent powder jet printing technology.
Background technology
In the making technology of LED white light, the thickness of blue-light excited phosphor powder layer has a strong impact on the light efficiency of the final product of the luminous optical efficiency of fluorescent material and product, the homogeneity of fluorescent material thickness also has very big influence to consistency of product and yield, so the paint-on technique of fluorescent material has great influence to the processing procedure of LED.
At present, traditional gluing process is on the surface with point after the arogel mixing deaeration, after overbaking, the led chip surface can form the arcuate structure that the thick middle both sides are thin, cause that a large amount of fluorescent material launching efficiencies is low, bright dipping is inhomogeneous, and the phenomenon that yellow circle, ring can occur, consistency of product are difficult to control, look is distinguished and loose.
Summary of the invention
At above-mentioned defective, the technical problem that the present invention solves is to provide a kind of LED fluorescent powder jet printing technology, and the fluorescent material thickness that the led chip that utilizes this kind technology to make applies evenly, product look district is concentrated, uniformity is more easy to control.
In order to solve above technical problem, LED fluorescent powder jet printing technology provided by the invention comprises the steps:
(1) fluorescent material, glue material and volatile solvent is even, make the mixed liquor of fluorescent material, be carried in the glue sprayer; (2) the support of the led chip of bonding wire is fixed on the anchor clamps; (3) according to mould of structure fabrication of led support and chip, the baffle plate of mould is put the top at led chip, and apart from certain interval, the distance of the horizontal direction of baffle plate distance L ED chip periphery equates; (4) glue sprayer is sprayed on chip surface with the mixed liquor of fluorescent material by baffle plate, and the mixed liquor of fluorescent material has surrounded side and the top of chip fully; (5) with after the volatile solvent volatilization, remaining fluorescent material is attached on the chip, carries out the loading molding procedure of outward appearance glue.
Preferably, the heat of the base auxiliary heating system transmission of described support evaporates volatile solvent.
Preferably, described volatile solvent is toluene.
Preferably, described volatile solvent is cyclohexane.
Preferably, described outward appearance glue is silica gel.
Preferably, described outward appearance glue is epoxy resin.
LED fluorescent powder jet printing technology provided by the invention, the baffle plate of mould is put the top at led chip, apart from certain interval, the distance of the horizontal direction of baffle plate distance L ED chip periphery equates, glue sprayer is sprayed on chip surface with the mixed liquor of fluorescent material by baffle plate, baffle plate has played the directionality of having controlled spraying preferably, and the mixed liquor of fluorescent material has surrounded side and the top of chip fully, and the thickness that can make fluorescent material cover led chip evenly equates.Compared with prior art, LED fluorescent powder jet printing technology provided by the invention, the fluorescent material thickness that the led chip that utilizes this kind technology to make applies is evenly, product look district is concentrated, uniformity is more easy to control.
Description of drawings
Fig. 1 is the structure chart during spraying in the LED fluorescent powder jet printing technology of the present invention, and the direction of arrow is the flow direction of mixed liquor among the figure.
The specific embodiment
For those skilled in the art can understand technical scheme provided by the present invention better, set forth below in conjunction with specific embodiment.
See also Fig. 1, this figure is the structure chart in when spraying in the LED fluorescent powder jet printing technology of the present invention, and the direction of arrow is the flow direction of mixed liquor among the figure.
The LED fluorescent powder jet printing technology that present embodiment provides comprises the steps:
(1) fluorescent material, glue material and volatile solvent is even, make the mixed liquor of fluorescent material, be carried in the glue sprayer; (2) the support of the led chip 1 of bonding wire is fixed on the anchor clamps; (3) according to mould of structure fabrication of led support and chip 1, the baffle plate 2 of mould is put on the top of led chip 1, and apart from certain interval, the distance of the horizontal direction of baffle plate 2 distance L ED chips 1 periphery equates; (4) glue sprayer 3 is sprayed on chip 1 surface with the mixed liquor of fluorescent material by baffle plate 2, and baffle plate 2 has played the directionality of having controlled spraying preferably, and the mixed liquor of fluorescent material has surrounded side and the top of chip 1 fully; (5) heat of the base auxiliary heating system transmission of support evaporates volatile solvent, treats that remaining fluorescent material is attached on the chip, carries out the loading molding procedure of outward appearance glue with after the volatile solvent volatilization.Described outward appearance glue is silica gel.If outward appearance glue is the high index of refraction product, then use toluene as volatile solvent; If outward appearance glue is the low-refraction product, then use cyclohexane give to be volatile solvent.
The LED fluorescent powder jet printing technology that present embodiment provides comprises the steps:
(1) fluorescent material, glue material and volatile solvent is even, make the mixed liquor of fluorescent material, be carried in the glue sprayer; (2) the support of the led chip 1 of bonding wire is fixed on the anchor clamps; (3) according to mould of structure fabrication of led support and chip 1, the baffle plate 2 of mould is put on the top of led chip 1, and apart from certain interval, the distance of the horizontal direction of baffle plate 2 distance L ED chips 1 periphery equates; (4) glue sprayer 3 is sprayed on chip 1 surface with the mixed liquor of fluorescent material by baffle plate 2, and baffle plate 2 has played the directionality of having controlled spraying preferably, and the mixed liquor of fluorescent material has surrounded side and the top of chip 1 fully; (5) heat of the base auxiliary heating system transmission of support evaporates volatile solvent, treats that remaining fluorescent material is attached on the chip, carries out the loading molding procedure of outward appearance glue with after the volatile solvent volatilization.Described outward appearance glue is epoxy resin.If outward appearance glue is the high index of refraction product, then use toluene as volatile solvent; If outward appearance glue is the low-refraction product, then use cyclohexane give to be volatile solvent.
Compared with prior art, LED fluorescent powder jet printing technology provided by the invention, the fluorescent material thickness that the led chip that utilizes this kind technology to make applies is evenly, product look district is concentrated, uniformity is more easy to control.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments herein.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (5)
1. a LED fluorescent powder jet printing technology is characterized in that, comprises the steps:
(1) fluorescent material, glue material and volatile solvent is even, make the mixed liquor of fluorescent material, be carried in the glue sprayer; (2) the support of the led chip of bonding wire is fixed on the anchor clamps; (3) according to mould of structure fabrication of led support and chip, the baffle plate of mould is put the top at led chip, and apart from certain interval, the distance of the horizontal direction of baffle plate distance L ED chip periphery equates; (4) glue sprayer is sprayed on chip surface with the mixed liquor of fluorescent material by baffle plate, and the mixed liquor of fluorescent material has surrounded side and the top of chip fully; (5) heat of the base auxiliary heating system transmission of described support evaporates volatile solvent; After the volatile solvent volatilization, remaining fluorescent material is attached on the chip, carries out the loading molding procedure of outward appearance glue.
2. LED fluorescent powder jet printing technology according to claim 1 is characterized in that, described volatile solvent is toluene.
3. LED fluorescent powder jet printing technology according to claim 1 is characterized in that, described volatile solvent is cyclohexane.
4. LED fluorescent powder jet printing technology according to claim 1 is characterized in that, described outward appearance glue is silica gel.
5. LED fluorescent powder jet printing technology according to claim 1 is characterized in that, described outward appearance glue is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110003999 CN102120213B (en) | 2011-01-10 | 2011-01-10 | LED fluorescent powder spraying process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110003999 CN102120213B (en) | 2011-01-10 | 2011-01-10 | LED fluorescent powder spraying process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102120213A CN102120213A (en) | 2011-07-13 |
| CN102120213B true CN102120213B (en) | 2013-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110003999 Expired - Fee Related CN102120213B (en) | 2011-01-10 | 2011-01-10 | LED fluorescent powder spraying process |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104241457B (en) * | 2013-06-19 | 2017-10-31 | 深圳市瑞丰光电子股份有限公司 | A kind of fluorescent material painting method of accurate control coated area |
| CN107088511A (en) * | 2017-04-17 | 2017-08-25 | 安徽路明光电科技有限公司 | A kind of fluorescent material application process of LED filament |
| CN108807221A (en) * | 2018-04-25 | 2018-11-13 | 四川省欧玛科技有限公司 | LED fluorescent powder spraying method |
| CN109256454A (en) * | 2018-10-16 | 2019-01-22 | 江苏稳润光电科技有限公司 | A kind of LED fluorescent powder coating method |
| CN113937203B (en) * | 2021-10-13 | 2023-07-18 | 厦门华联电子股份有限公司 | Packaging and film coating method of LED chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101515623A (en) * | 2009-03-26 | 2009-08-26 | 徐春云 | LED glue dispensing method |
| CN101694864A (en) * | 2009-09-28 | 2010-04-14 | 深圳市众明半导体照明有限公司 | Dispensing method of LED phosphor powder |
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
-
2011
- 2011-01-10 CN CN 201110003999 patent/CN102120213B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101515623A (en) * | 2009-03-26 | 2009-08-26 | 徐春云 | LED glue dispensing method |
| CN101694864A (en) * | 2009-09-28 | 2010-04-14 | 深圳市众明半导体照明有限公司 | Dispensing method of LED phosphor powder |
| CN101783384A (en) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | Method for sealing large-power LED |
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| CN102120213A (en) | 2011-07-13 |
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Owner name: HUIZHOU HUAYANG OPTOELECTRONIC TECHNOLOGY CO., LTD Free format text: FORMER OWNER: FORYOU MULTIMEDIA ELECTRONICS CO., LTD. Effective date: 20130605 |
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Effective date of registration: 20130605 Address after: 516006, No. 1, Xia Bei Road, Dongjiang hi tech Development Zone, Huizhou, Guangdong Applicant after: Huizhou Foryou Optoelectronics Technology Co., Ltd. Address before: 516006, No. 1, Xia Bei Road, Dongjiang hi tech Development Zone, Huizhou, Guangdong Applicant before: Foryou Multimedia Electronics Co., Ltd. |
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