CN103117352A - Light-emitting diode (LED) sealing structure and method achieving conformal coating of fluorescent powders based on the same - Google Patents
Light-emitting diode (LED) sealing structure and method achieving conformal coating of fluorescent powders based on the same Download PDFInfo
- Publication number
- CN103117352A CN103117352A CN2013100220295A CN201310022029A CN103117352A CN 103117352 A CN103117352 A CN 103117352A CN 2013100220295 A CN2013100220295 A CN 2013100220295A CN 201310022029 A CN201310022029 A CN 201310022029A CN 103117352 A CN103117352 A CN 103117352A
- Authority
- CN
- China
- Prior art keywords
- led
- boss structure
- coating
- fluorescent material
- conformal coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention provides a light-emitting diode (LED) sealing structure used for sealing of the LED and a method achieving conformal coating of fluorescent powders based on the LED sealing structure to improve the evenness of color space of the LED sealing products. Due to a protruding platform structure and a transparent sheet plate of the same shape and structure with the protruding platform, the conformal coating is achieved by utilizing the capillary self-aligned technology. The conformal coating technology of the fluorescent powders comprises steps as below: the fluorescent powder is coated on the protruding structure of an LED sealing substrate, the transparent sheet plate is contacted with a fluorescent powder glue to achieve self-alignment with the protruding platform structure and achieves distribution of uniform thickness of fluorescent powders around an LED chip required by the conformal coating of the fluorescent powder. The method achieving the conformal coating of the fluorescent powders based on the LED sealing structure is capable of being compatible with the free point gluing coating technology equipment of the fluorescent powder, and at the same time is simple in technology. By utilizing the protruding platform structure and the simple design of the transparent sheet plate, the factor requirements of thickness and geometrical morphology and the like of the conformal coating of different LED sealing structures can be effectively met.
Description
Technical field
The invention belongs to the LED encapsulation technology, relate to a kind of for improving the photochromic conforming LED encapsulating structure in LED illuminating product space and based on its method that realizes LED encapsulation fluorescent material shape-preserving coating in LED encapsulation, will be applied to especially during extensive LED encapsulation produces.
Background technology
LEDs(Light Emitting Diodes) be a kind of light emitting semiconductor device of making based on P-N junction electroluminescence principle, have that electro-optical efficiency is high, the advantage such as long service life, environmental protection and energy saving, volume are little, be described as the 21 century green illumination light source, to obtain very significant energy-saving effect if be applied to the traditional lighting field, this is significant now what be becoming tight global energy day.Breakthrough along with the third generation semi-conducting material technology take nitride as representative, semiconductor lighting industry based on high power high brightness led (LED) is risen rapidly in the whole world, just become semi-conductor photoelectronic industry new growth engines, and causing a revolution in the traditional lighting field.LED has begun to be used widely in a lot of fields due to its unique superiority, as Landscape Lighting, headlight for vehicles, street lamp and backlight etc., is thought the main development direction of following lighting technology by industry, has huge market potential.
The top priority that LED replaces the traditional lighting mode is to improve its light extraction efficiency and reliability, by years of researches and technical development, the light extraction efficiency of present commercial LED product has reached 100-130 lm/W, and laboratory level has reached 231 lm/W especially, far above the light efficiency of conventional light source; Simultaneously, along with the improvement of packaging technology, the optimization of radiator structure and the raising that drives reliability, the reliability of LED has also obtained significantly improving.In order further to improve the lighting quality of LED product, the LED color quality more and more is subject to everybody attention, specifically can comprise the photochromic consistency of LED and LED spatial color uniformity two aspects, for example USDOE will improve the photochromic consistency of LED, reduce minute Bin quantity as main five one of challenges greatly of LED illumination development, and the star (Energy Star) of american energy was classified the spatial color uniformity of LED encapsulation and light fixture one of as LED lighting quality evaluation index in 2008 simultaneously.Along with the rapid popularization (as commercial lighting, lighting of home, office lighting etc.) of LED in the room lighting field, people are progressively changed " according to comfortable " into to the requirement of LED illumination from " illuminating ", packaging technology by accurately controlling when therefore LED encapsulates, improve the photochromic consistency of LED and spatial color uniformity, become and widened the LED lighting field, accelerated the important technical goal that LED replaces traditional lighting.
Large power white light LED is normally mixed by two wavelength light (blue light+sodium yellow) or three-wavelength light (blue light+green light+red light).The white light LEDs that extensively adopts at present is to form by blue led chip (GaN) and yellow fluorescent powder (YAG or TAG).The phosphor powder layer parameter has a strong impact on the important optical properties such as light extraction efficiency, colour temperature, spatial color uniformity of LED in LED encapsulation.Current, a kind of fluorescent material coating method that the most generally adopts in the LED encapsulation is that fluorescent material free point glue applies, and this kind fluorescent material coating method has the advantages such as technique is simple and low-cost; Yet this kind fluorescent material coating method usually causes final LED encapsulating products colour temperature spatial distribution to have larger difference, is having a strong impact on the lighting quality of LED product.Researcher both domestic and external has carried out many research work, finds the method for LED fluorescent material shape-preserving coating, and namely the phosphor powder layer uniform thickness is coated on the LED chip surface.The shape-preserving coating mode requires to control the parameters such as fluorescent material geometry and thickness, thereby improves photochromic consistency and the spatial color uniformity of LED encapsulating products; Yet this encapsulation realizes that technique is more difficult.In order to realize the shape-preserving coating of fluorescent material, global famous LED encapsulates the electrophoresis (U. S. patent 6,576,488) that enterprise successively develops, solution evaporation (U. S. patent 7,217,583), wafer level packaging (B. Braune
Et al., Proc. SPIE 6486,64860X, 2007) and present process (the H. T. Huang of the Pulse Spraying described of pertinent literature
Et al., OPTICS EXPRESS, 18, A201,2010).Wherein electrophoresis and solution evaporation realize that shape-preserving coating is comparatively complicated, and cost is higher; The process of wafer level packaging and Pulse Spraying is had relatively high expectations to sealed in unit, and technique must accurately be controlled, and can not realize the shape-preserving coating of LED horizontal chip.Develop for this reason that a kind of technique is simple, low-cost and to be applicable to the fluorescent material shape-preserving coating of all LED chip types most important to the LED optical articles of encapsulation high optical quality.
Summary of the invention
The present invention proposes a kind of LED encapsulating structure and realizes the method for fluorescent material shape-preserving coating based on it, and this fluorescent material shape-preserving coating technology is based on the microfluid self alignment effect and realizes; This method of conformal coating is compared with other shape-preserving coating, has technique simple, and is low to the coating equipment requirement, low-cost and packaging efficiency advantages of higher, and the while can significantly be improved the colour temperature Space Consistency of LED encapsulating products, improves optical quality.
The LED encapsulating structure that the present invention proposes is characterized in that, is included in LED base plate for packaging and the transparent thin board of fixed chip place's increase boss structure; The sidewall of described boss structure can vertically or favour LED base plate for packaging horizontal plane, and the boss structure height can be 0.01 to 3 millimeter, and boss structure is of a size of 1 to 3 millimeter, and boss structure is round platform, square platform or polygon terrace with edge; The material of described LED base plate for packaging can be metal, plastic material, ceramic material or other material that encapsulates for LED at present; Described transparent thin board is of a size of 1 to 3 millimeter, and thickness is 0.1 to 1 millimeter, and the material of transparent thin board is the transparent organic materials such as the transparent inorganic materials such as glass or PMMA, and transparent thin board is round platform, square platform or polygon terrace with edge.
What the present invention proposed realizes specifically being implemented as follows the method for fluorescent material shape-preserving coating described based on above-mentioned LED encapsulating structure:
1, LED chip is bonded in the center of above-mentioned LED encapsulating structure boss structure, and above-mentioned LED encapsulating structure also is used for follow-up fluorescent material shape-preserving coating simultaneously;
2, complete LED chip bonding and lead key closing process on the LED base plate for packaging after, the mixture phosphor gel of fluorescent material and packaging plastic is coated in the end face place of LED base plate for packaging boss structure, phosphor gel will be limited on the end face of boss structure;
3, a transparent thin board is contacted with the phosphor gel that back applies from top to bottom, how much patterns of transparent thin board are identical with boss structure in the LED base plate for packaging with size; When transparent thin board one contact phosphor gel, immediately remove the institute's Constrained to transparent thin board.Under the phosphor gel surface tension effects, transparent thin board is aimed at the boss structure of LED base plate for packaging, and transparent thin board is parallel with LED base plate for packaging horizontal plane, fluid is limited between gap between transparent thin board and LED chip end face, this effect is capillary self alignment effect (J. Berthier et al., JOURNAL OF APPLIED PHYSICS, 108,2010).Thereby evenly distributing, phosphor gel around LED chip, realizes shape-preserving coating;
4, after the LED package module is completed above-mentioned technique, be transferred in the high-temperature baking case phosphor gel is cured.Namely realize LED fluorescent material shape-preserving coating after solidifying, can peel off on the LED package module according to using the needs transparent thin board, also can stay on package module.
The present invention is applied to the fluorescent material method of conformal coating of LED encapsulation, can be compatible with the fluorescent material free point coating device of current extensive employing, only increase simultaneously simple transparent thin board and lay technique, so it has advantages of good operability and extensive use rapidly.This technology can realize by the shape design of transparent thin board and LED base plate for packaging boss structure how much patterns control of shape-preserving coating phosphor powder layer simultaneously, so can be applied to without in encapsulating structure.
Description of drawings
Fig. 1-4 are the application of fluorescent material shape-preserving coating technical scheme of the present invention on lead frame structure; Wherein Fig. 1 is the lead frame LED base plate for packaging that contains be used to realizing capillary autoregistration boss structure, Fig. 2 is transparent thin board, Fig. 3 is spot printing phosphor gel on LED base plate for packaging boss structure, Fig. 4 (a)-(c) expression transparent thin board contacts with phosphor gel, realize autoregistration, finally reach the fluorescent material shape-preserving coating;
Fig. 5-8 are the application of fluorescent material shape-preserving coating technical scheme of the present invention on the ceramic LED package substrate; Wherein Fig. 5 is the ceramic LED package substrate that contains be used to realizing capillary autoregistration boss structure, Fig. 6 is transparent thin board, and Fig. 7 is spot printing phosphor gel on LED base plate for packaging boss structure, and Fig. 8 represents that transparent thin board contacts with phosphor gel, realize autoregistration, finally reach the fluorescent material shape-preserving coating.
In figure, each label is respectively: (1001) lead frame LED base plate for packaging, and (1002) are heat sink, (1003) moulding compound, (1004) support pin, (1005) LED chip, (1006) sheets of glass, (1007) phosphor gel, (1008) phosphor powder layer, (1009) fluorescent material point coating device, (1010) boss structure, (2001) ceramic LED package substrate, (2002) wire bond, (2003) ceramic layer, (2004) boss structure, (2005) PDMA thin plate.
Embodiment
A kind of fluorescent material method of conformal coating that is applied to the LED encapsulation that the present invention proposes, the method needing to realize LED package substrate construction and transparent thin board to assist; Phosphor gel is coated in boss structure on the LED base plate for packaging, transparent thin board with after the phosphor gel of coating contacts, can be realized the fluorescent material shape-preserving coating, wherein how much patterns of fluorescent material are identical with the shape of boss structure and transparent thin board; The shape of boss structure and transparent thin board can be square and other are irregularly shaped etc. in different application;
The material of LED base plate for packaging can be the metal substrate materials such as copper, aluminium, silicon, the non-metal base plate materials such as pottery and pcb board;
The transparent thin board material is glass, PDMA, other transparent materials such as PC;
The LED base plate for packaging can pass through CNC milling machine, and the processing technologys such as line cutting, forging and pressing, injection moulding and etching realize;
The surface of LED base plate for packaging is reflector layer, and the material of reflector layer can be silver or other reflectorized material;
Concrete phosphor gel painting method and capillary autoregistration realize: fluorescent material is added in the glue material, and mix, regulate the ratio between fluorescent material and glue material, matched proportion density is the phosphor gel of 0.01g/ml ~ 5.0g/ml, after completing fixed L ED chip and circuit is connected operation, phosphor gel is passed through a some glue coating unit, along the center coating in LED base plate for packaging boss structure zone, due to the stagnation effect at boss structure edge, phosphor gel rests on the upper end face of boss structure.Adopt clamping device with the close phosphor gel of transparent membrane, after the whether constraint of clamping device, phosphor gel is aimed at mobile transparent thin board with LED base plate for packaging boss structure, phosphor gel between boss structure and transparent thin board, thereby realize the fluorescent material shape-preserving coating.
The LED chip that is used for encapsulation can be that the quaternary materials such as the binary material such as GaN or AlGaNP form and other chip.
Fluorescent material in phosphor gel can be the fluorescent material that all LED encapsulation such as YAG and TAG are adopted.
It can be that the glue materials such as silica gel, epoxy resin and liquid glass form that the configuration phosphor gel is used the glue material.
In phosphor gel, the concentration of fluorescent material can be 0.01g/ml ~ 5.0g/ml.
Glue material and phosphor gel are transferred to approach on the LED base plate for packaging and can be dripped by syringe and be coated with, the approach such as spraying.
The method goes for the LED packing forms such as stent-type, chip on board, array and system in package.
Below by by embodiment, the present invention being described in further detail, but following examples are only illustrative, and protection scope of the present invention is not subjected to the restriction of these embodiment.
Embodiment 1
Referring to Fig. 1, for containing the lead frame LED encapsulation 1001 that is used for the LED encapsulation of boss structure 1010, boss structure 1010 is a rectangular configuration.As shown in Figure 3, after LED chip 1005 was bonded in boss structure 1010 end face centers, after completing gold thread 1004 lead key closing process, concentration was 0.5g/cm
3Phosphor gel 1007 is put 1009 of coating devices by fluorescent material and is coated in boss structure 1010 end faces, and the phosphor gel volume is 0.4 μ L, and can coat LED chip 1005.As shown in Fig. 4 (a)-(c), the sheets of glass 1006 contact phosphor gel 1007 identical with the boss structure shape, the thickness of sheets of glass is 0.2mm, sheets of glass 1006 will be aimed in boss structure 1010 under the phosphor gel surface tension effects, phosphor gel 1007 is limited between sheets of glass and boss structure 1010, is formed on LED chip 1005 equally distributed phosphor powder layer 1008 on every side.It is to carry out phosphor gel in 1 hour in the baking box of 150 ℃ to solidify that the LED module of completing above-mentioned technique is transferred to temperature, realizes the fluorescent material shape-preserving coating in the LED encapsulation.
Embodiment 2
Referring to Fig. 5, for containing the ceramic LED package substrate 2001 that is used for the LED encapsulation of boss structure 2004, boss structure 2004 is a circular configuration.As shown in Figure 7, after LED chip 1005 was bonded in boss structure 2004 end face centers, after completing gold thread 1004 lead key closing process, concentration was 0.8g/cm
3Phosphor gel 1007 put 1009 of coating devices by fluorescent material and be coated in boss structure 2004 end faces, volume is 0.28 μ l, and can coat LED chip 1005.As shown in Figure 8, the PDMA thin plate 2005 contact phosphor gel 1007 identical with boss structure 2004 shapes, PDMA thin plate 2005 will be aimed at boss structure 2004 afterwards, phosphor gel 1007 is limited between PDMA thin plate and boss structure 2004, is formed on LED chip 1005 equally distributed phosphor powder layer 1008 on every side.It is to carry out phosphor gel in 1 hour in the baking box of 150 ℃ to solidify that the LED module of completing above-mentioned technique is transferred to temperature, realizes the fluorescent material shape-preserving coating in the LED encapsulation.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the disclosed content of this embodiment and accompanying drawing.So everyly do not break away from the equivalence of completing under spirit disclosed in this invention or revise, all falling into the scope of protection of the invention.
Claims (4)
1. LED encapsulating structure, it is characterized in that, comprise LED base plate for packaging and transparent thin board, fixed L ED chip place's increase by one boss structure in described LED base plate for packaging, described boss structure can be vertical or favour the substrate horizontal plane, boss height is between 0.01 to 3 millimeter, and boss structure is of a size of between 1 to 3 millimeter; Described transparent thin board is of a size of between 1 to 3 millimeter, and thickness is between 0.1 to 1 millimeter.
2. LED encapsulating structure according to claim 1, is characterized in that, described boss structure is round platform, square platform or polygon terrace with edge.
3. the method that realizes the fluorescent material shape-preserving coating based on LED encapsulating structure claimed in claim 1, is characterized in that, the coating method that encapsulation is adopted according to LED selects corresponding process to carry out:
fluorescent material is added in the glue material, and mix, regulate the ratio between fluorescent material and glue material, matched proportion density is the phosphor gel of 0.01g/ml ~ 5.0g/ml, after completing fixed L ED chip and circuit be connected operation, phosphor gel is passed through a some glue coating unit, center coating along LED base plate for packaging boss structure zone, stagnation effect due to the boss structure edge, phosphor gel rests on the upper end face of boss structure, adopt clamping device with the close phosphor gel of transparent membrane, after the whether constraint of clamping device, phosphor gel is aimed at mobile transparent thin board with LED base plate for packaging boss structure, phosphor gel is between boss structure and transparent thin board, thereby realize the fluorescent material shape-preserving coating.
4. the method that realizes the fluorescent material shape-preserving coating according to claim 3, it is characterized in that, in order to realize geometry pattern parameter such as the phosphor powder layer thickness of different shape-preserving coating phosphor powder layers, side width etc. can be realized by the shape that changes boss structure and transparent thin board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310022029.5A CN103117352B (en) | 2013-01-22 | 2013-01-22 | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310022029.5A CN103117352B (en) | 2013-01-22 | 2013-01-22 | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103117352A true CN103117352A (en) | 2013-05-22 |
| CN103117352B CN103117352B (en) | 2016-02-10 |
Family
ID=48415670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310022029.5A Expired - Fee Related CN103117352B (en) | 2013-01-22 | 2013-01-22 | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103117352B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019095463A1 (en) * | 2017-11-14 | 2019-05-23 | 广东金源照明科技股份有限公司 | Magnetic fluorescent powder composite and plane coating method therefor |
| CN110739235A (en) * | 2018-07-20 | 2020-01-31 | 美科米尚技术有限公司 | Micro-device attaching method |
| CN111755347A (en) * | 2019-03-28 | 2020-10-09 | 美科米尚技术有限公司 | Method for limiting micro-device on conductive pad |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1966160A (en) * | 2005-11-15 | 2007-05-23 | 厦门华联电子有限公司 | Fluorescent glue coating process |
| WO2010136920A1 (en) * | 2009-05-28 | 2010-12-02 | Koninklijke Philips Electronics N.V. | Illumination device with an envelope enclosing a light source |
| CN102244177A (en) * | 2010-05-11 | 2011-11-16 | 北京宇极科技发展有限公司 | Semiconductor luminous device |
| CN203055985U (en) * | 2013-01-22 | 2013-07-10 | 东莞市石碣华中电子技术创新服务有限公司 | LED packaging structure |
-
2013
- 2013-01-22 CN CN201310022029.5A patent/CN103117352B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1966160A (en) * | 2005-11-15 | 2007-05-23 | 厦门华联电子有限公司 | Fluorescent glue coating process |
| WO2010136920A1 (en) * | 2009-05-28 | 2010-12-02 | Koninklijke Philips Electronics N.V. | Illumination device with an envelope enclosing a light source |
| CN102244177A (en) * | 2010-05-11 | 2011-11-16 | 北京宇极科技发展有限公司 | Semiconductor luminous device |
| CN203055985U (en) * | 2013-01-22 | 2013-07-10 | 东莞市石碣华中电子技术创新服务有限公司 | LED packaging structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019095463A1 (en) * | 2017-11-14 | 2019-05-23 | 广东金源照明科技股份有限公司 | Magnetic fluorescent powder composite and plane coating method therefor |
| CN110739235A (en) * | 2018-07-20 | 2020-01-31 | 美科米尚技术有限公司 | Micro-device attaching method |
| CN111755347A (en) * | 2019-03-28 | 2020-10-09 | 美科米尚技术有限公司 | Method for limiting micro-device on conductive pad |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103117352B (en) | 2016-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103817053B (en) | One realizes the photochromic uniform LED fluorescent powder coating unit of high spatial and method | |
| CN104393154A (en) | Wafer level packaging method for LED (Light-Emitting Diode) chip level white light source | |
| CN105720164B (en) | A kind of preparation method of white light LEDs | |
| CN202058732U (en) | High-power LED (light-emitting diode) white light panel with separated chip and fluorescent powder | |
| CN103325926B (en) | LED packaging structure used in on-board chip and fluorescent powder coating method thereof | |
| CN203760472U (en) | System-level LED packaging device | |
| CN104393145A (en) | Ceramic-substrate-contained white-light LED with low thermal resistance and high brightness | |
| CN102891242A (en) | LED (Light-Emitting Diode) package device | |
| CN101859759A (en) | White LED light source package | |
| CN103258936B (en) | A kind of LED package substrate and the method for shape-preserving coating | |
| CN202058783U (en) | LED encapsulated reflecting cup | |
| CN103117352B (en) | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it | |
| CN203205458U (en) | LED package substrate | |
| CN203055985U (en) | LED packaging structure | |
| CN102227011B (en) | Reflector cup and method for controlling geometric shape of fluorescent powder layer in LED (light-emitting diode) packaging by using same | |
| CN103022326A (en) | Intensive packaging method of LEDs | |
| CN202487663U (en) | Free-form surface lens | |
| CN205863219U (en) | A kind of LED encapsulation of Multi-core | |
| CN103178165B (en) | Light-emitting Diode And Its Making Method | |
| CN104465965B (en) | A kind of fluorescent powder film preparation method for white light LEDs wafer-level packaging | |
| CN203950834U (en) | A kind of support, adopting surface mounted LED and backlight module of adopting surface mounted LED | |
| CN203288648U (en) | White light-emitting diode with high light extraction efficiency | |
| CN102569558A (en) | Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application | |
| CN203737532U (en) | LED phosphor powder coating device for realizing high spatial light color uniformity | |
| CN203351649U (en) | COB (Chip On Board) LED packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160210 Termination date: 20190122 |