CN203760472U - System-level LED packaging device - Google Patents
System-level LED packaging device Download PDFInfo
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- CN203760472U CN203760472U CN201320833936.3U CN201320833936U CN203760472U CN 203760472 U CN203760472 U CN 203760472U CN 201320833936 U CN201320833936 U CN 201320833936U CN 203760472 U CN203760472 U CN 203760472U
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Abstract
The utility model relates to a system-level LED packaging device, comprising a substrate, a driving control module, an LED chip, and an optical lens. The driving control module and the LED chip are disposed on the substrate. The optical lens covers the driving control module and the LED chip and is fixed on the substrate. The device is characterized in that a surface of the substrate is provided with a plurality of grooves in different sizes and depths. Each electronic component in the driving control module and a bare chip of at least one LED chip are installed and fixed in the bottom of the grooves with corresponding sizes and depths according to shapes and sizes of the component and bare chip. After each electronic component in the driving control module and a bare chip of at least one LED chip are installed and fixed in the bottom of the corresponding grooves, height is consistent and is lower than the top surface of the substrate. The device can improve system lighting effect of a conventional system-level LED packaging device, and solves a problem of concentrated heat radiation of system-level LED packaging, and meanwhile use amount of packaging glue is reduced, and the system-level LED packaging device is more beautiful.
Description
Technical field
The utility model relates to a kind of LED packaging, relates in particular to a kind of system-level LED packaging.
Background technology
LED product, because it has energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long and not mercurous, has the advantages such as environmental benefit, with illumination with show industry, is become one of product attracting most attention in recent years by extensively.
Traditional LED light fixture is made up of parts such as light source, drive circuit, calorifics device and optics, and each part is independent separate.Wherein drive circuit is by after the nude film processing encapsulation of electronic component, then is welded on printed circuit board with scolding tin, electronic component encapsulate, and volume size is larger, makes the volume change of drive circuit board greatly.
There is at present a kind of " system-level " LED packaging, this kind of packaged type be exactly by die packages such as LED chip, components of drive circuit, control chip and wireless communication modules on a substrate with calorifics, optical property.That system in package has is integrated, the feature of miniaturization and multifunction, is the trend of following LED encapsulation.
But system in package also exists weak point, due to by the chip die package of each function on same substrate, the height size of each chip all there are differences, the height of general LED chip is minimum, and LED chip and other chips are all in same level.The light that LED chip sends will be absorbed by the chip of other chips, particularly black, thereby has affected the light efficiency of whole system level LED packaging.Chinese patent CN103337496A discloses a kind of LED integrated encapsulation structure and manufacture method of two-sided silicon substrate, it is fixed on LED chip in the groove of silicon substrate one side, to drive chip to be arranged in the groove of silicon substrate another side, then silicon substrate is provided with and drives a side of chip to be connected with radiator stack, form the integration packaging of LED.Although this encapsulating structure volume is little, heat radiation better, drives chip also can not block or absorb the light that LED chip sends, its manufacture craft relative complex.
Utility model content
For the problems referred to above, the utility model provides a kind of system-level LED packaging.
The utility model discloses a kind of system-level LED packaging, it comprises substrate, drive control module, LED chip and optical lens, described drive control module and described LED chip are arranged on described substrate, described optical lens covers described drive control module and described LED chip and is fixed on described substrate, it is characterized in that, on one surface of described substrate, be provided with the groove that multiple sizes are different with the degree of depth, the nude film of each electronic component in described drive control module and LED chip described at least one installs according to its shape and size the described bottom portion of groove that is fixed to corresponding size and the degree of depth accordingly, and each electronic component in described drive control module is fixed on after corresponding described bottom portion of groove with the nude film of LED chip described at least one, it is highly consistent and all lower than the end face of described substrate.
According to one preferred embodiment, described substrate is silicon substrate, high heat-conducting ceramic substrate or high thermal conductivity aluminum matrix plate, described groove on described substrate is circle, ellipse or polygon in vertical view, between the bottom of described groove and the surface of described substrate, is an inclined-plane.
According to one preferred embodiment, described polygon is square or rectangular.
According to one preferred embodiment, described substrate is coated with the circuit being made up of copper foil layer in the one side that described groove is set.
According to one preferred embodiment, on the described circuit of described bottom portion of groove, be provided with at least two gold or silver electrode, wherein, compared with groove for drive control module is installed, at the electrode for the groove that LED chip is installed with greater number.
According to one preferred embodiment, on the non-electrode zone of the bottom portion of groove for LED chip is installed and the copper foil layer on the inclined-plane between described bottom portion of groove and described substrate surface, be provided with reflector.
According to one preferred embodiment, non-electrode zone and non-reflective layer region on described copper foil layer are provided with white oil insulating barrier.
According to one preferred embodiment, described drive control module comprises components of drive circuit, control module chip and wireless communication module with protocols having, wherein, described components of drive circuit comprises integrated chip IC, MOS integrated circuit, resistance, electric capacity and/or rectifier diode, wherein, be the lighting fixture control chip of DALI, MAX512 with the control module chip of protocols having.
According to one preferred embodiment, described LED chip is blue-light LED chip, ultraviolet leds chip or purple LED chip, and described LED chip is horizontal structure LED chip, light emitting diode (LED) chip with vertical structure or the inverted structure chip forming on sapphire, gallium nitride or silicon substrate.
According to one preferred embodiment, electronic component in described drive control module and the nude film of described LED chip are mounted to the bottom portion of groove of corresponding size and the degree of depth on described substrate by die bond mode, and interconnect by gold thread, aluminum steel or alloy wire and described electrode, and adopt insulating cement or conducting resinl to fix, described drive control module and described LED chip are contained fluorescent material or are not covered containing the encapsulation glue-line overall package of fluorescent material.
Preferred embodiment described optical lens is glass lens or PC plastic cement lens according to one, and described optical lens is by engagement connection or be adhesively fixed on described substrate, on described optical lens, is provided with phosphor powder layer.
The utility model has the advantage of:
1. the utility model arranges multiple for placing the groove of each functional chip on its substrate surface, isolate luminous LED chip and other chips with this, make the light that LED chip sends do not absorbed and stop by other chips, thereby improve the light efficiency of LED system in package.
2. the utility model preferably adopts silicon substrate, and because the nude films such as LED chip, components of drive circuit, control chip and wireless communication module are placed on respectively on silicon substrate in groove separately, the heat being produced by different chips is evenly dispersed out, can be because heat accumulation can cause the too high performance that affects packaging of amount of localized heat.
3. the utility model can make each chip height unanimously and all locate with below substrate surface, when saving packaging plastic, also makes packaging more attractive in appearance.
Brief description of the drawings
Fig. 1 is according to the structural representation of system-level LED packaging of the present utility model;
Fig. 2 is the vertical view of a preferred implementation of the present utility model;
Fig. 3 is the schematic diagram of the board structure of system-level LED packaging of the present utility model.
Reference numerals list
100: system-level LED packaging
1: substrate 2: drive control module 3:LED chip 4: optical lens
101: groove 102: copper foil layer 103: electrode 104: reflector
105: white oil insulating barrier 106: encapsulation glue-line 107: gold thread
201: components of drive circuit 202: with the control module chip of protocols having
203: wireless communication module
Embodiment
Illustrate the utility model below in conjunction with accompanying drawing.
Fig. 1 is according to the structural representation of system-level LED packaging of the present utility model.Fig. 1 shows a kind of system-level LED packaging 100, and it comprises substrate 1, drive control module 2, LED chip 3 and optical lens 4.Drive control module 2 and LED chip 3 are arranged on substrate 1, and optical lens 4 surrounds drive control module 2 and LED chip 3 be fixed on substrate 1.On one surface of substrate 1, be provided with multiple sizes grooves 101 different from the degree of depth, each electronic component in drive control module 2 and the nude film of at least one LED chip 3 install according to its shape and size groove 101 bottoms that are fixed to corresponding size and the degree of depth accordingly, each electronic component in drive control module 2 and the nude film of at least one LED chip 3 are fixed on behind corresponding recesses 101 bottoms, and it is highly consistent and all below the end face in substrate 1.At this, described end face refers to the surface being limited by the region of unslotted.
Fig. 2 is the vertical view of a preferred implementation of the present utility model.As shown in the figure, the utility model arranges multiple for placing the groove of each functional chip in substrate 1 surface, isolates luminous LED chip 3 and other chips with this, makes the light that LED chip 3 sends do not absorbed and stop by other chips, thereby improves system light efficiency; And due to LED chip 3, components of drive circuit 201, be placed on respectively in groove separately with the nude film such as control module chip 202 and wireless communication module 203 of protocols having, the heat being produced by different chips is evenly dispersed out, can be because heat accumulation can cause the too high performance that affects packaging of amount of localized heat; Can also make each chip height unanimously and all locate with below substrate top surface.When saving packaging plastic, also make packaging more attractive in appearance.
Fig. 3 is the schematic diagram of the board structure of system-level LED packaging of the present utility model.Substrate 1 can be silicon substrate, high heat-conducting ceramic substrate or high thermal conductivity aluminum matrix plate.Preferably adopt the easily good silicon substrate of insulating heat-conductive of punching fluting.On one surface of substrate 1, have multiple sizes, groove 101 that the degree of depth is different.Groove 101 can be circle, ellipse or polygon in vertical view.Polygon can be square or rectangular.Between the surface of the bottom of groove 101 and substrate 1, be an inclined-plane, the cell wall of groove 101 is inclined-planes.
It is 50～200 μ m and uniform copper foil layer 102 that substrate 1 covers last layer thickness by sputter or chemical deposition process on this surface that groove 101 is set.And design circuit diagram on copper foil layer 102, adopt etch process to produce required circuit.
At least two gold or silver electrode 103 are set on the circuit of each groove 101 bottoms.And for electrode 103 in the groove 101 of each element of drive control module 2 than the electrode of the groove for LED chip 3 is installed 103 at least many is installed.At least one electrode of this having more can conduct to the heat of functional chip bottom fast, can play the effect of accelerating heat radiation.
On copper foil layer 102 on the inclined-plane between the groove 101 non-electrode zones in bottom and groove 101 bottoms and substrate 1 surface for LED chip 3 is installed, plate one deck reflectance coating by modes such as sputter, vacuum coating and chemical depositions, formation one deck has the reflector 104 of high reflectance.
Non-electrode zone on copper foil layer 102 and non-reflective layer region adopt the mode of silk screen printing to be covered with one deck white oil insulating barrier 105.The effect of white oil insulating barrier 105 is to provide insulation protection, prevents from getting an electric shock.
Drive control module 2 can comprise components of drive circuit 201, control module chip 202 and wireless communication module 203 with protocols having.Components of drive circuit 201 comprises the electronic components such as integrated chip IC, MOS integrated circuit, resistance, electric capacity, rectifier diode.Control module chip 202 with protocols having can be DALI, MAX512 or other lighting fixture control chips, its function be can realize LED optical color parameter adjustable.Wireless communication module 203 is integrated in LED packaging, and device can be realized radio communication function.
LED chip 3 can be blue-light LED chip, ultraviolet leds chip or purple LED chip.LED chip 3 can be horizontal structure LED chip, light emitting diode (LED) chip with vertical structure or the inverted structure chip forming on sapphire, gallium nitride or silicon substrate.
The nude film of the electronic component in drive control module 2 and LED chip 3 is mounted to groove 101 bottoms of corresponding size and the degree of depth on substrate 1 by die bond, be connected, and fix with insulating cement or conducting resinl by gold thread 107, aluminum steel or alloy wire with electrode 103.Packed glue-line 106 overall package of drive control module 2 and LED chip 3 cover.In encapsulation glue-line 106, can contain fluorescent material and also can not contain fluorescent material.In encapsulation glue-line 106, can form white light LED packaging device containing the device of fluorescent material; Be not blue-ray LED packaging, ultraviolet leds packaging or purple LED packaging containing the device of fluorescent material.
Optical lens 4 can be glass lens or PC plastic cement lens.Optical lens 4 can or be adhesively fixed on substrate 1 by engagement connection, and drive control module 2 and LED chip 3 are enclosed in optical lens 4.On optical lens 4, can also adopt method phosphor powder layers in its surface attachment such as silk screen printing, spraying and injection moulding.Optical lens 4 with phosphor powder layer is fixed on blue-ray LED packaging, can forms white light LED packaging device.
The utility model adopts the encapsulation silicon substrate with groove, by the isolation of each functional chip, not only improve the system light efficiency of legacy system level encapsulation, solve the system in package concentrated problem of dispelling the heat, and reduce the consumption of packaging plastic simultaneously, make packaging more attractive in appearance.
The utility model has the advantage of:
1. the utility model arranges multiple for placing the groove of each functional chip on its substrate surface, isolate luminous LED chip and other chips with this, make the light that LED chip sends do not absorbed and stop by other chips, thereby improve the light efficiency of LED system in package.
2. the utility model preferably adopts silicon substrate, and because the nude films such as LED chip, components of drive circuit, control chip and wireless communication module are placed on respectively on silicon substrate in groove separately, the heat being produced by different chips is evenly dispersed out, can be because heat accumulation can cause the too high performance that affects packaging of amount of localized heat.
3. the utility model can make each chip height unanimously and all locate with below substrate surface, when saving packaging plastic, also makes packaging more attractive in appearance.
It should be noted that; above-mentioned specific embodiment is exemplary; under above-mentioned instruction of the present utility model, those skilled in the art can carry out various improvement and distortion on the basis of above-described embodiment, and these improvement or distortion drop in protection range of the present utility model.It will be understood by those skilled in the art that specific descriptions are above in order to explain the purpose of this utility model, not for limiting the utility model.Protection range of the present utility model is limited by claim and equivalent thereof.
Claims (11)
1. a system-level LED packaging (100), it comprises substrate (1), drive control module (2), LED chip (3) and optical lens (4),
Described drive control module (2) and described LED chip (3) are arranged on described substrate (1), described optical lens (4) covers described drive control module (2) and described LED chip (3) and is fixed on described substrate (1)
It is characterized in that,
On one surface of described substrate (1), be provided with the groove that multiple sizes are different with the degree of depth (101),
The nude film of each electronic component in described drive control module (2) and LED chip (3) described at least one installs according to its shape and size described groove (101) bottom that is fixed to corresponding size and the degree of depth accordingly, and
Described in each electronic component in described drive control module (2) and at least one, the nude film of LED chip (3) is fixed on behind corresponding described groove (101) bottom, and it is highly unanimously and all lower than the end face of described substrate (1).
2. system-level LED packaging according to claim 1 (100), is characterized in that, described substrate (1) is silicon substrate, high heat-conducting ceramic substrate or high thermal conductivity aluminum matrix plate,
Described groove (101) on described substrate (1) is circle, ellipse or polygon in vertical view, between the bottom of described groove (101) and the surface of described substrate (1), is an inclined-plane.
3. system-level LED packaging according to claim 2 (100), is characterized in that, described polygon is square or rectangular.
4. system-level LED packaging according to claim 2 (100), it is characterized in that, described substrate (1) is coated with the circuit being made up of copper foil layer (102) in the one side that described groove (101) are set.
5. system-level LED packaging according to claim 4 (100), it is characterized in that, on the described circuit of described groove (101) bottom, be provided with at least two gold or silver electrode (103), wherein, compared with groove (101) for drive control module (2) are installed, at the electrode (103) for the groove that LED chip (3) is installed with greater number.
6. system-level LED packaging according to claim 5 (100), it is characterized in that, on the non-electrode zone of the groove for LED chip (3) are installed (101) bottom and the copper foil layer (102) on the inclined-plane between described groove (101) bottom and described substrate (1) surface, be provided with reflector (104).
7. system-level LED packaging according to claim 6 (100), is characterized in that, the non-electrode zone on described copper foil layer (102) and non-reflective layer region are provided with white oil insulating barrier (105).
8. system-level LED packaging according to claim 7 (100), it is characterized in that, described drive control module (2) comprises components of drive circuit (201), control module chip (202) and wireless communication module (203) with protocols having
Wherein, described components of drive circuit (201) comprises integrated chip IC, MOS integrated circuit, resistance, electric capacity and/or rectifier diode,
Wherein, be the lighting fixture control chip of DALI, MAX512 with the control module chip (202) of protocols having.
9. system-level LED packaging according to claim 8 (100), is characterized in that, described LED chip (3) is blue-light LED chip, ultraviolet leds chip or purple LED chip,
Horizontal structure LED chip, light emitting diode (LED) chip with vertical structure or the inverted structure chip of described LED chip (3) for forming on sapphire, gallium nitride or silicon substrate.
10. system-level LED packaging according to claim 9 (100), it is characterized in that, the nude film of the electronic component in described drive control module (2) and described LED chip (3) is mounted to groove (101) bottom of the upper corresponding size of described substrate (1) and the degree of depth by die bond mode, and interconnect by gold thread (107), aluminum steel or alloy wire and described electrode (103), and adopt insulating cement or conducting resinl to fix
Described drive control module (2) and described LED chip (3) are contained fluorescent material or are not covered containing encapsulation glue-line (106) overall package of fluorescent material.
11. system-level LED packagings according to claim 10 (100), it is characterized in that, described optical lens (4) is glass lens or PC plastic cement lens, described optical lens (4) is by engagement connection or be adhesively fixed on described substrate (1) above, and described optical lens is provided with phosphor powder layer on (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320833936.3U CN203760472U (en) | 2013-12-17 | 2013-12-17 | System-level LED packaging device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320833936.3U CN203760472U (en) | 2013-12-17 | 2013-12-17 | System-level LED packaging device |
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| CN203760472U true CN203760472U (en) | 2014-08-06 |
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| CN201320833936.3U Expired - Fee Related CN203760472U (en) | 2013-12-17 | 2013-12-17 | System-level LED packaging device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485407A (en) * | 2014-10-23 | 2015-04-01 | 浙江寰龙电子技术有限公司 | LED lamp with control chip |
| CN104659185A (en) * | 2015-02-09 | 2015-05-27 | 上海三思电子工程有限公司 | LED light emitting device |
| CN105098022A (en) * | 2014-05-19 | 2015-11-25 | 四川新力光源股份有限公司 | LED packaging device, substrate and manufacturing method thereof |
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
| CN106129037A (en) * | 2016-08-10 | 2016-11-16 | 武汉寻泉科技有限公司 | Multi-project wafer fast packing plate and preparation method thereof, method for packing |
| CN112133810A (en) * | 2020-10-29 | 2020-12-25 | 深圳市广社照明科技有限公司 | Long-range phosphor powder large-angle scattering patch LED |
| CN114335290A (en) * | 2019-08-13 | 2022-04-12 | 光宝光电(常州)有限公司 | Packaging structure |
-
2013
- 2013-12-17 CN CN201320833936.3U patent/CN203760472U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098022A (en) * | 2014-05-19 | 2015-11-25 | 四川新力光源股份有限公司 | LED packaging device, substrate and manufacturing method thereof |
| CN104485407A (en) * | 2014-10-23 | 2015-04-01 | 浙江寰龙电子技术有限公司 | LED lamp with control chip |
| CN104485407B (en) * | 2014-10-23 | 2017-05-24 | 贵州省兴豪华电子科技有限公司 | LED lamp with control chip |
| CN104659185A (en) * | 2015-02-09 | 2015-05-27 | 上海三思电子工程有限公司 | LED light emitting device |
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
| CN106129037A (en) * | 2016-08-10 | 2016-11-16 | 武汉寻泉科技有限公司 | Multi-project wafer fast packing plate and preparation method thereof, method for packing |
| CN114335290A (en) * | 2019-08-13 | 2022-04-12 | 光宝光电(常州)有限公司 | Packaging structure |
| CN112133810A (en) * | 2020-10-29 | 2020-12-25 | 深圳市广社照明科技有限公司 | Long-range phosphor powder large-angle scattering patch LED |
| CN112133810B (en) * | 2020-10-29 | 2022-06-07 | 深圳市广社照明科技有限公司 | Long-range phosphor powder large-angle scattering patch LED |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140806 Termination date: 20181217 |