CN203026552U

CN203026552U - LED (lighting emitted diode) component bracket

Info

Publication number: CN203026552U
Application number: CN 201220664043
Authority: CN
Inventors: 瞿崧; 文国军; 严华锋
Original assignee: Shanghai Dangoo Electronic Trading Co Ltd
Current assignee: Shanghai Dangoo Electronic Trading Co Ltd
Priority date: 2012-12-06
Filing date: 2012-12-06
Publication date: 2013-06-26
Anticipated expiration: 2022-12-06

Abstract

The utility model relates to an LED (lighting emitted diode) component bracket comprising a bracket body. At least one side of the bracket body is coated with a line layer, or at least one side of the bracket body is coated with a transparent insulating thermal conductivity material layer which is then coated with a line layer; and one or several serial-parallel LED chipsets are installed on the line layer in a forward or inversion way. According to the utility model, the bracket body is coated with the line layer, or is coated with the transparent insulating thermal conductivity material layer which is then coated with the line layer; and one or several serial-parallel LED chipsets are installed on the line layer in a forward or inversion way. Therefore, LED chips emit light in all directions in the simplest LED bracket manner, and the chip temperature is effectively reduced; and compared with a unilateral lighting mode of a traditional plastic resin bracket, the LED component bracket has the beneficial effects that the light-emitting loss of the LED chips is reduced and the heat dissipation capability of the bracket is improved.

Description

LED emitting components support

Technical field

The utility model relates to the luminous first device of a kind of LED, especially a kind of LED emitting components support.

Background technology

LED is light-emitting diode (LED, Lighting emitted diode), is to utilize under electric field action the Sony ericsson mobile comm ab that PN junction is luminous.Having high life/environmental protection/energy-conservation characteristics, is the new light sources of environmental protection.The LED technology is increasingly full-fledged, and at present usually to emit white light be to excite the yellow-green fluorescence powder by blue chip to LED, carries out that wavelength is in harmonious proportion and the white light that produces, and the warm white efficient of large-scale production on market reaches 120 lm/W, surpasses most of conventional light source.Generally speaking, LED is by MOCVD (Metal-organic Chemical Vapor Deposition, the metallo-organic compound chemical gaseous phase deposition) grow p-type layer, N-shaped layer and p-n junction luminescent layer on Sapphire Substrate or silicon carbide substrates, then by the chip of lighting, the technique such as cutting, granule proliferation, graduation is made different size, generally speaking 10*10 mil is arranged, 10*23 mil, 24*24 mil, 40*40 mil equidimension can be born the continuous current driving from 10mA ~ 1A.Traditional encapsulation is that these chips are fixed on a package support, by negative electrode and the anode of gold thread welding chip, passes into electric current and comes driving LED to send blue single wavelength light, thereby excite the yellow-green fluorescence powder to form white light.Support generally adopts engineering plastics or with the plastics of metal heat sink, then increase its light extraction yield by bottom reflection, or by silica gel, resin or glass ware forming or change the refractive index of internal material with secondary optical lens, thus its bright dipping increased.

Traditional packaged type, light utilization efficiency for LED chip is quite low, in general, the light that the LED chip back side surface sends is through after reflection/refraction, its light utilization efficiency is no more than 40%, and LED chip overleaf the light that sends of side account for 60% of its whole chip light-emitting, meaning to approach has 40% only be wasted.Traditional fluorescent material gluing process, because fluorescent material is pressed close to the higher chip pyrotoxin of temperature, thereby cause the fluorescent material Efficiency Decreasing in addition, also can affect light effect.The reduction of light extraction efficiency means the increase of caloric value, thereby the reliability of electronic devices and components is exerted an influence, and this is all interactional result., then be welded on respectively on aluminium base by being packaged into the LED assembly due to LED chip, mixing suitable driving power and structure housing, making at last whole lamp and sell.There is too much link to cause the waste of efficient and cost in the middle of this.Therefore, based on the purpose of simplifying, by designing the simplest a kind of supporting structure, improve the total system light extraction efficiency and reduce costs.

Summary of the invention

The purpose of this utility model is in order to overcome in the LED chip manufacturing because existing enclosure support structure makes the low shortcoming of LED chip light utilization efficiency, a kind of omnibearing luminous LED emitting components support to be provided.

For this reason, the technical solution of the utility model is, a kind of LED emitting components support, comprise stake body, stake body has the upper line layer that applies of one side at least, perhaps have at least one side to apply the insulation transparent thermal conductive material layer, apply line layer above the insulation transparent thermal conductive material layer, single or many connection in series-parallel LED chip group formal dress or upside-down mounting are connected on line layer.

All the other are at least simultaneously frosting for stake body, perhaps apply high radiative material layer on frosting.The stake body cross section is polygonal polyhedron, and perhaps the cross section is the polyhedron that straight line and curved surface consist of.The material of line layer is copper, silver or tin indium oxide.The material of insulation transparent thermal conductive material layer is aluminium nitride.The material of high radiative material is alumina powder.

The beneficial effects of the utility model are:

The utility model applies line layer on stake body, perhaps apply the insulation transparent Heat Conduction Material, apply line layer above the insulation transparent Heat Conduction Material, LED chip formal dress or upside-down mounting that single LEDs chip or the connection in series-parallel of plurality of LEDs chip form are connected on line layer, adopt the simplest LED support mode, make LED chip omnibearing luminous, effectively reduce chip temperature, be compared to traditional one-sided illumination mode of fat support of moulding, reduce the luminous loss of LED chip, improved the heat-sinking capability of support.

Description of drawings

Fig. 1 is the support schematic diagram that insulation lens heat-conducting layer is arranged;

Fig. 2 is the support schematic diagram of naked lens heat-conducting layer;

Fig. 3 applies high radiative material schematic surface after frosting or frosted.

Embodiment

The utility model is described in further detail below in conjunction with accompanying drawing and embodiment.

As shown in Figure 1 to Figure 3, LED emitting components support of the present utility model comprises stake body 5, LED chip group 1 etc.

Stake body 5 cross sections are polygonal polyhedron, perhaps the cross section is the polyhedron transparent rack body that straight line and curved surface consist of, stake body 5 has the upper line layer 3(Fig. 2 of having of one side at least), perhaps has one side at least with insulation transparent thermal conductive material layer 4, above insulation transparent thermal conductive material layer 4 with line layer 3(Fig. 1), single or many connection in series-parallel LED chip group 1 formal dress or upside-down mounting are connected on line layer 3.Stake body 5 its laps do not process or have at least one side to have to be coated with the high radiative material layer that is improved surface emissivity or at least the one side surface for frosting 6 or have at least and apply high radiative material layer on a frosting 6, in order to increase the surface emissivity ability of support.

The material of stake body 5 is clear glass or transparent ceramic or transparent sapphire; The material of line layer is copper, silver or tin indium oxide; The material of insulation transparent thermal conductive material layer 4 is aluminium nitride.

As shown in Figure 1, transparent polyhedron stake body 5 one side at least is coated with insulation transparent thermal conductive material layer 4, then on insulation transparent thermal conductive material layer 4 growth line layer 3, form the loop by solder joint 2 between single or many connection in series-parallel LED chip groups 1 and line layer 3, at least simultaneously carry out surface coarsening at all the other and form frosting 6, perhaps apply high radiative material layer after surface coarsening or do not process.

As shown in Figures 2 and 3, at least one long transmission line layer 3 of looking unfamiliar of transparent polyhedron stake body 5, form the loop by solder joint 2 between single or many connection in series-parallel LED chip groups 1 and line layer 3, at least simultaneously carry out surface coarsening at all the other and form frosting 6, perhaps apply high radiative material layer after surface coarsening or do not process.

Claims

1. LED emitting components support, comprise stake body (5), be characterised in that: stake body (5) has the upper line layer (3) that applies of one side at least, perhaps have at least one side to apply insulation transparent thermal conductive material layer (4), apply line layer (3) above insulation transparent thermal conductive material layer (4), single or many connection in series-parallel LED chip group (1) formal dress or upside-down mounting are connected on line layer (3).

2. LED emitting components support according to claim 1 is characterized in that: described stake body (5) all the other at least one side be frosting (6), perhaps frosting (6) is upper applies high radiative material layer.

3. LED emitting components support according to claim 1 is characterized in that: described stake body (5) cross section is polygonal polyhedron, and perhaps the cross section is the polyhedron that straight line and curved surface consist of.

4. LED emitting components support according to claim 1, it is characterized in that: the material of described line layer (3) is copper, silver or tin indium oxide.

5. LED emitting components support according to claim 1, it is characterized in that: the material of described insulation transparent thermal conductive material layer (4) is aluminium nitride.

6. LED emitting components support according to claim 2, it is characterized in that: the material of described high radiative material layer is alumina powder.