CN203026552U - LED (lighting emitted diode) component bracket - Google Patents

LED (lighting emitted diode) component bracket Download PDF

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Publication number
CN203026552U
CN203026552U CN 201220664043 CN201220664043U CN203026552U CN 203026552 U CN203026552 U CN 203026552U CN 201220664043 CN201220664043 CN 201220664043 CN 201220664043 U CN201220664043 U CN 201220664043U CN 203026552 U CN203026552 U CN 203026552U
Authority
CN
China
Prior art keywords
led
line layer
bracket
coated
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220664043
Other languages
Chinese (zh)
Inventor
瞿崧
文国军
严华锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Dangoo Electronic Trading Co Ltd
Original Assignee
Shanghai Dangoo Electronic Trading Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Dangoo Electronic Trading Co Ltd filed Critical Shanghai Dangoo Electronic Trading Co Ltd
Priority to CN 201220664043 priority Critical patent/CN203026552U/en
Application granted granted Critical
Publication of CN203026552U publication Critical patent/CN203026552U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to an LED (lighting emitted diode) component bracket comprising a bracket body. At least one side of the bracket body is coated with a line layer, or at least one side of the bracket body is coated with a transparent insulating thermal conductivity material layer which is then coated with a line layer; and one or several serial-parallel LED chipsets are installed on the line layer in a forward or inversion way. According to the utility model, the bracket body is coated with the line layer, or is coated with the transparent insulating thermal conductivity material layer which is then coated with the line layer; and one or several serial-parallel LED chipsets are installed on the line layer in a forward or inversion way. Therefore, LED chips emit light in all directions in the simplest LED bracket manner, and the chip temperature is effectively reduced; and compared with a unilateral lighting mode of a traditional plastic resin bracket, the LED component bracket has the beneficial effects that the light-emitting loss of the LED chips is reduced and the heat dissipation capability of the bracket is improved.

Description

LED emitting components support
Technical field
The utility model relates to the luminous first device of a kind of LED, especially a kind of LED emitting components support.
Background technology
LED is light-emitting diode (LED, Lighting emitted diode), is to utilize under electric field action the Sony ericsson mobile comm ab that PN junction is luminous.Having high life/environmental protection/energy-conservation characteristics, is the new light sources of environmental protection.The LED technology is increasingly full-fledged, and at present usually to emit white light be to excite the yellow-green fluorescence powder by blue chip to LED, carries out that wavelength is in harmonious proportion and the white light that produces, and the warm white efficient of large-scale production on market reaches 120 lm/W, surpasses most of conventional light source.Generally speaking, LED is by MOCVD (Metal-organic Chemical Vapor Deposition, the metallo-organic compound chemical gaseous phase deposition) grow p-type layer, N-shaped layer and p-n junction luminescent layer on Sapphire Substrate or silicon carbide substrates, then by the chip of lighting, the technique such as cutting, granule proliferation, graduation is made different size, generally speaking 10*10 mil is arranged, 10*23 mil, 24*24 mil, 40*40 mil equidimension can be born the continuous current driving from 10mA ~ 1A.Traditional encapsulation is that these chips are fixed on a package support, by negative electrode and the anode of gold thread welding chip, passes into electric current and comes driving LED to send blue single wavelength light, thereby excite the yellow-green fluorescence powder to form white light.Support generally adopts engineering plastics or with the plastics of metal heat sink, then increase its light extraction yield by bottom reflection, or by silica gel, resin or glass ware forming or change the refractive index of internal material with secondary optical lens, thus its bright dipping increased.
Traditional packaged type, light utilization efficiency for LED chip is quite low, in general, the light that the LED chip back side surface sends is through after reflection/refraction, its light utilization efficiency is no more than 40%, and LED chip overleaf the light that sends of side account for 60% of its whole chip light-emitting, meaning to approach has 40% only be wasted.Traditional fluorescent material gluing process, because fluorescent material is pressed close to the higher chip pyrotoxin of temperature, thereby cause the fluorescent material Efficiency Decreasing in addition, also can affect light effect.The reduction of light extraction efficiency means the increase of caloric value, thereby the reliability of electronic devices and components is exerted an influence, and this is all interactional result., then be welded on respectively on aluminium base by being packaged into the LED assembly due to LED chip, mixing suitable driving power and structure housing, making at last whole lamp and sell.There is too much link to cause the waste of efficient and cost in the middle of this.Therefore, based on the purpose of simplifying, by designing the simplest a kind of supporting structure, improve the total system light extraction efficiency and reduce costs.
Summary of the invention
The purpose of this utility model is in order to overcome in the LED chip manufacturing because existing enclosure support structure makes the low shortcoming of LED chip light utilization efficiency, a kind of omnibearing luminous LED emitting components support to be provided.
For this reason, the technical solution of the utility model is, a kind of LED emitting components support, comprise stake body, stake body has the upper line layer that applies of one side at least, perhaps have at least one side to apply the insulation transparent thermal conductive material layer, apply line layer above the insulation transparent thermal conductive material layer, single or many connection in series-parallel LED chip group formal dress or upside-down mounting are connected on line layer.
All the other are at least simultaneously frosting for stake body, perhaps apply high radiative material layer on frosting.The stake body cross section is polygonal polyhedron, and perhaps the cross section is the polyhedron that straight line and curved surface consist of.The material of line layer is copper, silver or tin indium oxide.The material of insulation transparent thermal conductive material layer is aluminium nitride.The material of high radiative material is alumina powder.
The beneficial effects of the utility model are:
The utility model applies line layer on stake body, perhaps apply the insulation transparent Heat Conduction Material, apply line layer above the insulation transparent Heat Conduction Material, LED chip formal dress or upside-down mounting that single LEDs chip or the connection in series-parallel of plurality of LEDs chip form are connected on line layer, adopt the simplest LED support mode, make LED chip omnibearing luminous, effectively reduce chip temperature, be compared to traditional one-sided illumination mode of fat support of moulding, reduce the luminous loss of LED chip, improved the heat-sinking capability of support.
Description of drawings
Fig. 1 is the support schematic diagram that insulation lens heat-conducting layer is arranged;
Fig. 2 is the support schematic diagram of naked lens heat-conducting layer;
Fig. 3 applies high radiative material schematic surface after frosting or frosted.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and embodiment.
As shown in Figure 1 to Figure 3, LED emitting components support of the present utility model comprises stake body 5, LED chip group 1 etc.
Stake body 5 cross sections are polygonal polyhedron, perhaps the cross section is the polyhedron transparent rack body that straight line and curved surface consist of, stake body 5 has the upper line layer 3(Fig. 2 of having of one side at least), perhaps has one side at least with insulation transparent thermal conductive material layer 4, above insulation transparent thermal conductive material layer 4 with line layer 3(Fig. 1), single or many connection in series-parallel LED chip group 1 formal dress or upside-down mounting are connected on line layer 3.Stake body 5 its laps do not process or have at least one side to have to be coated with the high radiative material layer that is improved surface emissivity or at least the one side surface for frosting 6 or have at least and apply high radiative material layer on a frosting 6, in order to increase the surface emissivity ability of support.
The material of stake body 5 is clear glass or transparent ceramic or transparent sapphire; The material of line layer is copper, silver or tin indium oxide; The material of insulation transparent thermal conductive material layer 4 is aluminium nitride.
As shown in Figure 1, transparent polyhedron stake body 5 one side at least is coated with insulation transparent thermal conductive material layer 4, then on insulation transparent thermal conductive material layer 4 growth line layer 3, form the loop by solder joint 2 between single or many connection in series-parallel LED chip groups 1 and line layer 3, at least simultaneously carry out surface coarsening at all the other and form frosting 6, perhaps apply high radiative material layer after surface coarsening or do not process.
As shown in Figures 2 and 3, at least one long transmission line layer 3 of looking unfamiliar of transparent polyhedron stake body 5, form the loop by solder joint 2 between single or many connection in series-parallel LED chip groups 1 and line layer 3, at least simultaneously carry out surface coarsening at all the other and form frosting 6, perhaps apply high radiative material layer after surface coarsening or do not process.

Claims (6)

1. LED emitting components support, comprise stake body (5), be characterised in that: stake body (5) has the upper line layer (3) that applies of one side at least, perhaps have at least one side to apply insulation transparent thermal conductive material layer (4), apply line layer (3) above insulation transparent thermal conductive material layer (4), single or many connection in series-parallel LED chip group (1) formal dress or upside-down mounting are connected on line layer (3).
2. LED emitting components support according to claim 1 is characterized in that: described stake body (5) all the other at least one side be frosting (6), perhaps frosting (6) is upper applies high radiative material layer.
3. LED emitting components support according to claim 1 is characterized in that: described stake body (5) cross section is polygonal polyhedron, and perhaps the cross section is the polyhedron that straight line and curved surface consist of.
4. LED emitting components support according to claim 1, it is characterized in that: the material of described line layer (3) is copper, silver or tin indium oxide.
5. LED emitting components support according to claim 1, it is characterized in that: the material of described insulation transparent thermal conductive material layer (4) is aluminium nitride.
6. LED emitting components support according to claim 2, it is characterized in that: the material of described high radiative material layer is alumina powder.
CN 201220664043 2012-12-06 2012-12-06 LED (lighting emitted diode) component bracket Expired - Fee Related CN203026552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220664043 CN203026552U (en) 2012-12-06 2012-12-06 LED (lighting emitted diode) component bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220664043 CN203026552U (en) 2012-12-06 2012-12-06 LED (lighting emitted diode) component bracket

Publications (1)

Publication Number Publication Date
CN203026552U true CN203026552U (en) 2013-06-26

Family

ID=48650511

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220664043 Expired - Fee Related CN203026552U (en) 2012-12-06 2012-12-06 LED (lighting emitted diode) component bracket

Country Status (1)

Country Link
CN (1) CN203026552U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102945912A (en) * 2012-12-06 2013-02-27 上海顿格电子贸易有限公司 LED (Light Emitting Diode) light-emitting component bracket
CN110473952A (en) * 2018-05-09 2019-11-19 深圳市聚飞光电股份有限公司 Circuit LED support and LED
CN111883636A (en) * 2019-12-06 2020-11-03 中山市木林森电子有限公司 Manufacturing method of LED lamp filament

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102945912A (en) * 2012-12-06 2013-02-27 上海顿格电子贸易有限公司 LED (Light Emitting Diode) light-emitting component bracket
WO2014086079A1 (en) * 2012-12-06 2014-06-12 上海顿格电子贸易有限公司 Led light-emitting component support
CN110473952A (en) * 2018-05-09 2019-11-19 深圳市聚飞光电股份有限公司 Circuit LED support and LED
CN111883636A (en) * 2019-12-06 2020-11-03 中山市木林森电子有限公司 Manufacturing method of LED lamp filament

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130626

Termination date: 20201206