CN204062597U - The luminous radiator structure of a kind of LED light source - Google Patents
The luminous radiator structure of a kind of LED light source Download PDFInfo
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- CN204062597U CN204062597U CN201420482908.6U CN201420482908U CN204062597U CN 204062597 U CN204062597 U CN 204062597U CN 201420482908 U CN201420482908 U CN 201420482908U CN 204062597 U CN204062597 U CN 204062597U
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Abstract
The utility model relates to the luminous radiator structure of a kind of LED light source, this LED light source is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin layer, wherein, this radiation conductive thin layer is attached on the outer surface of this transparent heat sink substrate, this radiation conductive thin layer comprises completely attached part and window part, this full attached part and this window partial separation are arranged, this LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate by this window part.
Description
Technical field
The utility model relates to a kind of luminous radiator structure, refers to a kind of luminous radiator structure for LED light source especially.
Background technology
As everyone knows, in order to effective running, traditional LED light source needs effective heat abstractor to dispel the heat, PCT international application no is the technology disclosing a kind of LED light source and manufacture method thereof in PCT/CN2011/000756, which describe a kind of LED element, it is luminous by two sides, thus avoid heat accumulation on the faying face and substrate of knot Conventional LED light sources, its LED element is directly connected in a sandwich format with two fluorescent elements, thus forms one or more passway to be reached through the heat trnasfer of this passway guiding LED element by this.
Its structure mainly comprises one or more LED light source group, wherein every described LED light source group comprises: at least one LED element, wherein said LED element has one first light-emitting area and one second light-emitting area at reverse side, and wherein said LED element is suitable for often described first light-emitting area and described second light-emitting area provide the illumination being greater than 180 ° of angles by electroluminescent; Two fluorescent elements, described two fluorescent elements lay respectively at described first light-emitting area of described LED element and described second light-emitting area top to keep described LED element in place, thus the illumination that described LED is produced respectively from described light-emitting area through described two fluorescent elements; With an electronic component, described electronic component and described LED element lotus root connect that described LED element is electrically connected on a power supply.
Described LED element to be clipped in the middle in sandwich mode by described two fluorescent elements thus to keep described LED element in place, directly press on described fluorescent element to make described first light-emitting area and described second light-emitting area and leave described LED element to be supported and to guide heat trnasfer, and described LED element is maintained in a LED container cavity in space between described fluorescent element.
Above-mentioned technology is applied to its product on specific product, and to have the little illumination effect of volume good, a LED light source can be utilized simultaneously simultaneously luminous to all directions, but when concrete enforcement, because it is just dispelled the heat to LED element by the first light-emitting area and the second light-emitting area, although its thinking is better, but it is undesirable to there is radiating effect when concrete enforcement, heat distributes comparatively slow and causes the overheated situation of LED element, can burn whole LED light source when more serious, and this is the major defect for conventional art.
Utility model content
The utility model provides the luminous radiator structure of a kind of LED light source and luminous heat dissipating method thereof, its structure good heat dissipation effect, and luminescent properties is excellent, and can significantly reduce light source works temperature, and this is main purpose of the present utility model.
Technical solution adopted in the utility model is: the luminous radiator structure of a kind of LED light source, this LED light source is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin layer, wherein, this radiation conductive thin layer is attached on the outer surface of this transparent heat sink substrate, this transparent heat sink substrate is made up of printing opacity heat sink material, this radiation conductive thin layer is made up of heat conduction and heat radiation conductive material, this radiation conductive thin layer comprises completely attached part and window part, this full attached part and this window partial separation are arranged, this LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate by this window part.
This transparent heat sink substrate is glass, and this radiation conductive thin layer is silver coating, and time this radiation conductive thin layer is silver coating, silver coating also possesses the effect of light reflection while radiation conductive.
When this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate is provided with some heat conduction Support Level in this window part, this heat conduction Support Level is identical with the material of this radiation conductive thin layer, all full with this attached part in both ends of each this heat conduction Support Level is connected, this heat conduction Support Level is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces conducts on this transparent heat sink substrate and this radiation conductive thin layer by this heat conduction Support Level, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level and be transmitted in external environment condition through after this transparent heat sink substrate.
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached portion top surface of these window part both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part and be transmitted in external environment condition through after this transparent heat sink substrate.
This transparent heat sink plate is erected on heat radiation rack, carries out heat conduction and heat radiation to reduce the operating temperature of this LED double-side chip further by this heat radiation rack to this transparent heat sink plate.
This LED light source is the light source of a LED lamp, this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate is ring-type, this heat radiation rack comprises heat radiation stationary pipes and heat radiation insertion pipe, wherein, this heat radiation stationary pipes one end is plugged in this lamp socket, this heat radiation insertion pipe is plugged in other one end of this heat radiation stationary pipes, this transparent heat sink plate is folded between this heat radiation stationary pipes and this heat radiation insertion pipe, is dispelled the heat further to this transparent heat sink plate by this heat radiation rack.
This heat radiation stationary pipes one end is provided with socket, this socket level extends to form the first clamp ring to surrounding, this heat radiation insertion pipe comprises intubate and the second horizontal clamping plate, wherein, this intubate is plugged in this socket of this heat radiation stationary pipes, this transparent heat sink plate is folded between this first clamp ring and this second horizontal clamping plate, and this LED double-side chip ring is located at this transparent heat sink plate surrounding.
This LED light source is the light source of a LED lamp, and this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate is tabular, and this heat radiation rack is folded in this transparent heat sink plate both sides, and this heat radiation racks some are plugged on this lamp socket simultaneously.
This LED light source is the light source of a LED lamp, this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, and this transparent heat sink plate is ring-type, and this heat radiation rack is connected in this lamp socket, this LED double-side chip ring is located at this transparent heat sink plate surrounding, this LED double-side chip is enclosed with layer of silica gel, and in this lampshade, filling has heat-conducting gas, can be promoted the radiating efficiency of this LED double-side chip by this heat-conducting gas.
This full attached part comprises some conductive radiator parts, this conductive radiator parts some are arranged independently of one another, this conductive radiator parts some are attached on the outer surface of this transparent heat sink substrate simultaneously, this illuminator is arranged between two these conductive radiator parts of arbitrary neighborhood, the electric connection line of this adjacent illuminator is electrically connected with this conductive radiator part respectively, thus makes this illuminators some form series connection and annexation.
This radiation conductive thin layer is also connected with external radiator portion, by auxiliary this radiation conductive thin layer heat radiation further of this external radiator portion.
The beneficial effects of the utility model are: this LED double-side chips some are arranged on transparent heat sink plate by the utility model, and this radiation conductive thin layer comprises completely attached part and window part, and this full attached part and this window partial separation are arranged.This LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate by this window part.The object arranging this window part, also just in order to make full use of the feature of this LED double-side chip double-side luminescence, makes the few to the greatest extent loss of luminous energy.In addition, the object of this radiation conductive thin layer being set mainly in order to utilize dispelling the heat for this LED double-side chip of its material behavior maximum possible, farthest reducing its operating temperature.
Accompanying drawing explanation
Fig. 1 is the structural representation of the positive cartridge chip of the utility model.
Fig. 2 is the structural representation of the utility model flip-chip.
Fig. 3 is the structural representation that the utility model is applied in light fixture.
Fig. 4 is the front view of the luminous radiator structure of Fig. 3 light fixture LED light source.
Fig. 5,7,8,9,10 is applied to the structural representation in light fixture for the utility model.
Fig. 6 is the top view of the luminous radiator structure of Fig. 5 light fixture LED light source.
Figure 11 is the structural representation that Figure 10 light fixture LED double-side chip is arranged on transparent heat sink plate.
Figure 12 is the structural representation that the external radiator portion of the utility model radiation conductive thin layer is connected.
Detailed description of the invention
As shown in Figure 1 to 9, the luminous radiator structure of a kind of LED light source, this LED light source is LED double-side chip, applicant of the present utility model is the technology disclosing a kind of LED light source and manufacture method thereof in PCT/CN2011/000756 at PCT international application no, which describe a kind of LED element, it is luminous by two sides, thus avoid heat accumulation on the faying face and substrate of knot Conventional LED light sources, its LED element is directly connected in a sandwich format with two fluorescent elements, thus form one or more passway to be reached through the heat trnasfer of this passway guiding LED element by this.Its structure mainly comprises one or more LED light source group, wherein every described LED light source group comprises: at least one LED element, wherein said LED element has one first light-emitting area and one second light-emitting area at reverse side, and wherein said LED element is suitable for often described first light-emitting area and described second light-emitting area provide the illumination being greater than 180 ° of angles by electroluminescent; Two fluorescent elements, described two fluorescent elements lay respectively at described first light-emitting area of described LED element and described second light-emitting area top to keep described LED element in place, thus the illumination that described LED is produced respectively from described light-emitting area through described two fluorescent elements; With an electronic component, described electronic component and described LED element lotus root connect that described LED element is electrically connected on a power supply.Described LED element to be clipped in the middle in sandwich mode by described two fluorescent elements thus to keep described LED element in place, directly press on described fluorescent element to make described first light-emitting area and described second light-emitting area and leave described LED element to be supported and to guide heat trnasfer, and described LED element is maintained in a LED container cavity in space between described fluorescent element.
The technology of PCT/CN2011/000756 is applied to that product of the present utility model to have the little illumination effect of volume good, a LED light source can be utilized simultaneously simultaneously luminous to all directions, but when concrete enforcement, because it is just dispelled the heat to LED element by the first light-emitting area and the second light-emitting area, although its thinking is better, but it is undesirable to there is radiating effect when concrete enforcement, heat distributes comparatively slow and causes the overheated situation of LED element.
Utility model people of the present utility model improves its radiating mode in conjunction with the technical characterstic of PCT/CN2011/000756 simultaneously, and be applied in backlight product of the present utility model, thus make backlight product of the present utility model all reach desirable state at illumination effect or in operating temperature, specifically describe as follows.
This LED double-side chip has upper light-emitting area and lower light-emitting area.This LED double-side chip has six light-emitting areas, and comprise plural layer overlapping and arrangement in an orderly manner, this LED double-side chip sequentially overlapping and arrangement one rigidity and transparent basalis, one luminescent layer and a current spreading layer, the inverted structure of this LED double-side chip, its structure is simple, and can define light-emitting area and this lower light-emitting area on this, and the concrete structure of this LED double-side chip is open in front case PCT/CN2011/000756 to be not repeated here.
Some this LED double-side chip A are arranged on transparent heat sink plate 100, and this transparent heat sink plate 100 comprises transparent heat sink substrate 110 and radiation conductive thin layer 120, and wherein, this radiation conductive thin layer 120 is attached on the outer surface of this transparent heat sink substrate 110.
This transparent heat sink substrate 110 is made up of printing opacity heat sink material, such as, and glass, sapphire etc.
This radiation conductive thin layer 120 is made up of heat conduction and heat radiation conductive material, such as, and silver slurry.
In on the outer surface specifically this radiation conductive thin layer 120 being attached to this transparent heat sink substrate 110, need first corrosion to be carried out to the outer surface of this transparent heat sink substrate 110 coarse, then adhered to by this radiation conductive thin layer 120, this mode strong adhesion, product quality is good.
This radiation conductive thin layer 120 comprises completely attached part 121 and window part 122, and this full attached part 121 and this window part 122 interval are arranged.
This LED double-side chip level is arranged on this window part 122 position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate 110 by this window part 122.
The object arranging this window part 122, also just in order to make full use of the feature of this LED double-side chip double-side luminescence, makes the few to the greatest extent loss of luminous energy.
In addition, the object of this radiation conductive thin layer 120 being set mainly in order to utilize dispelling the heat for this LED double-side chip of its material behavior maximum possible, farthest reducing its operating temperature.
When this transparent heat sink substrate 110 is glass, time this radiation conductive thin layer 120 is silver slurry, preferred thickness is, glassy layer 0. 6 millimeters thick, silver slurry layer ten micron thickness.
In addition, this radiation conductive thin layer 120 be silver slurry time, silver slurry layer also possess while radiation conductive light reflection effect, thus as much as possible by light reflection to this diffuser plate 10 direction.
This LED double-side chip can be horizontally set on this window part 122 position with formal dress and upside-down mounting two kinds of modes.
As shown in Figure 1, when this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate 110 is provided with some heat conduction Support Level 123 in this window part 122, and this heat conduction Support Level 123 is identical with the material of this radiation conductive thin layer 120.
All full with this attached part 121 in both ends of each this heat conduction Support Level 123 is connected.
This heat conduction Support Level 123 is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces is conducted on this transparent heat sink substrate 110 and this radiation conductive thin layer 120 by this heat conduction Support Level 123, and synchronously dispels the heat.
The light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level 123 and be transmitted in external environment condition through after this transparent heat sink substrate 110.
The width of this heat conduction Support Level 123 preferably five microns.
As shown in Figure 2, when this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached part 121 end face of these window part 122 both sides.
The heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate 110, and synchronously dispels the heat.
The light that the bottom surface of this LED double-side chip sends is by this window part 122 and be transmitted in external environment condition through after this transparent heat sink substrate 110.
Finally it is emphasized that, technology of the present utility model can be applied in field quite widely, the LED light source body utilizing technology of the present utility model to produce can replace the light source of all LED lamp, has the feature that illumination effect is good, volume is little, operating temperature is low simultaneously
When concrete enforcement, this transparent heat sink plate 100 entirety can be designed to circle, bar shaped or other shapes, when concrete enforcement, this transparent heat sink plate 100 is erected on heat radiation rack 200, carry out heat conduction and heat radiation to reduce the operating temperature of this LED double-side chip to this transparent heat sink plate 100 further by this heat radiation rack 200, this heat radiation rack 200 can be made up of metallic copper or other heat radiating metals.
This LED light source is the light source of a LED lamp, this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate 100 is ring-type, this heat radiation rack 200 comprises heat radiation stationary pipes 210 and heat radiation insertion pipe 220, wherein, this heat radiation stationary pipes 210 one end is plugged in this lamp socket, this heat radiation insertion pipe 220 is plugged in other one end of this heat radiation stationary pipes 210, this transparent heat sink plate 100 is folded between this heat radiation stationary pipes 210 and this heat radiation insertion pipe 220, is dispelled the heat further to this transparent heat sink plate 100 by this heat radiation rack 200.
When concrete enforcement, this heat radiation stationary pipes 210 one end is provided with socket, this socket level extends to form the first clamp ring 211 to surrounding, this heat radiation insertion pipe 220 comprises intubate 221 and the second horizontal clamping plate 222, wherein, this intubate 221 is plugged in this socket of this heat radiation stationary pipes 210, and this transparent heat sink plate 100 is folded between this first clamp ring 211 and this second horizontal clamping plate 222, and this LED double-side chip ring is located at this transparent heat sink plate 100 surrounding.
This LED light source is the light source of a LED lamp, and this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate 100 is tabular, and this heat radiation rack 200 is folded in this transparent heat sink plate 100 both sides, and this heat radiation racks 200 some are plugged on this lamp socket simultaneously.
As shown in Figure 10, this LED light source is the light source of a LED lamp, this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate 100 is ring-type, and this heat radiation rack 200 is connected in this lamp socket, and this LED double-side chip ring is located at this transparent heat sink plate 100 surrounding.
This LED double-side chip is enclosed with layer of silica gel, and in this lampshade, filling has heat-conducting gas, can be promoted the radiating efficiency of this LED double-side chip by this heat-conducting gas.
Although but traditional this LED lamp is wrapped in so heat can not both distribute immediately close to white candle lamp due to chip by silica gel, originally chip back can bright dipping initial light effect can reach more than 180lm can only reach about 120lm because operating temperature is high.
The shortcoming that the utility model overcomes conventional art utilizes above-mentioned structure heat can be derived by one the mode that silica gel parcel face directly contacts with heat-conducting gas to dispel the heat, chip of the present utility model is connected by silver layer in addition, and the heat that chip PN junction produces can be derived by silver layer the very first time.
Concrete implement time, this radiation conductive thin layer 120 is also coated with high-heating radiation material with improving radiating effect.
As shown in Figure 10,11, when concrete enforcement, this full attached part 121 comprises some conductive radiator parts 124, and this conductive radiator parts 124 some are arranged independently of one another, and this conductive radiator parts 124 some are attached on the outer surface of this transparent heat sink substrate 110 simultaneously.
This illuminator 31 is arranged between two these conductive radiator parts 124 of arbitrary neighborhood, and the electric connection line of this adjacent illuminator 31 is electrically connected with this conductive radiator part 124 respectively, thus makes this illuminators 31 some formation be connected in series relation.That is, by this conductive radiator parts 124 some when dispelling the heat, its effect connected to conduction simultaneously, this kind of structure, when not needing to add radiator in addition, may be used for the module of various light fixture.
As shown in figure 12, this radiation conductive thin layer 120 is also connected with external radiator portion 125, by auxiliary this radiation conductive thin layer heat radiation further of this external radiator portion 125.
The mode that high heat conduction is bonding or weld can be adopted, wherein preferred weld mode when external to this radiation conductive thin layer 120 and this radiator portion 125 being connected.
In addition, this above-mentioned LED lamp can also be the light fixture of the various forms moulding as Fig. 5 to Fig. 9.
As shown in Figure 1 to 9, the luminous heat dissipating method of a kind of LED light source, this LED double-side chips some are arranged on transparent heat sink plate 100, this transparent heat sink plate 100 comprises transparent heat sink substrate 110 and radiation conductive thin layer 120, wherein, this radiation conductive thin layer 120 is attached on the outer surface of this transparent heat sink substrate 110.This transparent heat sink substrate 110 is made up of printing opacity heat sink material, such as, and glass, sapphire etc.This radiation conductive thin layer 120 is made up of heat conduction and heat radiation conductive material, such as, and silver slurry.
In on the outer surface specifically this radiation conductive thin layer 120 being attached to this transparent heat sink substrate 110, need first corrosion to be carried out to the outer surface of this transparent heat sink substrate 110 coarse, then adhered to by this radiation conductive thin layer 120, this mode strong adhesion, product quality is good.
This radiation conductive thin layer 120 is divided into completely attached part 121 and window part 122, and this full attached part 121 and this window part 122 interval are arranged.
This LED double-side chip level is arranged on this window part 122 position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate 110 by this window part 122.
The object arranging this window part 122, also just in order to make full use of the feature of this LED double-side chip double-side luminescence, makes the few to the greatest extent loss of luminous energy.In addition, the object of this radiation conductive thin layer 120 being set mainly in order to utilize dispelling the heat for this LED double-side chip of its material behavior maximum possible, farthest reducing its operating temperature.
When this transparent heat sink substrate 110 is glass, time this radiation conductive thin layer 120 is silver slurry, preferred thickness is, glassy layer 0. 6 millimeters thick, silver slurry layer ten micron thickness.In addition, this radiation conductive thin layer 120 be silver slurry time, silver slurry layer also possess while radiation conductive light reflection effect, thus as much as possible by light reflection to this diffuser plate 10 direction.
This LED double-side chip can be horizontally set on this window part 122 position with formal dress and upside-down mounting two kinds of modes.
When this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate 110 is provided with some heat conduction Support Level 123 in this window part 122, and this heat conduction Support Level 123 is identical with the material of this radiation conductive thin layer 120.All full with this attached part 121 in both ends of each this heat conduction Support Level 123 is connected.
This heat conduction Support Level 123 is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces is conducted on this transparent heat sink substrate 110 and this radiation conductive thin layer 120 by this heat conduction Support Level 123, and synchronously dispels the heat.
The light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level 123 and be transmitted in external environment condition through after this transparent heat sink substrate 110.
The width of this heat conduction Support Level 123 preferably five microns.
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached part 121 end face of these window part 122 both sides.The heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate 110, and synchronously dispels the heat.The light that the bottom surface of this LED double-side chip sends is by this window part 122 and be transmitted in external environment condition through after this transparent heat sink substrate 110.
When concrete enforcement, this transparent heat sink plate 100 entirety can be designed to circle, bar shaped or other shapes, when concrete enforcement, this transparent heat sink plate 100 is erected on heat radiation rack 200, carry out heat conduction and heat radiation to reduce the operating temperature of this LED double-side chip to this transparent heat sink plate 100 further by this heat radiation rack 200, this heat radiation rack 200 can be made up of metallic copper or other heat radiating metals.
Claims (11)
1. the luminous radiator structure of LED light source, it is characterized in that: this LED light source is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin layer, wherein, this radiation conductive thin layer is attached on the outer surface of this transparent heat sink substrate, and this transparent heat sink substrate is made up of printing opacity heat sink material, this radiation conductive thin layer is made up of heat conduction and heat radiation conductive material
This radiation conductive thin layer comprises completely attached part and window part, this full attached part and this window partial separation are arranged, this LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate by this window part.
2. the luminous radiator structure of a kind of LED light source as claimed in claim 1, it is characterized in that: this transparent heat sink substrate is glass, this radiation conductive thin layer is silver coating, and time this radiation conductive thin layer is silver coating, silver coating also possesses the effect of light reflection while radiation conductive.
3. the luminous radiator structure of a kind of LED light source as claimed in claim 1, it is characterized in that: when this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate is provided with some heat conduction Support Level in this window part, this heat conduction Support Level is identical with the material of this radiation conductive thin layer, all full with this attached part in both ends of each this heat conduction Support Level is connected, this heat conduction Support Level is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces conducts on this transparent heat sink substrate and this radiation conductive thin layer by this heat conduction Support Level, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level and be transmitted in external environment condition through after this transparent heat sink substrate.
4. the luminous radiator structure of a kind of LED light source as claimed in claim 1, it is characterized in that: when this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached portion top surface of these window part both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part and be transmitted in external environment condition through after this transparent heat sink substrate.
5. the luminous radiator structure of a kind of LED light source as described in Claims 1-4 any one, it is characterized in that: this transparent heat sink plate is erected on heat radiation rack, further heat conduction and heat radiation is carried out to reduce the operating temperature of this LED double-side chip to this transparent heat sink plate by this heat radiation rack.
6. the luminous radiator structure of a kind of LED light source as claimed in claim 5, it is characterized in that: this LED light source is the light source of a LED lamp, this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate is ring-type, this heat radiation rack comprises heat radiation stationary pipes and heat radiation insertion pipe, wherein, this heat radiation stationary pipes one end is plugged in this lamp socket, this heat radiation insertion pipe is plugged in other one end of this heat radiation stationary pipes, this transparent heat sink plate is folded between this heat radiation stationary pipes and this heat radiation insertion pipe, by this heat radiation rack, this transparent heat sink plate is dispelled the heat further.
7. the luminous radiator structure of a kind of LED light source as claimed in claim 6, it is characterized in that: this heat radiation stationary pipes one end is provided with socket, this socket level extends to form the first clamp ring to surrounding, this heat radiation insertion pipe comprises intubate and the second horizontal clamping plate, wherein, this intubate is plugged in this socket of this heat radiation stationary pipes, and this transparent heat sink plate is folded between this first clamp ring and this second horizontal clamping plate, and this LED double-side chip ring is located at this transparent heat sink plate surrounding.
8. the luminous radiator structure of a kind of LED light source as claimed in claim 5, it is characterized in that: this LED light source is the light source of a LED lamp, this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate is tabular, and this heat radiation rack is folded in this transparent heat sink plate both sides, and this heat radiation racks some are plugged on this lamp socket simultaneously.
9. the luminous radiator structure of a kind of LED light source as claimed in claim 5, it is characterized in that: this LED light source is the light source of a LED lamp, this LED lamp comprises lamp socket and lampshade, wherein, this lampshade is connected on this lamp socket, this transparent heat sink plate is ring-type, this heat radiation rack is connected in this lamp socket, this LED double-side chip ring is located at this transparent heat sink plate surrounding, this LED double-side chip is enclosed with layer of silica gel, in this lampshade, filling has heat-conducting gas, can be promoted the radiating efficiency of this LED double-side chip by this heat-conducting gas.
10. the luminous radiator structure of a kind of LED light source as described in claim 1 or 9, it is characterized in that: this full attached part comprises some conductive radiator parts, this conductive radiator parts some are arranged independently of one another, this conductive radiator parts some are attached on the outer surface of this transparent heat sink substrate simultaneously, this illuminator is arranged between two these conductive radiator parts of arbitrary neighborhood, the electric connection line of this adjacent illuminator is electrically connected with this conductive radiator part respectively, thus makes this illuminators some form series connection and annexation.
The luminous radiator structure of 11. a kind of LED light source as claimed in claim 1, is characterized in that: this radiation conductive thin layer is also connected with external radiator portion, by auxiliary this radiation conductive thin layer heat radiation further of this external radiator portion.
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| CN201420482908.6U CN204062597U (en) | 2014-08-26 | 2014-08-26 | The luminous radiator structure of a kind of LED light source |
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| CN201420482908.6U CN204062597U (en) | 2014-08-26 | 2014-08-26 | The luminous radiator structure of a kind of LED light source |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371161A (en) * | 2014-08-26 | 2016-03-02 | 蔡鸿 | LED direct type backlight and light emitting method thereof |
| WO2016029808A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Light emission and heat dissipation structure of led light source and light emission and heat dissipation method therefor |
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2014
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371161A (en) * | 2014-08-26 | 2016-03-02 | 蔡鸿 | LED direct type backlight and light emitting method thereof |
| WO2016029808A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Light emission and heat dissipation structure of led light source and light emission and heat dissipation method therefor |
| WO2016029809A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Led direct-lit backlight source and light emission method therefor |
| CN105444036A (en) * | 2014-08-26 | 2016-03-30 | 蔡鸿 | Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof |
| CN105444036B (en) * | 2014-08-26 | 2017-03-22 | 蔡鸿 | Light-emitting diode (LED) light source light-emitting and heat-dissipating structure |
| CN105371161B (en) * | 2014-08-26 | 2018-08-28 | 蔡鸿 | A kind of LED direct-light-type backlights and its luminescent method |
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