CN105371161A - LED direct type backlight and light emitting method thereof - Google Patents

LED direct type backlight and light emitting method thereof Download PDF

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Publication number
CN105371161A
CN105371161A CN201410422541.3A CN201410422541A CN105371161A CN 105371161 A CN105371161 A CN 105371161A CN 201410422541 A CN201410422541 A CN 201410422541A CN 105371161 A CN105371161 A CN 105371161A
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China
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heat sink
light
led
side chip
led double
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CN201410422541.3A
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CN105371161B (en
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蔡鸿
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Individual
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Priority to CN201410422541.3A priority Critical patent/CN105371161B/en
Priority to PCT/CN2015/087463 priority patent/WO2016029809A1/en
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Publication of CN105371161B publication Critical patent/CN105371161B/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Abstract

The invention relates to an LED direct type backlight and a light emitting method thereof. The LED direct type backlight structurally comprises a diffuser plate, a bottom shell and light source units. The diffuser plate is connected to the bottom shell, and an air cavity is formed by the diffuser plate and the bottom shell in a surrounding manner. A top face of the air groove is formed on the inner side face of the diffuser plate. A bottom face of the air groove is formed on the inner side face of the bottom shell. The light source units are arranged in the air groove. During work, light generated through light emitting via powering-on of the light source units passes the diffuser plate to transmit into the external environment, and the backlight is formed. The light source units comprise a plurality of light emitting bodies. The light emitting bodies are arranged in the air groove in sequence, and each light emitting body is transversely arranged in the air groove.

Description

A kind of LED direct-light-type backlight and luminescent method thereof
Technical field
The present invention relates to a kind of structure and luminescent method thereof of backlight, refer to that a kind of take LED as direct-light-type backlight and the luminescent method thereof of light source especially.
Background technology
As everyone knows, in the electronics industry, backlight is a kind of form of illumination, is often used in LCD display.Backlight type and front smooth formula difference are that backlight is from side or irradiates behind, and as the term suggests front light is then irradiated from the front.They are used to be increased in the brightness on illuminance in low lighting environment and computer monitor, liquid crystal screen display, produce bright dipping to show similar mode with CRT.Its light source of led backlight can be incandescent lamp bulb, electrooptic panel (ELP), light emitting diode (LED), cold-cathode tube (CCFL) etc.Electrooptic panel provides the light of whole surface uniform, and other backlight module then uses in the never uniform light source of diffuser and provides uniform light.Backlight can be any one color, and single color LCD has Huang, the backlight such as green, blue, white usually.And colored display adopts white white light, because it contains maximum coloured light.
LED-backlit is used in small and exquisite LCD.His light is normally coloured, although white backlight is more and more general.Electrooptic panel is often used in large-scale display, and at this moment uniform backlight is very important.Electrooptic panel needs to drive via the alternating current of high pressure, and this part is provided by inverted rectifier loop.It similarly is on computer monitor that cold-cathode tube is used in, in color normally white, this equally also needs inverted rectifier and diffuser.LED-backlit can promote the color representation of LCD display.LED light generated via three other LED each, provides the coloured light spectrum of the LCD picture point colour filter self that quite coincide.
The simplest with the technique of direct-light-type backlight in the classification of LED backlight, it does not need light guide plate, and LED array is placed in bottom lamp box, and the light sent from LED through bottom surface and offside reflection, is more evenly penetrated by the diffuser plate on surface and optics module.The thickness of direct-light-type backlight determines with the distance of scatter plate by bottom lamp box, and usual thickness is thicker, and the optical uniformity of backlight is better.When backlight is thinner, color and brightness uniformity have just become the key problem in technology of direct-light-type backlight.But it is very high to adjust to the uniformity of color and brightness the technical costs paid required for it, also do not occur at present solving the thicker correlation technique of direct-light-type backlight thickness by change light source luminescent, arrangement mode, and this is the major defect for prior art.
In addition in field of liquid crystal display, existing liquid crystal display product, main direct LED backlight technology or the side entering-type LED backlight source technology of adopting throws light on to liquid crystal panel, to realize the display of picture.At present, direct LED backlight technology mainly adopts LED to mount lens as core component, lens are utilized to expand the dispersion angle of LED, utilize the air groove formed between LED and diffuser plate, for LED light provides light mixing distance, and then arrive diffuser plate again after LED light is mixed, by diffuser plate, LED light is done further after DIFFUSION TREATMENT, be irradiated to equably on whole liquid crystal panel.
The Bian LCD product of this direct LED backlight Technology design, the LED quantity of use is more and the spacing of LED is less, and the mixed effect of light is better; Meanwhile, light mixing distance is larger, and the mixed effect of light is also better.Therefore, current main Bian increases the quantity of LED or increases light mixing distance two kinds of modes, improves the mixed effect of light, LED light is thrown light on on liquid crystal panel equably, improves display effect.But, when increasing LED quantity, due to LED and lens costliness, the significantly rising of complete machine cost therefore can be caused; Adopt the mode increasing light mixing distance then can cause the increase of product thickness, and then affect the aesthetics of machine product profile, and this is the another shortcoming for prior art.
Summary of the invention
The invention provides a kind of LED direct-light-type backlight and luminescent method thereof, it is by significantly reducing the integral thickness of backlight product to the improvement of structure and illumination mode, and this is main purpose of the present invention.
The technical solution used in the present invention is: a kind of LED direct-light-type backlight, it comprises diffuser plate, drain pan and light source cell, wherein, this diffuser plate is connected on this drain pan, and by this diffuser plate and this drain pan around formation one air groove, the medial surface of this diffuser plate forms the end face of this air groove, the medial surface of this drain pan forms the bottom surface of this air groove, this light source cell is arranged in this air groove, when work, this diffuser plate of light therethrough that this light source cell electrified light emitting produces is transmitted in external environment condition, thus formation backlight, this light source cell comprises some illuminators, this illuminator orders some are arranged in this air groove, each this illuminator is horizontally installed in this air groove, angle between the normal luminous intensity direction of each this illuminator and this diffuser plate is in positive and negative 30 degree.
The normal luminous intensity direction of each this illuminator is parallel with this diffuser plate.This light source cell comprises some striations, this striation transverse directions some or longitudinal arrangement are arranged in this air groove, each this striation includes this illuminators some, and this medial surface of this drain pan is fixedly installed fixed strip, and this striations some are erected in this air groove by this fixed strip.This medial surface of this drain pan is provided with reflector, by this reflector as much as possible by light reflection to this diffuser plate direction.
This illuminator is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate is longitudinally plugged on Connection Block, this striation is combined to form by this LED double-side chips some, this transparent heat sink plate and this Connection Block, this transparent heat sink plate longitudinally structure be plugged on Connection Block determines that this illuminator is horizontally installed on the Structure composing mode in this air groove, determines the illumination mode of each this illuminator simultaneously.
This transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin film coating, wherein, this radiation conductive thin film coating is attached on the outer surface of this transparent heat sink substrate, this transparent heat sink substrate is made up of printing opacity heat sink material, this radiation conductive thin film coating is made up of heat conduction and heat radiation conductive material, this radiation conductive thin film coating comprises completely attached part and window part, this full attached part and this window partial separation are arranged, this LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate by this window part.
This transparent heat sink substrate is glass, and this radiation conductive thin film coating is silver slurry, and time this radiation conductive thin film coating is silver slurry, silver slurry layer also possesses the effect of light reflection while radiation conductive.
When this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate is provided with some heat conduction Support Level in this window part, this heat conduction Support Level is identical with the material of this radiation conductive thin film coating, all full with this attached part in both ends of each this heat conduction Support Level is connected, this heat conduction Support Level is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces conducts on this transparent heat sink substrate and this radiation conductive thin film coating by this heat conduction Support Level, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level and be transmitted in external environment condition through after this transparent heat sink substrate.
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached portion top surface of these window part both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part and be transmitted in external environment condition through after this transparent heat sink substrate.
The heat-dissipating luminous structure of a kind of illuminator, this illuminator is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin film coating, wherein, this radiation conductive thin film coating is attached on the outer surface of this transparent heat sink substrate, this transparent heat sink substrate is made up of printing opacity heat sink material, this radiation conductive thin film coating is made up of heat conduction and heat radiation conductive material, this radiation conductive thin film coating comprises completely attached part and window part, this full attached part and this window partial separation are arranged, this LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is by this window part and through being transmitted in external environment condition after this transparent heat sink substrate, this LED double-side chip can be horizontally set on this window part position with formal dress and upside-down mounting two kinds of modes, when this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate is provided with some heat conduction Support Level in this window part, this heat conduction Support Level is identical with the material of this radiation conductive thin film coating, all full with this attached part in both ends of each this heat conduction Support Level is connected, this heat conduction Support Level is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces conducts on this transparent heat sink substrate and this radiation conductive thin film coating by this heat conduction Support Level, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level and be transmitted in external environment condition through after this transparent heat sink substrate.
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached portion top surface of these window part both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part and be transmitted in external environment condition through after this transparent heat sink substrate.
A kind of LED direct-light-type backlight luminescent method, diffuser plate is connected on drain pan, and by this diffuser plate and this drain pan around formation one air groove, the medial surface of this diffuser plate forms the end face of this air groove, the medial surface of this drain pan forms the bottom surface of this air groove, light source cell is arranged in this air groove, when work, this diffuser plate of light therethrough that this light source cell electrified light emitting produces is transmitted in external environment condition, this light source cell comprises some illuminators, this illuminator orders some are arranged in this air groove, each this illuminator is horizontally installed in this air groove, make the normal luminous intensity direction of each this illuminator parallel with this diffuser plate, this light source cell comprises some striations, this striation transverse directions some or longitudinal arrangement are arranged in this air groove, each this striation includes this illuminators some, this medial surface of this drain pan is fixedly installed fixed strip, this striations some are erected in this air groove by this fixed strip, this medial surface of this drain pan is provided with reflector, by this reflector as much as possible by light reflection to this diffuser plate direction.
Beneficial effect of the present invention is: traditional direct-type backlight source technology mainly adopts LED to mount lens as core component, lens are utilized to expand the dispersion angle of LED, traditional back light source luminary is all be horizontally set in air groove, the normal luminous intensity direction of illuminator is general vertical with diffuser plate or close to vertical, and its lighting angle of traditional back light source luminary is generally 120 degree, 140 degree are generally reached after increase lens, the height of air groove is increased and just can strengthen the area that illuminator is irradiated to hot spot on diffuser plate, these some core reasons that also traditional direct-light-type backlight thickness is generally all bigger than normal just, and in the present invention, the normal luminous intensity direction of each this illuminator is arranged parallel with this diffuser plate or close to parallel, so product of the present invention does not need the height increasing this air groove to increase projected area, thus make the integral thickness of backlight product of the present invention can control in very thin scope, thus reduce the gauge of integral product, promote aesthetic.
Accompanying drawing explanation
Fig. 1 is three-dimensional exploded view of the present invention.
Fig. 2 is cross section structure schematic diagram of the present invention.
Fig. 3 is the three-dimensional exploded view of light source cell of the present invention.
Fig. 4 is the three-dimensional exploded view of fixed strip of the present invention and associated components.
Fig. 5 is the structural representation of the positive cartridge chip of the present invention.
Fig. 6 is the structural representation of flip-chip of the present invention.
Fig. 7 is the structural representation that the full attached part of the present invention comprises heat conduction and heat radiation part and conductive radiator part.
Detailed description of the invention
As shown in Figures 1 to 6, a kind of LED direct-light-type backlight, it comprises diffuser plate 10, drain pan 20 and light source cell 30, and wherein, this diffuser plate 10 is connected on this drain pan 20, and by this diffuser plate 10 with this drain pan 20 around formation one air groove 40.
The medial surface 11 of this diffuser plate 10 forms the end face of this air groove 40, and the medial surface 21 of this drain pan 20 forms the bottom surface of this air groove 40.
This light source cell 30 is arranged in this air groove 40.
When work, this diffuser plate 10 of light therethrough that this light source cell 30 electrified light emitting produces is transmitted in external environment condition, thus forms backlight.
When concrete enforcement, connection strap ring is located at this diffuser plate 10 and this drain pan 20 surrounding as required, the edge of this diffuser plate 10 and this drain pan 20 is plugged in this connection strap respectively, thus fixes the relative position between this diffuser plate 10 and this drain pan 20.
When concrete enforcement, the concrete structure of this diffuser plate 10 and this drain pan 20 and material formation belong to prior art and are not repeated here.
This light source cell 30 comprises some illuminators 31, and this illuminator 31 orders some are arranged in this air groove 40.
Each this illuminator 31 is horizontally installed in this air groove 40.
Angle between the normal luminous intensity direction of each this illuminator 31 and this diffuser plate 10 is in positive and negative 30 degree, and wherein, best embodiment is that the normal luminous intensity direction of each this illuminator 31 is parallel with this diffuser plate 10.
Traditional direct-type backlight source technology mainly adopts LED to mount lens as core component, lens are utilized to expand the dispersion angle of LED, traditional back light source luminary is all be horizontally set in air groove, the normal luminous intensity direction of illuminator is general vertical with diffuser plate or close to vertical, and its lighting angle of traditional back light source luminary is generally 120 degree, 140 degree are generally reached after increase lens, the height of air groove is increased and just can strengthen the area that illuminator is irradiated to hot spot on diffuser plate, these some core reasons that also traditional direct-light-type backlight thickness is generally all bigger than normal just.
And in the present invention, the normal luminous intensity direction of each this illuminator 31 is arranged parallel with this diffuser plate 10 or close to parallel, so product of the present invention does not need the height increasing this air groove 40 to increase projected area, thus make the integral thickness of backlight product of the present invention can control in very thin scope, thus reduce the gauge of integral product, promote aesthetic.
When concrete enforcement, this light source cell 30 comprises some striations 32, and this striation 32 transverse directions some or longitudinal arrangement are arranged in this air groove 40.
Each this striation 32 includes this illuminators 31 some.
When concrete enforcement, this medial surface 21 of this drain pan 20 is fixedly installed fixed strip 22, and this striations 32 some are erected in this air groove 40 by this fixed strip 22.
Pre-buried Electrode connection block 23 is provided with, by this pre-buried Electrode connection block 23 for this striation 32 corresponding provides electric power to supply in this fixed strip 22.
The light luminance produced due to these illuminator 31 tow sides can be variant, so two of arbitrary neighborhood these illuminators 31 is towards the opposite.
Conveniently produce, also can design, be positioned at this illuminator 31 on this striation 32 same towards all identical, and two of arbitrary neighborhood these striations 32 is towards the opposite.
When concrete enforcement, this medial surface 21 of this drain pan 20 is provided with reflector 24, by this reflector 24 as much as possible by light reflection to this diffuser plate 10 direction.
When concrete enforcement, best results time this illuminator 31 is LED luminescence chip.
It should be noted that when utilizing technology of the present invention to carry out concrete enforcement, if this illuminator 31 adopts generally traditional LED luminescence chip, Integral luminous effect and operating temperature all can not reach ideal state.
Applicant of the present invention is the technology disclosing a kind of LED light source and manufacture method thereof in PCT/CN2011/000756 at PCT international application no, which describe a kind of LED element, it is luminous by two sides, thus avoid heat accumulation on the faying face and substrate of knot Conventional LED light sources, its LED element is directly connected in a sandwich format with two fluorescent elements, thus forms one or more passway to be reached through the heat trnasfer of this passway guiding LED element by this.Its structure mainly comprises one or more LED light source group, wherein every described LED light source group comprises: at least one LED element, wherein said LED element has one first light-emitting area and one second light-emitting area at reverse side, and wherein said LED element is suitable for often described first light-emitting area and described second light-emitting area provide the illumination being greater than 180 ° of angles by electroluminescent; Two fluorescent elements, described two fluorescent elements lay respectively at described first light-emitting area of described LED element and described second light-emitting area top to keep described LED element in place, thus the illumination that described LED is produced respectively from described light-emitting area through described two fluorescent elements; With an electronic component, described electronic component and described LED element lotus root connect that described LED element is electrically connected on a power supply.Described LED element to be clipped in the middle in sandwich mode by described two fluorescent elements thus to keep described LED element in place, directly press on described fluorescent element to make described first light-emitting area and described second light-emitting area and leave described LED element to be supported and to guide heat trnasfer, and described LED element is maintained in a LED container cavity in space between described fluorescent element.
The technology of PCT/CN2011/000756 is applied to that product of the present invention to have the little illumination effect of volume good, a LED light source can be utilized simultaneously simultaneously luminous to all directions, but when concrete enforcement, because it is just dispelled the heat to LED element by the first light-emitting area and the second light-emitting area, although its thinking is better, but it is undesirable to there is radiating effect when concrete enforcement, heat distributes comparatively slow and causes the overheated situation of LED element.
The present inventor improves its radiating mode in conjunction with the technical characterstic of PCT/CN2011/000756 simultaneously, and be applied in backlight product of the present invention, thus make backlight product of the present invention all reach desirable state at illumination effect or in operating temperature, specifically describe as follows.
This illuminator 31 is LED double-side chip, and this LED double-side chip has upper light-emitting area and lower light-emitting area.This LED double-side chip has six light-emitting areas, and comprise plural layer overlapping and arrangement in an orderly manner, this LED double-side chip sequentially overlapping and arrangement one rigidity and transparent basalis, one luminescent layer and a current spreading layer, the inverted structure of this LED double-side chip, its structure is simple, and can define light-emitting area and this lower light-emitting area on this, and the concrete structure of this LED double-side chip is open in front case PCT/CN2011/000756 to be not repeated here.
This LED double-side chips some are arranged on transparent heat sink plate 100, and this transparent heat sink plate 100 is longitudinally plugged on Connection Block 200.
This striation 32 is combined to form by this LED double-side chips some, this transparent heat sink plate 100 and this Connection Block 200.
This transparent heat sink plate 100 longitudinally structure be plugged on Connection Block 200 determines that this illuminator 31 is horizontally installed on the Structure composing mode in this air groove 40, determines the illumination mode of angle in positive and negative 30 degree between the normal luminous intensity direction of each this illuminator 31 and this diffuser plate 10 simultaneously.
This transparent heat sink plate 100 comprises transparent heat sink substrate 110 and radiation conductive thin film coating 120, and wherein, this radiation conductive thin film coating 120 is attached on the outer surface of this transparent heat sink substrate 110.
This transparent heat sink substrate 110 is made up of printing opacity heat sink material, such as, and glass, sapphire etc.
This radiation conductive thin film coating 120 is made up of heat conduction and heat radiation conductive material, such as, and silver slurry.
In on the outer surface specifically this radiation conductive thin film coating 120 being attached to this transparent heat sink substrate 110, need first corrosion to be carried out to the outer surface of this transparent heat sink substrate 110 coarse, then this radiation conductive thin film coating 120 is adhered to, this mode strong adhesion, product quality is good.
This radiation conductive thin film coating 120 comprises completely attached part 121 and window part 122, and this full attached part 121 and this window part 122 interval are arranged.
This LED double-side chip level is arranged on this window part 122 position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate 110 by this window part 122.
The object arranging this window part 122, also just in order to make full use of the feature of this LED double-side chip double-side luminescence, makes the few to the greatest extent loss of luminous energy.
In addition, the object of this radiation conductive thin film coating 120 being set mainly in order to utilize dispelling the heat for this LED double-side chip of its material behavior maximum possible, farthest reducing its operating temperature.
When this transparent heat sink substrate 110 is glass, time this radiation conductive thin film coating 120 is silver slurry, preferred thickness is, glassy layer 0. 6 millimeters thick, silver slurry layer ten micron thickness.
In addition, this radiation conductive thin film coating 120 be silver slurry time, silver slurry layer also possess while radiation conductive light reflection effect, thus as much as possible by light reflection to this diffuser plate 10 direction.
As shown in Figure 7, when concrete enforcement, this full attached part 121 comprises heat conduction and heat radiation part 124 and conductive radiator part 125.
This heat conduction and heat radiation part 124 and this conductive radiator part 125 are attached on the outer surface of this transparent heat sink substrate 110 simultaneously.
Wherein, this heat conduction and heat radiation part 124 offers some through holes 126, this transparent heat sink substrate 110 is connected with external environment condition by this through holes 126 some, this transparent heat sink substrate 110 can be made to distribute heat to efficiently in external environment condition by this through hole 126.
This conductive radiator part 125 is separated with this heat conduction and heat radiation part 124, this conductive radiator part 125 is arranged between this illuminator 31, the electric connection line of this adjacent illuminator 31 is electrically connected with this conductive radiator part 125 respectively, thus makes this illuminators 31 some formation be connected in series relation.
When concrete enforcement, this radiation conductive thin film coating 120 can also apply high-heating radiation material, thus promote its radiating effect further.
In addition as shown in Figure 7, this kind of structure, when not needing to add radiator in addition, may be used for the module of various light fixture.
This LED double-side chip can be horizontally set on this window part 122 position with formal dress and upside-down mounting two kinds of modes.
When this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate 110 is provided with some heat conduction Support Level 123 in this window part 122, and this heat conduction Support Level 123 is identical with the material of this radiation conductive thin film coating 120.
All full with this attached part 121 in both ends of each this heat conduction Support Level 123 is connected.
This heat conduction Support Level 123 is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces is conducted on this transparent heat sink substrate 110 and this radiation conductive thin film coating 120 by this heat conduction Support Level 123, and synchronously dispels the heat.
The light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level 123 and be transmitted in external environment condition through after this transparent heat sink substrate 110.
The width of this heat conduction Support Level 123 preferably five microns.
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached part 121 end face of these window part 122 both sides.
The heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate 110, and synchronously dispels the heat.
The light that the bottom surface of this LED double-side chip sends is by this window part 122 and be transmitted in external environment condition through after this transparent heat sink substrate 110.
Finally it is emphasized that, back light source technique of the present invention can be applied in field quite widely, such as when above this diffuser plate 10, liquid crystal display is set time, the present invention can as the backlight of liquid crystal display, and backlight product of the present invention directly can be used as the lamp use of LED face in time not adding any other structure, like thisly do not enumerate here, in addition, when power increase, silver-plated aspect needs can weld during external heat radiation.
As shown in Figures 1 to 6, a kind of LED direct-light-type backlight luminescent method, diffuser plate 10 is connected on drain pan 20, and by this diffuser plate 10 with this drain pan 20 around formation one air groove 40, the medial surface 11 of this diffuser plate 10 forms the end face of this air groove 40, the medial surface 21 of this drain pan 20 forms the bottom surface of this air groove 40, is arranged on by light source cell 30 in this air groove 40.
When work, this diffuser plate 10 of light therethrough that this light source cell 30 electrified light emitting produces is transmitted in external environment condition, thus forms backlight.
This light source cell 30 comprises some illuminators 31, and this illuminator 31 orders some are arranged in this air groove 40.
Each this illuminator 31 is horizontally installed in this air groove 40.
Make the angle between the normal luminous intensity direction of each this illuminator 31 and this diffuser plate 10 in positive and negative 30 degree, wherein, best embodiment is make the normal luminous intensity direction of each this illuminator 31 parallel with this diffuser plate 10.
When concrete enforcement, this light source cell 30 comprises some striations 32, and this striation 32 transverse directions some or longitudinal arrangement are arranged in this air groove 40.
Each this striation 32 includes this illuminators 31 some.
When concrete enforcement, this medial surface 21 of this drain pan 20 is fixedly installed fixed strip 22, and this striations 32 some are erected in this air groove 40 by this fixed strip 22.
Pre-buried Electrode connection block 23 is provided with, by this pre-buried Electrode connection block 23 for this striation 32 corresponding provides electric power to supply in this fixed strip 22.
The light luminance produced due to these illuminator 31 tow sides can be variant, so two of arbitrary neighborhood these illuminators 31 is towards the opposite.
Conveniently produce, also can design, be positioned at this illuminator 31 on this striation 32 same towards all identical, and two of arbitrary neighborhood these striations 32 is towards the opposite.
When concrete enforcement, this medial surface 21 of this drain pan 20 is provided with reflector 24, by this reflector 24 as much as possible by light reflection to this diffuser plate 10 direction.
This illuminator 31 is LED double-side chip, and this LED double-side chip has upper light-emitting area and lower light-emitting area.This LED double-side chip has six light-emitting areas, and comprise plural layer overlapping and arrangement in an orderly manner, this LED double-side chip sequentially overlapping and arrangement one rigidity and transparent basalis, one luminescent layer and a current spreading layer, the inverted structure of this LED double-side chip, its structure is simple, and can define light-emitting area and this lower light-emitting area on this, and the concrete structure of this LED double-side chip is open in front case PCT/CN2011/000756 to be not repeated here.
This LED double-side chips some are arranged on transparent heat sink plate 100, and this transparent heat sink plate 100 is longitudinally plugged on Connection Block 200, is combined to form this striation 32 by this LED double-side chips some, this transparent heat sink plate 100 and this Connection Block 200.
This transparent heat sink plate 100 longitudinally structure be plugged on Connection Block 200 determines that this illuminator 31 is horizontally installed on the Structure composing mode in this air groove 40, determines the illumination mode of angle in positive and negative 30 degree between the normal luminous intensity direction of each this illuminator 31 and this diffuser plate 10 simultaneously.
This transparent heat sink plate 100 comprises transparent heat sink substrate 110 and radiation conductive thin film coating 120, and wherein, this radiation conductive thin film coating 120 is attached on the outer surface of this transparent heat sink substrate 110.
This transparent heat sink substrate 110 is made up of printing opacity heat sink material, such as, and glass, sapphire etc.
This radiation conductive thin film coating 120 is made up of heat conduction and heat radiation conductive material, such as, and silver slurry.
In on the outer surface specifically this radiation conductive thin film coating 120 being attached to this transparent heat sink substrate 110, need first corrosion to be carried out to the outer surface of this transparent heat sink substrate 110 coarse, then this radiation conductive thin film coating 120 is adhered to, this mode strong adhesion, product quality is good.
This radiation conductive thin film coating 120 comprises completely attached part 121 and window part 122, and this full attached part 121 and this window part 122 interval are arranged.
This LED double-side chip level is arranged on this window part 122 position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate 110 by this window part 122.
The object arranging this window part 122, also just in order to make full use of the feature of this LED double-side chip double-side luminescence, makes the few to the greatest extent loss of luminous energy.
In addition, the object of this radiation conductive thin film coating 120 being set mainly in order to utilize dispelling the heat for this LED double-side chip of its material behavior maximum possible, farthest reducing its operating temperature.
When this transparent heat sink substrate 110 is glass, time this radiation conductive thin film coating 120 is silver slurry, preferred thickness is, glassy layer 0. 6 millimeters thick, silver slurry layer ten micron thickness.
In addition, this radiation conductive thin film coating 120 be silver slurry time, silver slurry layer also possess while radiation conductive light reflection effect, thus as much as possible by light reflection to this diffuser plate 10 direction.
This LED double-side chip can be horizontally set on this window part 122 position with formal dress and upside-down mounting two kinds of modes.
When this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate 110 is provided with some heat conduction Support Level 123 in this window part 122, and this heat conduction Support Level 123 is identical with the material of this radiation conductive thin film coating 120.
All full with this attached part 121 in both ends of each this heat conduction Support Level 123 is connected.
This heat conduction Support Level 123 is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces is conducted on this transparent heat sink substrate 110 and this radiation conductive thin film coating 120 by this heat conduction Support Level 123, and synchronously dispels the heat.
The light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level 123 and be transmitted in external environment condition through after this transparent heat sink substrate 110.
The width of this heat conduction Support Level 123 preferably five microns.
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached part 121 end face of these window part 122 both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate 110, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part 122 and be transmitted in external environment condition through after this transparent heat sink substrate 110.

Claims (13)

1. a LED direct-light-type backlight, it comprises diffuser plate, drain pan and light source cell, wherein, this diffuser plate is connected on this drain pan, and by this diffuser plate and this drain pan around formation one air groove, the medial surface of this diffuser plate forms the end face of this air groove, the medial surface of this drain pan forms the bottom surface of this air groove, this light source cell is arranged in this air groove, when work, this diffuser plate of light therethrough that this light source cell electrified light emitting produces is transmitted in external environment condition, thus forms backlight
It is characterized in that: this light source cell comprises some illuminators, this illuminator orders some are arranged in this air groove, each this illuminator is horizontally installed in this air groove, and the angle between the normal luminous intensity direction of each this illuminator and this diffuser plate is in positive and negative 30 degree.
2. a kind of LED direct-light-type backlight as claimed in claim 1, is characterized in that: the normal luminous intensity direction of each this illuminator is parallel with this diffuser plate.
3. a kind of LED direct-light-type backlight as claimed in claim 1 or 2, it is characterized in that: this light source cell comprises some striations, this striation transverse directions some or longitudinal arrangement are arranged in this air groove, each this striation includes this illuminators some, this medial surface of this drain pan is fixedly installed fixed strip, and this striations some are erected in this air groove by this fixed strip.
4. a kind of LED direct-light-type backlight as claimed in claim 3, is characterized in that: on this medial surface of this drain pan, be provided with reflector, by this reflector as much as possible by light reflection to this diffuser plate direction.
5. a kind of LED direct-light-type backlight as claimed in claim 3, it is characterized in that: this illuminator is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate is longitudinally plugged on Connection Block, this striation is combined to form by this LED double-side chips some, this transparent heat sink plate and this Connection Block, this transparent heat sink plate longitudinally structure be plugged on Connection Block determines that this illuminator is horizontally installed on the Structure composing mode in this air groove, determines the illumination mode of each this illuminator simultaneously.
6. a kind of LED direct-light-type backlight as claimed in claim 5, it is characterized in that: this transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin film coating, wherein, this radiation conductive thin film coating is attached on the outer surface of this transparent heat sink substrate, this transparent heat sink substrate is made up of printing opacity heat sink material, this radiation conductive thin film coating is made up of heat conduction and heat radiation conductive material, this radiation conductive thin film coating comprises completely attached part and window part, this full attached part and this window partial separation are arranged
This LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is transmitted in external environment condition through after this transparent heat sink substrate by this window part.
7. a kind of LED direct-light-type backlight as claimed in claim 6, it is characterized in that: this transparent heat sink substrate is glass, this radiation conductive thin film coating is silver slurry, and time this radiation conductive thin film coating is silver slurry, silver slurry layer also possesses the effect of light reflection while radiation conductive.
8. a kind of LED direct-light-type backlight as claimed in claim 6, it is characterized in that: when this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate is provided with some heat conduction Support Level in this window part, this heat conduction Support Level is identical with the material of this radiation conductive thin film coating, all full with this attached part in both ends of each this heat conduction Support Level is connected, this heat conduction Support Level is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces conducts on this transparent heat sink substrate and this radiation conductive thin film coating by this heat conduction Support Level, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level and be transmitted in external environment condition through after this transparent heat sink substrate.
9. a kind of LED direct-light-type backlight as claimed in claim 6, it is characterized in that: when this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached portion top surface of these window part both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part and be transmitted in external environment condition through after this transparent heat sink substrate.
10. the heat-dissipating luminous structure of illuminator, it is characterized in that: this illuminator is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin film coating, wherein, this radiation conductive thin film coating is attached on the outer surface of this transparent heat sink substrate, this transparent heat sink substrate is made up of printing opacity heat sink material, this radiation conductive thin film coating is made up of heat conduction and heat radiation conductive material, this radiation conductive thin film coating comprises completely attached part and window part, this full attached part and this window partial separation are arranged, this LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is by this window part and through being transmitted in external environment condition after this transparent heat sink substrate,
This LED double-side chip can be horizontally set on this window part position with formal dress and upside-down mounting two kinds of modes, when this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate is provided with some heat conduction Support Level in this window part, this heat conduction Support Level is identical with the material of this radiation conductive thin film coating, all full with this attached part in both ends of each this heat conduction Support Level is connected, this heat conduction Support Level is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces conducts on this transparent heat sink substrate and this radiation conductive thin film coating by this heat conduction Support Level, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level and through being transmitted in external environment condition after this transparent heat sink substrate,
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached portion top surface of these window part both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part and be transmitted in external environment condition through after this transparent heat sink substrate.
11. 1 kinds of LED direct-light-type backlight luminescent methods, it is characterized in that: diffuser plate is connected on drain pan, and by this diffuser plate and this drain pan around formation one air groove, the medial surface of this diffuser plate forms the end face of this air groove, the medial surface of this drain pan forms the bottom surface of this air groove, is arranged on by light source cell in this air groove, when work, this diffuser plate of light therethrough that this light source cell electrified light emitting produces is transmitted in external environment condition
This light source cell comprises some illuminators, this illuminator orders some are arranged in this air groove, each this illuminator is horizontally installed in this air groove, make the normal luminous intensity direction of each this illuminator parallel with this diffuser plate, this light source cell comprises some striations, this striation transverse directions some or longitudinal arrangement are arranged in this air groove, each this striation includes this illuminators some, this medial surface of this drain pan is fixedly installed fixed strip, this striations some are erected in this air groove by this fixed strip, this medial surface of this drain pan is provided with reflector, by this reflector as much as possible by light reflection to this diffuser plate direction.
12. a kind of LED direct-light-type backlight luminescent methods as claimed in claim 11, it is characterized in that: this illuminator is LED double-side chip, this LED double-side chips some are arranged on transparent heat sink plate, this transparent heat sink plate is longitudinally plugged on Connection Block, by this LED double-side chips some, this transparent heat sink plate and this Connection Block are combined to form this striation, this transparent heat sink plate longitudinally structure be plugged on Connection Block determines that this illuminator is horizontally installed on the Structure composing mode in this air groove, determine the illumination mode of each this illuminator simultaneously, this transparent heat sink plate comprises transparent heat sink substrate and radiation conductive thin film coating, wherein, this radiation conductive thin film coating is attached on the outer surface of this transparent heat sink substrate, this transparent heat sink substrate is made up of printing opacity heat sink material, this radiation conductive thin film coating is made up of heat conduction and heat radiation conductive material, this radiation conductive thin film coating comprises completely attached part and window part, this full attached part and this window partial separation are arranged, this LED double-side chip level is arranged on this window part position, this moment, the light that this LED double-side chip lateral surface produces is transmitted directly in external environment condition, and the light that this LED double-side chip medial surface produces is by this window part and through being transmitted in external environment condition after this transparent heat sink substrate,
This LED double-side chip can be horizontally set on this window part position with formal dress and upside-down mounting two kinds of modes, when this LED double-side chip of formal dress, the outer surface of this transparent heat sink substrate is provided with some heat conduction Support Level in this window part, this heat conduction Support Level is identical with the material of this radiation conductive thin film coating, all full with this attached part in both ends of each this heat conduction Support Level is connected, this heat conduction Support Level is erected on the bottom surface of this LED double-side chip, the heat that this LED double-side chip operation produces conducts on this transparent heat sink substrate and this radiation conductive thin film coating by this heat conduction Support Level, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by the gap between some these heat conduction Support Level and through being transmitted in external environment condition after this transparent heat sink substrate,
When this LED double-side chip of upside-down mounting, the electrode of the both sides, bottom surface of this LED double-side chip is set up and is connected electrically on this full attached portion top surface of these window part both sides, the heat that this LED double-side chip operation produces is directly conducted on this transparent heat sink substrate, and synchronously dispel the heat, the light that the bottom surface of this LED double-side chip sends is by this window part and be transmitted in external environment condition through after this transparent heat sink substrate.
13. a kind of LED direct-light-type backlights as claimed in claim 6, it is characterized in that: this full attached part comprises heat conduction and heat radiation part and conductive radiator part, this heat conduction and heat radiation part and this conductive radiator part are attached on the outer surface of this transparent heat sink substrate simultaneously, wherein, this heat conduction and heat radiation part offers some through holes, this transparent heat sink substrate is connected with external environment condition by this through holes some, this transparent heat sink substrate can be made to distribute heat to efficiently in external environment condition by this through hole, this conductive radiator part and this heat conduction and heat radiation part are separated, this conductive radiator part is arranged between this illuminator, the electric connection line of this adjacent illuminator is electrically connected with this conductive radiator part respectively, thus make this illuminators some formation be connected in series relation.
CN201410422541.3A 2014-08-26 2014-08-26 A kind of LED direct-light-type backlights and its luminescent method Expired - Fee Related CN105371161B (en)

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PCT/CN2015/087463 WO2016029809A1 (en) 2014-08-26 2015-08-18 Led direct-lit backlight source and light emission method therefor

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105444036A (en) * 2014-08-26 2016-03-30 蔡鸿 Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof
CN109031773A (en) * 2017-06-09 2018-12-18 群创光电股份有限公司 Display device
CN109869647A (en) * 2019-03-05 2019-06-11 东莞中之光电股份有限公司 A kind of LED lamp bead of double-side

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070189032A1 (en) * 2006-02-10 2007-08-16 Hon Hai Precision Industry Co., Ltd. Backlight system
CN201606739U (en) * 2009-11-11 2010-10-13 康佳集团股份有限公司 LED backlight module
CN202327686U (en) * 2011-04-26 2012-07-11 蔡州 Light-emitting diode (LED) light source
US20130020600A1 (en) * 2011-07-21 2013-01-24 Samsung Electronics Co., Ltd. Light emitting diode package
CN102927483A (en) * 2012-11-20 2013-02-13 田茂福 Integrated flip type LED illuminating assembly
CN103925581A (en) * 2013-10-29 2014-07-16 蔡鸿 LED lamp heat dissipation structure
CN204062597U (en) * 2014-08-26 2014-12-31 蔡鸿 The luminous radiator structure of a kind of LED light source
CN204300813U (en) * 2014-08-26 2015-04-29 蔡鸿 A kind of LED direct-light-type backlight
CN105444036A (en) * 2014-08-26 2016-03-30 蔡鸿 Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200811543A (en) * 2006-08-31 2008-03-01 K Bridge Electronics Co Ltd Light source application efficiency improving device
CN201413835Y (en) * 2009-06-01 2010-02-24 北京众智同辉科技有限公司 LED cluster embedding structure
US20110038141A1 (en) * 2009-08-11 2011-02-17 Martin David Tillin Lateral emission led backlight for lcd
CN201851960U (en) * 2010-02-26 2011-06-01 金芃 Thin type straightly-downward LED (light-emitting diode) backlight module
CN101846256A (en) * 2010-05-04 2010-09-29 蔡州 Led light source
KR101719693B1 (en) * 2010-05-11 2017-03-27 삼성디스플레이 주식회사 Light emitting diode package and display apparatus having the same
CN102155695B (en) * 2011-04-21 2014-12-03 中山大学 Light source structure of backlight source and direct downward and side inlet backlight source structures thereof
TW201431042A (en) * 2013-01-25 2014-08-01 Xu-Wen Liao Double-sided light emitting type LED lamp panel structure
CN103824927B (en) * 2014-03-12 2016-08-17 亚浦耳照明股份有限公司 A kind of LED chip packaging body and preparation method thereof
CN204062595U (en) * 2014-08-26 2014-12-31 蔡鸿 A kind of LED lamp

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070189032A1 (en) * 2006-02-10 2007-08-16 Hon Hai Precision Industry Co., Ltd. Backlight system
CN201606739U (en) * 2009-11-11 2010-10-13 康佳集团股份有限公司 LED backlight module
CN202327686U (en) * 2011-04-26 2012-07-11 蔡州 Light-emitting diode (LED) light source
US20130020600A1 (en) * 2011-07-21 2013-01-24 Samsung Electronics Co., Ltd. Light emitting diode package
CN102927483A (en) * 2012-11-20 2013-02-13 田茂福 Integrated flip type LED illuminating assembly
CN103925581A (en) * 2013-10-29 2014-07-16 蔡鸿 LED lamp heat dissipation structure
CN204062597U (en) * 2014-08-26 2014-12-31 蔡鸿 The luminous radiator structure of a kind of LED light source
CN204300813U (en) * 2014-08-26 2015-04-29 蔡鸿 A kind of LED direct-light-type backlight
CN105444036A (en) * 2014-08-26 2016-03-30 蔡鸿 Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105444036A (en) * 2014-08-26 2016-03-30 蔡鸿 Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof
CN105444036B (en) * 2014-08-26 2017-03-22 蔡鸿 Light-emitting diode (LED) light source light-emitting and heat-dissipating structure
CN109031773A (en) * 2017-06-09 2018-12-18 群创光电股份有限公司 Display device
CN109869647A (en) * 2019-03-05 2019-06-11 东莞中之光电股份有限公司 A kind of LED lamp bead of double-side

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