CN105371161B - A kind of LED direct-light-type backlights and its luminescent method - Google Patents
A kind of LED direct-light-type backlights and its luminescent method Download PDFInfo
- Publication number
- CN105371161B CN105371161B CN201410422541.3A CN201410422541A CN105371161B CN 105371161 B CN105371161 B CN 105371161B CN 201410422541 A CN201410422541 A CN 201410422541A CN 105371161 B CN105371161 B CN 105371161B
- Authority
- CN
- China
- Prior art keywords
- light
- heat sink
- led
- air groove
- transparent heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 65
- 230000005855 radiation Effects 0.000 claims description 60
- 238000009501 film coating Methods 0.000 claims description 44
- 239000010409 thin film Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 230000000694 effects Effects 0.000 claims description 15
- 238000005286 illumination Methods 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 210000004209 hair Anatomy 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 13
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 238000004020 luminiscence type Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000007888 film coating Substances 0.000 description 4
- -1 for example Substances 0.000 description 4
- 239000008358 core component Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- H01L33/00—
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
Abstract
The present invention relates to a kind of LED direct-light-type backlights and its luminescent methods, its structure includes diffuser plate, bottom case and light source unit, wherein, the diffuser plate is connected on the bottom case, and it is surrounded by the diffuser plate and the bottom case and forms an air groove, the medial surface of the diffuser plate forms the top surface of the air groove, the medial surface of the bottom case forms the bottom surface of the air groove, the light source unit is arranged in the air groove, at work, light caused by the light source unit electrified light emitting is transmitted to through the diffuser plate in external environment, to form backlight, the light source unit includes several illuminators, several illuminators, which are ranked sequentially, to be arranged in the air groove, each illuminator is horizontally installed in the air groove.
Description
Technical field
The present invention relates to a kind of structure of backlight and its luminescent method, particularly relate to it is a kind of using LED as light source it is straight under
Formula backlight and its luminescent method.
Background technology
It is well known that in the electronics industry, backlight is a kind of form of illumination, is commonly used for LCD and shows.Backlight type and
Preceding smooth formula is the difference is that backlight is from side or irradiation behind, and preceding light is then irradiated from the front as its name suggests.Their quilts
It is similar to be shown with CRT for increasing the brightness in illuminance and computer monitor, liquid crystal screen display in low lighting environment
Mode generates light extraction.Its light source of led backlights can be incandescent lamp bulb, electrooptic panel (ELP), light emitting diode (LED), cold the moon
Pole pipe (CCFL) etc..Electrooptic panel provides the uniform light of whole surface, and other backlight modules then use diffuser from unevenness
Uniform light is provided in even light source.Backlight can be any type color, and single color LCD usually has yellow, green, blue, white etc.
Backlight.And colored display uses white white light, because it covers most coloured light.
LED backlight is used in small and exquisite LCD panel.His light is typically coloured, although white backlight has been cured
Come more universal.Electrooptic panel is often employed in large-scale display, and at this moment uniform backlight is critically important.Electrooptic panel needs
It to be driven via the alternating current of high pressure, this is partly provided by inverted rectifier circuit.It seems computer that cold-cathode tube, which is used in,
It is typically white in color, this is equally also required to inverted rectifier and diffuser on display.It is aobvious that LED backlight can promote LCD
The color representation shown.LED light is come out via produced by three other LED, and the LCD picture points colour filter itself that quite coincide is provided
Color spectrum.
It is the simplest with the technique of direct-light-type backlight in the classification of LED backlight, do not need light guide plate, LED gusts
Row are placed in lamp box bottom, and the light sent out from LED is equal by bottom surface and offside reflection, then by the diffuser plate and optics module on surface
Even injection.The thickness of direct-light-type backlight is determined that usual thickness is thicker by the distance of lamp box bottom and scatter plate, the light of backlight
Uniformity is better.In the case where backlight is relatively thin, color and brightness uniformity are just closed at the technology of direct-light-type backlight
Key.But it is adjusted that the technical costs paid required for it is very high, and there is presently no appearance to the uniformity of color and brightness
The thicker the relevant technologies of direct-light-type backlight thickness are solved by changing light source luminescent, arrangement mode, and this is for existing skill
The major defect of art.
In addition in field of liquid crystal display, existing liquid crystal display product mainly uses direct LED backlight technology or side
Enter formula LED backlight technology to illuminate liquid crystal display panel, to realize the display of picture.Currently, direct LED backlight technology
Mainly expand the dispersion angle of LED using lens, using between LED and diffuser plate as core component using LED attachment lens
The air groove of formation provides light mixing distance for LED light, and then LED light is made to reach diffuser plate again after mixing, passes through diffuser plate
After doing further DIFFUSION TREATMENT to LED light, it is evenly radiated on entire liquid crystal display panel.
Using the liquid crystal product of this direct LED backlight Technology design, between the LED quantity used is more and LED
Away from smaller, the mixed effect of light is better；Meanwhile light mixing distance is bigger, the mixed effect of light is also better.Therefore, current main
LED light is enable equably to improve the mixed effect of light using the quantity or increase light mixing distance two ways that increase LED
It illuminates on liquid crystal display panel, improves display effect.But when increasing LED quantity, since LED and lens are expensive, it can lead
Cause being sharply increased for complete machine cost；And can then lead to the increase of product thickness by the way of increasing light mixing distance, and then influence
The aesthetics of machine product shape, and this is the another disadvantage for the prior art.
Invention content
The present invention provides a kind of LED direct-light-type backlights and its luminescent method, by structure and illumination mode
The integral thickness that can significantly reduce backlight product is improved, and this is the main object of the present invention.
The technical solution used in the present invention is：A kind of LED direct-light-type backlights comprising diffuser plate, bottom case and light
Source unit, wherein the diffuser plate is connected on the bottom case, and by the diffuser plate and the bottom case around an air groove is formed, should
The medial surface of diffuser plate forms the top surface of the air groove, and the medial surface of the bottom case forms the bottom surface of the air groove, the light source unit
It is arranged in the air groove, at work, light caused by the light source unit electrified light emitting is transmitted through the diffuser plate
Into external environment, to form backlight, which includes several illuminators, and several illuminators are ranked sequentially setting
In the air groove, each illuminator is horizontally installed in the air groove, the normal luminous intensity side of each illuminator
To the angle between the diffuser plate in positive and negative 30 degree.
The normal luminous intensity direction of each illuminator is parallel with the diffuser plate.The light source unit includes several striations,
Several striations are transversely or longitudinally arranged in the air groove, each striation includes several illuminators,
Fixed strip is fixedly installed on the medial surface of the bottom case, several striations are erected at the air groove by the fixed strip
In.It is provided with reflector on the medial surface of the bottom case, light is as much as possible reflected into the diffusion by the reflector
Plate direction.
The illuminator is LED double-side chips, and several LED double-side chips are arranged on transparent heat sink plate, should
Transparent heat sink plate is longitudinally plugged on connecting seat, by several LED double-sides chips, the transparent heat sink plate and the connection
Seat combination forms the striation, and the structure determination which is longitudinally plugged on connecting seat goes out the illuminator and laterally sets
The structure constituted mode in the air groove is set, while determining the illumination mode of each illuminator.
The transparent heat sink plate includes transparent heat sink substrate and radiation conductive thin film coating, wherein the radiation conductive film
Coating is attached on the outer surface of the transparent heat sink substrate, which is made of light transmission heat sink material, which leads
Conductive film coating is made of heat conduction and heat radiation conductive material, which includes full attached part and window portion,
The full attached part and window portion interval setting, the LED double-side chip levels are arranged at the window portion position,
This moment, light caused by the LED double-side chip lateral surfaces is transmitted directly in external environment, and the LED double-sides
Light caused by chip medial surface is transmitted to by the window portion and after penetrating the transparent heat sink substrate in external environment.
The transparent heat sink substrate is glass, which is silver paste, which is silver
When slurry, silver slurry layer also has the effect of light reflection while radiation conductive.
When the formal dress LED double-side chips, on the outer surface of the transparent heat sink substrate and in the window
Several heat conduction support lines are provided in part, which supports the material identical of line and the radiation conductive thin film coating, each
The both ends of item heat conduction support line are all connected with the full attached part, which is located at the LED double-side cores
On the bottom surface of piece, heat caused by the LED double-side chip operations supports line to conduct to the transparent heat sink by the heat conduction
On substrate and the radiation conductive thin film coating, and synchronizes and radiate, the light that the bottom surfaces of the LED double-side chips is sent out
Line is transmitted to by the gap between several heat conduction support lines and after penetrating the transparent heat sink substrate in external environment.
When the upside-down mounting LED double-side chips, the electrode of the bottom surface both side of the LED double-side chips sets up electricity
It is connected on the full attached portion top surface of the window portion both sides, heat is direct caused by the LED double-side chip operations
It on conduction to the transparent heat sink substrate, and synchronizes and radiates, the light that the bottom surface of the LED double-side chips is sent out passes through
The window portion and through being transmitted in external environment after the transparent heat sink substrate.
A kind of heat-dissipating luminous structure of illuminator, the illuminator are LED double-side chips, several LED double-side cores
Piece is arranged on transparent heat sink plate, which includes transparent heat sink substrate and radiation conductive thin film coating, wherein should
Radiation conductive thin film coating is attached on the outer surface of the transparent heat sink substrate, and the transparent heat sink substrate is by light transmission heat sink material system
At, which is made of heat conduction and heat radiation conductive material, the radiation conductive thin film coating include full attached part with
And window portion, the full attached part and window portion interval setting, the LED double-side chip levels are arranged in the window
At portion, this moment, light is transmitted directly in external environment caused by the LED double-side chip lateral surfaces, and is somebody's turn to do
Light caused by LED double-side chip medial surfaces is by the window portion and outer through being transmitted to after the transparent heat sink substrate
In portion's environment, which can be horizontally set on the window portion position with formal dress and upside-down mounting two ways
Place, when the formal dress LED double-side chips, on the outer surface of the transparent heat sink substrate and in the window portion
Be provided with several heat conduction support lines, which supports the material identical of line and the radiation conductive thin film coating, each this lead
The both ends of heat support line are all connected with the full attached part, which is located at the bottom of the LED double-side chips
On face, heat caused by the LED double-side chip operations by the heat conduction support line conduct to the transparent heat sink substrate with
And on the radiation conductive thin film coating, and synchronize and radiate, the light that the bottom surface of the LED double-side chips is sent out passes through
Several heat conduction support the gap between lines and are transmitted in external environment after penetrating the transparent heat sink substrate.
When the upside-down mounting LED double-side chips, the electrode of the bottom surface both side of the LED double-side chips sets up electricity
It is connected on the full attached portion top surface of the window portion both sides, heat is direct caused by the LED double-side chip operations
It on conduction to the transparent heat sink substrate, and synchronizes and radiates, the light that the bottom surface of the LED double-side chips is sent out passes through
The window portion and through being transmitted in external environment after the transparent heat sink substrate.
A kind of LED direct-light-type backlights luminescent method, diffuser plate is connected on bottom case, and by the diffuser plate and the bottom
Shell is around an air groove is formed, and the medial surface of the diffuser plate forms the top surface of the air groove, and the medial surface of the bottom case forms the sky
The bottom surface of air drain light source unit is arranged in the air groove, at work, caused by the light source unit electrified light emitting
Light is transmitted to through the diffuser plate in external environment, which includes several illuminators, and several illuminator sequences are arranged
Row are arranged in the air groove, each illuminator is horizontally installed in the air groove, makes the method for each illuminator
All parallel with the diffuser plate to light intensity direction, which includes several striations, and several striations transversely or longitudinally arrange
It is arranged in the air groove, each striation includes several illuminators, fixed on the medial surface of the bottom case to set
It is equipped with fixed strip, several striations are erected at by the fixed strip in the air groove, are arranged on the medial surface of the bottom case
There is reflector, light is as much as possible reflected into the diffuser plate direction by the reflector.
Beneficial effects of the present invention are：Traditional direct-type backlight source technology mainly uses LED to mount lens as core
Component expands the dispersion angle of LED using lens, and traditional back light source luminary is horizontally set in air groove, shines
The normal luminous intensity direction of body is generally vertical with diffuser plate or close to vertical, and traditional back light source luminary its light emitting angle
Generally 120 degree, as soon as commonly reaching 140 degree after increasing lens, the height increase of air groove can be increased
Illuminator is irradiated to the area of hot spot on diffuser plate, this point also universal core all bigger than normal of exactly traditional direct-light-type backlight thickness
Reason, and in the present invention by be arranged parallel with the diffuser plate of the normal luminous intensity direction of each illuminator or close to
It is parallel, so the product of the present invention need not increase the height of the air groove to increase projected area, to make the back of the body of the present invention
The integral thickness of light source product can control in very thin range, to reduce the thickness of integral product, promote beautiful effect
Fruit.
Description of the drawings
Fig. 1 is the stereogram exploded view of the present invention.
Fig. 2 is the cross section structure schematic diagram of the present invention.
Fig. 3 is the stereogram exploded view of light source unit of the present invention.
Fig. 4 is the stereogram exploded view of fixed strip of the present invention and associated components.
Fig. 5 is the structural schematic diagram of the positive cartridge chip of the present invention.
Fig. 6 is the structural schematic diagram of flip-chip of the present invention.
Fig. 7 is the structural schematic diagram that the full attached part of the present invention includes heat conduction and heat radiation part and conductive radiator part.
Specific implementation mode
As shown in Figures 1 to 6, a kind of LED direct-light-type backlights comprising diffuser plate 10, bottom case 20 and light source unit 30,
Wherein, which is connected on the bottom case 20, and by the diffuser plate 10 and the bottom case 20 around one air groove 40 of formation.
The medial surface 11 of the diffuser plate 10 forms the top surface of the air groove 40, and the medial surface 21 of the bottom case 20 forms the air
The bottom surface of slot 40.
The light source unit 30 is arranged in the air groove 40.
At work, light caused by 30 electrified light emitting of light source unit is transmitted to outside through the diffuser plate 10
In environment, to form backlight.
When specific implementation, connection strap ring is located at the diffuser plate 10 and 20 surrounding of bottom case as needed, it should
The edge of diffuser plate 10 and the bottom case 20 is plugged in respectively in the connection strap, to fix the diffuser plate 10 and the bottom case 20 it
Between relative position.
When specific implementation, specific configuration and the material composition of the diffuser plate 10 and the bottom case 20 belong to existing
Technology is described again here.
The light source unit 30 includes several illuminators 31, and several illuminators 31, which are ranked sequentially, to be arranged in the air groove 40
In.
Each illuminator 31 is horizontally installed in the air groove 40.
Angle between the normal luminous intensity direction of each illuminator 31 and the diffuser plate 10 in positive and negative 30 degree,
In, best embodiment is that the normal luminous intensity direction of each illuminator 31 is parallel with the diffuser plate 10.
Traditional direct-type backlight source technology mainly uses LED attachment lens as core component, expands LED using lens
Dispersion angle, traditional back light source luminary is horizontally set in air groove, and the normal luminous intensity direction of illuminator is general
It is vertical with diffuser plate or close to vertical, and traditional back light source luminary its light emitting angle is generally 120 degree,
As soon as commonly reaching 140 degree after increasing lens, the height increase of air groove, which can be increased illuminator, to be irradiated on diffuser plate
The area of hot spot, this point also universal core reasons all bigger than normal of exactly traditional direct-light-type backlight thickness.
And the normal luminous intensity direction of each illuminator 31 is arranged in the present invention parallel with the diffuser plate 10 or
Person is close to parallel, so the product of the present invention need not increase the height of the air groove 40 to increase projected area, to make
The integral thickness of the backlight product of the present invention can control in very thin range, to reduce the thickness of integral product,
Promote aesthetic effect.
When specific implementation, which includes several striations 32, and several striations 32 are transversely or longitudinally
It is arranged in the air groove 40.
Each striation 32 includes several illuminators 31.
When specific implementation, fixed strip 22, several light are fixedly installed on the medial surface 21 of the bottom case 20
Item 32 is erected at by the fixed strip 22 in the air groove 40.
It is provided with pre-buried electrode link block 23 in the fixed strip 22, is the corresponding light by the pre-buried electrode link block 23
Item 32 provides power supply.
Since light luminance caused by 31 tow sides of illuminator can be variant, so two of the arbitrary neighborhood hairs
The direction of body of light 31 is opposite.
In order to facilitate production, can also design, the direction for being located at the illuminator 31 on the same striation 32 is all identical, and
The direction of two striations 32 of arbitrary neighborhood is opposite.
When specific implementation, it is provided with reflector 24 on the medial surface 21 of the bottom case 20, by the reflector
Light is as much as possible reflected into 10 direction of diffuser plate by 24.
When specific implementation, best results when which is LED luminescence chips.
It is worth noting that, when specific implementation using the technology of the present invention, if the illuminator 31 uses one
As traditional LED luminescence chips then Integral luminous effect and operating temperature cannot all reach ideal state.
Applicant of the present invention disclosed in PCT international application no are PCT/CN2011/000756 a kind of LED light source and
The technology of its manufacturing method, which describe a kind of LED elements, can be shone by two sides, to avoid heat from being gathered in knot
On the faying face and substrate of Conventional LED light sources, LED element is directly connected in a sandwich format with two fluorescent elements, to
One or more passways are formed thereby to reach the heat transmission for guiding LED element by the passway.Its structure includes mainly
One or more LED light source groups, wherein including per the LED light source group：An at least LED element, wherein the LED element has
One first light-emitting surface and one second light-emitting surface in reverse side, wherein the LED element is suitable in every first light-emitting surface and institute
It states the second light-emitting surface and the illumination for being more than 180 ° of angles is provided by electroluminescent；Two fluorescent elements, the two fluorescent elements difference
Positioned at first light-emitting surface of the LED element and second light-emitting surface top to keep the LED element in place, to
Make the illumination that the LED is generated respectively from the light-emitting surface by two fluorescent element；With an electronic component, the electricity
Subcomponent connects with the LED element lotus root the LED element is electrically connected to a power supply.The LED element is by two fluorescence
Element is clipped in the middle to keep the LED element in place in a manner of sandwich, so that first light-emitting surface and described second
Light-emitting surface is press directly against on the fluorescent element is communicated off the LED element, and the LED to be supported and guide heat
Element is maintained between the fluorescent element in a LED accommodating chambers in gap.
The technology of PCT/CN2011/000756, which is applied on the product of the present invention, has small illumination effect good, can
It is shone simultaneously to all directions simultaneously using a LED light source, but when specific implementation, since it is simply by first
Light-emitting surface and the second light-emitting surface radiate to LED element, although thinking is preferable, exists when specific implementation and dissipate
Thermal effect is undesirable, and heat distributes relatively slow and causes the case where LED element overheats.
The present inventor simultaneously changes its radiating mode in conjunction with the technical characterstic of PCT/CN2011/000756
Into, and be applied to the present invention backlight product in, to make the present invention backlight product no matter illumination effect or
Ideal state is all reached in terms of operating temperature, has been described in detail below.
The illuminator 31 be LED double-side chips, the LED double-side chips have upper light-emitting surface and it is lower shine
Face.There are six light-emitting surfaces for LED double-side chips tool, and include that plural layer is overlapped and arranges in an orderly manner, the two-sided hairs of the LED
Optical chip sequentially is overlapped and arranges a rigid and transparent basal layer, a luminescent layer and a current spreading layer, and the LED is bis-
The inverted structure of face luminescence chip, it is simple in structure, and it is bis- to define light-emitting surface and the lower light-emitting surface, the LED on this
The concrete structure of face luminescence chip has disclosed in preceding case PCT/CN2011/000756 and is described again here.
Several LED double-side chips are arranged on transparent heat sink plate 100, and the transparent heat sink plate 100 is longitudinal to be plugged in
On connecting seat 200.
One is formed by the combination of several LED double-sides chips, the transparent heat sink plate 100 and the connecting seat 200
The striation 32.
The longitudinal structure determination being plugged on connecting seat 200 of the transparent heat sink plate 100 goes out the illuminator 31 and is horizontally installed on
Structure constituted mode in the air groove 40, while determining normal luminous intensity direction and the diffuser plate of each illuminator 31
Illumination mode of the angle in positive and negative 30 degree between 10.
The transparent heat sink plate 100 includes transparent heat sink substrate 110 and radiation conductive thin film coating 120, wherein the heat dissipation
Conductive film coating 120 is attached on the outer surface of the transparent heat sink substrate 110.
The transparent heat sink substrate 110 is made of light transmission heat sink material, for example, glass, sapphire etc..
The radiation conductive thin film coating 120 is made of heat conduction and heat radiation conductive material, for example, silver paste.
When specifically the radiation conductive thin film coating 120 is attached on the outer surface of the transparent heat sink substrate 110,
Need the outer surface first to the transparent heat sink substrate 110 corrode it is coarse, it is then that the radiation conductive thin film coating 120 is attached
It, this mode strong adhesive force, product quality is good.
The radiation conductive thin film coating 120 includes full attached part 121 and window portion 122, the full attached part 121 and
The setting of the window portion 122 interval.
The LED double-side chip levels are arranged at 122 position of window portion, this moment, the LED double-side chips
Light caused by lateral surface is transmitted directly in external environment, and light caused by the LED double-side chip medial surfaces
It is transmitted in external environment by the window portion 122 and after penetrating the transparent heat sink substrate 110.
The purpose of the window portion 122 is set also precisely in order to the LED double-side chip double-sides is made full use of to shine
Feature makes luminous energy use up few loss.
In addition, the purpose of the radiation conductive thin film coating 120 is arranged primarily to using its material property maximum possible
It is that the LED double-side chips radiate, reduces its operating temperature to the greatest extent.
Preferred thickness when it is silver paste that the transparent heat sink substrate 110, which is the glass radiation conductive thin film coating 120,
For, 0. 6 millimeters thick of glassy layer, ten microns of thickness of silver slurry layer.
In addition, when the radiation conductive thin film coating 120 is silver paste, silver slurry layer also has light while radiation conductive
The effect of reflection, to which light is as much as possible reflected into 10 direction of diffuser plate.
As shown in fig. 7, when specific implementation, which includes that heat conduction and heat radiation part 124 and conduction dissipate
Hot part 125.
The heat conduction and heat radiation part 124 and the conductive radiator part 125 are attached to the outer of the transparent heat sink substrate 110 simultaneously
On surface.
Wherein, several through-holes 126 are offered on the heat conduction and heat radiation part 124, several through-holes 126 are by the transparent heat sink base
Plate 110 is connected with external environment, the transparent heat sink substrate 110 can be made efficiently to distribute heat to by the through-hole 126
In external environment.
The conductive radiator part 125 is separated with the heat conduction and heat radiation part 124, which is arranged at this
Between illuminator 31, the electric connection line of the adjacent illuminator 31 is electrically connected with the conductive radiator part 125 respectively, if to make
It does the illuminator 31 formation and is connected in series with relationship.
When specific implementation, high-heating radiation material can also be coated on the radiation conductive thin film coating 120, thus into
One step promotes its heat dissipation effect.
In addition as shown in fig. 7, such structure can be used for the mould of various lamps and lanterns in the case where being not required in addition add radiator
Group.
The LED double-sides chip can be horizontally set on the window portion 122 with formal dress and upside-down mounting two ways
Set place.
When the formal dress LED double-side chips, on the outer surface of the transparent heat sink substrate 110 and in the window
Several heat conduction support lines 123 are provided in oral area point 122, which supports line 123 and the radiation conductive thin film coating 120
Material identical.
The both ends of each heat conduction support line 123 are all connected with the full attached part 121.
Heat conduction support line 123 is erected on the bottom surface of the LED double-side chips, the LED double-side chip operations
Generated heat supports the conduction of line 123 to the transparent heat sink substrate 110 and the radiation conductive thin film coating by the heat conduction
On 120, and synchronizes and radiate.
Between the light that the bottom surface of the LED double-side chips is sent out is supported between lines 123 by several heat conduction
Gap and through being transmitted in external environment after the transparent heat sink substrate 110.
The heat conduction supports preferably five microns of the width of line 123.
When the upside-down mounting LED double-side chips, the electrode of the bottom surface both side of the LED double-side chips sets up electricity
It is connected on full 121 top surface of attached part of 122 both sides of window portion.
Heat is directly conducted on the transparent heat sink substrate 110 caused by the LED double-side chip operations, and synchronous
It radiates.
The light that the bottom surface of the LED double-side chips is sent out is by the window portion 122 and penetrates the transparent heat sink
It is transmitted in external environment after substrate 110.
Finally it is emphasized that the present invention back light source technique can apply in quite extensive field, such as when
When 10 top setting liquid crystal display of the diffuser plate, the present invention can as the backlight of liquid crystal display, and ought not add it is any its
The backlight product of the present invention can be used directly as the faces LED lamp when his structure, such to be not listed one by one here,
In addition, silver-plated level needs to be welded when external heat dissipation when power increase.
As shown in Figures 1 to 6, a kind of LED direct-light-type backlights luminescent method, diffuser plate 10 is connected on bottom case 20, and
By the diffuser plate 10 and the bottom case 20 air groove 40 is formed around an air groove 40, the medial surface 11 of the diffuser plate 10 is formed
Top surface, the medial surface 21 of the bottom case 20 forms the bottom surface of the air groove 40, light source unit 30 is arranged in the air groove 40.
At work, light caused by 30 electrified light emitting of light source unit is transmitted to outside through the diffuser plate 10
In environment, to form backlight.
The light source unit 30 includes several illuminators 31, and several illuminators 31, which are ranked sequentially, to be arranged in the air groove 40
In.
Each illuminator 31 is horizontally installed in the air groove 40.
Make the angle between the normal luminous intensity direction of each illuminator 31 and the diffuser plate 10 in positive and negative 30 degree,
Wherein, best embodiment is to keep the normal luminous intensity direction of each illuminator 31 parallel with the diffuser plate 10.
When specific implementation, which includes several striations 32, and several striations 32 are transversely or longitudinally
It is arranged in the air groove 40.
Each striation 32 includes several illuminators 31.
When specific implementation, fixed strip 22, several light are fixedly installed on the medial surface 21 of the bottom case 20
Item 32 is erected at by the fixed strip 22 in the air groove 40.
It is provided with pre-buried electrode link block 23 in the fixed strip 22, is the corresponding light by the pre-buried electrode link block 23
Item 32 provides power supply.
Since light luminance caused by 31 tow sides of illuminator can be variant, so two of the arbitrary neighborhood hairs
The direction of body of light 31 is opposite.
In order to facilitate production, can also design, the direction for being located at the illuminator 31 on the same striation 32 is all identical, and
The direction of two striations 32 of arbitrary neighborhood is opposite.
When specific implementation, it is provided with reflector 24 on the medial surface 21 of the bottom case 20, by the reflector
Light is as much as possible reflected into 10 direction of diffuser plate by 24.
The illuminator 31 be LED double-side chips, the LED double-side chips have upper light-emitting surface and it is lower shine
Face.There are six light-emitting surfaces for LED double-side chips tool, and include that plural layer is overlapped and arranges in an orderly manner, the two-sided hairs of the LED
Optical chip sequentially is overlapped and arranges a rigid and transparent basal layer, a luminescent layer and a current spreading layer, and the LED is bis-
The inverted structure of face luminescence chip, it is simple in structure, and it is bis- to define light-emitting surface and the lower light-emitting surface, the LED on this
The concrete structure of face luminescence chip has disclosed in preceding case PCT/CN2011/000756 and is described again here.
Several LED double-side chips are arranged on transparent heat sink plate 100, and the transparent heat sink plate 100 is longitudinal to be plugged in
On connecting seat 200, combines and formed by several LED double-sides chips, the transparent heat sink plate 100 and the connecting seat 200
One striation 32.
The longitudinal structure determination being plugged on connecting seat 200 of the transparent heat sink plate 100 goes out the illuminator 31 and is horizontally installed on
Structure constituted mode in the air groove 40, while determining normal luminous intensity direction and the diffuser plate of each illuminator 31
Illumination mode of the angle in positive and negative 30 degree between 10.
The transparent heat sink plate 100 includes transparent heat sink substrate 110 and radiation conductive thin film coating 120, wherein the heat dissipation
Conductive film coating 120 is attached on the outer surface of the transparent heat sink substrate 110.
The transparent heat sink substrate 110 is made of light transmission heat sink material, for example, glass, sapphire etc..
The radiation conductive thin film coating 120 is made of heat conduction and heat radiation conductive material, for example, silver paste.
When specifically the radiation conductive thin film coating 120 is attached on the outer surface of the transparent heat sink substrate 110,
Need the outer surface first to the transparent heat sink substrate 110 corrode it is coarse, it is then that the radiation conductive thin film coating 120 is attached
It, this mode strong adhesive force, product quality is good.
The radiation conductive thin film coating 120 includes full attached part 121 and window portion 122, the full attached part 121 and
The setting of the window portion 122 interval.
The LED double-side chip levels are arranged at 122 position of window portion, this moment, the LED double-side chips
Light caused by lateral surface is transmitted directly in external environment, and light caused by the LED double-side chip medial surfaces
It is transmitted in external environment by the window portion 122 and after penetrating the transparent heat sink substrate 110.
The purpose of the window portion 122 is set also precisely in order to the LED double-side chip double-sides is made full use of to shine
Feature makes luminous energy use up few loss.
In addition, the purpose of the radiation conductive thin film coating 120 is arranged primarily to using its material property maximum possible
It is that the LED double-side chips radiate, reduces its operating temperature to the greatest extent.
Preferred thickness when it is silver paste that the transparent heat sink substrate 110, which is the glass radiation conductive thin film coating 120,
For, 0. 6 millimeters thick of glassy layer, ten microns of thickness of silver slurry layer.
In addition, when the radiation conductive thin film coating 120 is silver paste, silver slurry layer also has light while radiation conductive
The effect of reflection, to which light is as much as possible reflected into 10 direction of diffuser plate.
The LED double-sides chip can be horizontally set on the window portion 122 with formal dress and upside-down mounting two ways
Set place.
When the formal dress LED double-side chips, on the outer surface of the transparent heat sink substrate 110 and in the window
Several heat conduction support lines 123 are provided in oral area point 122, which supports line 123 and the radiation conductive thin film coating 120
Material identical.
The both ends of each heat conduction support line 123 are all connected with the full attached part 121.
Heat conduction support line 123 is erected on the bottom surface of the LED double-side chips, the LED double-side chip operations
Generated heat supports the conduction of line 123 to the transparent heat sink substrate 110 and the radiation conductive thin film coating by the heat conduction
On 120, and synchronizes and radiate.
Between the light that the bottom surface of the LED double-side chips is sent out is supported between lines 123 by several heat conduction
Gap and through being transmitted in external environment after the transparent heat sink substrate 110.
The heat conduction supports preferably five microns of the width of line 123.
When the upside-down mounting LED double-side chips, the electrode of the bottom surface both side of the LED double-side chips sets up electricity
It is connected on full 121 top surface of attached part of 122 both sides of window portion, it is hot caused by the LED double-side chip operations
Amount is directly conducted on the transparent heat sink substrate 110, and is synchronized and radiated, and the bottom surface of the LED double-side chips is sent out
Light by the window portion 122 and through being transmitted in external environment after the transparent heat sink substrate 110.
Claims (8)
1. a kind of LED direct-light-type backlights comprising diffuser plate, bottom case and light source unit, wherein the diffuser plate is connected to this
On bottom case, and by the diffuser plate and the bottom case around an air groove is formed, the medial surface of the diffuser plate forms the air groove
The medial surface of top surface, the bottom case forms the bottom surface of the air groove, the light source unit be arranged in the air groove, work when
It waits, light is transmitted to through the diffuser plate in external environment caused by the light source unit electrified light emitting, to form backlight,
It is characterized in that：The light source unit includes several illuminators, and several illuminators, which are ranked sequentially, to be arranged in the air groove,
Each illuminator is horizontally installed in the air groove, the normal luminous intensity direction of each illuminator and the diffuser plate it
Between angle in positive and negative 30 degree,
The light source unit includes several striations, and several striations are transversely or longitudinally arranged in the air groove, each
The striation all includes several illuminators, and fixed strip is fixedly installed on the medial surface of the bottom case, and several striations are logical
The fixed strip is crossed to be erected in the air groove,
The illuminator is LED double-side chips, and several LED double-side chips are arranged on transparent heat sink plate, this is transparent
Heat sink is longitudinally plugged on connecting seat, by several LED double-sides chips, the transparent heat sink plate and the connecting seat group
It closes and forms the striation, the structure determination which is longitudinally plugged on connecting seat goes out the illuminator and is horizontally installed on
Structure constituted mode in the air groove, while determining the illumination mode of each illuminator,
The transparent heat sink plate includes transparent heat sink substrate and radiation conductive thin film coating, wherein the radiation conductive thin film coating
It is attached on the outer surface of the transparent heat sink substrate, which is made of light transmission heat sink material, and the radiation conductive is thin
Film coating is made of heat conduction and heat radiation conductive material, which includes full attached part and window portion, this is full
Attached part and window portion interval setting,
The LED double-side chip levels are arranged at the window portion position, this moment, the LED double-side chip lateral surfaces
Generated light is transmitted directly in external environment, and light caused by the LED double-side chip medial surfaces passes through this
Window portion and through being transmitted in external environment after the transparent heat sink substrate.
2. a kind of LED direct-light-type backlights as described in claim 1, it is characterised in that：The normal direction light of each illuminator
Strong direction is all parallel with the diffuser plate.
3. a kind of LED direct-light-type backlights as described in claim 1, it is characterised in that：It is set on the medial surface of the bottom case
It is equipped with reflector, light is as much as possible reflected into the diffuser plate direction by the reflector.
4. a kind of LED direct-light-type backlights as described in claim 1, it is characterised in that：The transparent heat sink substrate is glass, should
Radiation conductive thin film coating is silver paste, and when which is silver paste, silver slurry layer is while radiation conductive
Also has the effect of light reflection.
5. a kind of LED direct-light-type backlights as described in claim 1, it is characterised in that：In the formal dress LED double-side chips
When, several heat conduction support lines are provided on the outer surface of the transparent heat sink substrate and in the window portion, it should
Heat conduction supports the material identical of line and the radiation conductive thin film coating, the both ends of each heat conduction support line all full attached with this
Part is connected, which is located on the bottom surface of the LED double-side chips, the LED double-side chip operations
Generated heat supports line to conduct to the transparent heat sink substrate and the radiation conductive thin film coating by the heat conduction, and same
Step radiates, between the light that the bottom surfaces of the LED double-side chips is sent out is supported between lines by several heat conduction
Gap and through being transmitted in external environment after the transparent heat sink substrate.
6. a kind of LED direct-light-type backlights as described in claim 1, it is characterised in that：In the upside-down mounting LED double-side chips
When, the electrode of the bottom surface both side of the LED double-side chips sets up the full attached portion for being connected electrically in the window portion both sides
Divide on top surface, heat is directly conducted on the transparent heat sink substrate caused by the LED double-side chip operations, and same stepping
Row heat dissipation, the light that the bottom surfaces of the LED double-side chips is sent out is by the window portion and penetrates the transparent heat sink substrate
After be transmitted in external environment.
7. a kind of LED direct-light-type backlights as described in claim 1, it is characterised in that：The full attached part includes heat conduction and heat radiation
Part and conductive radiator part, the heat conduction and heat radiation part and the conductive radiator part are attached to the transparent heat sink substrate simultaneously
Outer surface on, wherein offer several through-holes on the heat conduction and heat radiation part, several through-holes by the transparent heat sink substrate with it is outer
Portion's environment is connected, and the transparent heat sink substrate can be made to distribute heat in external environment by the through-hole, the conductive radiator
Part is separated with the heat conduction and heat radiation part, which is arranged between the illuminator, the adjacent illuminator
Electric connection line is electrically connected with the conductive radiator part respectively, to make several illuminator formation be connected in series with relationship.
8. a kind of LED direct-light-type backlights luminescent method, it is characterised in that：Diffuser plate is connected on bottom case, and by the expansion
It falls apart with the bottom case around an air groove is formed, the medial surface of the diffuser plate forms the top surface of the air groove, the inside of the bottom case
Face forms the bottom surface of the air groove, and light source unit is arranged in the air groove, and at work, which, which is powered, sends out
Light caused by light is transmitted to through the diffuser plate in external environment,
The light source unit includes several illuminators, and several illuminators, which are ranked sequentially, to be arranged in the air groove, each hair
Body of light is all horizontally installed in the air groove, keeps the normal luminous intensity direction of each illuminator parallel with the diffuser plate, should
Light source unit includes several striations, and several striations are transversely or longitudinally arranged in the air groove, each striation
All include several illuminators, fixed strip is fixedly installed on the medial surface of the bottom case, several striations are solid by this
Determine item to be erected in the air groove, reflector is provided on the medial surface of the bottom case, using up maximum by the reflector can
Light can be reflected into the diffuser plate direction,
The illuminator is LED double-side chips, and several LED double-side chips are arranged on transparent heat sink plate, this is transparent
Heat sink is longitudinally plugged on connecting seat, by several LED double-sides chips, the transparent heat sink plate and the connecting seat group
It closes and forms the striation, the structure determination which is longitudinally plugged on connecting seat goes out the illuminator and is horizontally installed on
Structure constituted mode in the air groove, while determining the illumination mode of each illuminator, which includes
Transparent heat sink substrate and radiation conductive thin film coating, wherein the radiation conductive thin film coating is attached to the transparent heat sink substrate
Outer surface on, which is made of light transmission heat sink material, the radiation conductive thin film coating by heat conduction and heat radiation conduction
Material is made, which includes full attached part and window portion, the full attached part and the window portion
Interval setting, which is arranged at the window portion position, this moment, outside the LED double-side chips
Light caused by side is transmitted directly in external environment, and light caused by the LED double-side chip medial surfaces is logical
It crosses the window portion and is transmitted in external environment after penetrating the transparent heat sink substrate,
The LED double-sides chip can be horizontally set on formal dress and upside-down mounting two ways at the window portion position,
When the formal dress LED double-side chips, it is arranged on the outer surface of the transparent heat sink substrate and in the window portion
There are several heat conduction support lines, the heat conduction to support the material identical of line and the radiation conductive thin film coating, each heat conduction branch
The both ends for supportting line are all connected with the full attached part, which is located on the bottom surface of the LED double-side chips,
Heat caused by the LED double-side chip operations by the heat conduction support line conduct to the transparent heat sink substrate and this dissipate
It on thermally conductive thin film coating, and synchronizes and radiates, the light that the bottom surfaces of the LED double-side chips is sent out is by several
The heat conduction supports the gap between line and is transmitted in external environment after penetrating the transparent heat sink substrate,
When the upside-down mounting LED double-side chips, the electrode of the bottom surface both side of the LED double-side chips sets up electrical connection
On the full attached portion top surface of the window portion both sides, heat directly conducts caused by the LED double-side chip operations
It to the transparent heat sink substrate, and synchronizes and radiates, the light that the bottom surface of the LED double-side chips is sent out passes through the window
Oral area divides and is transmitted in external environment after penetrating the transparent heat sink substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410422541.3A CN105371161B (en) | 2014-08-26 | 2014-08-26 | A kind of LED direct-light-type backlights and its luminescent method |
| PCT/CN2015/087463 WO2016029809A1 (en) | 2014-08-26 | 2015-08-18 | Led direct-lit backlight source and light emission method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410422541.3A CN105371161B (en) | 2014-08-26 | 2014-08-26 | A kind of LED direct-light-type backlights and its luminescent method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105371161A CN105371161A (en) | 2016-03-02 |
| CN105371161B true CN105371161B (en) | 2018-08-28 |
Family
ID=55373603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410422541.3A Expired - Fee Related CN105371161B (en) | 2014-08-26 | 2014-08-26 | A kind of LED direct-light-type backlights and its luminescent method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105371161B (en) |
| WO (1) | WO2016029809A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105444036B (en) * | 2014-08-26 | 2017-03-22 | 蔡鸿 | Light-emitting diode (LED) light source light-emitting and heat-dissipating structure |
| CN109031773A (en) * | 2017-06-09 | 2018-12-18 | 群创光电股份有限公司 | Display device |
| CN109869647B (en) * | 2019-03-05 | 2021-05-18 | 东莞中之科技股份有限公司 | LED lamp pearl of two-sided luminous |
| CN113192435A (en) * | 2021-05-31 | 2021-07-30 | 常州明耀半导体科技有限公司 | Photoelectric semiconductor display screen |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201606739U (en) * | 2009-11-11 | 2010-10-13 | 康佳集团股份有限公司 | LED backlight module |
| CN202327686U (en) * | 2011-04-26 | 2012-07-11 | 蔡州 | Light-emitting diode (LED) light source |
| CN102927483A (en) * | 2012-11-20 | 2013-02-13 | 田茂福 | Integrated flip type LED illuminating assembly |
| CN103925581A (en) * | 2013-10-29 | 2014-07-16 | 蔡鸿 | LED lamp heat dissipation structure |
| CN204062597U (en) * | 2014-08-26 | 2014-12-31 | 蔡鸿 | The luminous radiator structure of a kind of LED light source |
| CN204300813U (en) * | 2014-08-26 | 2015-04-29 | 蔡鸿 | A kind of LED direct-light-type backlight |
| CN105444036A (en) * | 2014-08-26 | 2016-03-30 | 蔡鸿 | Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100468170C (en) * | 2006-02-10 | 2009-03-11 | 鸿富锦精密工业（深圳）有限公司 | Back light system |
| TW200811543A (en) * | 2006-08-31 | 2008-03-01 | K Bridge Electronics Co Ltd | Light source application efficiency improving device |
| CN201413835Y (en) * | 2009-06-01 | 2010-02-24 | 北京众智同辉科技有限公司 | LED cluster embedding structure |
| US20110038141A1 (en) * | 2009-08-11 | 2011-02-17 | Martin David Tillin | Lateral emission led backlight for lcd |
| CN201851960U (en) * | 2010-02-26 | 2011-06-01 | 金芃 | Thin type straightly-downward LED (light-emitting diode) backlight module |
| CN101846256A (en) * | 2010-05-04 | 2010-09-29 | 蔡州 | Led light source |
| KR101719693B1 (en) * | 2010-05-11 | 2017-03-27 | 삼성디스플레이 주식회사 | Light emitting diode package and display apparatus having the same |
| CN102155695B (en) * | 2011-04-21 | 2014-12-03 | 中山大学 | Light source structure of backlight source and direct downward and side inlet backlight source structures thereof |
| KR20130011377A (en) * | 2011-07-21 | 2013-01-30 | 삼성전자주식회사 | Light emitting package |
| TW201431042A (en) * | 2013-01-25 | 2014-08-01 | Xu-Wen Liao | Double-sided light emitting type LED lamp panel structure |
| CN103824927B (en) * | 2014-03-12 | 2016-08-17 | 亚浦耳照明股份有限公司 | A kind of LED chip packaging body and preparation method thereof |
| CN204062595U (en) * | 2014-08-26 | 2014-12-31 | 蔡鸿 | A kind of LED lamp |
-
2014
- 2014-08-26 CN CN201410422541.3A patent/CN105371161B/en not_active Expired - Fee Related
-
2015
- 2015-08-18 WO PCT/CN2015/087463 patent/WO2016029809A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201606739U (en) * | 2009-11-11 | 2010-10-13 | 康佳集团股份有限公司 | LED backlight module |
| CN202327686U (en) * | 2011-04-26 | 2012-07-11 | 蔡州 | Light-emitting diode (LED) light source |
| CN102927483A (en) * | 2012-11-20 | 2013-02-13 | 田茂福 | Integrated flip type LED illuminating assembly |
| CN103925581A (en) * | 2013-10-29 | 2014-07-16 | 蔡鸿 | LED lamp heat dissipation structure |
| CN204062597U (en) * | 2014-08-26 | 2014-12-31 | 蔡鸿 | The luminous radiator structure of a kind of LED light source |
| CN204300813U (en) * | 2014-08-26 | 2015-04-29 | 蔡鸿 | A kind of LED direct-light-type backlight |
| CN105444036A (en) * | 2014-08-26 | 2016-03-30 | 蔡鸿 | Light-emitting diode (LED) light source light-emitting and heat-dissipating structure and light-emitting and heat-dissipating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016029809A1 (en) | 2016-03-03 |
| CN105371161A (en) | 2016-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8564739B2 (en) | LED backlight system for LCD displays | |
| CN101523109B (en) | Thin illumination device, display device and luminary device | |
| JP2006294618A (en) | Light emitting panel | |
| CN105371161B (en) | A kind of LED direct-light-type backlights and its luminescent method | |
| CN107219679A (en) | Backlight module of LED liquid crystal display | |
| KR102064107B1 (en) | Quantum dot film integrated light guide plate and backlight unit using the same | |
| CN202946948U (en) | Bulb | |
| CN103104843B (en) | Lighting device | |
| CN204300813U (en) | A kind of LED direct-light-type backlight | |
| WO2013152519A1 (en) | Manufacturing method for led light bar, led light bar and backlight module | |
| CN107085260A (en) | The backing structure and LED of side entering type LED | |
| CN204062595U (en) | A kind of LED lamp | |
| CN102121585A (en) | LED soft light flat-panel illuminating and displaying lamp taking LED area light source light bar as light source | |
| CN207424457U (en) | Direct-light-type backlight based on dual chip double circuit connection LED lamp bead | |
| CN104654079A (en) | High-performance 360-degree LED (Light-Emitting Diode) lamp | |
| CN206694861U (en) | LED illuminator | |
| KR20090040362A (en) | Lamp | |
| CN208384295U (en) | A kind of self-excitation LED backlight plate | |
| CN105679916A (en) | Light-emitting device with adjustable color temperature | |
| CN204459825U (en) | High-performance 360 degree of light emitting LED lamp | |
| CN103822129A (en) | LED panel lamp and manufacturing method thereof | |
| JP2015018682A (en) | Luminaire and control method of luminaire | |
| JP3189955U (en) | Lamps using LEDs | |
| CN102109127A (en) | LED (Light Emitting Diode) street lamp | |
| CN201028459Y (en) | Trace background illumination underplate composed by backlight board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 Termination date: 20210826 |