CN201851960U - Thin type straightly-downward LED (light-emitting diode) backlight module - Google Patents

Thin type straightly-downward LED (light-emitting diode) backlight module Download PDF

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Publication number
CN201851960U
CN201851960U CN2010201404207U CN201020140420U CN201851960U CN 201851960 U CN201851960 U CN 201851960U CN 2010201404207 U CN2010201404207 U CN 2010201404207U CN 201020140420 U CN201020140420 U CN 201020140420U CN 201851960 U CN201851960 U CN 201851960U
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light
main body
encapsulation
backlight module
led encapsulation
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CN2010201404207U
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彭晖
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Jin Pi
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Jin Pi
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Abstract

The utility model provides a thin type straightly-downward LED (light-emitting diode) backlight module which comprises a frame, a lamp panel, an optical device, a main light reflecting sheet, an optical film component and a supporting device, wherein the frame comprises a bottom part and a side edge of the frame; the lamp panel comprises a circuit board and at least one LED encapsulation, and the LED encapsulation is fixed on the circuit board; the optical device comprises at least one unit, the unit comprises at least one main body, and the inner surface of the main body is located towards the light emitting surface of the LED encapsulation so that one part of light emitted by the LED encapsulation is reflected or scattered when being emitted to the inner surface of the main body so as to be spread to the direction of the optical film component; the bottom part of the main light reflecting sheet is fixed on the circuit board, and a hole is formed on the preset position of the main light reflecting sheet, so that the LED encapsulation can be exposed out of the hole; the surface of the top part of the main light reflecting sheet is provided with a structure formed by a scattering material, so that one part of light emitted by the LED encapsulation is reflected or scattered when being emitted to the surface of the top part of the main light reflecting sheet so as to be spread to the direction of the optical film component; and the optical film component is supported by the supporting device.

Description

Slim direct-light type LED backlight module
Technical field
The utility model discloses a kind of slim direct-light type LED backlight module, belongs to technical field of liquid crystal display.
Background technology
LED has been widely used in the module backlight of liquid crystal display, and the commercialization form of LED-backlit module mainly contains two kinds, and the one, side entering type (edge backlight) LED-backlit module, the one, straight-down negative (direct backlight) LED-backlit module.One of major defect of direct-light type LED backlight module is: compare with side entering type LED-backlit module, thickness is bigger.
Therefore, need a kind of slim direct-light type LED backlight module.
The utility model content
The utility model provides slim direct-light type LED backlight module, has ultra-thin, local area control, is applicable to large-sized LED liquid crystal display, etc. advantage.
An embodiment of slim direct-light type LED backlight module, essential characteristic is as follows, comprises, and framework, lamp plate, Optical devices, main reflecting piece, optical thin film assembly, light are propagated cavity, supportive device.Wherein, framework comprises base of frame and frame sides.Lamp plate comprises, circuit board and at least one LED encapsulation, and circuit board is fixed on the base of frame, and the LED encapsulation is fixed on the circuit board.Optical devices comprise at least one unit, and a unit comprises at least one main body, and the reflection of Optical devices and the function of scattering are realized by main body.The bottom of main reflecting piece is fixed on the circuit board, forms hole on the precalculated position of main reflecting piece, makes the LED encapsulation expose from hole.Have the structure that is formed by diffusion material on the top surface of main reflecting piece, this structure comprises, the combination of site (dot pattern), net piece, site and net piece.Each film of optical thin film assembly is to select from one group of optical thin film, and this group optical thin film comprises, diffuser plate (diffuser plate), diffusion sheet (diffuser sheet), light-collecting piece, polaroid, liquid crystal display, etc.Supportive device (not showing in the drawings) comprises a plurality of supports, and the bottom of support is fixed on the base of frame, and the optical thin film assembly is supported at the top of support.The lower surface of the top surface of main reflecting piece, optical thin film assembly, frame sides define light jointly and propagate cavity.
The profile of the top view of the main body of Optical devices is to select from one group of shape, and this group shape comprises, circle, equilateral triangle, rectangle (comprising square), regular hexagon, circular arc, linear, broken line shape.The shape in the cross section of the inner surface of the main body of Optical devices is to select from one group of shape, and this group shape comprises, becomes a straight line less than 90 ° of angles, curve with the framework bottom surface, etc.The inner surface towards described LED encapsulation of the main body of Optical devices has structure, and the structure of inner surface is to select from one group of structure, and this group structure comprises having the micro-structural of scattering process on smooth interior surface, the inner surface.The setting on the surface of the structure of the inner surface of the main body of Optical devices comprises, naked surface, formation reflectance coating.
The part of the light that LED encapsulation is sent is mapped on the naked surface or reflectance coating of main body of Optical devices, by partial reflection or all reflection and/or scatterings, changes the direction of propagation, propagates to the direction of optical thin film assembly.Another part of the light that LED encapsulation is sent is mapped to the site on the top surface of main reflecting piece or the combination of net piece or site and net piece, and is scattered, and changes the direction of propagation, directive optical thin film assembly then.Therefore, the height that light is propagated cavity is lowered, that is, the direct-light type LED backlight module is thinner.
For the site of area, be called the net piece greater than 50 square millimeters.
Embodiment: form the shape net piece identical with main reflecting piece on the surface at the top of main reflecting piece with size.
Embodiment: propagate in the face of light on the surface of side of framework of cavity reflecting piece is set, be referred to as the side reflecting piece.
Embodiment: form site or net piece on the side reflecting piece.
An embodiment: the polaroid in the optical thin film assembly is arranged on the position that the top surface with main reflecting piece faces one another, and other diaphragm arrangement in the optical thin film assembly are on the surface away from main reflecting piece of polaroid.
Slim direct-light type LED backlight module, wherein,
1.LED the structure of encapsulation comprises, not with the surface-mount type (SMD) of lens encapsulate, have lens surface-mount type encapsulation, side-light type (side view) encapsulation, lateral type encapsulation, have reflection-light-radiating lens encapsulation, have the encapsulation of LGP mirror.
2. do not have micro-structural with the surface-mount type encapsulation of lens and the light output surface of side-light type encapsulation.
3. a LED encapsulates the chip that can adopt a bill coloured light, also can adopt the chip of a plurality of bill coloured light.Monochromatic chip comprises ruddiness, blue light, green glow chip.
4.LED encapsulation emits white light.
The purpose of this utility model and every effect that can reach are as follows:
(1) slim direct-light type LED backlight module of the present utility model, slimming.
(2) slim direct-light type LED backlight module of the present utility model is applicable to large-sized backlight,, even for the large scale backlight, also can provide sufficient brightness and excellent luminance uniformity that is.
(3) the slim direct-light type LED backlight module of the utility model can adopt local area control (localdimming).
(4) the slim direct-light type LED backlight module that provides of the utility model is easy to produce in batches.
The utility model and its feature and benefit will better be showed in the following detailed description.
Description of drawings
Fig. 1 shows direct-light type LED backlight module formerly.
Fig. 2 a shows the top view of an embodiment of slim direct-light type LED backlight module of the present utility model.
Fig. 2 b shows the sectional view of an embodiment of slim direct-light type LED backlight module of the present utility model.
Fig. 3 a, Fig. 3 b, Fig. 3 c, Fig. 3 d, Fig. 3 e, Fig. 3 f, Fig. 3 g, Fig. 3 h, Fig. 3 j show the embodiment of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model respectively.
Fig. 3 k and Fig. 3 m show the embodiment of array of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model respectively.
Fig. 4 a shows the embodiment of shape in cross section of inner surface of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model.
Fig. 4 b shows the embodiment of shape in cross section of inner surface of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model.
Fig. 5 a shows the embodiment of shape in cross section of inner surface of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model.
Fig. 5 b shows the embodiment of setting on surface of the structure of the structure of inner surface of main body of Optical devices of main body of Optical devices of slim direct-light type LED backlight module of the present utility model and inner surface.
Fig. 6 a, 6b, 6c, 6d, 6e, 6f show the embodiment of the LED encapsulation of slim direct-light type LED backlight module of the present utility model.
Specific embodiment
Though embodiment of the present utility model will be described below, following description just illustrates principle of the present utility model, rather than limitation the utility model is in the description of following embodiment.
Attention: following all embodiment that are applicable to slim direct-light type LED backlight module of the present utility model:
(1) ratio of each several part is not represented the true ratio of the each several part of embodiment among each figure.
(2) profile of the top view of the main body of Optical devices is to select from one group of shape, and this group shape comprises, circle, equilateral triangle, rectangle (comprising square), regular hexagon, circular arc, linear, broken line shape.
(3) shape of the hypotenuse in the cross section of the inner surface of the main body of Optical devices is to select from one group of shape, and this group shape comprises, becomes a straight line less than 90 ° of angles, curve with the framework bottom surface, etc.
(4) inner surface towards described LED encapsulation of the main body of Optical devices has structure, and the structure of inner surface is to select from one group of structure, and this group structure comprises having the micro-structural of scattering process on smooth interior surface, the inner surface.
(5) setting on the surface of the structure of the inner surface of the main body of Optical devices comprises, naked surface, formation reflectance coating.Naked surface is the surface of the material of main body of Optical devices own, naked surface has scattering and function of reflecting, make the main component of the light that LED encapsulation is sent be mapped to behind the inner surface of main body of Optical devices by partial reflection or all reflection and/or scatterings, part light or whole light change the direction of propagation, propagate towards optical thin film assembly direction.Reflectance coating makes and is all reflected when illumination is penetrated thereon.
(6) reflecting piece comprises main reflecting piece and side reflecting piece, and the bottom of main reflecting piece is fixed on the base of frame, and the side reflecting piece is fixed on the frame sides.The top surface of main reflecting piece is the surface with the main reflecting piece that it is right that the optical thin film assembly is practised physiognomy.
(7) has the structure that forms by diffusion material on the top surface of main reflecting piece:, be called the net piece for the site of area greater than 50 square millimeters.The structure that is formed by diffusion material is to select from one group of structure, and this group structure comprises, the combination of site (dot pattern), net piece, site and net piece.
(8) the structure that is formed by diffusion material on the top surface of main reflecting piece of choosing any one kind of them in the setting, (7) on surface of structure of inner surface of main body of Optical devices of choosing any one kind of them from above-mentioned (2) that choosing any one kind of them in the profile, (3) of main body of Optical devices chooses any one kind of them in the shape, (4) of hypotenuse in cross section of inner surface of main body of Optical devices and choose any one kind of them in structure on the inner surface of main body of Optical devices, (5) is promptly formed an embodiment of the present utility model.
(9) form site or net piece on the surface in the face of light propagation cavity of side reflecting piece.
(10) supportive device (in the drawings show) comprises a plurality of supports, and the bottom of support is fixed on the base of frame, and support passes the hole on the precalculated position on the main reflecting piece, and the optical thin film assembly is supported at the top of support.
(11) lower surface of the top surface of main reflecting piece, optical thin film assembly, frame sides define a light jointly and propagate cavity.
(12) the optical thin film assembly 205 among Fig. 2 b is identical with the optical thin film assembly of formerly side entering type LED-backlit module.Each film of optical thin film assembly is to select from one group of optical thin film, and this group optical thin film comprises, diffuser plate (diffuser plate), diffusion sheet (diffuser sheet), light-collecting piece, polaroid, liquid crystal display, etc.
(13) LED encapsulating structure: be to select from one group of encapsulating structure, this group encapsulating structure comprises: not with the surface-mount type (SMD) of lens encapsulate, have lens surface-mount type encapsulation, side-light type (side view) encapsulation, lateral type encapsulation, have reflection-light-radiating lens encapsulation, have the encapsulation of LGP mirror.
(14) any one does not have micro-structural with the light output surface of the LED of lens encapsulation.
The chip that (15) LED encapsulation is adopted comprises: the chip of a bill coloured light, also can adopt the chip of a plurality of bill coloured light.Monochromatic chip comprises ruddiness, blue light, green glow chip.
(16) the LED encapsulation emits white light.
(17) slim direct-light type LED backlight module is easy to produce in batches.
(18) slim direct-light type LED backlight module is thinner than formerly direct-light type LED backlight module.
Fig. 1 shows the sectional view of an embodiment of direct-light type LED backlight module formerly.The direct-light type LED backlight module comprises that framework, circuit board 102, at least one LED encapsulation 103, main reflecting piece 104, optical thin film assembly 105, light are propagated cavity 106.Wherein, framework comprises, base of frame 101c, frame sides 101a and 101b.Circuit board 102 is arranged on the base of frame 101c, and LED encapsulation 103 is arranged on the circuit board 102.Main reflecting piece 104 is arranged on the circuit board 102, has hole on the preposition of main reflecting piece 104, makes LED encapsulation 103 expose from hole, makes the light-emitting area of LED encapsulation 103 towards optical thin film assembly 105.
The shortcoming of direct-light type LED backlight module formerly is, only directly propagates to optical thin film assembly 105 from the LED encapsulation, in order to reach the uniformity of brightness, limited the slimming of direct-light type LED backlight module.Its advantage is good heat dissipation, can carries out the local LED-backlit source of controlling and being applicable to virtually any size of light.
Fig. 2 a shows the top view of an embodiment of slim direct-light type LED backlight module of the present utility model.
The main reflecting piece 204 of only drawing among Fig. 2 a at preposition, forms hole 210 on the reflecting piece 204, make LED encapsulation 203 expose from hole, and the circular arc main body 207 of Optical devices is arranged on preposition.The Optical devices that Fig. 2 a shows comprise four unit, and each unit comprises a main body 207, and the slim direct-light type LED backlight module of utility model comprises a plurality of such unit, form array.
Notice that Fig. 3 a to Fig. 3 j shows the embodiment of a plurality of difform main bodys.
The A-A sectional view of the embodiment of Fig. 2 b exploded view 2a.Slim direct-light type LED backlight module comprises that framework, lamp plate, Optical devices, main reflecting piece 204c, side reflecting piece 204a and 204b, optical thin film assembly 205, light are propagated cavity 206, supportive device (not showing in the drawings).Wherein, framework comprises, base of frame 201c, frame sides 201a and 201b, other sides of framework do not show in the drawings.Lamp plate comprises circuit board 202 and at least one LED encapsulation 203, and circuit board 202 is arranged on the base of frame 201c, and LED encapsulation 203 is arranged on the circuit board 202.Optical devices comprise main body 207a and 207b.The main body of Optical devices promptly can be arranged on (207a of Fig. 2 b) on the main reflecting piece, also can be arranged on (207b of Fig. 2 b) on the circuit board, but this is not illustrated in the same LED-backlit module, and Optical devices must be arranged on the different assembly of LED-backlit module.
Optical devices main body 207 on the inner surface of LED encapsulation, have structure, the lip-deep setting of structure comprises, naked surface, reflectance coating (showing in Fig. 4 d).Reflectance coating makes the main component of the light that LED encapsulation is sent be reflected and/or scattering after being mapped on the structure of inner surface of main body of Optical devices, changes the direction of propagation, propagates towards optical thin film assembly 205 directions.
The reflection of Optical devices and scattering function are realized by the inner surface 209 of main body 207.
Main reflecting piece 204c is arranged on the circuit board 202, has hole on the preposition of main reflecting piece 204c, makes LED encapsulation 203 expose from hole.The top surface of main reflecting piece 204c has the structure 208 that is formed by diffusion material, and this structure comprises, the combination of site, net piece, site and net piece.In order to simplify, the combination of site or net piece or site and net piece is all represented with site 208.
In order to simplify picture, whole other optical thin film assemblies of the slim direct-light type LED backlight module of optical thin film assembly 205 representatives, each film of optical thin film assembly 205 is to select from one group of optical thin film, this group optical thin film comprises, diffuser plate (diffuser plate), diffusion sheet (diffuser sheet), light-collecting piece, polaroid, liquid crystal display, etc.
The side of the lower surface of optical thin film assembly 205, the top surface of main reflecting piece 204c and framework has defined light jointly and has propagated cavity 206.The major part of LED encapsulation 203 light that send is propagated in the cavity 206 at light and is propagated, and the major part of light is entered optical thin film assembly 205 by the inner surface reflection of Optical devices and/or scattering.
Supportive device (not showing in the drawings) comprises that a plurality of supports, the bottom of support are fixed on the base of frame 201c, and optical thin film assembly 205 is supported at the top of support.
Note, (1) because the light that the LED encapsulation is sent is not direct directive optical thin film assembly 205, but a part is by main body 207 reflection and the scatterings of Optical devices, another part is by structure 207 scatterings of the top surface of main reflecting piece 204c, enter optical thin film assembly 205 then, therefore, light is propagated the thinner thickness of cavity 206, that is direct-light type LED backlight module thinner thickness.(2) the side reflecting piece is set on the frame sides, only show two frame sides 201a and 201b and side reflecting piece 204a and 204b disposed thereon among the figure, in fact on four frame sides the side reflecting piece is set all, perhaps, main reflecting piece and side reflecting piece are by being bent to form with a slice reflecting piece; Form the combination of site or net piece or site and net piece on all surfaces of side reflecting piece.(3) inner surface 209 of the main body 207 of showing among Fig. 2 b has level and smooth surface, and still, inner surface 209 also can have micro-structural.The hypotenuse of inner surface 209 becomes one less than 90 ° of angles with the framework bottom surface.(4) setting on the surface of the structure of the inner surface of the main body of the Optical devices of showing among Fig. 2 b promptly can be naked surface, also can form reflectance coating thereon.
Fig. 3 shows (comprising Fig. 3 a, Fig. 3 b, Fig. 3 c, Fig. 3 d, Fig. 3 e, Fig. 3 f, Fig. 3 g, Fig. 3 h, Fig. 3 j) embodiment of profile of top view of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model respectively.
An embodiment of the profile of the top view of Fig. 3 a display optics device main body, the profile of main body is the center that 307, one LED encapsulation 303 of a square (comprising square) are arranged on main body.
An embodiment of the profile of the top view of Fig. 3 b display optics device main body, the profile of main body is the center that 307, one LED encapsulation 303 of a regular hexagon are arranged on main body.
An embodiment of the profile of the top view of Fig. 3 c display optics device main body, the profile of main body is the center that 307, one LED encapsulation 303 of an equilateral triangle are arranged on main body.
An embodiment of the profile of the top view of Fig. 3 d display optics device main body, the profile of main body is the center that 307, one LED encapsulation 303 of a circle are arranged on main body.
An embodiment of the profile of the top view of Fig. 3 e display optics device main body, the profile of main body is that 307, three LED encapsulation 303 of a circle are arranged in an equilateral triangle, is arranged on the center of main body.The exiting surface of three LED encapsulation 303 is separately towards the main body of Optical devices.
An embodiment of the profile of the top view of Fig. 3 f display optics device main body, the profile of main body is that 307, three LED encapsulation 303 of a regular hexagon are arranged in an equilateral triangle, is arranged on the center of main body.The exiting surface of three LED encapsulation 303 is separately towards the main body of Optical devices.
An embodiment of the profile of the top view of Fig. 3 g display optics device main body, three LED encapsulation 303a, 303b, 303c are arranged in an equilateral triangle, the unit of Optical devices comprises three discrete main body 307a, 307b, 307c, corresponding with the exiting surface of three LED encapsulation 303a, 303b, 303c respectively, each main body is a rectilinear main body.
An embodiment of the profile of the top view of Fig. 3 h display optics device main body, three LED encapsulation 303a, 303b, 303c are arranged in an equilateral triangle, the unit of Optical devices comprises main body 307a, 307b, the 307c of three circular arcs, and is corresponding with the exiting surface of three LED encapsulation 303a, 303b, 303c respectively.A preferred embodiment, the pairing central angle of circular arc is 120 °, the main body of three circular arcs constitutes a circle.
An embodiment of the profile of the top view of Fig. 3 j display optics device main body, three LED encapsulation 303a, 303b, 303c are arranged in an equilateral triangle, the unit of Optical devices comprises that three main body 307a, 307b, 307c are corresponding with the exiting surface of three LED encapsulation 303a, 303b, 303c respectively, and each main body is the main body of a broken line shape.A preferred embodiment, the pairing central angle of broken line shape is 120 °, the main body of three broken line shapes constitutes a regular hexagon.
Fig. 3 k shows the embodiment of the array that main body 307a, 307b, 307c, the 307d of four squares of the Optical devices of slim direct-light type LED backlight module of the present utility model forms. Main body 307a, 307b, 307c, 307d can machine-shapings, and the array of this main body 307a, 307b, 307c, 307d can be arranged on the main reflecting piece.
Fig. 3 m shows the embodiment of the array that main body 307a, 307b, the 307c of three circles of the Optical devices of slim direct-light type LED backlight module of the present utility model forms. Main body 307a, 307b, 307c can machine-shapings, and the array of this main body 307a, 307b, 307c can be arranged on the main reflecting piece.
Notice that Fig. 3 a is embodiment of an integral body to the main body of the Optical devices that Fig. 3 f shows.The main body of the Optical devices that Fig. 3 g shows to Fig. 3 j is embodiment of several discrete individualities.The Optical devices that Fig. 3 k shows to Fig. 3 m be the embodiment of the array that forms of several main bodys.
Fig. 4 a shows the embodiment of shape of hypotenuse 409 in cross section of inner surface of main body 407 of the Optical devices of slim direct-light type LED backlight module of the present utility model.The shape of the hypotenuse 409 in cross section is a straight line, becomes one with the framework bottom surface less than 90 ° of angles.
Fig. 4 b shows the embodiment of shape in cross section 409 of inner surface of main body 407 of the Optical devices of slim direct-light type LED backlight module of the present utility model.The shape of the hypotenuse 409 in cross section is a curve.
Fig. 5 a shows the embodiment of structure of inner surface of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model.The structure of the inner surface of main body 507 is the micro-structurals 511 with scattering function.
Fig. 5 b shows the embodiment of setting on surface of structure of inner surface of main body of the Optical devices of slim direct-light type LED backlight module of the present utility model.The setting on the surface of the structure of the inner surface of main body 507 is to form a reflectance coating 512 on the surface of structure.
Notice that the structure on the inner surface of the main body of Optical devices 507 comprises, but is not limited to the embodiment that Fig. 5 a is showed.The setting on the surface of the structure of the inner surface of the main body of Optical devices comprises, but is not limited to the embodiment that Fig. 5 b is showed.
Fig. 6 a, 6b, 6c, 6d, 6e, 6f show the embodiment of the LED encapsulation of slim direct-light type LED backlight module of the present utility model.The direction of propagation of thick arrow 622 expression LED encapsulation 603 light that send among Fig. 6 a, 6b, 6c, 6d, 6e, the 6f.
Fig. 6 a shows an embodiment of LED encapsulation.The emitting led encapsulation 603 of face is fixed on the circuit board 602, and circuit board 602 is fixed on the support 621, and support 621 is fixed on the base of frame (among the figure not display frame bottom).
Fig. 6 b shows an embodiment of LED encapsulation.Sidelight (side view) LED encapsulation 603 is fixed on the circuit board 602, and circuit board 602 is fixed on the base of frame (among the figure not display frame bottom).
Fig. 6 c shows an embodiment of LED encapsulation.The emitting led encapsulation 603 of face that has lens is fixed on the circuit board 602, and circuit board 602 is fixed on the support 621, and support 621 is fixed on the base of frame (among the figure not display frame bottom).
Fig. 6 d shows an embodiment of LED encapsulation.Lateral type LED encapsulation 603 is fixed on the circuit board 602, and circuit board 602 is fixed on the base of frame (among the figure not display frame bottom).LED encapsulation 603 light that send 622 are to the 360 ° of emissions in side.
Fig. 6 e shows an embodiment of LED encapsulation.The emitting led encapsulation 603 of face that has reflection-light-radiating lens 625 is fixed on the circuit board 602, and circuit board 602 is fixed on the base of frame (among the figure not display frame bottom).The light that sends 622 of LED encapsulation 603 is reflected-light-radiating lens 625 reflection and/or scatterings, to the 360 ° of emissions in side.
Fig. 6 f shows an embodiment of LED encapsulation.The emitting led encapsulation 603 of face that has LGP mirror 626 is fixed on the circuit board 602, and circuit board 602 is fixed on the base of frame (among the figure not display frame bottom).The light that sends 622 of LED encapsulation 603 is changed the direction of propagation by LGP mirror 626, to the 360 ° of emissions in side.
Notice that the LED to the bright dipping of exiting surface the place ahead that (1) Fig. 6 a, Fig. 6 b, Fig. 6 c show encapsulates, be suitable in each unit of Optical devices, adopting two or three LED encapsulation.(2) the LED encapsulation of 360 ° of bright dippings towards periphery of Fig. 6 d, Fig. 6 e, Fig. 6 f displaying is suitable for adopting a LED encapsulation in each unit of Optical devices.
Top concrete description does not limit scope of the present utility model, and only provides some specific illustrations of the present utility model.Therefore covering scope of the present utility model should be determined by claim and their legal equivalents, rather than by above-mentioned specific detailed description and embodiment decision.

Claims (10)

1. a slim direct-light type LED backlight module is characterized in that, comprises framework, lamp plate, Optical devices, main reflecting piece, optical thin film assembly, supportive device; Wherein, described framework comprises base of frame and frame sides; Described lamp plate comprises, circuit board and at least one LED encapsulation, and described LED encapsulation is fixed on the described circuit board; Described Optical devices comprise at least one unit; Described unit comprises at least one main body, the inner surface of described main body is towards the exiting surface of described LED encapsulation, change the direction of propagation when making the inner surface of the described main body of a part of directive of the light that described LED encapsulation is sent, propagate to described optical thin film assembly direction; The bottom of described main reflecting piece is fixed on the described circuit board, forms hole on the precalculated position of described main reflecting piece, makes described LED encapsulation expose from hole; Has the structure that forms by diffusion material on the top surface of described main reflecting piece, change the direction of propagation when making the structure of top surface of the described main reflecting piece of a part of directive of the light that described LED encapsulation is sent, propagate to described optical thin film assembly direction; Described supportive device is supported described optical thin film assembly.
2. the slim direct-light type LED backlight module of claim 1, it is characterized in that, the profile of the top view of the main body of described Optical devices is to select from one group of shape, and this group shape comprises, circle, equilateral triangle, rectangle, regular hexagon, circular arc, linear, broken line shape.
3. the slim direct-light type LED backlight module of claim 1, it is characterized in that, the shape of the hypotenuse in the cross section of the inner surface of the main body of described Optical devices is to select from one group of shape, and this group shape comprises, becomes a straight line less than 90 ° of angles, curve with the framework bottom surface.
4. the slim direct-light type LED backlight module of claim 1, it is characterized in that, the inner surface towards described LED encapsulation of the main body of described Optical devices has structure, the structure of described inner surface is to select from one group of structure, this group structure comprises having had the micro-structural of scattering process on smooth interior surface, the inner surface.
5. the slim direct-light type LED backlight module of claim 1 is characterized in that, the surface of the structure of the inner surface of the main body of described Optical devices comprises, naked surface, formation reflectance coating.
6. the slim direct-light type LED backlight module of claim 1 is characterized in that, a plurality of unit of described Optical devices form array.
7. the slim direct-light type LED backlight module of claim 1 is characterized in that, the structure that is formed by diffusion material on the top surface of described main reflecting piece is to select from one group of structure, and this group structure comprises, the combination of site, net piece, site and net piece.
8. the slim direct-light type LED backlight module of claim 1, it is characterized in that, the structure of described LED encapsulation is to select from one group of structure, this group structure comprises, not with the surface-mount type encapsulation of lens, the surface-mount type encapsulation that has lens, side-light type encapsulation, lateral type encapsulation, have reflection-light-radiating lens encapsulation, have the encapsulation of LGP mirror.
9. the slim direct-light type LED backlight module of claim 1 is characterized in that, the chip of at least one bill coloured light is adopted in described LED encapsulation; The chip of described bill coloured light is to select from a core assembly sheet, and this core assembly sheet comprises, ruddiness, blue light, green glow chip.
10. the slim direct-light type LED backlight module of claim 1 is characterized in that, described LED encapsulation emits white light.
CN2010201404207U 2010-02-26 2010-02-26 Thin type straightly-downward LED (light-emitting diode) backlight module Expired - Fee Related CN201851960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201404207U CN201851960U (en) 2010-02-26 2010-02-26 Thin type straightly-downward LED (light-emitting diode) backlight module

Applications Claiming Priority (1)

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Cited By (7)

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CN102829402A (en) * 2012-09-14 2012-12-19 京东方科技集团股份有限公司 Direct type backlight module and display device thereof
CN103511885A (en) * 2012-06-27 2014-01-15 Lg伊诺特有限公司 Lighting device
CN103528024A (en) * 2013-10-31 2014-01-22 京东方科技集团股份有限公司 Light guiding element, backlight source and display device
WO2016029809A1 (en) * 2014-08-26 2016-03-03 蔡鸿 Led direct-lit backlight source and light emission method therefor
CN106641884A (en) * 2016-12-27 2017-05-10 四川联恺照明有限公司 LED light source capable of realizing uniform luminescence
EP3211298A4 (en) * 2014-10-22 2017-11-29 LG Innotek Co., Ltd. Lighting apparatus and vehicular lamp comprising same
CN109581743A (en) * 2018-12-24 2019-04-05 惠州市德赛西威汽车电子股份有限公司 A kind of slim high-new dynamic back lighting device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103511885A (en) * 2012-06-27 2014-01-15 Lg伊诺特有限公司 Lighting device
CN103511885B (en) * 2012-06-27 2016-06-08 Lg伊诺特有限公司 Means of illumination
CN102829402A (en) * 2012-09-14 2012-12-19 京东方科技集团股份有限公司 Direct type backlight module and display device thereof
CN102829402B (en) * 2012-09-14 2015-02-04 京东方科技集团股份有限公司 Direct type backlight module and display device thereof
CN103528024A (en) * 2013-10-31 2014-01-22 京东方科技集团股份有限公司 Light guiding element, backlight source and display device
WO2015062259A1 (en) * 2013-10-31 2015-05-07 京东方科技集团股份有限公司 Light guide element, backlight source and display device
WO2016029809A1 (en) * 2014-08-26 2016-03-03 蔡鸿 Led direct-lit backlight source and light emission method therefor
EP3211298A4 (en) * 2014-10-22 2017-11-29 LG Innotek Co., Ltd. Lighting apparatus and vehicular lamp comprising same
US10300836B2 (en) 2014-10-22 2019-05-28 Lg Innotek Co., Ltd. Lighting apparatus and vehicular lamp comprising the same
CN106641884A (en) * 2016-12-27 2017-05-10 四川联恺照明有限公司 LED light source capable of realizing uniform luminescence
CN109581743A (en) * 2018-12-24 2019-04-05 惠州市德赛西威汽车电子股份有限公司 A kind of slim high-new dynamic back lighting device

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