CN106641884A - LED light source capable of realizing uniform luminescence - Google Patents
LED light source capable of realizing uniform luminescence Download PDFInfo
- Publication number
- CN106641884A CN106641884A CN201611221668.4A CN201611221668A CN106641884A CN 106641884 A CN106641884 A CN 106641884A CN 201611221668 A CN201611221668 A CN 201611221668A CN 106641884 A CN106641884 A CN 106641884A
- Authority
- CN
- China
- Prior art keywords
- led
- wiring board
- line plate
- led chip
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004020 luminiscence type Methods 0.000 title abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 31
- 239000000741 silica gel Substances 0.000 claims description 27
- 229910002027 silica gel Inorganic materials 0.000 claims description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000011324 bead Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The invention provides an LED light source capable of realizing uniform luminescence. The LED light source capable of realizing uniform luminescence comprises an LED chip, a first circuit board and a second circuit board, wherein the first circuit board is a flexible circuit board. The LED chip is welded and fixed to one surface of the first circuit board and electrically connected with the first circuit board, a first bonding pad is arranged on the first circuit board located at one side of the LED chip, and the first circuit board is welded and fixed to one surface of the second circuit board through the first bonding pad; a plurality of light-transmitting holes are formed in the first circuit board located at the other side of the LED chip at intervals; and after the first circuit board is bent twice along the boundary area of the LED chip and the light-transmitting holes and the boundary area of the LED chip and the first bonding pad, the area corresponding to the LED chip, of the first circuit board, forms a certain included angle with the second circuit board, and the area corresponding to the light-transmitting holes, of the first circuit board, is approximately parallel to the second circuit board. The LED light source capable of realizing uniform luminescence, which is provided by the invention, has the advantage of uniform light emitting.
Description
Technical field
The present invention relates to a kind of light-emitting device, more particularly to a kind of LED/light source of uniformly light-emitting.
Background technology
Existing LED-backlit source plate, because producer considers the cost of product, mostly using plug-in unit LED lamp bead, due to plug-in unit
The condenser performance spy of LED lamp bead is good, so producer is carried out with regard to application reflection or optics diffusion principle to the light assembled
Diverging, to reach the purpose of lighting uniform in the plane.Because the difference of component parameter and the precision of optical element differ
Cause, ultimately result in flat luminous uneven, the light-out effect for making product is had a greatly reduced quality.
The content of the invention
Technical problem underlying to be solved by this invention is to provide a kind of LED/light source, realizes the light-out effect of uniformly light-emitting.
In order to solve above-mentioned technical problem, the invention provides the LED/light source of uniformly light-emitting, including LED chip, also wrap
First line plate and the second wiring board are included, the first line plate is FPC；
The LED chip is fixed on the one side of first line plate, and electrically connects with the first line plate, positioned at described
The first line plate of LED chip side is provided with the first pad, and first line plate weld is fixed on into institute by the first pad
State the one side of the second wiring board；The first line plate positioned at the LED chip opposite side is interval with multiple loopholes；
The first line plate passes through the border region and the LED core along the LED chip with the loophole
After piece bends twice with the border region of first pad, the first line plate correspondence LED core panel region with it is described
Second wiring board angle at an angle, the corresponding printing opacity bore region of the first line plate is big with second wiring board
Cause parallel.
In a preferred embodiments, the first line plate is lamina, and first pad is arranged at and the LED chip
Identical one side.
In a preferred embodiments, the first line plate is doubling plate, and first pad is arranged at and the LED chip
Relative another side.
In a preferred embodiments, the one side of second wiring board is wiring layer, and the second wiring board one side is near side
Acies side is provided with the second pad, and second pad is electric respectively with first pad by the wiring of second wiring board
Connection, second pad is electrically connected with external power source.
In a preferred embodiments, second wiring board is provided with multiple first line plates, multiple First Lines
Road plate is located on the same line and is spaced from each other a distance.
In a preferred embodiments, the first line plate corresponds to the folder of the LED core panel region and second wiring board
Angle is 90 °.
In a preferred embodiments, the LED chip is fixed by tin cream with first line plate weld.
In a preferred embodiments, the one side that second wiring board is connected with the first line plate is filled with silica gel, fills out
The thickness for filling the silica gel is roughly equal to the distance of second wiring board with the loophole, the LED chip parcel envelope
Loaded in the silica gel.
In a preferred embodiments, a part of light that the LED chip sends is after silica gel refraction by the silicon
The surface of glue is projected, and another part light that the LED chip 1 is sent is after the refraction of the silica gel by the loophole
Project.
In a preferred embodiments, the surface of the surface of the first line plate and second wiring board has certain
Reflection action, the light that the part LED sends refracts to the table of second wiring board and/or first line plate through silica gel
The silica gel is reflected back toward behind face, then is projected from the Silica Surface.
Compared with prior art, the LED/light source that the present invention is provided, by using FPC as first line plate,
Allow first line plate along the LED chip and the border region of the loophole and the LED chip with it is described
After the border region of the first pad bends twice；Light that LED chip a sends part sends from loophole, another part Jing the
The surface of the surface of one wiring board and/or the second wiring board is projected after secondary reflection again, has reached the effect of uniformly light-emitting.
Description of the drawings
Fig. 1 is the structure front view that LED chip is fixed on first line plate in the 1st embodiment of the invention；
Fig. 2 is the top view of structure shown in Fig. 1；
Fig. 3 is the upward view of structure shown in Fig. 1；
Fig. 4 is that first line plate is fixed on the second wiring board, the knot before the bending of first line plate in the 1st embodiment of the invention
Structure front view；
Fig. 5 is the top view of structure shown in Fig. 4；
Fig. 6 is structure front view of the first line plate Jing after bending twice in Fig. 4；
Fig. 7 is the top view of structure shown in Fig. 6；
Fig. 8 is the light path schematic diagram of structure shown in Fig. 6；
Fig. 9 is the front view after structure filling silica gel shown in Fig. 6；
Figure 10 is the structure front view that LED chip is fixed on first line plate in the 2nd embodiment of the invention；
Figure 11 is that first line plate is fixed on the second wiring board in the 2nd embodiment of the invention, after the bending of first line plate
Structure front view；
Figure 12 is the diagrammatic elevation view after structure filling silica gel shown in Figure 10.
Description of reference numerals：
1 LED chip 2a first line plate
2 first line plate the first pads of 21a
The wiring board of 21 first pad 3 second
The pad of 22 loophole 31 second
The silica gel of 23 via 4
L1 the first light the second light of L2
Specific embodiment
Below in conjunction with the accompanying drawings the LED/light source of the uniformly light-emitting of the present invention is further described with specific embodiment.
Embodiment 1
With reference to Fig. 4, the LED/light source of uniformly light-emitting, including LED chip 1, it is flip LED chips；Also include first line
The wiring board 3 of plate 2 and second, for the ease of bending, the first line plate 2 is FPC.
Referring to figs. 1 to Fig. 3, in the present embodiment the first line plate 2 is doubling plate, and the LED chip 1 is fixed on the
The one side of one wiring board 2, and electrically connect with the first line plate 2, the LED chip 1 is welded by tin cream with first line plate 2
Connect fixation.The first line plate 2 positioned at the side of the LED chip 1 is provided with two the first pads 21, first pad 21
The another side relative with the LED chip 1 is arranged at, first pad 21 is with the LED chip 1 by the first line
The wiring electrical connection of plate 2.The first line plate 2 is additionally provided with two mistakes between first pad 21 and the LED chip 1
Hole 23, the via 23 is used to the wiring of the first line plate 2 and is communicated to from the one side for being provided with the LED chip 1 be provided with the
The wiring of the another side of one pad 21, so as to realize the electrical connection of LED chip 1 and first pad 21.By the first pad
21 one sides that first line plate 2 is fixedly welded on second wiring board 3.Positioned at described the of the opposite side of the LED chip 1
One wiring board 2 is interval with multiple loopholes 22, and the loophole 22 is used for some light that the LED chip 1 sends therefrom
Appear.The loophole 22 can be the shapes such as circle, regular polygon, preferably circular in the present embodiment.
With reference to Fig. 5 to Fig. 7, the first line plate 2 passes through the boundary along the LED chip 1 with the loophole 22
After region and the LED chip 1 bend twice with the border region of first pad 21, and the direction phase for bending twice
Together, left image shape of the first line plate 2 in " Contraband " word, the first line plate 2 correspondence region of LED chip 1 with
Second wiring board 3 angle at an angle, the corresponding region of loophole 22 of the first line plate 2 and described second
Wiring board 3 is almost parallel.In the present embodiment, the first line plate 2 corresponds to the region of LED chip 1 and second circuit
The angle of plate 3 is 90 °.
The one side of second wiring board 3 is wiring layer, and the one side of the second wiring board 3 is provided with two near marginal end side
Individual second pad 31, second pad 31 is electrically connected respectively by the wiring of second wiring board 3 and first pad 21
Connect, second pad 31 is electrically connected with external power source (not shown).So, external power source can pass through the second wiring board 3
The first pads of Jing 21 are connected with the LED chip 1.
Refer to Fig. 4 to Fig. 7, second wiring board 3 is provided with multiple first line plates 2, multiple described first
Wiring board 2 is located on the same line and is spaced from each other a distance.Refer to the surface of first line plate 2 described in Fig. 8 with
And the surface of second wiring board 3 has certain reflection action, so, the light of part first that the LED chip 1 sends
L1 is appeared by the loophole 22, and the second light L2 of another part is irradiated to surface and/or second circuit of first line plate 2
The surface back reflection of plate 3 is projected so that the illumination effect of LED chip 1 is more uniformly distributed.
Refer to Fig. 7 and Fig. 9, in order to further lift the light-out effect of LED chip 1, second wiring board 3 with it is described
The one side of the connection of first line plate 2 is filled with silica gel 4, fills the thickness and the loophole 22 to described second of the silica gel 4
The distance of wiring board 3 is roughly equal, and the wrapping and encapsulating of the LED chip 1 is in the silica gel 4.The LED chip 1 send one
Some light (not shown) is projected after the refraction of the silica gel 4 by the surface of the silica gel 4, and the LED chip 1 is sent
Another part light projected by the loophole 22 after the refraction of the silica gel 4；Also LED described in other parts sends
Light be reflected back toward the silica gel behind the surface that silica gel 4 refracts to second wiring board 3 and/or first line plate 2
4, then project from the surface of the silica gel 4.Therefore, above-mentioned LED/light source can more reach the light-out effect of uniformly light-emitting.
Embodiment 2
With reference to Figure 10 to Figure 12, the LED/light source of another kind of uniformly light-emitting is present embodiments provided, with embodiment 1 not
Be：In the present embodiment the first line plate 2 is lamina, positioned at the first line of the side of the LED chip 1
Plate 2 is provided with two the first pads 21, and first pad 21 is arranged at and the identical of the LED chip 1 one side, first weldering
Disk 21 directly can be electrically connected by wiring with the LED chip 1, without the need for arranging via 23 again；The first line plate 2 is passed through
Along the LED chip 1 and the border region of the loophole 22 and the LED chip 1 and first pad 21 point
After battery limit (BL) domain bends twice, and primary overbending direction and second overbending direction conversely, the first line plate 2 substantially
In alphabetical " Z " word shape.
Remaining setting of the present embodiment is identical with embodiment 1, and acquired optical effect is also identical with implementing 1,
Will not be described here.
Present pre-ferred embodiments are these are only, it is all in spirit of the invention and principle not to limit the present invention
Within, any modification, equal replacement, improvement for being made etc. should be included within the scope of protection of the invention.
Claims (10)
1. the LED/light source of uniformly light-emitting, including LED chip, it is characterised in that：Also include first line plate and the second wiring board,
The first line plate is FPC；
The LED chip is fixed on the one side of first line plate, and electrically connects with the first line plate, positioned at the LED core
The first line plate of piece side is provided with the first pad, and first line plate weld is fixed on into described second by the first pad
The one side of wiring board；The first line plate positioned at the LED chip opposite side is interval with multiple loopholes；
The first line plate through the border region and the LED chip along the LED chip and the loophole with
After the border region of first pad bends twice, the corresponding LED core panel region of the first line plate and described second
Wiring board angle at an angle, the corresponding printing opacity bore region of the first line plate is substantially put down with second wiring board
OK.
2. the LED/light source of uniformly light-emitting according to claim 1, it is characterised in that：The first line plate be lamina, institute
State the first pad to be arranged at and LED chip identical one side.
3. the LED/light source of uniformly light-emitting according to claim 1, it is characterised in that：The first line plate be doubling plate, institute
State the first pad and be arranged at the another side relative with the LED chip.
4. the LED/light source of uniformly light-emitting according to claim 1, it is characterised in that：The one side of second wiring board is
Wiring layer, the second wiring board one side is provided with the second pad near marginal end side, and second pad passes through described second
The wiring of wiring board is electrically connected with first pad, and second pad is electrically connected with external power source.
5. the LED/light source of uniformly light-emitting according to claim 4, it is characterised in that：Second wiring board is provided with many
The individual first line plate, multiple first line plates are located on the same line and are spaced from each other a distance.
6. the LED/light source of uniformly light-emitting according to claim 1, it is characterised in that；The corresponding LED of the first line plate
Chip area is 90 ° with the angle of second wiring board.
7. the LED/light source of uniformly light-emitting according to claim 1, it is characterised in that：The LED chip is by tin cream and the
One wiring board is welded and fixed.
8. the LED/light source of uniformly light-emitting according to claim 5, it is characterised in that：Second wiring board and described first
The one side of wiring board connection is filled with silica gel, fill the thickness of the silica gel and the loophole to second wiring board away from
From roughly equal, the LED chip wrapping and encapsulating is in the silica gel.
9. the LED/light source of uniformly light-emitting according to claim 8, it is characterised in that：The part that the LED chip sends
Light is projected after silica gel refraction by the surface of the silica gel, and another part light that the LED chip is sent leads to
Cross after the refraction of the silica gel and projected by the loophole.
10. the LED/light source of uniformly light-emitting according to claim 8, it is characterised in that：The surface of the first line plate with
And the surface of second wiring board has certain reflection action, the light that the part LED sends is refracted to through silica gel
The silica gel is reflected back toward behind the surface of second wiring board and/or first line plate, then is projected from the Silica Surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611221668.4A CN106641884A (en) | 2016-12-27 | 2016-12-27 | LED light source capable of realizing uniform luminescence |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611221668.4A CN106641884A (en) | 2016-12-27 | 2016-12-27 | LED light source capable of realizing uniform luminescence |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106641884A true CN106641884A (en) | 2017-05-10 |
Family
ID=58831419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611221668.4A Pending CN106641884A (en) | 2016-12-27 | 2016-12-27 | LED light source capable of realizing uniform luminescence |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106641884A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0593059U (en) * | 1992-05-23 | 1993-12-17 | 株式会社小糸製作所 | Linear light emitting device |
| CN201129643Y (en) * | 2007-12-04 | 2008-10-08 | 胜华科技股份有限公司 | Light source module group and back light module group with the same |
| CN201851960U (en) * | 2010-02-26 | 2011-06-01 | 金芃 | Thin type straightly-downward LED (light-emitting diode) backlight module |
| CN202216081U (en) * | 2011-07-29 | 2012-05-09 | 北京京东方光电科技有限公司 | Back light source capable of adjusting light locally and liquid crystal display module |
| US20140376219A1 (en) * | 2011-03-25 | 2014-12-25 | Sharp Kabushiki Kaisha | Light-emitting device, illuminating apparatus, and display apparatus |
| CN104979124A (en) * | 2014-04-11 | 2015-10-14 | 群光电能科技股份有限公司 | Flexible circuit board having shielding effect and applied to keyboard backlight |
| CN105957947A (en) * | 2016-05-16 | 2016-09-21 | 漳州立达信光电子科技有限公司 | LED area light source and preparation method thereof |
| CN206352770U (en) * | 2016-12-27 | 2017-07-25 | 四川联恺照明有限公司 | The LED/light source of uniformly light-emitting |
-
2016
- 2016-12-27 CN CN201611221668.4A patent/CN106641884A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0593059U (en) * | 1992-05-23 | 1993-12-17 | 株式会社小糸製作所 | Linear light emitting device |
| CN201129643Y (en) * | 2007-12-04 | 2008-10-08 | 胜华科技股份有限公司 | Light source module group and back light module group with the same |
| CN201851960U (en) * | 2010-02-26 | 2011-06-01 | 金芃 | Thin type straightly-downward LED (light-emitting diode) backlight module |
| US20140376219A1 (en) * | 2011-03-25 | 2014-12-25 | Sharp Kabushiki Kaisha | Light-emitting device, illuminating apparatus, and display apparatus |
| CN202216081U (en) * | 2011-07-29 | 2012-05-09 | 北京京东方光电科技有限公司 | Back light source capable of adjusting light locally and liquid crystal display module |
| CN104979124A (en) * | 2014-04-11 | 2015-10-14 | 群光电能科技股份有限公司 | Flexible circuit board having shielding effect and applied to keyboard backlight |
| CN105957947A (en) * | 2016-05-16 | 2016-09-21 | 漳州立达信光电子科技有限公司 | LED area light source and preparation method thereof |
| CN206352770U (en) * | 2016-12-27 | 2017-07-25 | 四川联恺照明有限公司 | The LED/light source of uniformly light-emitting |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170510 |