CN105957947A - LED area light source and preparation method thereof - Google Patents
LED area light source and preparation method thereof Download PDFInfo
- Publication number
- CN105957947A CN105957947A CN201610325646.6A CN201610325646A CN105957947A CN 105957947 A CN105957947 A CN 105957947A CN 201610325646 A CN201610325646 A CN 201610325646A CN 105957947 A CN105957947 A CN 105957947A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- reflector
- led chip
- light source
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
An LED area light source provided by the present invention comprises a circuit board, a reflector and at least one LED chip, the LED chip is connected with the circuit board electrically, and the circuit board is fixed on the reflector and has an included angle with the reflector. The LED chip is arranged on the circuit board, and the reflector is used to reflect the light rays emitted out by the LED chip towards a direction far away from the reflector. The present invention also relates to a preparation method of the LED area light source. According to the LED area light source of the present invention, the light is emitted out uniformly from the right side and the side surfaces of the LED area light source, thereby realizing the uniform light emission.
Description
Technical field
The present invention relates to LED field, particularly relate to a kind of LED area light source and preparation method thereof.
Background technology
LED is through years development, and technology is the most ripe, considerably reduces its production cost, can be abundant
Play its cost and the advantage of scale, it is achieved cost is reasonable, the LED flexible surface light source illuminating product of stay in grade.
But, existing LED flexible surface light source, LED chip is typically all directly anchored on substrate.
Such as, the Chinese patent of Publication No. CN104319273A, disclose a kind of LED light source, including
Substrate and at least two LED chip, each LED chip is fixed on substrate, and substrate surface is provided with at least one
Individual membrane electrode, at least one electrode of at least one LED chip electrically connects with corresponding membrane electrode.
But, the LED light source of the program, LED chip and the substrate state in laminating, luminescence concentrates on close
The position of LED chip, non-uniform light.
Summary of the invention
The technical problem to be solved is: provide a kind of uniform LED area light source of light-emitting area；Enter one
Step provides the preparation method of a kind of LED area light source.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is:
A kind of LED area light source, including wiring board, reflector and at least one LED chip, described LED
Chip electrically connects with described wiring board, and described wiring board is fixed on this reflector, described wiring board and described
Reflector be angle arrange, described LED chip is arranged on described wiring board, described reflector for towards
The light that described LED chip sends is reflected in direction away from this reflector.
Another technical scheme that the present invention provides is:
The preparation method of a kind of LED area light source, is arranged at the LED chip of at least one on wiring board, so
After the wiring board being provided with LED chip is arranged on reflector, along the periphery of described LED chip by described
LED chip and wiring board separate from described reflector, do not seal until forming one on described reflector
The tangent line closed, is then bent described LED chip and wiring board, so by described untight tangent line
After on this reflector, site is set, it is thus achieved that described area source.
The beneficial effects of the present invention is:
(1) LED area light source of the present invention, wiring board and reflector are angle, and LED chip is arranged on this
On wiring board, therefore LED chip and reflector are also in angle, thus the light that LED chip sends is from reflector
Front, side uniformly penetrate, and no longer concentrate on the position near LED chip, can be formed and uniformly go out light
LED area light source.
(2) preparation method of the LED area light source of the present invention, by LED chip and carry LED chip
Wiring board separates from reflector so that wiring board is not exclusively connected with reflector, and then can be by LED
Chip and wiring board are by the local bending not exclusively connected so that LED chip and reflector are in a certain angle,
The light that LED chip sends can from the front of reflector, side injection, thus prepare uniform in light emission
LED area light source.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED area light source of the embodiment of the present invention；
Fig. 2 is the structural representation of the LED area light source of the embodiment of the present invention one；
Fig. 3 is the structural representation of the LED area light source of the embodiment of the present invention two；
Fig. 4 is the top view of the LED area light source of the embodiment of the present invention two；
Fig. 5 is the structural representation of the LED area light source of the embodiment of the present invention three.
Label declaration:
1, wiring board；2, reflector；3, LED chip；4, cover plate；5, fixture；6, site；7、
Encapsulated layer.
Detailed description of the invention
By describing the technology contents of the present invention in detail, being realized purpose and effect, below in conjunction with embodiment also
Accompanying drawing is coordinated to be explained.
The design of most critical of the present invention is: LED chip and wiring board are that angle is arranged, so that light is disperseed,
Obtain the LED area light source uniformly going out light.
Refer to Fig. 1, the present invention provides a kind of LED area light source, including wiring board 1, reflector 2 and extremely
A few LED chip 3, described LED chip 3 electrically connects with described wiring board 1, and described wiring board 1 is solid
Being scheduled on this reflector 2, described wiring board 1 is arranged in angle with described reflector 2, described LED chip
3 are arranged on described wiring board 1, and described reflector 2 is for being directed away from the direction reflection institute of this reflector 2
State the light that LED chip 3 sends.
Knowable to foregoing description, having the beneficial effects that of LED area light source of the present invention: LED chip 3 is with reflective
Plate 2 is arranged in certain angle, and the light that LED chip 3 sends uniformly is penetrated from the front of reflector 2, side
Go out, form the LED area light source uniformly going out light.
Further, this wiring board 1 is one-body molded with this reflector 2, and described reflector 2 is provided with circuit
And described circuit electrically connects with the LED chip 3 on this wiring board 1.
Knowable to foregoing description, wiring board 1 and reflector 2 are one-body molded, simple in construction, firm.Circuit
Plate 1 and reflector 2 are alternatively two independent parts, and concrete setting can be adjusted according to reality application.
Further, also include that cover plate 4, described wiring board 1 are provided with the opening of at least one, described opening
Being arranged at wiring board 1 and the position of reflector 2 connection, described cover plate 4 covers described opening.
Knowable to foregoing description, cover plate 4 is set to cover the part of opening between wiring board 1 and reflector 2,
Opening is filled with, it is ensured that LED chip 3 and circuit normally work.
Further, this wiring board 1 is flexible base board with this reflector 2, also includes fixture 5, described
Fixture 5 is rigid structure, and a face of described fixture 5 is fixed on described reflector 2, described solid
Another face of locking member 5 is fixed on this wiring board 1, so that this wiring board 1 and this reflector 2 are in angle
Arrange.
Knowable to foregoing description, by fixture 5, LED chip 3 is fixed, thus wiring board 1 He
Between reflector 2, volume angle is fixed, moreover it is possible to avoid LED chip 3 to come off from wiring board 1.
Further, also including that site 6, described site 6 are arranged on this reflector 2, described site 6 is used
In reflecting the light that described LED chip 3 sends.
Knowable to foregoing description, the light that LED chip 3 sends is reflected after running into site 6, is originally going out light
The total reflection that side is upwardly formed is destroyed.
Further, also include that encapsulated layer 7, described encapsulated layer 7 cover the LED chip of described wiring board 1
3 and this reflector 2.
Knowable to foregoing description, the LED chip 3 on wiring board 1 and reflector 2 are sealed by encapsulated layer 7
Dress, carries out LED chip 3 sealing protection.
Another technical scheme of the present invention is:
The preparation method of a kind of LED area light source, is arranged at the LED chip of at least one on wiring board, so
After the wiring board being provided with LED chip is arranged on reflector, along the periphery of described LED chip by described
LED chip and wiring board separate from described reflector, do not seal until forming one on described reflector
The tangent line closed, is then bent described LED chip and wiring board, so by described untight tangent line
After on this reflector, site is set, it is thus achieved that described area source.
Knowable to foregoing description, having the beneficial effects that of the preparation method of LED area light source of the present invention:
LED chip and wiring board are separated from reflector such that it is able to by LED chip and wiring board
By the local bending separated so that LED chip and reflector are in a certain angle, the light that LED chip sends
Can from the front of reflector, side injection, formed uniform in light emission LED area light source.
Further, fixture is set on wiring board, makes the described LED chip after bending be fixed on circuit
On plate.
Knowable to foregoing description, by setting fixture in the circuit board, LED chip is fixed on this wiring board
On, prevent LED chip from coming off.
Further, the surrounding of the LED chip after bending and site is packaged.
Knowable to foregoing description, by LED chip is sealed by the encapsulation of the surrounding of LED chip and site
Protection.
Refer to Fig. 2, embodiments of the invention one are:
A kind of LED area light source is many including multiple wiring boards 1, reflector 2, multiple LED chip 3 one-level
Individual cover plate 4, described wiring board 1, cover plate 4 quantity consistent with the quantity of described LED chip 3, described
Wiring board 1 is vertically arranged with reflector 2, and the position that reflector 2 is connected with each wiring board 1 is provided with out
Mouthful；Single LED chip 3 is fixed on single described wiring board 1 by tin cream；Described wiring board 1
On be provided with that right angle is fixing to be fixed for LED chip 3；Described cover plate 4 covers described opening.Wherein,
Described wiring board 1 and reflector 2 are flexible circuit board, and described wiring board 1 becomes with reflector 2 one
Type.As in figure 2 it is shown, the light direction that the direction of arrow indication is LED chip 3.
Refer to Fig. 3 and Fig. 4, embodiments of the invention two are:
A kind of LED area light source, the difference with above-described embodiment one is, described reflector 2 is provided with projection
Site 6；Described wiring board 1 is arranged at the one side being provided with circuit away from described reflector 2, described site 6
It is arranged at reflector 2 and is not provided with the one side of circuit.As shown in Fig. 2 and Fig. 4.By protruding site 6
The light preventing LED chip 3 from sending forms total reflection, light direction as shown by arrows in FIG..
Refer to Fig. 5, embodiments of the invention three are:
A kind of LED area light source, the difference with above-described embodiment one and embodiment two is, also includes silica gel system
The encapsulated layer 7 become, described encapsulated layer 7 is arranged at reflector 2 and is not provided with the one side of circuit, and is coated with described
LED chip 3；LED chip 3 on whole wiring board and wiring board can also be wrapped by described encapsulated layer 7
Cover.Described encapsulated layer is rough near the inner surface of LED chip 3, it is to avoid LED chip 3 sends
Light package surface formed total reflection.
Embodiments of the invention four are:
A kind of preparation method of LED area light source, multiple LED chip is fixing in the circuit board by tin cream,
And use right angle fix pin by fixing for LED chip in the circuit board；Then the periphery along each LED chip will
LED chip and wiring board separate from reflector, until forming an otch；Then by described LED
Chip and wiring board are bent by this otch；On described reflector, an opening is formed after bending；Will
Described opening wiring board covers.Preferably, described wiring board is flexible circuit board.
Embodiments of the invention five are:
The preparation method of a kind of LED area light source, the difference with above-described embodiment four is, described LED chip
The one side being not provided with circuit towards described reflector with wiring board bends, and is not provided with circuit at described reflector
The site of projection is set in one side.Described site can also be arranged on other light directions of LED chip, also
Can be inner concavity, as long as being capable of destroying the total reflection of the light that LED chip sends.
Embodiments of the invention six are:
The preparation method of a kind of LED area light source, the difference with above-described embodiment four and embodiment five is, will
The inner surface of the packaging part that silica gel is made is arranged to rough, is then coated on LED chip and site
Surrounding, whole wiring board and LED chip can also be coated with by this packaging part.
In sum, the LED area light source that the present invention provides, LED chip and reflector are that angle is arranged, light
Uniformly penetrate from the front of reflector and side, it is achieved uniformly go out light.The preparation of the LED area light source of the present invention
Method, by LED chip and the wiring board being provided with LED chip being separated from reflector, makes LED
Chip and reflector shape are at a certain angle, it is achieved front and side uniformly go out light.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every profit
The equivalents made by description of the invention and accompanying drawing content, or directly or indirectly it is used in relevant technology
Field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (10)
1. a LED area light source, including wiring board, reflector and at least one LED chip, described LED
Chip electrically connects with described wiring board, it is characterised in that described wiring board is fixed on this reflector, described
Wiring board and described reflector are that angle is arranged, and described LED chip is arranged on described wiring board, described instead
Tabula rasa reflects, for the direction being directed away from this reflector, the light that described LED chip sends.
LED area light source the most according to claim 1, it is characterised in that this wiring board is reflective with this
Plate is one-body molded, and described reflector is provided with circuit and described circuit is electrically connected with the LED chip on this wiring board
Connect.
LED area light source the most according to claim 1, it is characterised in that also include cover plate, described
Wiring board is provided with the opening of at least one, and described opening is arranged at wiring board and the position of reflector connection,
Described cover plate covers described opening.
LED area light source the most according to claim 2, it is characterised in that this wiring board is reflective with this
Plate is flexible base board, also includes that fixture, described fixture are rigid structure, of described fixture
Face is fixed on described reflector, and another face of described fixture is fixed on this wiring board, so that this line
Road plate and this reflector are that angle is arranged.
LED area light source the most according to claim 1, it is characterised in that also include site, described
Site is arranged on this reflector, and described site is for reflecting the light that described LED chip sends.
LED area light source the most according to claim 1, it is characterised in that also include encapsulated layer, institute
State encapsulated layer and cover the LED chip on described wiring board and this reflector.
LED area light source the most according to claim 2, it is characterised in that include plural line
Road plate, plural described wiring board is disposed on described reflector.
8. the preparation method of a LED area light source, it is characterised in that the LED chip of at least one is set
It is placed on wiring board, then the wiring board being provided with LED chip is arranged on reflector, along described LED core
Described LED chip and wiring board are separated from described reflector by the periphery of sheet, until described reflective
Form a untight tangent line on plate, then described LED chip and wiring board are passed through described unclosed tangent line
Carrying out bend, then site is set on this reflector, it is thus achieved that described area source.
The preparation method of LED area light source the most according to claim 8, it is characterised in that in circuit
Fixture is set on plate, makes the described LED chip after bending be fixed on wiring board.
The preparation method of LED area light source the most according to claim 8, it is characterised in that to bending
After LED chip and the surrounding of site be packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610325646.6A CN105957947B (en) | 2016-05-16 | 2016-05-16 | LED area light source and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610325646.6A CN105957947B (en) | 2016-05-16 | 2016-05-16 | LED area light source and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105957947A true CN105957947A (en) | 2016-09-21 |
| CN105957947B CN105957947B (en) | 2019-01-18 |
Family
ID=56912100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610325646.6A Active CN105957947B (en) | 2016-05-16 | 2016-05-16 | LED area light source and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105957947B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106641884A (en) * | 2016-12-27 | 2017-05-10 | 四川联恺照明有限公司 | LED light source capable of realizing uniform luminescence |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2630892Y (en) * | 2003-05-24 | 2004-08-04 | 鸿富锦精密工业（深圳）有限公司 | LED area source |
| CN1837930A (en) * | 2005-01-24 | 2006-09-27 | 西铁城电子股份有限公司 | Planar light source unit |
| JP4411732B2 (en) * | 2000-03-02 | 2010-02-10 | 日亜化学工業株式会社 | Planar light emitting device |
| CN102261584A (en) * | 2010-05-31 | 2011-11-30 | 启耀光电股份有限公司 | Light-emitting module |
| CN103928594A (en) * | 2014-03-21 | 2014-07-16 | 京东方科技集团股份有限公司 | Light-emitting device |
-
2016
- 2016-05-16 CN CN201610325646.6A patent/CN105957947B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4411732B2 (en) * | 2000-03-02 | 2010-02-10 | 日亜化学工業株式会社 | Planar light emitting device |
| CN2630892Y (en) * | 2003-05-24 | 2004-08-04 | 鸿富锦精密工业（深圳）有限公司 | LED area source |
| CN1837930A (en) * | 2005-01-24 | 2006-09-27 | 西铁城电子股份有限公司 | Planar light source unit |
| CN102261584A (en) * | 2010-05-31 | 2011-11-30 | 启耀光电股份有限公司 | Light-emitting module |
| CN103928594A (en) * | 2014-03-21 | 2014-07-16 | 京东方科技集团股份有限公司 | Light-emitting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106641884A (en) * | 2016-12-27 | 2017-05-10 | 四川联恺照明有限公司 | LED light source capable of realizing uniform luminescence |
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| Publication number | Publication date |
|---|---|
| CN105957947B (en) | 2019-01-18 |
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Effective date of registration: 20210706 Address after: 629000 Sichuan Suining economic and Technological Development Zone Microelectronics Industrial Park workshop Patentee after: Suining Heidexin Photoelectric Technology Co.,Ltd. Address before: 363900 Xingtai Industrial Park, Changtai County Economic Development Zone, Zhangzhou, Fujian Patentee before: Zhangzhou Lidaxin Optoelectronic Technology Co.,Ltd. |
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