CN103872219B - A kind of LED package support and LED illuminator - Google Patents
A kind of LED package support and LED illuminator Download PDFInfo
- Publication number
- CN103872219B CN103872219B CN201410101543.2A CN201410101543A CN103872219B CN 103872219 B CN103872219 B CN 103872219B CN 201410101543 A CN201410101543 A CN 201410101543A CN 103872219 B CN103872219 B CN 103872219B
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- CN
- China
- Prior art keywords
- bowl
- led
- plastic layer
- package support
- sinking
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The present invention is applicable to lighting technical field, provide a kind of LED support, including the metal substrate with sinking bowl, the medial surface of sinking bowl has plastic layer, plastic layer extends to the periphery of sinking bowl and forms cup edge, and the vertical dimension bottom the upper surface on cup edge to bowl is 1/3～3 times of chip thickness；The subtended angle in the often group relative inner face of plastic layer is less than 60 °；Also including the outer sealing of plastic cement, form reflector on metal substrate, reflector is one-body molded with plastic layer.The present invention directly one-body molded sinking bowl on metal substrate, saves operation, improves production efficiency；The degree of depth of plastic cement bowl is set to 1/3～3 times of chip thickness, medial surface subtended angle is defined to 60 °, chip sides extinction can be avoided and ensure that front normally goes out light, improve the luminous efficiency of LED；At bowl surface configuration plastic layer, facilitate the setting of the degree of depth and angle；Reflector is one-body molded with plastic layer, improves the reliability of LED.
Description
Technical field
The present invention relates to technical field of LED illumination, particularly relate to a kind of LED package support and LED is luminous
Body.
Background technology
LED is one of current widely used light source, in the manufacturing process of LED, generally at core
Sheet surrounding makes box dam, in order to coating fluorescent glue or packaging plastic, or stops the absorption to light of the chip sidewall.
Existing box dam manufacture method is to make box dam before packaging on substrate, is then arranged on one by one by chip and encloses
In the middle of dam, this mode complex procedures, inefficient, too increase cost, and owing to box dam is independent
On substrate, permanent use has deformation hidden danger, affects the reliability of LED.
Summary of the invention
It is an object of the invention to provide a kind of novel LED package support, it is intended to simplify operation, improve raw
Produce efficiency, and improve its reliability.
The present invention is achieved in that a kind of LED package support, including metal substrate, described metal substrate
Having sinking bowl integrated with it, the medial surface of described sinking bowl has plastic layer, described plastic cement
Layer extends towards the periphery of described sinking bowl from described inner side and forms cup edge, and the upper surface on described cup edge is to institute
State 1/3～3 times of the thickness that vertical dimension is LED chip of the bottom of sinking bowl；Described plastic layer has
Two groups of relative medial surface, the subtended angle often organizing relative medial surface is respectively less than 60 °；Described LED encapsulation
Frame also includes that the outer sealing of plastic cement, described plastic cement outer sealing part on described metal substrate form reflector；
Described reflector is formed at the periphery of described sinking bowl, and one-body molded with described plastic layer.
Another object of the present invention is to provide a kind of LED illuminator, including described LED package support,
It is provided with LED chip in the described sinking bowl of described LED package support.
The LED package support directly one-body molded sinking bowl on metal substrate that the present invention provides, it is not necessary to
Box dam is additionally set, saves operation, improve production efficiency；Further, the degree of depth of plastic cement bowl is arranged
For 1/3～3 times of the thickness of LED chip, and within the subtended angle of two groups of relative medial surface is defined to 60 °,
The cooperation of this degree of depth and angle can well avoid chip sides extinction and ensure front normally go out light,
Improve the luminous efficiency of LED；It addition, at sinking bowl surface configuration plastic layer, facilitate the above-mentioned degree of depth
And the setting of angle, chip sides extinction can be prevented effectively from；On the other hand, reflector and plastic layer one
Molding, further enhances reflector, plastic layer and the adhesion of metal substrate, improves the reliable of LED
Property.It addition, this kind of design can not only the geomery of accurate sinking control cup, and owing to being heavy cup design
Structure, will not destroy the optical texture of reflector, it is ensured that excellent optical effect.
Accompanying drawing explanation
Fig. 1 is the front view of the LED package support that the embodiment of the present invention provides；
Fig. 2 is that the A-A of LED package support shown in Fig. 1 is to sectional view；
Fig. 3 is that the B-B of LED package support shown in Fig. 1 is to sectional view.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality
Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein
Only in order to explain the present invention, it is not intended to limit the present invention.
Please referring collectively to Fig. 1～3, Fig. 3 shows LED chip 4 in the cross-section so that describing, this
The LED package support that bright embodiment provides includes metal substrate 1, and it has sinking bowl integrated with it
Cup 2, specifically can pass through chemical etching, punching press, forge and press, cast, the method such as machining is at a metal
Sinking bowl 2 is made to obtain this metal substrate 1 on tablet.This sinking bowl 2 have two groups relative interior
Side, with plastic layer 3 on the medial surface of sinking bowl 2, this plastic layer 3 extends to sinking bowl 2
Periphery, formed cup along 31, i.e. this cup is formed on metal substrate 1 along 31, and plastic layer 3 encloses
One plastic cement bowl, (i.e. cup is along between upper surface and the bottom of sinking bowl 2 of 31 for the degree of depth of this plastic cement bowl
Vertical dimension) be 1/3～3 times of thickness of LED chip 4, it addition, plastic layer 3 also has two groups of phases
To medial surface, the i.e. first medial surface 32 and the second medial surface 33, two the first medial surface 32 and two
The subtended angle β of two medial surface 33 is respectively less than 60 °.Further, this LED package support also includes a plastic cement
Outer sealing 5, all wraps up or portion envelops metal substrate 1, and the part on metal substrate 1 is formed
Reflector 51, this reflector 51 is surrounded on the periphery of sinking bowl 2, and bowl 2 surface configuration of sinking
Plastic layer 3 be integrated with this reflector 51, the outer sealing 5 of the most whole plastic cement is together with sinking bowl 2
The plastic layer 3 on surface is one-body molded.It addition, the coat of metal can be gold plate, silvering, copper coating,
One or several stepped construction in nickel coating and palladium coating.For realizing LED chip 4 and supply lines
The electric connection on road.
This LED package support directly one-body molded sinking bowl 2 on metal substrate 1, it is not necessary to additionally set
Put box dam, save operation, improve production efficiency；Further, the degree of depth of plastic cement bowl is set to LED
1/3～3 times of the thickness of chip 4, and within the subtended angle of two groups of relative medial surface is defined to 60 °, this
The cooperation planting the degree of depth and angle can well be blocked the light of directive LED chip 4 side and will not hinder core
Sheet front goes out light, it is to avoid chip sides extinction and ensure that front normally go out light, improve sending out of LED
Light efficiency；It addition, because the sinking bowl 2 directly made on metal substrate 1, the inclination angle of its side is relatively
Difficult control, general inclination angle is relatively big, and the top edge of bowl has bigger radius of curvature, and these are all unfavorable for
Block the light of directive chip sides, therefore sinking bowl 2 surface configuration plastic layer 3 facilitate above-mentioned deeply
Degree and the setting of angle, can be prevented effectively from chip sides extinction；On the other hand, reflector 51 and plastic layer
3 is one-body molded, further enhances reflector 51, plastic layer 3 and the adhesion of metal substrate 1, improves
The reliability of LED.
With further reference to Fig. 1 and Fig. 3, metal substrate 1 can be rectangle, circular or square etc., its quilt
Being wrapped in the outer sealing 5 of plastic cement internal, the shape of reflector 51 can also be rectangle, circular or square etc.,
Preferably consistent with the shape of metal substrate 1.Fig. 1 is a kind of optional implementation, encloses at reflector 51
Region in, the first medial surface 32 of plastic layer 3 is closer to, inside first with the long limit of reflector 51
The cup that face 32 connects connects as one along 31 with reflector 51, and the cup that the second medial surface 33 connects is along 31
It is isolated with reflector 51.
With further reference to Fig. 2, the subtended angle in the often group relative inner face of plastic layer 3 all under 60 °, metal
The subtended angle α of the medial surface of the sinking bowl 2 of substrate 1 can accomplish less than 120 °, therefore plastic layer 3
Thickness is inconsistent at bowl depth direction, the feature of thin upper thickness under having.
In the present embodiment, the material of the outer sealing 5 of plastic cement and plastic layer 3 can select PPA, PCT, ring
The thermosetting such as epoxy resins, silica gel or thermoplastic high reflection plastic material, plasticity and good stability, and
It is beneficial to the reflection of light, reduces and absorb, improve light extraction efficiency.
In the present embodiment, a sinking bowl 2 can be provided with in the region that a plastic cement reflector 51 encloses,
Such as Fig. 1, it is also possible to arrange multiple sinking bowl 2, such as, be provided with three sinking bowls in each reflector 51
Cup 2, is respectively provided with red, green, blue optical chip, so, each reflector 51 and its internal junction enclosed
Structure constitutes a white light unit.Moreover, it is also possible to adopt in other ways, the most each reflector 51
Two or more sinking bowl 2 grades corresponding are all feasible.
Further, in the manufacture process of LED, after installing chip, a glue process need to be carried out,
Fluorescent glue or transparent enclosure glue are filled in reflector 51, sinking bowl 2 can be filled up in the lump, it is also possible to
Only it is covered in outside LED chip 4 and sinking bowl 2.That is: the bowl size enclosed when plastic layer 3 is bigger
Time, fluorescent glue or transparent enclosure glue can fill sinking bowl 2, and the bowl size enclosed when plastic layer 3 is less
Time, fluorescent glue or transparent enclosure glue are only covered on bowl or fill on a small quantity inside bowl, both feelings
Condition goes out light all without affecting LED, and the present embodiment repeats no more.
The present invention further provides a kind of LED illuminator, including above-mentioned LED support, and be arranged at
LED chip 4 in the sinking bowl 2 of LED support.This LED chip 4 can man-to-man be arranged at
In sinking bowl 2, it is also possible to be arranged in sinking bowl 2 according to particular/special requirement is many-to-one.
Further, in reflector 51, fluorescent glue or transparent enclosure glue, this fluorescent glue or transparent envelope it are filled with
Dress glue can be full of sinking bowl 2 or be covered in outside sinking bowl 2.
This LED illuminator have employed the LED package support that the present invention provides, its sinking bowl and reflector
One-body molded, it is not necessary on metal substrate, separately to set box dam, save operation, improve production efficiency, and
Enhance stability and the reliability of LED, improve product quality.Further, since outside plastic layer and plastic cement
Sealing is one-body molded, strengthens the adhesion of plastic layer, reflector and metal substrate, and improve LED can
By property.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention
Protection domain within.
Claims (9)
1. a LED package support, it is characterised in that include that metal substrate, described metal substrate have
Sinking bowl integrated with it, the medial surface of described sinking bowl has plastic layer, described sinking bowl
There are two groups of relative medial surface, described plastic layer from described inner side towards described sinking bowl periphery extend
Forming cup edge, the vertical dimension of the bottom of the upper surface on described cup edge to described sinking bowl is LED chip
1/3～3 times of thickness；Described plastic layer has two groups of relative medial surface, often organizes opening of relative medial surface
Angle is respectively less than 60 °；Described LED package support also includes the outer sealing of plastic cement, and the outer sealing of described plastic cement is in institute
State the part on metal substrate and form reflector；Described reflector is formed at the periphery of described sinking bowl,
And it is one-body molded with described plastic layer.
2. LED package support as claimed in claim 1, it is characterised in that a group of described plastic layer
Relative cup is along connecting as one with reflector.
3. LED package support as claimed in claim 1, it is characterised in that described metal substrate is by institute
State plastic cement outer sealing parcel.
4. LED package support as claimed in claim 1, it is characterised in that described metal substrate is square
Shape, circular or square.
5. the LED package support as described in any one of Claims 1 to 4, it is characterised in that described sinking
The subtended angle often organizing relative medial surface of bowl is respectively less than 120 °.
6. LED package support as claimed in claim 1, it is characterised in that the outer sealing of described plastic cement and
The material of plastic layer is thermosetting or thermoplasticity height reflection plastic material.
7. LED package support as claimed in claim 1, it is characterised in that the table of described metal substrate
Face is provided with the coat of metal, and the described coat of metal is gold plate, silvering, copper coating, nickel coating and palladium coating
In one or several stepped construction.
8. a LED illuminator, it is characterised in that include the LED described in any one of claim 1 to 7
Package support, is provided with LED chip in the described sinking bowl of described LED package support.
9. LED illuminator as claimed in claim 8, it is characterised in that in described LED package support
Reflector in be filled with fluorescent glue or transparent enclosure glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410101543.2A CN103872219B (en) | 2014-03-18 | 2014-03-18 | A kind of LED package support and LED illuminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410101543.2A CN103872219B (en) | 2014-03-18 | 2014-03-18 | A kind of LED package support and LED illuminator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103872219A CN103872219A (en) | 2014-06-18 |
| CN103872219B true CN103872219B (en) | 2016-09-14 |
Family
ID=50910555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410101543.2A Active CN103872219B (en) | 2014-03-18 | 2014-03-18 | A kind of LED package support and LED illuminator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103872219B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015139191A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led packaging frame and led illuminant |
| WO2015139190A1 (en) * | 2014-03-18 | 2015-09-24 | 深圳市瑞丰光电子股份有限公司 | Led frame and led illuminant |
| CN105047797A (en) * | 2015-09-17 | 2015-11-11 | 深圳成光兴光电技术股份有限公司 | SMD LED packaging structure |
| CN110010741A (en) * | 2019-03-13 | 2019-07-12 | 惠州市长方照明节能科技有限公司 | A kind of novel high lumen LED support |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997075A (en) * | 2009-08-05 | 2011-03-30 | 夏普株式会社 | Light emitting device and method of manufacturing light emitting device |
| CN202094168U (en) * | 2011-05-03 | 2011-12-28 | 深圳市华星光电技术有限公司 | Led packaging structure |
| CN102683544A (en) * | 2011-03-17 | 2012-09-19 | 展晶科技(深圳)有限公司 | Paster type light-emitting diode |
| CN203787455U (en) * | 2014-03-18 | 2014-08-20 | 深圳市瑞丰光电子股份有限公司 | LED packaging bracket and LED luminous body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7777244B2 (en) * | 2006-03-17 | 2010-08-17 | Seoul Semiconductor Co., Ltd. | Side-view light emitting diode package having a reflector |
-
2014
- 2014-03-18 CN CN201410101543.2A patent/CN103872219B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101997075A (en) * | 2009-08-05 | 2011-03-30 | 夏普株式会社 | Light emitting device and method of manufacturing light emitting device |
| CN102683544A (en) * | 2011-03-17 | 2012-09-19 | 展晶科技(深圳)有限公司 | Paster type light-emitting diode |
| CN202094168U (en) * | 2011-05-03 | 2011-12-28 | 深圳市华星光电技术有限公司 | Led packaging structure |
| CN203787455U (en) * | 2014-03-18 | 2014-08-20 | 深圳市瑞丰光电子股份有限公司 | LED packaging bracket and LED luminous body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103872219A (en) | 2014-06-18 |
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