CN206697519U - Surface mount type LED support and adopting surface mounted LED device - Google Patents
Surface mount type LED support and adopting surface mounted LED device Download PDFInfo
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- CN206697519U CN206697519U CN201720400387.9U CN201720400387U CN206697519U CN 206697519 U CN206697519 U CN 206697519U CN 201720400387 U CN201720400387 U CN 201720400387U CN 206697519 U CN206697519 U CN 206697519U
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- bowl
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- enclosure wall
- encapsulated layer
- layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The utility model discloses a kind of surface mount type LED support and adopting surface mounted LED device, wherein, the surface mount type LED support includes bowl, the side of the inner bottom surface of the bowl is provided with enclosure wall, the inner bottom surface is divided into the second bowl region outside the first bowl region and the enclosure wall in the enclosure wall by the enclosure wall, and the first bowl region is less than the depth of the bowl less than or equal to the height of the second bowl region and the enclosure wall.Double device integrations can be single device by setting enclosure wall that bowl is divided into double cup structures by the utility model surface mount type LED support, saved material, reduced cost.
Description
Technical field
It the utility model is related to LED technology field, more particularly to a kind of surface mount type LED support and adopting surface mounted LED device.
Background technology
Existing adopting surface mounted LED device load has feux rouges（R）Chip, green glow（G）Chip, blue light（B）Chip, pass through three kinds
The chip of different glow colors can realize quality white light；However, the adopting surface mounted LED device is when realizing quality white light, once
A kind of chip of color shows optical issue, and whole device will be unable to obtain required quality white light.On the other hand, prior art uses
Double device light emitting modules solve the above problems, and this pair of device light emitting module above-mentioned has the SMD of RGB chips by one
LED component and a white light（W）Adopting surface mounted LED device forms, however, this pair of device light emitting module is additionally arranged a white light paster
Formula LED component, causes cost to increase.
Utility model content
Main purpose of the present utility model is to provide a kind of surface mount type LED support, it is intended to by double device integrations is single device
Part, reduce cost.
To achieve the above object, the utility model provides a kind of surface mount type LED support, and the surface mount type LED support includes
Bowl, the side of the inner bottom surface of the bowl are provided with enclosure wall, and the inner bottom surface is divided into the enclosure wall by the enclosure wall
The second bowl region outside one bowl region and the enclosure wall, the first bowl region are less than or equal to the second bowl area
The height of domain and the enclosure wall is less than the depth of the bowl.
Preferably, the height of the enclosure wall is more than the half of the depth of the bowl.
Preferably, the enclosure wall is connected with the medial surface of the bowl.
Preferably, the medial surface of the bowl includes relative first side and second side and the 3rd relative side
With the 4th side；The enclosure wall includes end to end first wall section and the second wall section, and the first wall section is along the medial surface
And first side described with part, the 3rd side and the part second side are connected.
Preferably, the upper surface roughening processing of the enclosure wall.
Preferably, the surface of the enclosure wall is in black or grey.
Preferably, the height of the bowl is 2mm ~ 20mm.
In addition, to achieve the above object, the utility model also provides a kind of adopting surface mounted LED device, the adopting surface mounted LED device
Part includes surface mount type LED support as described above, first area chip, the first encapsulated layer, second area chip and the second envelope
Fill layer；The first area chip is on the first bowl region；First encapsulated layer covers the first bowl area
Domain and first area chip and in the enclosure wall；The second area chip is on the second bowl region；It is described
Second encapsulated layer covers the second bowl region, second area chip and first encapsulated layer.
Preferably, the first area chip includes a blue chip, and first encapsulated layer is fluorescent adhesive layer；Described
Two region chips include a red light chips, a green glow chip and a blue chip, and second encapsulated layer is glue layer.
Preferably, the first area chip includes a blue chip, and first encapsulated layer includes covering the blue light
The fluorescence coating and the covering fluorescence coating, the encapsulation glue layer in the first bowl region of chip；The second area chip
Including a red light chips, a green glow chip and a blue chip, second encapsulated layer is glue layer.
Preferably, the encapsulation glue layer and second encapsulated layer are formed in one and are made.
Preferably, the first area chip includes a gold-tinted chip or an orange light chip, and first encapsulated layer is
Glue layer；The second area chip includes a red light chips, a green glow chip and a blue chip, and second encapsulated layer is
Glue layer.
Preferably, first encapsulated layer is integrally formed with second encapsulated layer and is made.
Technical solutions of the utility model, bowl is divided into by double cup structures by enclosure wall, and then can be in the first bowl
In region set White-light LED chip and in the second bowl region set RGB chips and be single device by double device integrations, save
Material has been saved, has reduced cost.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to the structure shown in these accompanying drawings.
Fig. 1 is the structural representation of the utility model surface mount type LED support first embodiment；
Fig. 2 is the structural representation at another visual angle of surface mount type LED support in Fig. 1；
Fig. 3 is the top view of surface mount type LED support in Fig. 1；
Fig. 4 is sectional view of the surface mount type LED support along line A-A in Fig. 3；
Fig. 5 is the sectional view of the utility model adopting surface mounted LED device first embodiment；
Structural representation when Fig. 6 is the non-sealing of adopting surface mounted LED device in Fig. 5；
Fig. 7 is the sectional view of the utility model adopting surface mounted LED device second embodiment；
Fig. 8 is the sectional view of the utility model adopting surface mounted LED device 3rd embodiment.
The utility model purpose is realized, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than all
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, belong to the scope of the utility model protection.
It is to be appreciated that the directional instruction of institute in the utility model embodiment（Such as up, down, left, right, before and after ...）
It is only used for explaining in a certain particular pose（As shown in drawings）Under relative position relation between each part, motion conditions etc., such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes therewith.
In addition, and it can not be managed in the utility model such as relating to the description of " first ", " second " etc. is only used for describing purpose
Solve to indicate or implying its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " the
One ", at least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the skill between each embodiment
Art scheme can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when technical scheme
With reference to occurring conflicting or will be understood that the combination of this technical scheme is not present when can not realize, also not in the utility model
It is required that protection domain within.
The utility model provides a kind of surface mount type LED support, refer to Fig. 1 to Fig. 4, in the first embodiment, the paster
Formula LED support includes bowl 1 and the pin 2 drawn from the bowl 1.Wherein, the side of the inner bottom surface 10 of bowl 1 is provided with enclosure wall
3, inner bottom surface 10 is divided into the second bowl region 12 outside the first bowl region 11 and the enclosure wall 3 in enclosure wall 3 by enclosure wall 3, and first
Bowl region 11 is less than the depth D of bowl 1 less than or equal to the height H of the second bowl region 12 and enclosure wall 3.
The present embodiment surface mount type LED support in bowl 1 by setting enclosure wall 3 to be divided into the inner bottom surface 10 of bowl 1
First bowl region 11 and the second bowl region 12, i.e., bowl 1 is divided into by double cup structures by enclosure wall 3, and then can be
White chip is set in the first bowl region 11 and RGB chips are set in the second bowl region 12 and are by double device integrations
Single device, saves material, reduces cost；Moreover, the depth D that the height H of enclosure wall 3 is less than bowl 1 is set, and during encapsulation, envelope
Filling the material in the first bowl region 11 can be covered on the region that enclosure wall 3 is formed, and form secondary envelope to the part of enclosure wall 3
Dress, is advantageous to mixed light and lifts light efficiency；Simultaneously because enclosure wall 3 is closure cyclic structure, the material and enclosure wall 3 of secondary encapsulation can be made
Upper surface 30 contact area it is bigger, with reference to more fully, so as to improve secondary encapsulation to the sealing effectiveness of the part of enclosure wall 3 and
Waterproof effect, and then the waterproof sealing effect of whole device is improved, and be advantageous to improve the lighting angle of the part of enclosure wall 3 and mix
Light path degree.
It should be noted that in the utility model, weldering is equipped with the first bowl region 11 and the second bowl region 12
Disk 20, an and pad 20 is corresponding is connected with a pin 2, quantity that the specific set-up mode of pad 20 can be according to chip, connection in series-parallel
Depending on mode, a pair typically, on the first bowl region 11 are set to place the pad 20 of a chip, and the second bowl area
Three pairs of pads 20 can be set on domain 12, and respectively placing a feux rouges（R）Chip, a green glow（G）Chip and a blue light（B）
Chip, shared first pad and 3 second pads, a feux rouges can also be set on the second bowl region 12（R）Chip, one
Green glow（G）Chip and a blue light（B）Chip is separately positioned on one second pad and the negative or positive electrode of three chips is electrical
Connect the first pad.However, the set-up mode of pad 20 on the first bowl region 11 and the second bowl region 12 be not limited to it is above-mentioned
Situation about enumerating.In addition, particular location of the enclosure wall 3 in the inner bottom surface 10 of bowl 1, size can be set according to the actual requirements
Put, enclosure wall 3 is located at the side of inner bottom surface 10, i.e. the enclosure wall 3 can be located at left side, right side, upside, downside, the left side of inner bottom surface 10
Upside, lower left side, upper right side or lower right side etc., rather than positioned at the center of inner bottom surface 10, so as to make full use of in bowl 1
Space to ensure the abundant mixed light of the chip light emitting in the first bowl region 11 or the second bowl region 12.
In the present embodiment, further, the height H of enclosure wall 3 is more than the depth D of bowl 1 half, i.e. 0.5D ＜ H ＜
D, as shown in Figure 4.
Because the height H of enclosure wall 3 is more than 0.5D, when carrying out secondary encapsulation to the part of enclosure wall 3, making for glue amount can be reduced
With, while ensure good light mixing effect and the good waterproof effect in the first bowl region 11 and the second bowl region 12.
In this embodiment, it is preferred that the height H of enclosure wall 3 is 3/4ths of the depth of bowl 1, i.e. H=3D/4=
0.75D.It is arranged such, glue amount and light mixing effect, the preferably balance of waterproof effect can be reached.
In the present embodiment, further, enclosure wall 3 is connected with the medial surface of bowl 1.
Because enclosure wall 3 is connected with the medial surface of bowl 1, and then enclosure wall 3 is provided only on the avris position in bowl 1, and incites somebody to action
Inner bottom surface 10 is divided into the first bowl region 11 and the second bowl region 12 effectively utilized, avoids space in the region of bowl 1
Waste, to reduce the volume of surface mount type LED support.
In the present embodiment, further, the medial surface of bowl 1 include relative first side 13 and second side 14 with
And the 3rd relative side 15 and the 4th side 16.Enclosure wall 3 includes end to end first wall section 32 and the second wall section 34, and first
Wall section 32 is connected along medial surface with part first side 13, the 3rd side 15 and portions of second side 14.
By by the first wall section 32 of enclosure wall 3 along medial surface set and with part first side 13, the 3rd side 15 and portion
Divide second side 14 to overlap connection, and then maximally utilize the space in bowl 1.
In this embodiment, it is preferred that enclosure wall 3 is in " D " shape structure, wherein, the first wall section 32 is bent portion, the second wall
Section 34 is straight line portion.
In the present embodiment, further, the height h of bowl 1 is 2mm ~ 20mm.
The height h of bowl 1 is higher, and the thickness of encapsulated layer is also thicker, is advantageous to improve waterproof effect, increases the service life,
Meets outdoor the needs of using.
In this embodiment, it is preferred that the height h of bowl 1 is 2.5mm.Herein under height, you can meet outdoor water-proof need
Ask, while reduce the use of encapsulating material, reduce cost.
In the present embodiment, further, a pair of pads 20 are provided with the first bowl region 11, wherein, a pad 20 connects
Connect a pin 2；Three pairs of pads 20 side by side are provided with second bowl region 12, wherein, a pad 20 one pin 2 of connection, and the
Pad 20 in one bowl region 11 and the pad 20 in the second bowl region 12 are parallel side by side.It is SMD due to the present embodiment
LED support is embedded in pin configuration, then by poly- terephthalate p-phenylenediamine in a mold in advance by insert injection molding
（PPA）Or epoxy molding material（EMC）Melten gel injection mould in, and moulding is formed on pin configuration, after cleaved
The part that the pin configuration is located at outside moulding forms pin 2, and the part in moulding forms pad 20.
The utility model also provides the second embodiment of surface mount type LED support, refer to Fig. 1 to Fig. 4, the present embodiment is upper
State and be improved on the basis of first embodiment：
The upper surface 30 roughening processing of enclosure wall 3, and then when can improve secondary encapsulation, encapsulating material is upper with enclosure wall 3
The tightness degree of the combination on surface 30, is mitigated or eliminated the influence at interface, and be advantageous to will be transmitted to the upper surface 30 of enclosure wall 3
Light reflection, scatter out, improve light emission rate and light-emitting uniformity.
It should be noted that in the utility model, the roughening of the upper surface 30 of enclosure wall 3 can be by forming enclosure wall 3
Mould corresponding to mold cavity surface roughening and realize.
The utility model also provides the 3rd embodiment of surface mount type LED support, refer to Fig. 1 to Fig. 4, the present embodiment is upper
State and be improved on the basis of first embodiment：
The surface of enclosure wall 3 is in black or grey, due to the surface melanism of enclosure wall 3 or ashing, when surface mount type LED support is made
Adopting surface mounted LED device when emitting white light, be advantageous to improve the contrast that the part of enclosure wall 3 emits white light, while can also improve whole
The contrast of device.
It should be noted that in the utility model, the surface melanism of enclosure wall 3 or ashing can be by spraying ink and shape
Into, it can also be formed by Shooting Technique, such as two-shot process or two-shot molding process.
The utility model also provides a kind of adopting surface mounted LED device, refer to Fig. 5 and Fig. 6, in the first embodiment, the patch
Sheet-shaped LED device includes surface mount type LED support, because the adopting surface mounted LED device of the present embodiment employs above-mentioned all embodiments
Whole technical schemes, therefore all beneficial effects caused by the same technical scheme with above-described embodiment, herein no longer
Repeat one by one.Wherein, the adopting surface mounted LED device also includes first area chip 4, the first encapsulated layer 5, the and of second area chip 6
Second encapsulated layer 7.First area chip 4 is on the first bowl region 11, the first encapsulated layer 5 covering He of the first bowl region 11
First area chip 4 and in the enclosure wall 3.Second area chip 6 is on the second bowl region 12, the covering of the second encapsulated layer
Second bowl region 12, the encapsulated layer 5 of second area chip 6 and first.
Because the second encapsulated layer 7 covers the first encapsulated layer 5, so as to carry out secondary encapsulation, and then first to the part of enclosure wall 3
The light that region chip 4 and second area chip 6 are sent can be mixed in the second encapsulated layer 7, improve the uniform of light extraction
Property；Simultaneously the second encapsulated layer 7 and the contact area of the upper surface 30 of enclosure wall 3 it is bigger, with reference to more fully, so as to improve secondary envelope
The sealing effectiveness and waterproof effect to the part of enclosure wall 3 are filled, and then improves the waterproof sealing effect of whole device, and is advantageous to carry
The lighting angle and mixed light degree of the high part of enclosure wall 3.
It should be noted that in the utility model, first area chip 4 is the core on the first bowl region 11
Piece, quantity, glow color and the species of unlimited chip etc., first area chip 4 can be positive cartridge chip or flip-chip；Equally
Ground, second area chip 6 are the chip, quantity, glow color and the species of unlimited chip etc. on the second bowl region 12
Deng second area chip 6 can be positive cartridge chip or flip-chip.First encapsulated layer 5 can fill up the enclosure wall 3 and enclose the sky to be formed
Between, the space can not also be filled up, in other words, the second encapsulated layer 7 can be covered to the space in enclosure wall 3, can also only be covered
Space outside lid wall 3.
In the present embodiment, further, first area chip 4 includes a blue chip, and the first encapsulated layer 5 is fluorescent glue
Layer, fluorescent adhesive layer include glue and fluorescent material.Second area chip 6 includes a red light chips, a green glow chip and a blue light core
Piece, the second encapsulated layer 7 are glue layer.
Because fluorescent adhesive layer is mixture, comprising fluorescent material and glue, fluorescent adhesive layer covering blue chip, and then enclosure wall
3 structure divisions can send white light, at the same red light chips, green glow chip and the blue chip mixed light outside enclosure wall 3 and produce white light.
In the present embodiment, further, the glue of fluorescent adhesive layer can be in epoxy resin, silicones and silica gel
One kind, the second encapsulated layer 7 can also be selected from one kind in epoxy resin, silicones and silica gel.Preferably, the glue of fluorescent adhesive layer
Same glue is selected from the second encapsulated layer 7, because fluorescent adhesive layer includes and the identical material of the second encapsulated layer 7, Jin Eryou
Beneficial to the interface eliminated between the first encapsulated layer 5 and the second encapsulated layer 7, the loss to light at interface is reduced, improves light extraction efficiency.
The production technology of the adopting surface mounted LED device of the present embodiment is as follows：
Step 1: prepare surface mount type LED support：
Using the mould of CAD design surface mount type LED support, insert injection moulding is carried out, multiple bowls 1 are formed after die sinking, it is each
The pad 20 that integrated injection molding is formed formed with enclosure wall 3 and by inserts in bowl 1, cutting separate bowl 1 and make inserts in bowl
Pin 2 is formed outside cup 1, and then obtains single surface mount type LED support, wherein, a pad 20 is integrated knot with a corresponding pin 2
Structure；The size of the surface mount type LED support can be 5050, or 3535 or other, resin material can be PPA, or
EMC；In addition, in other embodiment of the present utility model, the upper surface 30 of enclosure wall 3 can be by mould and roughening processing；
Or in order to improve the contrast of white light, surface melanism or the ashing of enclosure wall 3 can be made in the surface spraying ink of enclosure wall 3；
Step 2: die bond, bonding wire：
It is solid in the first bowl region 11 respectively using corresponding insulating cement, silica gel or elargol according to the difference of chip
The red light chips of die bond one, a green glow chip and a blue chip in a brilliant blue chip and the second bowl region 12, primer die bond
Lead is used afterwards（Gold thread, copper cash or alloy wire）The mode bonding wire of bonding and be electrically connected with the both positive and negative polarity of pad 20 and chip；
Step 3: sealing：
First using encapsulation glue（Epoxy resin, silicones or silica gel）The fluorescent glue encapsulation mixed with fluorescent material is enclosed
Space in wall 3 and form the first encapsulated layer 5, according to requirements using different-colour, the different aobvious fluorescent glues referred to；Then make
Whole bowl 1 is filled with same encapsulation mucilage sealing and forms the second encapsulated layer 7.
Fig. 7 is refer to, in the lump with reference to Fig. 6, Fig. 7 is the sectional view of the utility model adopting surface mounted LED device second embodiment,
The difference of this second embodiment and first embodiment is：
First encapsulated layer 5 includes the fluorescence coating 50 of covering blue chip and covers the bowl region 11 of fluorescence coating 50 and first
Encapsulate glue layer 52, the one kind of encapsulation glue layer 52 in epoxy resin, silicones or silica gel.Wherein, glue layer is encapsulated
52 and second encapsulated layer 7 use glue of the same race, be advantageous to eliminate the interface between different interlayers.
In the present embodiment, further, encapsulation glue layer 52 is integrally formed with the second encapsulated layer 7 is made.
Blue chip is set in enclosure wall 3, blue chip is directly then fitted over using fluorescent film and forms fluorescence coating 50,
Finally directly to the internal model glue of enclosure wall 3（Epoxy resin, silicones or silica gel）, packaging plastic is formed to the enclosure wall 3 is filled up
Water layer 52, and whole bowl 1 is filled up after being overflowed by enclosure wall 3 and forms the second encapsulated layer 7, so as to which encapsulation glue layer 52 be completely eliminated
With the interface between the second encapsulated layer 7, luminous flux is further improved, simplifies packaging technology, improves production efficiency.
Fig. 8 is refer to, in the lump with reference to Fig. 6, Fig. 8 is the sectional view of the utility model adopting surface mounted LED device 3rd embodiment,
The difference of this third embodiment and first embodiment is：
First area chip 4 includes a gold-tinted chip（Existing chip）An or orange light chip（Existing chip）, the first envelope
Dress layer 5 is glue layer.Second area chip 6 includes a red light chips, a green glow chip and a blue chip, the second encapsulated layer 7
For glue layer.
Due to setting gold-tinted chip or orange light chip in enclosure wall 3, and then the part-structure of enclosure wall 3 sends gold-tinted or orange light, encloses
White light is sent outside wall 3, so as to which wider array of luminous colour gamut can be realized.
In the present embodiment, further, the first encapsulated layer 5 can be selected from one in epoxy resin, silicones and silica gel
Kind, the second encapsulated layer 7 can also be selected from one kind in epoxy resin, silicones and silica gel.Preferably, the first encapsulated layer 5 and
Two encapsulated layers 7 are selected from same glue, because the first encapsulated layer 5 is identical with the material of the second encapsulated layer 7, and then are advantageous to disappear
Except the interface between the first encapsulated layer 5 and the second encapsulated layer 7, the loss to light at interface is reduced, improves light extraction efficiency.
It is made in this embodiment, it is preferred that the first encapsulated layer 5 is integrally formed with the second encapsulated layer 7.
After gold-tinted chip or orange light chip are placed in enclosure wall 3, directly glue is molded into enclosure wall 3（Epoxy resin, silicon
Resin and silica gel）, the first encapsulated layer 5 is formed to filling up the enclosure wall 3, and whole bowl 1 is filled up after being overflowed by enclosure wall 3 and is formed
Second encapsulated layer 7, so as to which the interface between the first encapsulated layer 5 and the second encapsulated layer 7 be completely eliminated, luminous flux is further improved,
Packaging technology is simplified, improves production efficiency.
Preferred embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model,
Every equivalent structure under utility model of the present utility model design, made using the utility model specification and accompanying drawing content
Conversion, or directly/be used in other related technical areas indirectly and be included in scope of patent protection of the present utility model.
Claims (13)
1. a kind of surface mount type LED support, it is characterised in that including bowl, the side of the inner bottom surface of the bowl is provided with enclosure wall, institute
State the second bowl region that the inner bottom surface is divided into outside the first bowl region and the enclosure wall in the enclosure wall by enclosure wall, institute
State the depth that the first bowl region is less than the bowl less than or equal to the height of the second bowl region and the enclosure wall.
2. surface mount type LED support as claimed in claim 1, it is characterised in that the height of the enclosure wall is more than the bowl
The half of depth.
3. surface mount type LED support as claimed in claim 1, it is characterised in that the enclosure wall and the medial surface phase of the bowl
Even.
4. surface mount type LED support as claimed in claim 3, it is characterised in that
The medial surface of the bowl includes relative first side and second side and the 3rd relative side and the 4th side；
The enclosure wall includes end to end first wall section and the second wall section, the first wall section along the medial surface and with part
The first side, the 3rd side connect with the part second side.
5. surface mount type LED support as claimed in claim 1, it is characterised in that the upper surface roughening processing of the enclosure wall.
6. surface mount type LED support as claimed in claim 1, it is characterised in that the surface of the enclosure wall is in black or grey.
7. the surface mount type LED support as described in claim 1 to 6 any one, it is characterised in that the height of the bowl is
2mm~20mm。
8. a kind of adopting surface mounted LED device, it is characterised in that including the adopting surface mounted LED branch described in claim 1 to 7 any one
Frame, first area chip, the first encapsulated layer, second area chip and the second encapsulated layer；
The first area chip is on the first bowl region；
First encapsulated layer covers the first bowl region and first area chip and in the enclosure wall；
The second area chip is on the second bowl region；
Second encapsulated layer covers the second bowl region, second area chip and first encapsulated layer.
9. adopting surface mounted LED device as claimed in claim 8, it is characterised in that
The first area chip includes a blue chip, and first encapsulated layer is fluorescent adhesive layer；
The second area chip includes a red light chips, a green glow chip and a blue chip, and second encapsulated layer is glue
Water layer.
10. adopting surface mounted LED device as claimed in claim 9, it is characterised in that
The first area chip includes a blue chip, and first encapsulated layer includes the fluorescence coating for covering the blue chip
And the covering fluorescence coating, the encapsulation glue layer in the first bowl region；
The second area chip includes a red light chips, a green glow chip and a blue chip, and second encapsulated layer is glue
Water layer.
11. adopting surface mounted LED device as claimed in claim 10, it is characterised in that the encapsulation glue layer and second envelope
Dress layer, which is formed in one, to be made.
12. adopting surface mounted LED device as claimed in claim 8, it is characterised in that
The first area chip includes a gold-tinted chip or an orange light chip, and first encapsulated layer is glue layer；
The second area chip includes a red light chips, a green glow chip and a blue chip, and second encapsulated layer is glue
Water layer.
13. adopting surface mounted LED device as claimed in claim 12, it is characterised in that first encapsulated layer and second envelope
Dress layer, which is integrally formed, to be made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720400387.9U CN206697519U (en) | 2017-04-17 | 2017-04-17 | Surface mount type LED support and adopting surface mounted LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720400387.9U CN206697519U (en) | 2017-04-17 | 2017-04-17 | Surface mount type LED support and adopting surface mounted LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206697519U true CN206697519U (en) | 2017-12-01 |
Family
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