CN214705966U - Secondary packaging structure - Google Patents
Secondary packaging structure Download PDFInfo
- Publication number
- CN214705966U CN214705966U CN202121294775.6U CN202121294775U CN214705966U CN 214705966 U CN214705966 U CN 214705966U CN 202121294775 U CN202121294775 U CN 202121294775U CN 214705966 U CN214705966 U CN 214705966U
- Authority
- CN
- China
- Prior art keywords
- metal pin
- dam
- glue
- groove
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a secondary packaging structure, including outer frame construction and a packaging body, wherein, a packaging body includes first metal pin I, second metal pin I, glue injection groove, first box dam, luminous chip and a packaging glue, and outer frame construction includes that second box dam, base plate, first metal pin II, second metal pin II and secondary packaging glue, and first packaging body gomphosis sets up in the second recess that the second box dam formed. The utility model has the advantages of as follows: (1) by adopting twice packaging, water vapor is not easy to permeate into the interior, so that the air-tightness is extremely high; (2) the two times of packaging adopt glue of different materials, and when the temperature changes, the internal metal wire is less pulled by stress and is not easy to break; (3) the chip is positioned in the two layers of frame structures, so that the structural strength is high, and the chip is not easily damaged by impact; (4) the structure is flexible and variable, and when different colors are needed, only the color of the inner packaging body needs to be changed.
Description
Technical Field
The utility model relates to a secondary packaging structure belongs to LED components and parts.
Background
The application of the light-emitting diode in the field of automobile application has a plurality of limitations, and the light-emitting diode applied to the automobile is required to have high air tightness and reliability due to the factors of long service life of automobile products, severe service environment and the like. However, the light emitting diodes on the market are all based on the characteristics of the materials to improve the air tightness and reliability. With the development of miniaturization of products, the characteristics of the materials of the light emitting diode cannot meet more and more severe conditions. Therefore, the structure of the light emitting diode needs to be redesigned, the designed structural characteristics and material characteristics are combined, and the air tightness and reliability of the light emitting diode are further improved, so that the increasingly severe requirements of automobile products on the light emitting diode are met.
SUMMERY OF THE UTILITY MODEL
For solving not enough among the prior art, the utility model provides a secondary packaging structure carries out the secondary to emitting diode's chip and encapsulates, inlays the packaging body for the first time in frame construction, makes it be in two-layer encapsulation and glues, receives two-layer frame construction's protection, improves emitting diode's chip packaging body's structural strength and gas tightness.
The utility model discloses the technical scheme who mainly adopts among does:
a secondary packaging structure comprises an outer frame structure and a primary packaging body, wherein the primary packaging body is embedded in the outer frame structure; wherein the content of the first and second substances,
the primary packaging body comprises a first metal pin I, a second metal pin I, a glue injection groove, a first dam, a light-emitting chip and primary packaging glue, wherein the glue injection groove is formed between the first metal pin I and the second metal pin I, the first dam is arranged on the upper surfaces of the first metal pin I and the second metal pin I to form a first groove, the light-emitting chip is fixed on the upper surface of the first metal pin I and is positioned in the first groove of the first dam, the light-emitting chip leads the positive electrode and the negative electrode to the first metal pin I and the second metal pin I through leads respectively, the first groove is filled with the primary packaging glue, and the primary packaging glue covers the light-emitting chip and the leads and is flush with the upper surface of the first dam;
the outer frame structure comprises a second dam, a substrate, a first metal pin II, a second metal pin II and secondary packaging glue, wherein the second dam is arranged on the substrate and integrally formed to form a second groove, the upper surface of the substrate is respectively provided with a first metal pin groove and a second metal pin groove, the first metal pin II and the second metal pin II are positioned in the second groove, the first metal pin II and the second metal pin II are respectively arranged on the first metal pin groove and the second metal pin groove, the upper surfaces of the first metal pin II and the second metal pin II are flush with the upper surface of the substrate, the bottoms of the first metal pin II and the second metal pin II respectively extend through two sides of the substrate, and the first metal pin II and the second metal pin II are bent to the bottom of the substrate to form a pad structure;
the primary packaging body is embedded in a second groove formed by a second dam, and a first metal pin I and a second metal pin I of the primary packaging body are respectively connected with a first metal pin II and a second metal pin II in the outer frame structure in a one-to-one correspondence mode; the secondary packaging glue is filled in the second groove and is flush with the upper surface of the second box dam, and the secondary packaging glue covers the primary packaging body.
Preferably, the glue injection groove is of a convex structure.
Preferably, the cross-sectional shape of the first dam is a right trapezoid, and the hypotenuse of the right trapezoid is inside the first dam.
Preferably, the cross-sectional shape of the second dam is a right trapezoid, and the hypotenuse of the right trapezoid is inside the second dam.
Preferably, the first dam and the second dam are both closed circles, the height of the first dam is larger than the thickness of the light emitting chip, and the height of the second dam is larger than the height of the primary packaging body.
Preferably, the primary package body is loaded in the outer frame structure in an SMT patch manner.
Preferably, the glue of the primary packaging glue is silica gel.
Preferably, the glue of the secondary packaging glue is epoxy glue.
Preferably, the glue injection groove is filled with epoxy glue.
Has the advantages that: the utility model provides a secondary packaging structure has following advantage:
(1) because of adopting twice encapsulation, the moisture is difficult to permeate into inside, and its inside chip has high gas tightness.
(2) Because twice encapsulation adopts the glue of different materials, when meetting temperature variation, inside metal wire receives stress and pulls fewly, is difficult to the fracture, and the reliability is high.
(3) The chip is in two-layer encapsulation glue, and two-layer frame construction's protection, structural strength is big, is difficult to receive the striking damage.
(4) The utility model discloses nimble variable, when needing different colours, only need change inside once the encapsulation the colour can.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a top view of the structure in S1;
fig. 3 is a sectional view of the structure in S1;
FIG. 4 is a structural sectional view of S2;
FIG. 5 is a structural sectional view of S3;
FIG. 6 is a top view of the structure of S4;
FIG. 7 is a structural sectional view of S4;
FIG. 8 is a structural sectional view of S5;
FIG. 9 is a structural sectional view of S6;
in the figure: the LED packaging structure comprises a primary packaging body 1, a first metal pin I1-1, a second metal pin I1-2, a glue injection groove 1-3, a first dam 1-4, a light emitting chip 1-5, primary packaging glue 1-6, a first groove 1-7, a lead 1-8, an outer frame structure 2, a second dam 2-1, a substrate 2-2, a first metal pin II2-3, a second metal pin II2-4, secondary packaging glue 2-5, a second groove 2-6 and solder paste 3.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example 1:
a secondary packaging structure comprises an outer frame structure 2 and a primary packaging body 1, wherein the primary packaging body 1 is embedded in the outer frame structure 2; wherein the content of the first and second substances,
the primary packaging body 1 comprises a first metal pin I1-1, a second metal pin I1-2, a glue injection groove 1-3, a first dam 1-4, a light emitting chip 1-5 and primary packaging glue 1-6, the glue injection groove 1-3 is arranged between the first metal pin I1-1 and the second metal pin I1-2, the first dam 1-4 is arranged on the upper surfaces of the first metal pin I1-1 and the second metal pin I1-2 to form a first groove 1-7, the light emitting chip 1-5 is fixed on the upper surface of the first metal pin I1-1 and is positioned in the first groove 1-7 of the first dam 1-4, the light emitting chip 1-5 leads the positive electrode and the negative electrode to the first metal pin I1-1 and the second metal pin I1-2 through leads 1-8 respectively, primary packaging glue 1-6 is filled in the first groove 1-7, and the primary packaging glue 1-6 covers the light-emitting chip 1-5 and the wire 1-8 and is flush with the upper surface of the first dam 1-4; in the utility model discloses in, once encapsulation glues 1-6 and incompletely wraps first metal pin I1-1 and second metal pin I1-2.
The outer frame structure 2 comprises a second dam 2-1, a substrate 2-2, a first metal pin II2-3, a second metal pin II2-4 and secondary packaging adhesive 2-5, the second dam 2-1 is arranged on the substrate 2-2 and integrally formed to form a second groove 2-6, the upper surface of the substrate 2-2 is provided with a first metal pin groove and a second metal pin groove respectively and is positioned in the second groove 2-6, the first metal pin II2-3 and the second metal pin II2-4 are arranged on the first metal pin groove and the second metal pin groove respectively, the upper surfaces of the first metal pin II2-3 and the second metal pin II2-4 are flush with the upper surface of the substrate 2-2, the bottoms of the first metal pin II2-3 and the second metal pin II2-4 extend through the two sides of the substrate 2-2 respectively, and bending to the bottom of the substrate 2-2 to form a pad structure;
the primary packaging body 1 is embedded in a second groove 2-6 formed by a second dam 2-1, and a first metal pin I1-1 and a second metal pin I1-2 of the primary packaging body 1 are respectively connected with a first metal pin II2-3 and a second metal pin II2-4 in the outer frame structure 2 in a one-to-one correspondence manner; the secondary packaging adhesive 2-5 is filled in the second groove 2-6 and is flush with the upper surface of the second dam 2-1, and the primary packaging body 1 is coated by the secondary packaging adhesive 2-5.
Preferably, the glue injection grooves 1-3 are of a convex structure.
Preferably, the cross-sectional shape of the first dam 1-4 is a right trapezoid, and the hypotenuse of the right trapezoid is inside the first dam 1-4.
Preferably, the cross-sectional shape of the second dam 2-1 is a right trapezoid, and the hypotenuse of the right trapezoid is inside the second dam 2-1.
Preferably, the first dam 1-4 and the second dam 2-1 are both closed circles, the height of the first dam 1-4 is greater than the thickness of the light emitting chip 1-5, and the height of the second dam 2-1 is greater than the height of the primary package 1. In the utility model, the size of the area surrounded by the first box dam in the direction vertical to the height of the first box dam is larger than or equal to the size of the chip in the direction vertical to the thickness of the chip; the size of the area surrounded by the second dam in the direction vertical to the height direction of the second dam is larger than or equal to the size of the primary packaging body in the direction vertical to the thickness direction of the primary packaging body.
Preferably, the primary package body 1 is mounted in the outer frame structure in an SMT patch manner.
Preferably, the glue of the primary packaging glue 1-6 is silica gel.
Preferably, the glue of the secondary packaging glue 2-5 is epoxy glue.
Preferably, the glue injection grooves 1-3 are filled with epoxy glue.
The utility model discloses a concrete encapsulation step as follows:
s1: as shown in fig. 2 and 3, a frame structure of a primary package is designed, which includes a first metal pin I1-1, a second metal pin I1-2, a glue injection groove 1-3, and a first dam 1-4, the first dam is in a bowl-shaped structure, a first groove 1-7 is formed on the upper surfaces of the first metal pin I1-1 and the second metal pin I1-2, the glue injection groove 1-3 is arranged between the first metal pin I1-1 and the second metal pin I1-2, the glue injection groove 1-3 is filled with epoxy glue (epoxy PCT or PPA), and the first dam 1-4 is made of plastic material; in addition, the volume of the primary package should be kept as small as possible so as to be able to be loaded into the subsequently designed outer frame structure. The utility model discloses in, glue injection groove and first box dam integrated into one piece adopt the same kind of material, belong to conventional technical means.
S2: as shown in fig. 4, the light emitting chip 1-5 is fixed in the first groove 1-7 in the primary package, and the positive and negative electrodes of the light emitting chip 1-5 are led to the corresponding metal pins by the metal wires 1-8;
s3: as shown in fig. 5, a primary packaging adhesive 1-6 is encapsulated in a first groove 1-7 in a primary packaging body 1 for placing a light emitting chip 1-5 and a welding wire 1-8 for protection, and the material of the adhesive is preferably a silica gel material;
s4: as shown in fig. 6 and 7, the outer frame structure 2 is designed, the outer frame structure 2 includes a second dam 2-1, a substrate 2-2, a first metal lead II2-3 and a second metal lead II2-4, the structure of the second dam 2-1 is a bowl-shaped structure, is integrally formed with the substrate 2-2, and a second groove 2-6 is formed on the upper surface of the substrate, the first metal pin II2-3 and the second metal pin II2-4 are respectively arranged on the substrate 2-2, and level with the upper surface of the base plate 2-2, the first metal pin II2-3 and the second metal pin II2-4 pass through the base plate respectively and are bent 2 times at the bottom of the base plate 2-2 to form a pad structure, the second groove 2-6 of the outer frame structure can contain a primary packaging body, in the utility model, the base plate 2-2 and the second dam 2-1 are made of plastic materials;
s5: as shown in fig. 8, solder paste 3 is dispensed on the first metal pin II2-3 and the second metal pin II2-4 in the second groove 2-6 of the outer frame structure 2 by a dispensing or spraying process;
s6: as shown in fig. 9, the primary package 1 is loaded into the outer frame structure 2 by an SMT die bonding method, and the first metal lead I1-1 and the second metal lead I1-2 of the primary package 1 are soldered to the first metal lead II2-3 and the second metal lead II2-4 of the outer frame structure 2 by solder paste, respectively;
s7: as shown in fig. 1, the first package body is completely wrapped by using a secondary packaging glue 2-5, preferably an epoxy glue, to perform secondary sealing, so as to obtain a final product structure.
The utility model discloses in, once encapsulate gluey glue of adopting different glue of glue and secondary encapsulation and encapsulate, can select the encapsulation glue model by technical personnel in the field according to the actual demand.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A secondary packaging structure is characterized in that the secondary packaging structure comprises an outer frame structure and a primary packaging body, the primary packaging body is embedded in the outer frame structure, wherein,
the primary packaging body comprises a first metal pin I, a second metal pin I, a glue injection groove, a first dam, a light-emitting chip and primary packaging glue, wherein the glue injection groove is formed between the first metal pin I and the second metal pin I, the first dam is arranged on the upper surfaces of the first metal pin I and the second metal pin I to form a first groove, the light-emitting chip is fixed on the upper surface of the first metal pin I and is positioned in the first groove of the first dam, the light-emitting chip leads the positive electrode and the negative electrode to the first metal pin I and the second metal pin I through leads respectively, the first groove is filled with the primary packaging glue, and the primary packaging glue covers the light-emitting chip and the leads and is flush with the upper surface of the first dam;
the outer frame structure comprises a second dam, a substrate, a first metal pin II, a second metal pin II and secondary packaging glue, wherein the second dam is arranged on the substrate and integrally formed to form a second groove, the upper surface of the substrate is respectively provided with a first metal pin groove and a second metal pin groove, the first metal pin II and the second metal pin II are positioned in the second groove, the first metal pin II and the second metal pin II are respectively arranged on the first metal pin groove and the second metal pin groove, the upper surfaces of the first metal pin II and the second metal pin II are flush with the upper surface of the substrate, the bottoms of the first metal pin II and the second metal pin II respectively extend through two sides of the substrate, and the first metal pin II and the second metal pin II are bent to the bottom of the substrate to form a pad structure;
the primary packaging body is embedded in a second groove formed by a second dam, and a first metal pin I and a second metal pin I of the primary packaging body are respectively connected with a first metal pin II and a second metal pin II in the outer frame structure in a one-to-one correspondence mode; the secondary packaging glue is filled in the second groove and is flush with the upper surface of the second box dam, and the secondary packaging glue covers the primary packaging body.
2. The secondary package structure of claim 1, wherein the glue injection groove is a convex structure.
3. The secondary packaging structure of claim 2, wherein the cross-sectional shape of the first dam is a right trapezoid, and the hypotenuse of the right trapezoid is inside the first dam.
4. The secondary packaging structure of claim 2, wherein the cross-sectional shape of the second dam is a right trapezoid, and the hypotenuse is inside the second dam.
5. The secondary packaging structure according to claim 3 or 4, wherein the first dam and the second dam are both a closed ring, and the height of the first dam is greater than the thickness of the light emitting chip, and the height of the second dam is greater than the height of the primary package.
6. The secondary package structure of claim 1, wherein the primary package body is mounted inside the outer frame structure by SMT patch mounting.
7. The secondary package structure of claim 1, wherein the glue of the primary package glue is a silicone glue.
8. The secondary packaging structure of claim 1, wherein the glue of the secondary packaging glue is epoxy glue.
9. The secondary packaging structure of claim 1, wherein the glue injection groove is filled with epoxy glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121294775.6U CN214705966U (en) | 2021-06-10 | 2021-06-10 | Secondary packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121294775.6U CN214705966U (en) | 2021-06-10 | 2021-06-10 | Secondary packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214705966U true CN214705966U (en) | 2021-11-12 |
Family
ID=78555509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121294775.6U Active CN214705966U (en) | 2021-06-10 | 2021-06-10 | Secondary packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214705966U (en) |
-
2021
- 2021-06-10 CN CN202121294775.6U patent/CN214705966U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10454003B2 (en) | Light emitting device and manufacturing method thereof | |
| KR101521260B1 (en) | Light emitting diode package and manufacturing method thereof | |
| CN100438111C (en) | Method for producing light-emitted diode package structure | |
| CN101452986A (en) | Encapsulation structure and method for white light emitting diode device | |
| CN104916765A (en) | Light emitting device and method for manufacturing the same | |
| US20120091487A1 (en) | Light emitting diode package and method for manufacturing the same | |
| US8216864B2 (en) | LED device and packaging method thereof | |
| CN102738351B (en) | Light emitting diode (LED) packaging structure and manufacturing method thereof | |
| KR20120094280A (en) | Light emitting device package and method of fabricating the same | |
| US20140134766A1 (en) | Method of manufacturing light emitting device package | |
| CN102820384B (en) | The manufacture method of package structure for LED | |
| JP2013168647A (en) | Method of manufacturing fluorescent film and method of manufacturing light-emitting diode package | |
| CN214705966U (en) | Secondary packaging structure | |
| CN112951968B (en) | Outdoor full-color display screen SMD LED device | |
| CN206697519U (en) | Surface mount type LED support and adopting surface mounted LED device | |
| CN102509761A (en) | Chip package | |
| CN212848472U (en) | Prevent vulcanizing LED packaging structure | |
| JP3470949B2 (en) | Semiconductor light emitting device | |
| CN102593321B (en) | The method for packing of LED, LED encapsulation structure and display screen | |
| CN211088299U (en) | Light emitting diode packaging structure capable of emitting white light | |
| CN206992109U (en) | A kind of outdoor big spacing LED component and LED display | |
| CN110379324A (en) | A kind of LED luminous display unit and preparation method thereof | |
| CN106876555A (en) | Surface mount type LED support and adopting surface mounted LED device | |
| KR101505432B1 (en) | Light-emitting device package and method of manufacturing the same | |
| CN208674164U (en) | A kind of direct insertion LED encapsulation structure of light leakage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |