CN206992109U - A kind of outdoor big spacing LED component and LED display - Google Patents

A kind of outdoor big spacing LED component and LED display Download PDF

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Publication number
CN206992109U
CN206992109U CN201720652849.6U CN201720652849U CN206992109U CN 206992109 U CN206992109 U CN 206992109U CN 201720652849 U CN201720652849 U CN 201720652849U CN 206992109 U CN206992109 U CN 206992109U
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China
Prior art keywords
led
pad
pin
cup
big spacing
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CN201720652849.6U
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Chinese (zh)
Inventor
赵强
刘传标
刘晓峰
谢宗贤
范凯亮
刘艳
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Foshan NationStar Optoelectronics Co Ltd
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Foshan NationStar Optoelectronics Co Ltd
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Abstract

The utility model is related to a kind of outdoor big spacing LED component and LED display, LED component therein includes illuminating part and paster pin, and illuminating part includes prefocus cup, metal pins, LED chip and packing colloid;Prefocus cup is provided with cup cavity and rim of a cup;Metal pins include the pad for being arranged on cup cavity inner bottom surface;LED chip is arranged on the pad;The SMD bottom surface for being arranged at illuminating part of paster pin, pad electrically connect with paster pin.Thus the advantages of combining Lamp LED and SMD LED, after LED chip is encapsulated in prefocus cup, not only the heat derives of LED chip are radiated to outer by paster pin, and original direct insertion outdoor big spacing LED component is converted into by SMD outdoor big spacing LED component by paster pin, so as to reduce packaging cost, the plug-in unit process efficiency that display screen makes is improved, and improves the brightness of device, the heat dispersion of optimised devices.

Description

A kind of outdoor big spacing LED component and LED display
Technical field
LED technology field is the utility model is related to, more particularly to a kind of outdoor big spacing LED component and LED display.
Background technology
Full-color LED has been widely used in the display field of daily life, traditional outdoor full color LED display screen at present LED component there are two kinds of structures --- one kind is made up of 3~4 single red, green, blue pinned (Lamp) LEDs One luminescence unit, another kind are using RGB chip package SMD LED together as a luminescence unit.Both devices Part cuts both ways, Lamp LED components due to have a prefocus cup and with brightness it is high the advantages of, be normally applied big spacing out of doors In display area, but when the Area comparison of outdoor display screen is big, it is necessary to the RGB Lamp LED components of plug-in unit very It is more, it can so cause workload to increase severely with manufacturing cost greatly very much.And although traditional SMD LED components have gathered RGB Three colors, but applied to point spacing be more than P10 outdoor display screen in when, one side light extraction efficiency is low so that display screen Brightness can not meet to require, on the other hand because outdoor display screen requires that RGB pipe is highlighted, caused heat is big, heat It is concentrated in LED component and is difficult to spread in time, LED component generation light decay phenomenon can be caused and reliability drastically declines.
Utility model content
To solve the shortcomings that above-mentioned prior art and deficiency, the utility model provides a kind of outdoor big spacing LED component, Optimize heat dispersion while LED component display brightness can be improved, and disclosure satisfy that the LED of more than P10 point spacing is shown The requirement of screen, production cost is reduced, improve production efficiency and strengthens the reliability of LED component.It is of the present utility model another Purpose is to provide a kind of LED display for including above-mentioned outdoor big spacing LED component.
In order to solve the above technical problems, first, the utility model provides a kind of outdoor big spacing LED component, including hair Light portion and paster pin, the illuminating part include prefocus cup, metal pins, LED chip and packing colloid;The prefocus cup is provided with Cup cavity and rim of a cup;The rim of a cup is formed by the cup cavity through the top of the prefocus cup;The metal pins bag Include the pad for being arranged on the cup cavity inner bottom surface;The LED chip is arranged on the pad;The paster pin paster Formula is arranged at the bottom surface of the illuminating part, and the pad electrically connects with the paster pin;The packing colloid wraps up the LED Chip, the prefocus cup and the pad.
From there through above-mentioned technical proposal, the advantages of the utility model knot combines Lamp LED and SMD LED, by 1 Or after multiple LED chips are encapsulated in prefocus cup, not only the heat derives of LED chip are dissipated to outer by paster pin Heat, and original direct insertion outdoor big spacing LED component is converted into by SMD outdoor big spacing LED devices by paster pin Part, so as to reduce packaging cost, the plug-in unit process efficiency that display screen makes is improved, and improve the brightness of device, optimised devices Heat dispersion.Therefore the utility model LED component optimizes heat dispersion while can improve LED component display brightness, and can Meet the requirement of the LED display of more than P10 point spacing, reduce production cost, improve production efficiency and strengthen LED devices The reliability of part.
Further, the metal pins also include interior pin;The interior pin is located at the prefocus cup and the paster draws Between pin, the both ends of the interior pin electrically connect with the pad and paster pin respectively, and are wrapped up by the packing colloid.It is logical Cross and set up interior pin, be advantageous to improve the height of prefocus cup, so as to increase rising angle, further increase LED component Emitting brightness.
Further, outdoor big spacing LED component of the present utility model also includes firm banking, and the firm banking is arranged on Between the illuminating part and the paster pin;The SMD bottom surface for being arranged at the firm banking of the paster pin and with institute Pad electrical connection is stated, and is electrically connected by the pad with the LED chip.By setting up firm banking, envelope is not only facilitated The operation of the packaging technology of colloid is filled, and also enhances the stability of each structure division installation of LED component, so that LED component can form the higher display screen of reliability.
Further, the paster pin is to be electroplated in the bottom surface of the firm banking, printed or sprayed metal layer shape Into conducting strip.By limiting herein, be advantageous to quickly to realize that display screen assembles, further improve operating efficiency and display screen Production efficiency.
Further, the metal pins are structure as a whole with the paster pin.
Further, the paster pin is electrically-conductive backing plate, and the electrically-conductive backing plate includes multiple sheet metals, passes through multiple metals Piece realizes the conducting with LED chip respectively.By limiting herein, be advantageous to expand the space of paster pin selection so that energy It is enough to select different types of paster pin according to the actual requirements, preferably to meet actual use demand.
Further, the paster pin is insulated substrate;The insulated substrate, which is provided with, runs through its multiple conductive through holes, leads to Cross multiple conductive through holes and realize conducting with LED chip respectively.By limiting herein, be advantageous to expand paster pin selection Space, enabling different types of paster pin is selected according to the actual requirements, preferably to meet actual use demand.
Further, the width of the cup cavity is gradually increased from its inner bottom surface toward rim of a cup direction;And/or the cup The structure of cavity is rounding mesa-shaped;And/or the inwall covering of the cup cavity is provided with least one layer of reflecting coating;With/ Or, the top surface of the packing colloid is globoidal structure or spherical structure of the nock towards the rim of a cup of the prefocus cup;And/or institute The side for stating packing colloid is cylindrical surface structure.Wherein, it is beneficial to further enhance by defining for the width to cup cavity The display brightness of LED component;Advantageously ensure that the uniformity of LED chip light extraction goes forward side by side one by the structure qualification to cup cavity The display brightness of step enhancing LED component;By setting reflecting coating in cup cavity inwall, be advantageous to further enhance The display brightness of LED component, the light extraction efficiency of LED component is improved, can more meet the LED display of more than P10 point spacing Requirement;By the restriction of the top surface structure to packing colloid, be advantageous to the further light extraction efficiency for improving LED component, energy Enough better meet the requirement of the LED display of more than P10 point spacing;Pass through the limit of the side structure to packing colloid It is fixed, be advantageous to further improve light extraction efficiency.
Further, outdoor big spacing LED component of the present utility model includes at least three LED chip;And the pad includes Corresponded with least three LED chip and at least three die bond pad for being mutually not turned on, and the paster pin include with The one-to-one at least three electrode pin of at least three LED chip and 1 common pin;Or
The pad include 1 public pad and with the one-to-one at least three electrode pad of at least three chip, The public pad and 3 electrode pads are mutually not turned on;The paster pin includes at least four pin, described at least four Pin electrically connects with 1 public pad and at least three electrode pad respectively;Or
The pad includes at least three groups of chip bonding pads for corresponding with least three LED chip and being mutually not turned on; Every group of chip bonding pad includes two electrode pads being mutually not turned on;The paster pin includes and at least three groups of chip bonding pads one At least three groups of pins corresponding to one, every group of pin includes and two electrode pads of one group of corresponding chip bonding pad are electrically connected respectively Two electrode pins connect.By a variety of pad structures provided herein, actual use demand is met significantly, while is also achieved pair The rational Design on Plane of pad structure.
To realize another object of the present utility model, the utility model additionally provides a kind of outdoor big space distance LED display screen, Including wiring board, uniformly and it is disposed on the wiring board and some LED components for being turned on wiring board and is covered in The LED on some LED component surfaces shows mask;Wherein, each LED component is the LED component described in any of the above-described.Due to this LED display has the LED component described in any of the above-described, therefore the LED display has all Advantageous effects of LED component Fruit, it will not be repeated here.
Brief description of the drawings
Fig. 1 is the structural representation of the big spacing LED component in open air of the utility model embodiment 1;
Fig. 2 is the structural representation of the pad in the utility model embodiment 1;
Fig. 3 is the structural representation of the big spacing LED component in open air in the utility model embodiment 2;
Fig. 4 is the structural representation of the big spacing LED component in open air in the utility model embodiment 3;
Fig. 5 is the structural representation of the big spacing LED component in open air in the utility model embodiment 4;
Fig. 6 is the welding plate structure schematic of the big spacing LED component in open air in the utility model embodiment 5;
Fig. 7 is the welding plate structure schematic of the big spacing LED component in open air in the utility model embodiment 6.
Embodiment
The utility model provides a kind of outdoor big spacing LED component and its LED display, in order that the technology of this area Personnel are better understood when the technical solution of the utility model, the utility model is made with preferred embodiment below in conjunction with the accompanying drawings into The detailed description of one step.
A kind of embodiment of outdoor big spacing LED component
Embodiment 1
Referring to Fig. 1, the big spacing LED component in the open air of the present embodiment includes illuminating part and paster pin 2, the illuminating part Including prefocus cup 11, metal pins, LED chip and packing colloid 16.
In the present embodiment, the LED component includes at least three LED chip.
Specifically, the prefocus cup 11 is provided with cup cavity 111 and rim of a cup 112.The rim of a cup 112 is by the cup cavity 111 form through the top of the prefocus cup 11.
Specifically, the metal pins include the pad 121 for being arranged on the inner bottom surface of cup cavity 111.Described at least 3 Individual LED chip is arranged on the pad 121.
Specifically, the SMD bottom surface for being arranged at the illuminating part of the paster pin 2, the i.e. outer bottom of prefocus cup 11, And electrically connected with the pad 121.Specifically, the paster pin 2 from the bottom of prefocus cup 11 by penetrating to prefocus cup 11 Cup cavity 111 inner bottom surface at conductive media electrically connected with the pad 121, be achieved in by the pad 121 Turned on at least three LED chip.Wherein, conductive media can be plain conductor, or through hole, the through-hole wall are provided with Conductive material is filled with conductive layer or the through hole.
Specifically, the packing colloid 16 wraps up at least three LED chip, the prefocus cup 11 and the pad 121, while the bottom surface of packing colloid 16 also and with the top surface of the paster pin 2 after the conducting connection of pad 121 is locally bonded or complete Full fitting, it is understood that the top surface part or top surface of parcel paster pin 2 are also covered for packing colloid 16.
In the present embodiment, the electrode of at least three LED chip turns on paster pin 2 respectively, specifically, described Pad 121 includes at least three die bond pad for corresponding with least three LED chip and being mutually not turned on, and the paster Pin 2 includes at least three electrode pin one-to-one with least three LED chip and 1 common pin.Described at least 3 The bottom of the LED chip with bottom electrode is electrically connected and fixed on corresponding die bond pad in individual LED chip, and is led to The corresponding die bond pad and the electrical connection of corresponding electrode pin are crossed, and its top electrodes and common pin are electrically connected Connect;The bottom of other LED chips is insulated respectively to be fixed on corresponding die bond pad, and its top two electrodes respectively with public affairs Pin and the electrical connection of corresponding electrode pin altogether;Wherein, the polarity for being electrically connected to all electrodes of common pin is identical 's.In the present embodiment, as depicted in figs. 1 and 2, the LED component has 3 LED chips and 3 LED chips are respectively Red LED chips 13, green LED chip 14 and blue LED die 15, and the red LED chips 13 are arranged at the green Between LED chip 14 and the blue LED die 15.Correspondingly, the pad 121 only have 3 die bond pad h1, h2 and H3, and the paster pin 2 have 4 pins (electrode pin of wherein red LED chips is not shown in fig. 2) altogether, its In 1 pin be common pin g.
Preferably, to easily determine out common pin, mark can be set to distinguish in common pin;Similarly, for convenience Other electrode pins are distinguished, can also set and mark in other electrode pins.
The paster pin 2 is electrically-conductive backing plate, and the electrically-conductive backing plate includes multiple sheet metals, distinguished by multiple sheet metals Realize the conducting with corresponding LED chip;Or the paster pin 2 is insulated substrate, and only one piece, and the insulation Substrate, which is provided with, runs through its multiple conductive through holes, realizes from there through multiple conductive through holes and is led with corresponding LED chip respectively Logical, in addition, in other variant embodiments, the quantity of insulated substrate can be not limited to the present embodiment depending on actual conditions In situation.
In addition, in other embodiments, the metal pins are structure as a whole with the paster pin 2, i.e., described paster Pin 2 can also be the pin being bent to form from the outer bottom of the metal pins toward the prefocus cup 11;Or the paster Pin 2 can also be to be electroplated in the outer bottom of prefocus cup 11, printed or conducting strip that sprayed metal layer is formed.
To further enhance the display brightness of LED component, it is preferable that the width of the cup cavity 111 is by its inner bottom surface Gradually increase toward the direction of rim of a cup 112;And it is the further uniformity for improving LED chip light extraction, it is highly preferred that the cup cavity 111 structure is rounding mesa-shaped.
Further to improve the light emission rate of LED component, so that LED component can more meet that the LED of more than P10 point spacing shows The requirement of display screen, as a kind of more excellent technical scheme, the inwall covering of the cup cavity 111 is provided with least one layer Reflecting coating.Preferably, the reflectivity of the reflecting coating is more than 85%.
Further to improve the display brightness of LED component, as a kind of more excellent technical scheme, the packing colloid 16 Top surface 161 be globoidal structure of the nock towards the rim of a cup 112 of the prefocus cup 11;More preferably, the top of the packing colloid 16 Face 161 is spherical structure, and/or the side of the packing colloid 16 is cylindrical surface structure, as shown in Figure 1.
Further to improve the light extraction efficiency of LED component, while the heat diffusion of LED chip can also be gone out in time, carried The service life of high LED component, it is preferable that the packing colloid 16 is epoxy encapsulation colloid or silicone encapsulation colloid; The linear expansion coefficient of the epoxy encapsulation colloid is 65~170ppm/ DEG C, and refractive index is more than 1.4, it is preferred that refractive index For 1.49;The linear expansion coefficient of the silicone encapsulation colloid is 72~190ppm/ DEG C, and refractive index is more than 1.5, it is preferred that The refractive index is 1.53.
Embodiment 2
The structure base of the big spacing LED component in open air and the big spacing LED component in open air in embodiment 1 in the present embodiment 2 This is identical, and it is differed only in:The structure of metal pins is improved in the present embodiment 2, correspondingly, while also changed The position of paster pin 2, specifically, referring to Fig. 3, the metal pins also include the interior pin for supporting the prefocus cup 11 122;The interior pin is between the prefocus cup 11 and the paster pin 2, specifically, the interior pin 122 is arranged at Simultaneously wrapped up by the packing colloid 16 bottom of the prefocus cup 11;The paster pin 2 is SMD to be arranged at the interior pin 122 bottom, and electrically connected by the interior pin 122 and the pad with LED chip.
In the present embodiment, the interior pin 122 realizes that the structure of the electrical connection between paster pin 2 and pad is:It is interior The one end of pin 122 is through to after the inner bottom surface of the cup cavity of prefocus cup 11 from the outer bottom of prefocus cup 11 and electrically connected with pad, Its other end directly electrically connects with the paster pin 2.
In addition, in other embodiments, the interior pin and the paster pin are structure as a whole, i.e., described paster pin It is appreciated that for by the pin in metal pins in addition to pad and interior pin, namely by being located in metal pins outside packing colloid The pin for fitting in packing colloid bottom surface that is bent to form toward packing colloid bottom surface direction of pin.Now understand, metal Pin includes integral structure and the pad, interior pin and the outer pin that are sequentially connected, and paster pin is from outer pin toward the envelope Dress colloid bottom surface direction is bent to form.
Embodiment 3
The structure base of the big spacing LED component in open air and the big spacing LED component in open air in embodiment 1 in the present embodiment 3 This is identical, and it is differed only in:Referring to Fig. 4, the big spacing LED component in open air in the present embodiment 3 also includes the fixation of insulation Base 3.The firm banking 3 is arranged between the illuminating part and the paster pin 2, specifically, the firm banking 3 is set The outer bottom of the prefocus cup 11 is placed in, i.e., the described top surface of firm banking 3 is provided with the prefocus cup 11.The paster pin 2 The SMD bottom surface for being arranged at the firm banking 3 simultaneously electrically connects with the pad 121, and passes through the pad 121 and LED core Piece electrically connects.In the present embodiment, paster pin 2 is by being penetrated from firm banking 3 toward the bottom of prefocus cup 11 to prefocus cup Conductive media at the inner bottom surface of 11 cup cavity 111 electrically connects with the pad 121, is achieved in by the pad 121 turn on at least three LED chip.Wherein, conductive media can be metal wire, or through hole, the through-hole wall are provided with Conductive material is filled with conductive layer or the through hole.
In the present embodiment, the paster pin 2 is to be electroplated in the bottom surface of the firm banking 3, printed, spraying gold Belong to the conducting strip that layer is formed.
Packing colloid 16 in the present embodiment is the top surface part or top surface that parcel is covered in the firm banking 3, and Separated between packing colloid 16 and paster pin 2 by firm banking 3, therefore in the present embodiment 3, packing colloid 16 and paster pin 2 are not in contact with each other.
Embodiment 4
The structure base of the big spacing LED component in open air and the big spacing LED component in open air in embodiment 1 in the present embodiment 4 This is identical, and it is differed only in:The big spacing LED component in open air in the present embodiment 4 is the big spacing LED in open air in embodiment 2 The combination of the big spacing LED component in open air in device and embodiment 3, that is, referring to Fig. 5, in the present embodiment, the open air Big spacing LED component includes the firm banking 3 of insulation;The firm banking 3 is arranged at the outer bottom of the prefocus cup 11.And And the metal pins include the interior pin 122 of the support prefocus cup 11;The interior pin 122 is by the packing colloid 16 Parcel, and be arranged between the bottom of prefocus cup 11 and the top of the firm banking 3, and its one end runs through the bottom of prefocus cup 11 And electrically connected with pad, its other end electrically connects through the firm banking 3 and with the paster pin 2.
In addition, it is below the i.e. metal pins by exposing to the pin outside packing colloid in metal pins with paster pin 2 The illustratively manufacture of the LED component in the present embodiment 4 exemplified by this case that outer pin is bent to form toward prefocus cup outer bottom Processing step:
A, support prepares:
LED support is got out, with PPA materials or other can be applied to insulating materials that LED bases manufacture in LED support Junction between interior pin and conductive pin forms the firm banking;
Firm banking formed after just by interior pin to firm banking direction bending, form the patch of SMD structure Piece pin;
An inner chamber bottom surface is formed in pad periphery as circular prefocus cup, the prefocus cup of formation has cup cavity, described Pad is located at the inner bottom surface of the cup cavity, is higher than pad at its cup cavity top surface namely prefocus cup rim of a cup, and rim of a cup Bore is more than the interior diameter of cup cavity bottom surface, namely the vertical section structure of the cup cavity of prefocus cup is an inverted trapezoidal;
One layer of mirror surface structure is formed in the cup cavity internal face of the prefocus cup:It can be coated by the internal face in cavity One layer of reflecting coating is formed, and the reflecting coating is the material containing silver or aluminium, and reflecting rate is more than 85%;
B, die bond:
Point conducting resinl or insulating cement at pad in prefocus cup, by LED chip be respectively placed at corresponding conducting resinl or On insulating cement, then make glue curing through overbaking, be achieved in the fixation of LED chip;And continue executing with process C;
If using flip LED chips, need to use tin cream or scaling powder that LED chip is fixed in die bond, I.e. first at pad point tin cream or scaling powder, then flip LED chips are placed on tin cream or scaling powder again, finally by return Fluid welding fixes LED chip, can now save following process C and directly perform process D;
C, bonding wire:Using metal lead wire bonding technology, by LED chip both positive and negative polarity and circuit turn-on;
D, encapsulate:LED support after bonding wire is placed on progress encapsulating encapsulation in mould bar;
E, harden:Cure process is carried out to glue at a high temperature of 130 DEG C~160 DEG C, obtains LED component;
F, testing, sorting:LED component similar in photoelectric parameter is classified:
G, paster:Using tin cream is coated on mode of printing assist side module, LED component is placed with tin cream, then Crossing Reflow Soldering fixes tin cream;
H, multiple LED module fixed Combinations are installed to form LED display.
Embodiment 5
The big spacing LED component in open air in the present embodiment and the big spacing LED component in open air in any of the above-described embodiment Structure is essentially identical, and it is differed only in:The pad structure in pad structure and above-mentioned each embodiment in the present embodiment is not Together, that is, in the present embodiment 5, the pad is one-to-one extremely including 1 public pad and with least three chip Few 3 electrode pads, the public pad and 3 electrode pads are mutually not turned on.The paster pin is drawn including at least four Pin, at least four pin electrically connect with 1 public pad and at least three electrode pad respectively.
In the present embodiment, at least three LED chip is all flip-chip, the electrode of bottom two point of each LED chip Do not electrically connect and fix by conducting resinl and corresponding electrode pad and public pad.
And in other embodiments, at least three LED chip can also be all horizontal structure, and each LED chip is fixed Insulating regions or insulation between corresponding electrode pad and public pad are fixed on corresponding electrode pad, and its Two electrodes electrically connect with corresponding electrode pad and public pad respectively.Or at least three LED chip, one of them LED chip is vertical stratification, and remaining LED chip is horizontal structure, can be by the bottom electricity of the LED chip with bottom electrode Pole is electrically connected and fixed on electrode pad with corresponding electrode pad, and top electrodes are electrically connected by wire with public pad, And other LED chips are insulating regions or the insulation fixation by being fixed between corresponding electrode pad and public pad In on corresponding electrode pad, and its two electrode electrically connects with corresponding electrode pad and public pad respectively.
Only there are 3 LED chips with the present embodiment and 3 LED chips are respectively red LED chips 13, blue led core Illustrate the pad structure in the present embodiment exemplified by piece 15 and green LED chip 14, pad now only has 1 public pad g1 With 3 electrode pads d1, d2 and d3, as shown in Figure 6;And the paster pin only has 4 pins.
Embodiment 6
The structure of LED component and the big spacing LED component in open air in any embodiment of embodiment 1~4 in the present embodiment Essentially identical, it is differed only in:Pad structure in the present embodiment is different from the pad structure in above-mentioned each embodiment, That is, in the present embodiment 6, the pad includes at least three groups for corresponding with least three LED chip and being mutually not turned on Chip bonding pad;Every group of chip bonding pad includes two electrode pads being mutually not turned on.The paster pin includes and described at least three groups The one-to-one at least three groups of pins of chip bonding pad, every group of pin includes and the weldering of two electrodes of one group of corresponding chip bonding pad Two electrode pins that disk is electrically connected.
In the present embodiment, at least three LED chip is all flip-chip, the electrode of bottom two of each LED chip It is electrically connected and fixed at respectively by conducting resinl and two corresponding electrode pads on the electrode pad.
And in other embodiments, at least three LED chip can be all horizontal structure, and each LED chip is fixed Insulating regions between two electrode pads or insulation in one group of corresponding chip bonding pad are fixed on two electrode pads On any electrode pad, and its two electrode electrically connects with two corresponding electrode pads respectively.Or at least three LED core Piece, one of LED chip are vertical stratification, and remaining LED chip is horizontal structure, can be by the LED with bottom electrode The bottom electrode of chip is electrically connected and fixed on electrode pad with a corresponding electrode pad, and other LED chips are to pass through Insulating regions or insulation between two electrode pads being fixed in one group of corresponding chip bonding pad are fixed on the weldering of two electrodes On any electrode pad of disk and its two electrode electrically connects with two corresponding electrode pads respectively.
Only there are 3 LED chips with the present embodiment and 3 LED chips are respectively red LED chips 13, blue led core Illustrate the pad structure in the present embodiment exemplified by piece 15 and green LED chip 14, the pad includes 3 groups of chip bonding pads x1, x2 And x3, as shown in Figure 7;And the paster pin only has 6 pins.
In addition, the quantity of the LED chip in each sub- embodiment of the embodiment of outdoor big spacing LED component can be with above Be changed according to being actually needed, for example, the LED chip in outdoor big spacing LED component only have one can also, only two It is individual can also, more than three can also;Also, in each sub- embodiment of the embodiment of above LED component, paster pin is all Parallel with the bottom surface of prefocus cup, in other embodiments, the paster pin can be in non-parallel shape with the bottom surface of prefocus cup State, it can be determined on a case-by-case basis, situation about being not limited in embodiment hereof.
A kind of embodiment of LED display
A kind of LED display, including wiring board, uniformly and be disposed on the wiring board and turned on wiring board Some outdoor big spacing LED components and the LED display masks for being covered in some outdoor big spacing LED component surfaces.Wherein, Each outdoor big spacing LED component is the outdoor big spacing described in any embodiment in outdoor big spacing LED component embodiment LED component, therefore will not be repeated here.
Relative to prior art, a kind of outdoor big spacing LED component of the present utility model and its LED display combine The advantages of Lamp LED and SMD LED, after one or more LED chips are encapsulated in a prefocus cup, not only drawn by paster Pin is radiated the heat derives of LED chip to outer, and by paster pin by original direct insertion outdoor big spacing LED Device is converted into SMD outdoor big spacing LED component, so as to reduce packaging cost, improves the plug-in unit technique effect that display screen makes Rate, and the brightness of device is also improved, the heat dispersion of device is optimized, and disclosure satisfy that the LED of more than P10 point spacing The requirement of display screen, production cost is reduced, improve production efficiency and strengthens the reliability of LED component.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The scope of protection of the utility model.

Claims (10)

  1. A kind of 1. outdoor big spacing LED component, it is characterised in that:Including illuminating part and paster pin, the illuminating part includes poly- Light cup, metal pins, LED chip and packing colloid;The prefocus cup is provided with cup cavity and rim of a cup;The rim of a cup is by the cup Body cavity is formed through the top of the prefocus cup;The metal pins include being arranged on the weldering of the cup cavity inner bottom surface Disk;The LED chip is arranged on the pad;The SMD bottom surface for being arranged at the illuminating part of the paster pin, it is described Pad electrically connects with the paster pin;The packing colloid wraps up LED chip, the prefocus cup and the pad.
  2. 2. outdoor big spacing LED component according to claim 1, it is characterised in that:The metal pins also include interior draw Pin;The interior pin between the prefocus cup and the paster pin, the both ends of the interior pin respectively with the pad Electrically connect with paster pin, and wrapped up by the packing colloid.
  3. 3. outdoor big spacing LED component according to claim 1, it is characterised in that:Also include firm banking, the fixation Base is arranged between the illuminating part and the paster pin;The paster pin is SMD to be arranged at the firm banking Bottom surface simultaneously electrically connects with the pad, and is electrically connected by the pad with the LED chip.
  4. 4. outdoor big spacing LED component according to claim 3, it is characterised in that:The paster pin is in described solid The bottom surface for determining base electroplated, is printed or conducting strip that sprayed metal layer is formed.
  5. 5. according to any big spacing LED component in described open air of claims 1 to 3, it is characterised in that:The metal pins and institute Paster pin is stated to be structure as a whole.
  6. 6. outdoor big spacing LED component according to claim 1, it is characterised in that:The paster pin is electrically-conductive backing plate; The electrically-conductive backing plate includes multiple sheet metals, and the conducting with LED chip is realized respectively by multiple sheet metals.
  7. 7. outdoor big spacing LED component according to claim 1, it is characterised in that:The paster pin is insulated substrate; The insulated substrate, which is provided with, runs through its multiple conductive through holes, and the conducting with LED chip is realized respectively by multiple conductive through holes.
  8. 8. outdoor big spacing LED component according to claim 1, it is characterised in that:The width of the cup cavity is by it Inner bottom surface gradually increases toward rim of a cup direction;And/or the structure of the cup cavity is rounding mesa-shaped;And/or the cup is empty The inwall covering of chamber is provided with least one layer of reflecting coating;And/or the top surface of the packing colloid is nock towards the optically focused The globoidal structure or spherical structure of the rim of a cup of cup;And/or the side of the packing colloid is cylindrical surface structure.
  9. 9. outdoor big spacing LED component according to claim 1, it is characterised in that:Including at least three LED chip;And institute State at least three die bond pad that pad includes corresponding with least three LED chip and being mutually not turned on, and the paster Pin includes at least three electrode pin one-to-one with least three LED chip and 1 common pin;Or
    The pad include 1 public pad and with the one-to-one at least three electrode pad of at least three chip, it is described Public pad and 3 electrode pads are mutually not turned on;The paster pin includes at least four pin, at least four pin Electrically connected respectively with 1 public pad and at least three electrode pad;Or
    The pad includes at least three groups of chip bonding pads for corresponding with least three LED chip and being mutually not turned on;Every group Chip bonding pad includes two electrode pads being mutually not turned on;The paster pin includes and a pair of at least three groups of chip bonding pads 1 At least three groups of pins answered, every group of pin include what is be electrically connected with two electrode pads of one group of corresponding chip bonding pad Two electrode pins.
  10. 10. a kind of outdoor big space distance LED display screen, including wiring board, uniformly and it is disposed on the wiring board and and line Some outdoor big spacing LED components of road plate conducting and it is covered in the LED on some outdoor big spacing LED component surfaces and shows Mask;Its feature as:Each outdoor big spacing LED component is the big spacing LED in open air described in any one of claim 1~9 Device.
CN201720652849.6U 2017-06-07 2017-06-07 A kind of outdoor big spacing LED component and LED display Active CN206992109U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020108501A1 (en) * 2018-11-28 2020-06-04 深圳Tcl新技术有限公司 Led array and led display screen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020108501A1 (en) * 2018-11-28 2020-06-04 深圳Tcl新技术有限公司 Led array and led display screen

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