CN207068923U - A kind of novel full color LED light source encapsulating structure and application - Google Patents
A kind of novel full color LED light source encapsulating structure and application Download PDFInfo
- Publication number
- CN207068923U CN207068923U CN201720954248.0U CN201720954248U CN207068923U CN 207068923 U CN207068923 U CN 207068923U CN 201720954248 U CN201720954248 U CN 201720954248U CN 207068923 U CN207068923 U CN 207068923U
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit
- light source
- line pad
- side circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of novel full color LED light source encapsulating structure and application, including：Substrate, the circuit-line being arranged on substrate；Circuit-line includes two parts：Front-side circuit line pad and back-side circuit line pad；It is arranged on substrate, and for connecting the conductive hole of front-side circuit line pad and back-side circuit line pad, conductive hole extends to back-side circuit line pad from the front-side circuit line pad, and is filled with filler；Positioned at the green paint of the square structure of back side circuit；The LED chip being placed in front-side circuit line pad；Play the bonding line of conducting for connecting LED chip and circuit-line pad；Play the conductive primer of conducting and fixed LED chip for connecting LED chip and substrate circuit；Packaging plastic for packaging LED chips.The utility model can be achieved the Multifunctional LED encapsulating structure design of common-anode or common cathode, can lift the compatibility that product uses by circuit structure, product design function optimization.
Description
Technical field
LED encapsulation technologies field is the utility model is related to, more particularly to a kind of novel full color LED light source encapsulation
Structure and application.
Background technology
As indoor display application technology improves constantly, tradition shows that product technology is gradually climbed to the top of a mountain, indoor small spacing product
As following main technique extension space；The product size of indoor main flow is 1010 products, and state's star, hundred million light, brilliant platform, Dongshan are smart
Close to wait the encapsulation enterprise product of volume production 1010, each structure design for encapsulating the product of factory 1010 differs, and main feature uses
Common-anode designs, and can not realize common cathode structure, with the maturation of power drives technology, to reduce display screen power consumption and display one
Cause property, has producer to begin attempt to use common cathode circuit structure design, and gradually move towards market.Therefore, to meet the market demand,
The product that can meet common-anode or common cathode circuit structure design simultaneously for designing a high reliability is that have great city
Field value.In addition, the air-tightness of 1010 products is bad on the market at present, reliability is relatively low.Improving product reliability turns into each envelope
One of direction that dress enterprise is continually striving to.
Therefore, how a kind of Multifunctional LED encapsulating structure design that can not only realize common-anode or common cathode is provided, can be carried
Rise the compatibility that product uses；Moreover, improving traditional all-colour LED illuminating source packaging structure air-tightness, the reliability of product is lifted
Novel full color LED light source encapsulating structure and application the problem of being those skilled in the art's urgent need to resolve.
Utility model content
In view of this, the utility model provides a kind of Multifunctional LED encapsulation that can not only realize common-anode or common cathode
Structure design, the compatibility that product uses can be lifted；Moreover, improving traditional all-colour LED illuminating source packaging structure air-tightness, lifted
The novel full color LED light source encapsulating structure of the reliability of product and application.
To achieve the above object, the utility model provides following technical scheme：
A kind of novel full color LED light source encapsulating structure and application, including：Substrate, the circuit line being arranged on the substrate
Road pad；The circuit-line pad includes two parts：Positioned at the substrate front side and the front-side circuit line pad of reverse side and
Back-side circuit line pad；It is arranged on the substrate, and for connecting the front-side circuit line pad and the back side
The conductive hole of circuit-line pad, the conductive hole extend to the back-side circuit circuit weldering from the front-side circuit line pad
Disk, and it is filled with filler；Characterized in that, also include：Positioned at the green paint of the square structure of the back side circuit；It is placed on institute
State the LED chip in front-side circuit line pad；Play conducting for connecting the LED chip and the circuit-line pad
Bonding line；Play the conductive bottom of conducting and the fixed LED chip for connecting the LED chip and the substrate circuit
Glue；For encapsulating the packaging plastic of the LED chip.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, the front-side circuit line pad
Including：Public pad, the No.1 pad to be linked together with the public pad, No. two pads of a reserved position of bonding wire,
No. No. three pads of pin on back surface corresponding to two absolute construction and connection.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, No.1 weldering with it is described public
The connecting line of pad is centrally located；No. three pads are using minimum design structure, long a width of 0.13-0.15mm, for prolonging
Long steam enters the stroke of interiors of products.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, the thickness of the substrate is
0.1mm-3mm, color are black or white, material be BT substrates, FR4 substrates, aluminium base, copper base, ceramic substrate its
Middle one kind.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, the front-side circuit line pad
One layer of nickel can be first coated with by electroplating or changing depositing process in layers of copper, nickel thickness is in 100-300u "；One layer of silver can be plated on nickel dam
Or one layer of gold, one layer of gold is plated again after can also plating one layer of silver, and silver is thick thick in 2-10u " in 20-80u ", gold.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, the conductive hole is a diameter of
0.05-0.5mm, the filler inside the conductive hole can be metallics, or nonmetallic substance, and metallics
It is to be completed by way of electroplating or filling in metal column.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, the position of the conductive hole can be set
Count the design method all covered by colloid inside functional areas；It can also design in corner, four lamps share leads described in one
The design method in electric hole.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, the LED chip is by feux rouges
Chip, green glow chip, blue chip combine, and chip size can be 50um-150um, and quantitative proportion is preferably 1: 1: 1.
Preferably, in a kind of above-mentioned novel full color LED light source encapsulating structure and application, the LED chip is using conductive
Crystal-bonding adhesive is fixed on the front-side circuit line pad functional areas surface, is then connected to the public affairs by the bonding line respectively
Turned on altogether on pad, protect the LED chip to light finally by the packaging plastic.
Understood via above-mentioned technical scheme, compared with prior art, the utility model disclose provide it is a kind of new complete
Color LED light source encapsulating structure and application, including：Substrate, the circuit-line pad being arranged on the substrate；The circuit-line
Pad includes two parts：Positioned at the substrate front side and the front-side circuit line pad and back-side circuit line pad of reverse side；If
It is placed on the substrate, and for connecting the conduction of the front-side circuit line pad and the back-side circuit line pad
Hole, the conductive hole extends to the back-side circuit line pad from the front-side circuit line pad, and is filled with filler；
Characterized in that, also include：Positioned at the green paint of the square structure of the back side circuit；It is placed on the front-side circuit line pad
On LED chip；Play the bonding line of conducting for connecting the LED chip and the circuit-line pad；For connecting
The LED chip and the substrate circuit play the conductive primer of conducting and the fixed LED chip；It is described for encapsulating
The packaging plastic of LED chip.The utility model changes traditional common-anode circuit structure design, passes through circuit structure, product design
Function optimization, the Multifunctional LED encapsulating structure design of common-anode or common cathode can be achieved, the compatibility that product uses can be lifted.
Meanwhile traditional all-colour LED illuminating source packaging structure air-tightness is improved, lift the reliability of product.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is embodiment of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, also
Other accompanying drawings can be obtained according to the accompanying drawing of offer.
Fig. 1 accompanying drawings are the structural representation of this prior art.
Fig. 2 accompanying drawings are the positive structure schematic of embodiment 1 of the present utility model.
Fig. 3 accompanying drawings are the structure schematic diagram of embodiment 1 of the present utility model.
Fig. 4 accompanying drawings are the positive structure schematic of embodiment 2 of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
The utility model embodiment discloses a kind of Multifunctional LED encapsulating structure that can not only realize common-anode or common cathode
Design, can lift the compatibility that product uses；Moreover, improving traditional all-colour LED illuminating source packaging structure air-tightness, product is lifted
Reliability novel full color LED light source encapsulating structure and application.
Accompanying drawing 1, accompanying drawing 2, accompanying drawing 3, accompanying drawing 4 are referred to, is a kind of novel full color LED light source envelope disclosed in the utility model
Assembling structure and application, are specifically included：
Substrate 1, the circuit-line pad being arranged on substrate 1；Circuit-line pad includes two parts：Positioned at substrate 1 just
Face and the front-side circuit line pad and back-side circuit line pad of reverse side；It is arranged on substrate 1, and for connecting positive electricity
The conductive hole 4 of road line pad and back-side circuit line pad, conductive hole 4 extend to back-side circuit from front-side circuit line pad
Line pad, and it is filled with filler；Characterized in that, also include：Positioned at back-side circuit line pad square structure it is green
Paint 5；The LED chip 6 being placed in front-side circuit line pad；Play conducting for connecting LED chip 6 and circuit-line pad and make
Bonding line 7；Play the conductive primer of conducting and fixed LED chip 6 for connecting LED chip 6 and the circuit of substrate 1；With
In the packaging plastic 8 of packaging LED chips 6.
The utility model uses new design concept, by being laid out again to PCB substrate circuit structure, have devised a
It can meet that common-anode drives, and can meets the multifunctional product structure of common cathode driving, improves the compatibility of product；Together
When, pad structure is optimized, increases the contact area of BT resins and epoxy glue, internal stress is reduced, improves the reliable of product
Property.
In order to further optimize above-mentioned technical proposal, front-side circuit line pad includes：Public pad 21, with public pad
The 21 No.1 pads 22 to link together, reserve No. two pads 23 of a position of bonding wire, and two absolute construction simultaneously connect correspondingly
Pin on back surface No. three pads 24.
In order to further optimize above-mentioned technical proposal, the connecting line of No.1 pad 22 and public pad 21 is located at interposition
Put；No. three pads 24 long a width of 0.13-0.15mm, enter interiors of products using design structure is minimized for extending steam
Stroke.
In order to further optimize above-mentioned technical proposal, the thickness of substrate 1 is 0.1mm-3mm, and color is black or white,
Material is BT substrates, FR4 substrates, aluminium base, copper base, the one of which of ceramic substrate.
, can be by electroplating or changing plating in front-side circuit line pad layers of copper in order to further optimize above-mentioned technical proposal
Technique is first coated with one layer of nickel, and nickel thickness is in 100-300u "；One layer of silver or one layer of gold can be plated on nickel dam, can also be plated after one layer of silver again
One layer of gold is plated, silver is thick thick in 2-10u " in 20-80u ", gold.
In order to further optimize above-mentioned technical proposal, 4 a diameter of 0.05-0.5mm of conductive hole, the filling inside conductive hole 4
Thing can be metallics, or nonmetallic substance, and metallics is complete by way of electroplating or filling in metal column
Into.
In order to further optimize above-mentioned technical proposal, the position of conductive hole 4 can be designed inside functional areas by colloid whole
The design method of covering；It can also design in corner, four lamps share the design method of a conductive hole 4.
In order to further optimize above-mentioned technical proposal, LED chip 6 is combined by red light chips, green glow chip, blue chip
Form, chip size can be 50um-150um, and quantitative proportion is preferably 1: 1: 1.
In order to further optimize above-mentioned technical proposal, LED chip 6 is fixed on the weldering of front-side circuit circuit using conductive crystal-bonding adhesive
Disk functional areas surface, then it is connected on public pad 21 and is turned on by the bonding line respectively, finally by packaging plastic 8
To protect LED chip 6 luminous.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.For device disclosed in embodiment
For, because it is corresponded to the method disclosed in Example, so description is fairly simple, related part is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or new using this practicality
Type.A variety of modifications to these embodiments will be apparent for those skilled in the art, determine herein
The General Principle of justice can be realized in other embodiments in the case where not departing from spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The most wide scope consistent with features of novelty.
Claims (9)
1. a kind of novel full color LED light source encapsulating structure and application, including：Substrate, the circuit-line being arranged on the substrate
Pad；The circuit-line pad includes two parts：Positioned at the substrate front side and the front-side circuit line pad and the back of the body of reverse side
Face circuit-line pad；It is arranged on the substrate, and for connecting the front-side circuit line pad and back side electricity
The conductive hole of road line pad, the conductive hole extend to the back-side circuit circuit weldering from the front-side circuit line pad
Disk, and it is filled with filler；Characterized in that, also include：Positioned at the green paint of the square structure of the back side circuit；It is placed on institute
State the LED chip in front-side circuit line pad；Play conducting for connecting the LED chip and the circuit-line pad
Bonding line；Play the conductive bottom of conducting and the fixed LED chip for connecting the LED chip and the substrate circuit
Glue；For encapsulating the packaging plastic of the LED chip.
2. a kind of novel full color LED light source encapsulating structure according to claim 1 and application, it is characterised in that it is described just
Face circuit-line pad includes：Public pad, the No.1 pad to be linked together with the public pad, reserve a bonding wire position
No. three pads of pin on back surface corresponding to No. two pads put, two absolute construction and connection.
3. a kind of novel full color LED light source encapsulating structure according to claim 2 and application, it is characterised in that described one
Number weldering is centrally located with the connecting line of the public pad；No. three pads are using minimum design structure, long a width of 0.13-
0.15mm, the stroke of interiors of products is entered for extending steam.
4. a kind of novel full color LED light source encapsulating structure according to claim 1 and application, it is characterised in that the base
The thickness of plate is 0.1mm-3mm, and color is black or white, and material is BT substrates, FR4 substrates, aluminium base, copper base, pottery
The one of which of porcelain substrate.
5. a kind of novel full color LED light source encapsulating structure according to claim 1 and application, it is characterised in that it is described just
One layer of nickel can be first coated with by electroplating or changing depositing process in the circuit-line bond pad copper layer of face, nickel thickness is in 100-300u "；Nickel
One layer of silver or one layer of gold can be plated on layer, plates one layer of gold again after can also plating one layer of silver, silver is thick thick in 2-10u " in 20-80u ", gold.
6. a kind of novel full color LED light source encapsulating structure according to claim 1 and application, it is characterised in that described to lead
Electric bore dia is 0.05-0.5mm, and the filler inside the conductive hole can be metallics, or nonmetallic substance,
And metallics is completed by way of electroplating or filling in metal column.
7. a kind of novel full color LED light source encapsulating structure according to claim 1 and application, it is characterised in that described to lead
The position in electric hole can design the design method all covered by colloid inside functional areas；It can also design in corner, four lamps
Share the design method of a conductive hole.
8. a kind of novel full color LED light source encapsulating structure according to claim 1 and application, it is characterised in that the LED
Chip is combined by red light chips, green glow chip, blue chip, and chip size can be 50um-150um, and quantitative proportion is excellent
Elect 1: 1: 1 as.
9. a kind of novel full color LED light source encapsulating structure according to claim 1 and application, it is characterised in that the LED
Chip is fixed on the front-side circuit line pad functional areas surface using conductive crystal-bonding adhesive, then passes through the bonding line respectively
It is connected on the public pad and is turned on, protects the LED chip to light finally by the packaging plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720954248.0U CN207068923U (en) | 2017-08-02 | 2017-08-02 | A kind of novel full color LED light source encapsulating structure and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720954248.0U CN207068923U (en) | 2017-08-02 | 2017-08-02 | A kind of novel full color LED light source encapsulating structure and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207068923U true CN207068923U (en) | 2018-03-02 |
Family
ID=61518723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720954248.0U Active CN207068923U (en) | 2017-08-02 | 2017-08-02 | A kind of novel full color LED light source encapsulating structure and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207068923U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
-
2017
- 2017-08-02 CN CN201720954248.0U patent/CN207068923U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
| CN114141912B (en) * | 2021-11-24 | 2023-05-23 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202111151U (en) | Novel TOP LED support and TOP LED device manufactured by using the same | |
| CN105609621A (en) | 360-degree light source packaging device | |
| CN206451731U (en) | A kind of inverted structure LED core chip package for realizing the close display of superelevation | |
| CN206422064U (en) | A kind of light emitting diode (LED) chip with vertical structure encapsulating structure for realizing the close display of superelevation | |
| CN106711136A (en) | Vertical-structure LED chip packaging structure for realizing super-high density display | |
| CN104282676A (en) | Integrated LED lamp panel packaging structure and technology | |
| CN203503708U (en) | Sapphire base LED encapsulation structure | |
| CN207068923U (en) | A kind of novel full color LED light source encapsulating structure and application | |
| CN206758464U (en) | A kind of LED packaged light sources based on ceramic substrate | |
| CN202513204U (en) | Packaging structure with white light surface attached with light emitting diode | |
| CN205960016U (en) | Adopt LED packaging structure who electroplates base plate | |
| CN204045626U (en) | Chip-packaging structure on the light-emitting diode panel of many races array | |
| CN204403892U (en) | A kind of LED of Sapphire Substrate | |
| CN203707188U (en) | Mirror plane aluminum substrate capable of improving light source luminous efficiency | |
| CN203812913U (en) | LED packaging structure | |
| CN206992107U (en) | A kind of small spacing LED component and the display screen being produced from it | |
| CN203038968U (en) | LED illumination module | |
| CN204045589U (en) | A kind of LED-COB light source | |
| CN206992109U (en) | A kind of outdoor big spacing LED component and LED display | |
| CN207217587U (en) | A kind of indoor display LED component encapsulating structure of high-contrast | |
| CN202695440U (en) | Led integrated light source | |
| CN207637842U (en) | A kind of indoor display LED packagings of high contrast | |
| CN207664061U (en) | A kind of convex LED substrate encapsulating structure | |
| CN208352292U (en) | A kind of LED charactrons | |
| CN202796938U (en) | Flip chip of white-light module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |