CN206451731U - A kind of inverted structure LED core chip package for realizing the close display of superelevation - Google Patents
A kind of inverted structure LED core chip package for realizing the close display of superelevation Download PDFInfo
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- CN206451731U CN206451731U CN201720060825.1U CN201720060825U CN206451731U CN 206451731 U CN206451731 U CN 206451731U CN 201720060825 U CN201720060825 U CN 201720060825U CN 206451731 U CN206451731 U CN 206451731U
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- terminal pad
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Abstract
A kind of inverted structure LED core chip package for realizing the close display of superelevation, including substrate, blue-light LED chip, green LED chip and red LED chip；The front and back of substrate is respectively arranged with front-side circuit circuit and back-side circuit circuit, and conductive hole is provided with substrate, a public positive terminal pad and A independences negative terminal pad and B independence negative terminal pads are provided with the front-side circuit circuit of substrate, blue-light LED chip is connected with A independences negative terminal pad and public positive terminal pad respectively by conductive primer, green LED chip is connected with B independences negative terminal pad and public positive terminal pad respectively by conductive primer, red LED chip is fastened in public positive terminal pad by conductive primer, red LED chip surface electrode is connected on front-side circuit circuit by a bonding line, the green paint of triangular structure is provided with the middle part of substrate back.The encapsulating structure greatly reduces the size of LED encapsulation structure, realizes the full-color applications of LED of the close display of superelevation.
Description
Technical field
The utility model is related to LED encapsulation technologies field, and in particular to a kind of inverted structure LED for realizing the close display of superelevation
Chip-packaging structure.
Background technology
As indoor display application technology is improved constantly, tradition shows that product technology is gradually climbed to the top of a mountain, indoor small spacing product
As following main technique extension space；Product is shown for high definition in substitution LCD, DLP rooms, for small clearance display screen
The smaller pixel distance to reduce display screen to be done of the size of LED encapsulation structure, realizes high definition display function.Small of tradition
Designed away from LED encapsulation structure using the chip of surface bipolar electrode, need to be by two bonding lines respectively by two in LED encapsulation process
Electrode is connected with BT plate pads reaches the effect of conducting.Weldering bonding line has to the electrode of chip and the distance of BT plate pads will
Ask, distance is too small, can cause to weld or the problem of soldering reliability is low, thus constrain small spacing LED encapsulation chi
Very little diminution.
Utility model content
In order to solve the above technical problems, we have proposed a kind of inverted structure LED chip encapsulation for realizing the close display of superelevation
Structure, the length and width size of the LED encapsulation structure can be that between 0.45mm-1.0mm, minimum dimension can accomplish 0.45*0.45mm,
Realize the full-color applications of LED of the close display of superelevation.
To reach above-mentioned purpose, the technical solution of the utility model is as follows：
A kind of inverted structure LED core chip package for realizing the close display of superelevation, including substrate, blue-light LED chip, green glow
LED chip, red LED chip, bonding line, A independences negative terminal pad, B independences negative terminal pad, public positive terminal pad and triangle knot
The green paint of structure；The blue-light LED chip and green LED chip are inverted structure chip, and the red LED chip is vertical stratification core
Piece, the front and back of the substrate is respectively arranged with front-side circuit circuit and back-side circuit circuit, and sets on the substrate
The conductive hole for connecting the front-side circuit circuit and the back-side circuit circuit is equipped with, the conductive hole is electric from the front
Route road extends to the back-side circuit circuit, and is filled up sealing by conducting metal material or electron opaque material and fill and lead up,
A public positive terminal pad is provided with the front-side circuit circuit of the substrate and in the placement blue-light LED chip and green glow
The region of LED chip is respectively arranged with the A independences negative terminal pad and B independence negative terminal pads, and the blue-light LED chip is by leading
Electric primer is connected with the A independences negative terminal pad and public positive terminal pad respectively, and the green LED chip passes through conductive primer point
It is not connected with the B independences negative terminal pad and public positive terminal pad, the red LED chip is fastened on by conductive primer
In the public positive terminal pad, the red LED chip surface electrode is connected to the front electricity by a bonding line
On route road, the green paint of triangular structure is provided with the middle part of the substrate back.
It is preferred that, the thickness of the substrate is 0.1mm-0.5mm, and color is black or white, material be BT substrates,
FR4 substrates, aluminium base, one of which or several mixing of copper base and ceramic substrate.
It is preferred that, it is nickel in the substrate front side circuit-line layers of copper, nickel thickness is between 100-300u "；Can on nickel dam
Silver-plated or gold, also can it is silver-plated after plate one layer of gold again, silver thickness is between 20-80u ", and gold thickness is between 2-10u ".
It is preferred that, a diameter of 0.05-0.5mm of the conductive hole, metal charge is by plating in the conductive hole
Or the mode of plug metal column is completed, or completed with the mode of plug nonmetallic substance.
By above-mentioned technical proposal, the utility model is by using conductive primer the inverted structure blue-light LED chip
It is connected respectively with A independences negative terminal pad and public positive terminal pad, the inverted structure green LED chip is only with the B respectively
Vertical negative terminal pad and public positive terminal pad connection, and the vertical stratification red LED chip is fastened on described public
In positive terminal pad, the blue-light LED chip and green LED chip can be turned on directly with the circuit on the substrate, described
Red LED chip only needs to be turned on the circuit on the substrate by a bonding line.The encapsulating structure
The size of LED encapsulation structure is greatly reduced, its length and width size can be between 0.45mm-1.0mm, minimum dimension can accomplish
0.45*0.45mm；The pixel distance of display screen is substantially reduced, the full-color applications of LED of the close display of superelevation, application effect pole is realized
It is good.The encapsulating structure makes the level of indoor display application technology improve a step again.Shown for indoor small spacing and apply skill
Art is made that huge contribution.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the accompanying drawing used required in description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of inverted structure LED chip encapsulation for realizing the close display of superelevation disclosed in the utility model embodiment
Structure positive structure schematic；
Fig. 2 is a kind of inverted structure LED chip encapsulation for realizing the close display of superelevation disclosed in the utility model embodiment
Structured rear surface structural representation.
Numeral and the corresponding component title represented by letter in figure：
1st, substrate 2, blue-light LED chip 3, green LED chip 4, red LED chip 5, bonding line 6, A independence negative poles
The green paint 10 of pad 7, B independences negative terminal pad 8, public positive terminal pad 9, triangular structure, conductive hole 11, front-side circuit line
Road
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
The utility model is described in further detail with reference to embodiment and embodiment.
Embodiment
As depicted in figs. 1 and 2, a kind of inverted structure LED core chip package for realizing the close display of superelevation, including substrate 1,
Blue-light LED chip 2, green LED chip 3, red LED chip 4, bonding line 5, A independences negative terminal pad 6, B independences negative terminal pad 7,
The public green paint 9 of positive terminal pad 8 and triangular structure；The blue-light LED chip 2 and green LED chip 3 are inverted structure chip,
The red LED chip 4 is thin-film LED, and the front and back of the substrate 1 is respectively arranged with front-side circuit circuit 11
With back-side circuit circuit, and it is provided with the substrate 1 for connecting the front-side circuit circuit 11 and the back-side circuit
The conductive hole 10 of circuit, the conductive hole 10 extends to the back-side circuit circuit from the front-side circuit circuit 11, and passes through
Conducting metal material or electron opaque material are filled up sealing and filled and led up, and one is provided with the front-side circuit circuit 11 of the substrate 1
Individual public positive terminal pad 8 and to be respectively arranged with the A in the region for placing the blue-light LED chip 2 and green LED chip 3 only
Vertical negative terminal pad 6 and B independences negative terminal pad 7, the blue-light LED chip 2 are welded with the A independences negative pole respectively by conductive primer
Disk 6 and public positive terminal pad 8 are connected, the green LED chip 3 by conductive primer respectively with the B independences negative terminal pad 7 and
Public positive terminal pad 8 is connected, and the red LED chip 4 is fastened in the public positive terminal pad 8 by conductive primer,
The surface electrode of red LED chip 4 is connected on the front-side circuit circuit 11 by a bonding line 5, the base
The green paint 9 of triangular structure is provided with the middle part of the back side of plate 1.
The thickness of the substrate 1 be 0.1mm-0.5mm, color be black or white, material be BT substrates, FR4 substrates,
Aluminium base, the one of which of copper base and ceramic substrate or several mixing.
It is nickel in the front-side circuit circuit layers of copper of substrate 1, nickel thickness is between 100-300u "；On nickel dam can it is silver-plated or
Gold, also can it is silver-plated after plate one layer of gold again, silver thickness is between 20-80u ", and gold thickness is between 2-10u ".
In a diameter of 0.05-0.5mm of the conductive hole 10, the conductive hole 10 metal charge be by plating or
The mode of plug metal column is completed, or is completed with the mode of plug nonmetallic substance.
By above-mentioned technical proposal, the utility model is by using conductive primer the inverted structure blue-light LED chip 2
Be connected respectively with A independences negative terminal pad 6 and public positive terminal pad 8, the inverted structure green LED chip 3 respectively with the B
Independent negative terminal pad 7 and public positive terminal pad 8 are connected, and the vertical stratification red LED chip 4 are fastened on described
In public positive terminal pad 8, the blue-light LED chip 2 and green LED chip 3 directly can be led with the circuit on the substrate 1
Logical, the red LED chip 4 only needs to be turned on the circuit on the substrate 1 by a bonding line 5.
The encapsulating structure greatly reduces the size of LED encapsulation structure, its length and width size can be 0.45mm-1.0mm between, minimum chi
It is very little to accomplish 0.45*0.45mm；The pixel distance of display screen is substantially reduced, the full-color applications of LED of the close display of superelevation are realized, should
Use excellent.The encapsulating structure makes the level of indoor display application technology improve a step again.It is aobvious for indoor small spacing
Show that application technology is made that huge contribution.
Above-described is only a kind of inverted structure LED core chip package for realizing the close display of superelevation of the present utility model
Preferred embodiment, it is noted that for the person of ordinary skill of the art, design is created not departing from the utility model
On the premise of, various modifications and improvements can be made, these belong to protection domain of the present utility model.
Claims (4)
1. a kind of inverted structure LED core chip package for realizing the close display of superelevation, it is characterised in that including substrate, blue-ray LED
Chip, green LED chip, red LED chip, bonding line, A independences negative terminal pad, B independences negative terminal pad, public positive terminal pad
With the green paint of triangular structure；The blue-light LED chip and green LED chip are inverted structure chip, and the red LED chip is
Thin-film LED, the front and back of the substrate is respectively arranged with front-side circuit circuit and back-side circuit circuit, and in institute
State the conductive hole being provided with substrate for connecting the front-side circuit circuit and the back-side circuit circuit, the conductive hole from
The front-side circuit circuit extends to the back-side circuit circuit, and is filled up by conducting metal material or electron opaque material
Sealing is filled and led up, and a public positive terminal pad is provided with the front-side circuit circuit of the substrate and in the placement blue-ray LED core
The region of piece and green LED chip is respectively arranged with the A independences negative terminal pad and B independence negative terminal pads, the blue-ray LED core
Piece is connected with the A independences negative terminal pad and public positive terminal pad respectively by conductive primer, and the green LED chip is by leading
Electric primer is connected with the B independences negative terminal pad and public positive terminal pad respectively, and the red LED chip is connected by conductive primer
Connect and be fixed in the public positive terminal pad, the red LED chip surface electrode is connected to institute by a bonding line
State on front-side circuit circuit, the green paint of triangular structure is provided with the middle part of the substrate back.
2. a kind of inverted structure LED core chip package for realizing the close display of superelevation according to claim 1, its feature exists
In the thickness of the substrate is 0.1mm-0.5mm, and color is black or white, and material is BT substrates, FR4 substrates, aluminium base
Plate, the one of which of copper base and ceramic substrate or several mixing.
3. a kind of inverted structure LED core chip package for realizing the close display of superelevation according to claim 1, its feature exists
In being nickel in the substrate front side circuit-line layers of copper, nickel thickness is between 100-300u "；On nickel dam can silver-plated or gold, also may be used
One layer of gold is plated after silver-plated again, silver thickness is between 20-80u ", and gold thickness is between 2-10u ".
4. a kind of inverted structure LED core chip package for realizing the close display of superelevation according to claim 1, its feature exists
In metal charge in, a diameter of 0.05-0.5mm of the conductive hole, the conductive hole be by electroplating or plug metal column
Mode complete, or completed with the mode of plug nonmetallic substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720060825.1U CN206451731U (en) | 2017-01-18 | 2017-01-18 | A kind of inverted structure LED core chip package for realizing the close display of superelevation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720060825.1U CN206451731U (en) | 2017-01-18 | 2017-01-18 | A kind of inverted structure LED core chip package for realizing the close display of superelevation |
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| Publication Number | Publication Date |
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| CN206451731U true CN206451731U (en) | 2017-08-29 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784253A (en) * | 2017-01-18 | 2017-05-31 | 苏州晶台光电有限公司 | A kind of inverted structure LED core chip package for realizing the close display of superelevation |
| CN108091644A (en) * | 2017-12-15 | 2018-05-29 | 深圳市晶台股份有限公司 | A kind of encapsulating structure of the highly dense display light source devices of LED |
| CN108963060A (en) * | 2018-09-20 | 2018-12-07 | 东莞市春瑞电子科技有限公司 | Light and thin type LED support |
| CN109166846A (en) * | 2018-08-02 | 2019-01-08 | 吴香辉 | A kind of novel LED display device and manufacture craft |
| CN111403581A (en) * | 2018-02-14 | 2020-07-10 | 晶元光电股份有限公司 | Light emitting device, method of manufacturing the same, and display module |
| CN111463339A (en) * | 2019-01-22 | 2020-07-28 | 亿光电子工业股份有限公司 | Light-emitting unit and display screen |
| CN112420906A (en) * | 2019-08-22 | 2021-02-26 | 晶元光电股份有限公司 | Light emitting device, method of manufacturing the same, and display module |
| CN108963060B (en) * | 2018-09-20 | 2024-05-17 | 东莞市春瑞电子科技有限公司 | Light and thin type LED bracket |
-
2017
- 2017-01-18 CN CN201720060825.1U patent/CN206451731U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784253A (en) * | 2017-01-18 | 2017-05-31 | 苏州晶台光电有限公司 | A kind of inverted structure LED core chip package for realizing the close display of superelevation |
| CN108091644A (en) * | 2017-12-15 | 2018-05-29 | 深圳市晶台股份有限公司 | A kind of encapsulating structure of the highly dense display light source devices of LED |
| CN111403581A (en) * | 2018-02-14 | 2020-07-10 | 晶元光电股份有限公司 | Light emitting device, method of manufacturing the same, and display module |
| US11955589B2 (en) | 2018-02-14 | 2024-04-09 | Epistar Corporation | Light-emitting device, manufacturing method thereof and display module using the same |
| CN109166846A (en) * | 2018-08-02 | 2019-01-08 | 吴香辉 | A kind of novel LED display device and manufacture craft |
| CN108963060A (en) * | 2018-09-20 | 2018-12-07 | 东莞市春瑞电子科技有限公司 | Light and thin type LED support |
| CN108963060B (en) * | 2018-09-20 | 2024-05-17 | 东莞市春瑞电子科技有限公司 | Light and thin type LED bracket |
| CN111463339A (en) * | 2019-01-22 | 2020-07-28 | 亿光电子工业股份有限公司 | Light-emitting unit and display screen |
| CN112420906A (en) * | 2019-08-22 | 2021-02-26 | 晶元光电股份有限公司 | Light emitting device, method of manufacturing the same, and display module |
| US11515295B2 (en) | 2019-08-22 | 2022-11-29 | Epistar Corporation | Light-emitting device, manufacturing method thereof and display module using the same |
| CN112420906B (en) * | 2019-08-22 | 2024-02-06 | 晶元光电股份有限公司 | Light emitting device, method of manufacturing the same, and display module |
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