CN203433762U - Arc-shaped LED (light-emitting diode) display panel - Google Patents
Arc-shaped LED (light-emitting diode) display panel Download PDFInfo
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- CN203433762U CN203433762U CN201320555194.2U CN201320555194U CN203433762U CN 203433762 U CN203433762 U CN 203433762U CN 201320555194 U CN201320555194 U CN 201320555194U CN 203433762 U CN203433762 U CN 203433762U
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- eutectic
- substrate
- arc
- display board
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Abstract
The utility model relates to an arc-shaped LED (light-emitting diode) display panel which comprises an arc-shaped circuit board, a heating panel and light-emitting eutectic wafers. The arc-shaped circuit board comprises a substrate with a bending radian, an ITO (indium tin oxide) laminating circuit layer, eutectic bonding pads and isolation grooves among the eutectic bonding pads, a plurality of conductive layers and insulating layers are adhered in a crimped manner to form the ITO laminating circuit layer, the conductive layers are electrically communicated through via holes, the ITO laminating circuit layer is annularly or laterally pasted on the surface of the substrate, the heating panel is mounted below the substrate, and the light-emitting eutectic wafers are mounted on the eutectic bonding pads and electrically connected with the ITO laminating circuit layer through the eutectic bonding pads.
Description
Technical field
The utility model relates to semiconductor applications, relates in particular to a kind of arc LED luminescence display panel.
Background technology
Traditional semiconductor display product, conventionally adopt conventional shelving and bond technology, can be specifically by light emitting diode (Light Emitting Diodes, LED) after the upper elargol of tube core point, be arranged on printed circuit board (PCB) (Printed Circuit Board) PCB) or the corresponding pad of LED support on, carry out subsequently sintering elargol solidified.With aluminium wire or spun gold welding machine, electrode is connected on LED tube core again to the lead-in wire injecting to make electric current.The required preparation manipulation of above-mentioned semiconductor display product is loaded down with trivial details, and manufacturing process's time is long, and (for example, when pel spacing requires to be less than 1MM) cannot realize processing when the resolution of semiconductor display is brought up to a certain degree.And because adopted pcb board as substrate, its thickness is thicker, flexibility is poor, conventionally can only prepare the semiconductor display product of planar structure, cannot meet more application demand.
Utility model content
The purpose of this utility model is to provide the arc LED luminescence display panel of a kind of low cost, high light-emitting rate.
In first aspect, the utility model provides a kind of arc LED luminescence display panel, and described display board comprises:
Arc-shaped circuit board, heat sink and luminous eutectic wafer;
Described arc-shaped circuit board comprises: have the isolation channel between substrate, indium tin oxide ITO pad pasting circuit layer, eutectic pad and the described eutectic pad of crooked radian; Wherein, described ITO pad pasting circuit layer is bonded by multilayer conductive layer and insulation course crimping, and between described multilayer conductive layer, via hole forms electric connection; Described ITO pad pasting circuit layer ring subsides or side are affixed on the surface with described substrate;
Described heat sink is loaded on the below of described substrate; Described luminous eutectic wafer is loaded on described eutectic pad, by described eutectic pad, is electrically connected to described ITO pad pasting circuit layer.
Preferably, described eutectic pad is the superiors' conductive layer of described ITO pad pasting circuit layer.
The substrate preferably, with crooked radian is specially:
Any one in the glass substrate of arc, ceramic substrate, glass mat and laminated substrate.
Preferably, described display board also comprises:
One or more in power supply adaptor module, driver module, interface module, Metal-oxide-semicondutor MOS line scanning module and image data processing module.
Preferably, described display board also comprises linker, connects described in polylith between display board by described linker.
Preferably, on the substrate exposing in described isolation channel, spray or be pasted with sub-optical cement or opaque packing material.
The arc LED luminescence display panel providing at the utility model, can provide even bright dipping, and compares traditional luminescence display panel and improved light extraction efficiency, has also increased rising angle simultaneously, and arcuate structure can meet the manufacture demand of any arc display.Adopted luminous eutectic wafer and eutectic pad simultaneously, therefore supported to adopt eutectic welding technology to complete the electric connection between them, saved traditional encapsulation process operation, thereby effectively saved equipment processing cost and cost of labor.
Accompanying drawing explanation
The side view of the arc LED luminescence display panel that Fig. 1 provides for the utility model embodiment;
The local enlarged diagram of section of the arc LED luminescence display panel that Fig. 2 provides for the utility model embodiment;
The vertical view of the arc LED luminescence display panel that Fig. 3 provides for the utility model embodiment;
The upward view of the arc LED luminescence display panel that Fig. 4 provides for the utility model embodiment.
Embodiment
Below in conjunction with drawings and Examples, the utility model is elaborated.
A kind of arc LED luminescence display panel of the present utility model, is mainly used in LED display, Ultra fine pitch LED display, super-high density LED display, the just luminous TV of LED, the just luminous monitor of LED, LED video wall, LED indication, LED special lighting etc.
The side view of the arc LED luminescence display panel that Fig. 1 provides for the utility model embodiment.The local enlarged diagram of section of the arc LED luminescence display panel that Fig. 2 provides for the utility model embodiment.With Fig. 1, in conjunction with Fig. 2, the arc LED luminescence display panel of the present embodiment is described further.
As shown in the figure, the arc LED luminescence display panel of the present embodiment: comprising:
Arc-shaped circuit board 1, heat sink 2 and luminous eutectic wafer 3;
Arc-shaped circuit board 1 comprises: have the isolation channel 14 between substrate 11, indium tin oxide (ITO) pad pasting circuit layer 12, eutectic pad 13 and a plurality of eutectic pad 13 of crooked radian.
Preferably, eutectic pad 13 is the superiors' conductive layer of ITO pad pasting circuit layer 12.
Luminous eutectic wafer 3 can be: one or more combinations in red LED eutectic wafer, green LED eutectic wafer, blue led eutectic wafer and eutectic semiconductor wafer, or be the three-in-one wafer of eutectic RGB.The positive and negative electrode pad of luminous eutectic wafer 3 is all positioned at the below of wafer, therefore can adopt mode and the substrate of direct subsides welderings (Direct Attach, DA) to join.The reverse mould inverted structure at top makes the front at top and side can have higher amount of light.
In a concrete example, as shown in the vertical view of the arc LED luminescence display panel providing as Fig. 3, luminous eutectic wafer 3 specifically comprises red LED eutectic wafer 31, green LED eutectic wafer 32 and blue led eutectic wafer 33.
The substrate 11 with crooked radian is specially any one in arc PCB glass substrate, ceramic substrate or FR4 glass fibre fabric swatch, laminated substrate.On the surface of aforesaid substrate 11, adopt the technique of the deposition guide hole of ITO side pad pasting and ring attaching membrane technology and multilayer ITO pad pasting circuit to form ITO pad pasting circuit layer 12, ITO pad pasting circuit layer 12 is pasted on the outside surface of substrate 11, form closed ring-type, or not closed.ITO pad pasting circuit layer 12, for multilayer conductive layer (not shown) and the crimping of insulation course (not shown) are bonded, are handed over and is put electric connection by various via hole (not shown)s between multilayer conductive layer.Different from other substrates, the central core of the substrate 11 of the present embodiment is glass substrate or ceramic substrate, can produce so enough sheet material bending resistance tensile strength.
Preferably, the ITO film conductive material of ITO pad pasting circuit layer 12 can be copper sheet or indium stannum alloy cortex, is convenient to the heavy copper of guide hole or spray tin or wicking or electroplates filling perforation plug in fact, to reduce interlayer thermal stress, disturbs.The pad of copper sheet or indium stannum alloy element also can make by electrogilding ashbury metal layer or common tin layer.
On the substrate 11 exposing in isolation channel 14, spray or be pasted with sub-optical cement or opaque packing material 15 to increase display panel contrast.
Display board also has a plurality of functional modules 4 in heat sink 2 one sides.For example: power supply adaptor module, driver module, interface module, Metal-oxide-semicondutor MOS line scanning module and image data processing module.Preferably, driver module is specifically realized by a drive IC, integrated ultra-large continuous current drive integrated circult; Image data processing module is specially image data processor, integrated comprises that image γ correction process special IC (ASIC) IC, pixel correct ASIC IC and many primary colours of super-high density pixel colourity corrective processor etc.
In a concrete example, shown in the upward view of arc LED luminescence display panel as shown in Figure 4, functional module 4 specifically comprises: power supply adaptor 41, interface IC42, MOS line scanning IC43, drive IC 44 and image data processor 45.
The arc LED luminescence display panel that the utility model embodiment provides, adopted LED eutectic wafer, in production technology, do not re-use traditional die bond, the integrated operations of LED such as routing welding, but adopt eutectic welding, also can use common reflow machine to do common surface installation technique (Surface Mounted Technology, SMT) welding; Also can connect equipment by special-purpose SMT gule and use anisotropy conductiving glue to realize splicing, substitute traditional tin welding completely.LED eutectic wafer has completed the dustproof transparence processing of protection against the tide of spontaneous body in the processing procedure of itself simultaneously, so also saved traditional LED packaging process.
The arc LED luminescence display panel that the utility model provides, can provide even bright dipping, and compares traditional luminescence display panel and improved light extraction efficiency, has also increased rising angle simultaneously, and arcuate structure can meet the manufacture demand of any arc display.Adopted LED eutectic wafer and eutectic pad simultaneously, therefore supported to adopt eutectic welding technology to complete the electric connection between them, saved traditional encapsulation process operation, thereby effectively saved equipment processing cost and cost of labor.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only embodiment of the present utility model; and be not used in and limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (6)
1. an arc LED luminescence display panel, is characterized in that, described display board comprises:
Arc-shaped circuit board, heat sink and luminous eutectic wafer;
Described arc-shaped circuit board comprises: have the isolation channel between substrate, indium tin oxide ITO pad pasting circuit layer, eutectic pad and the described eutectic pad of crooked radian; Wherein, described ITO pad pasting circuit layer is bonded by multilayer conductive layer and insulation course crimping, and between described multilayer conductive layer, via hole forms electric connection; Described ITO pad pasting circuit layer ring subsides or side are affixed on the surface with described substrate;
Described heat sink is loaded on the below of described substrate; Described luminous eutectic wafer is loaded on described eutectic pad, by described eutectic pad, is electrically connected to described ITO pad pasting circuit layer.
2. display board according to claim 1, is characterized in that, described eutectic pad is the superiors' conductive layer of described ITO pad pasting circuit layer.
3. display board according to claim 1, is characterized in that, described in there is crooked radian substrate be specially:
Any one in the glass substrate of arc, ceramic substrate, glass mat and laminated substrate.
4. display board according to claim 1, is characterized in that, described display board also comprises:
One or more in power supply adaptor module, driver module, interface module, Metal-oxide-semicondutor MOS line scanning module and image data processing module.
5. display board according to claim 1, is characterized in that, described display board also comprises linker, connects described in polylith between display board by described linker.
6. display board according to claim 1, is characterized in that, sprays or be pasted with sub-optical cement or opaque packing material in described isolation channel on the substrate exposing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320555194.2U CN203433762U (en) | 2013-09-06 | 2013-09-06 | Arc-shaped LED (light-emitting diode) display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320555194.2U CN203433762U (en) | 2013-09-06 | 2013-09-06 | Arc-shaped LED (light-emitting diode) display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203433762U true CN203433762U (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320555194.2U Expired - Lifetime CN203433762U (en) | 2013-09-06 | 2013-09-06 | Arc-shaped LED (light-emitting diode) display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203433762U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192428A1 (en) * | 2014-06-18 | 2015-12-23 | 黄欣 | Circular-arc-shaped led display screen |
| CN108028250A (en) * | 2015-09-14 | 2018-05-11 | 法雷奥照明公司 | LED light source comprising electronic circuit |
-
2013
- 2013-09-06 CN CN201320555194.2U patent/CN203433762U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192428A1 (en) * | 2014-06-18 | 2015-12-23 | 黄欣 | Circular-arc-shaped led display screen |
| CN108028250A (en) * | 2015-09-14 | 2018-05-11 | 法雷奥照明公司 | LED light source comprising electronic circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160811 Address after: 214100, Jiangsu, Wuxi Province, high road, Binhu District No. 999 (software R & D building) Patentee after: HUANSHI ADVANCED DIGITAL DISPLAY WUXI CO.,LTD. Address before: 100097 room B1F, unit four, building No. three, Far East Road, Haidian District, Beijing Patentee before: Zhou Mingbo Patentee before: Yan Min Patentee before: Cheng Jun |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140212 |