CN203760010U - Semiconductor display unit based on lamination baseboard with separated display and control - Google Patents
Semiconductor display unit based on lamination baseboard with separated display and control Download PDFInfo
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- CN203760010U CN203760010U CN201420070213.7U CN201420070213U CN203760010U CN 203760010 U CN203760010 U CN 203760010U CN 201420070213 U CN201420070213 U CN 201420070213U CN 203760010 U CN203760010 U CN 203760010U
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- led
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- base plate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000003475 lamination Methods 0.000 title abstract 2
- 235000012431 wafers Nutrition 0.000 claims abstract description 82
- 238000004806 packaging method and process Methods 0.000 claims description 59
- 230000005496 eutectics Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract 8
- 230000017525 heat dissipation Effects 0.000 abstract 5
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model relates to a semiconductor display unit based on a lamination baseboard with separated display and control, which comprises a sealing baseboard, a wafer support, an adherence layer, an interface device, LED wafers, a drive component, a heat dissipation layer and a heat dissipation cover plate, wherein the drive component comprises an FPGA chip, a constant-current drive chip and a line scanning power tube; the sealing baseboard is disposed inside the wafer support and the multiple LED wafers are disposed in an inverted manner on the top face of the sealing baseboard and connected to the sealing baseboard by the adherence layer; the FPGA chip, the constant-current drive chip and the line scanning power tube are installed on the bottom face of the sealing baseboard and fixed inside the wafer support by the heat dissipation layer and the heat dissipation cover plate; the interface device is disposed inside the wafer support between the bottom face of the sealing baseboard and the heat dissipation cover plate and exposed outwards by an opening; the multiple LED wafers are electrically connected to the FPGA chip, the constant-current drive chip and the line scanning power tube by the adherence layer and the sealing baseboard; and the sealing baseboard is electrically connected to an external circuit by the interface device.
Description
Technical field
The utility model relates to semiconductor applications, relates in particular to a kind of demonstration based on laminated substrate, controls separated semiconductor display unit.
Background technology
In recent ten years, in demonstration field, there is the variation of twice directivity.Before and after 2000, cathode ray tube (CRT) industry faces alternative crisis.After that, main flow direction trends towards plasma demonstration (PDP) and tft liquid crystal demonstration (TFT-LCD).By development in more than 10 years, TFT-LCD became demonstration field main flow.Then, along with the progress of TFT-LCD and electroluminescence (EL) technology, active organic light emitting display (AMOLED) also starts industrialization.In addition, flexibility shows that the novel display techniques such as (Flexible Display), laser display (Laser Display) continue to bring out.At present, the arguement of the relevant display industries developing direction of a new round starts again.No matter, from TFT-LCD or AMOLED development angle, all can clearly see two large key driving force of semiconductor display industries development: the one, technical progress; The 2nd, market application.For this reason, people in the industry has proposed " semiconductor demonstration " this industry and has newly defined, and expectation can produce guiding and help to the development of next step display industries.
For example, the application of semiconductor light-emitting-diode (LED, Light Emitting Diode) has jumbo expansion in this year, and wherein, the market of the tool potentiality of growing up is at the soonest application backlight of LCDs (LCD).Between several years, white light-emitting diode is general gradually along with the application backlight of small display screen, and the color liquid crystal panel in current nearly all mobile phone all provides backlight by light emitting diode.Recently, white light-emitting diode more starts to march toward more high-performance and the display backlight application on knee of longer working time.Yet light emitting diode is entering large scale display screen, as not smooth on the road of PC display screen and TV applications.This situation is because except more best performance and longer off-the-job, large-scale liquid crystal panel need to be used as this class light emitting diode (LED) of red, green, blue (RGB) and create abundanter Color Range, just can provide than using cathode fluorescent tube (CCFL) better buying inducement backlight.
Yet there is bottleneck in high density field in traditional LED display technique.Because be limited by the traditional structure of LED light source, be limited by the related material structure of module of rear integrated processing simultaneously, driving capacity and structure that for example traditional constant current source encapsulates, thermal stability problems and the flatness strength problem of the integrated finished product that traditional loose material of FR4PCB plate is brought, and be spliced into the needed injection moulding face shield of giant-screen and mould shell etc. for installing, these are all seriously limiting LED display technique in high density field, particularly at pel spacing, are less than breakthrough and the application in 1.0mm demonstration.
Utility model content
The purpose of this utility model is to provide a kind of unit that can overcome above-mentioned defect.
The utility model provides a kind of demonstration based on laminated substrate, has controlled separated semiconductor display unit, comprising: base plate for packaging, chip support, bonding coat, interface arrangement, a plurality of LED wafer, driving element, heat dissipating layer and heat-dissipating cover plate; Wherein, described driving element comprises: fpga chip, constant-current driven chip and line scanning power tube;
Described base plate for packaging is arranged in described chip support, and described a plurality of LED flip-chip are arranged at the end face of described base plate for packaging, by described bonding coat, is connected with described base plate for packaging; Described fpga chip, constant-current driven chip and line scanning power tube are installed in the bottom surface of described base plate for packaging, by described heat dissipating layer and heat-dissipating cover plate, are fixed in described chip support; Described interface arrangement is arranged in the bottom surface and the chip support between described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate;
Described a plurality of LED wafer is electrically connected to described fpga chip, constant-current driven chip and line scanning power tube by described bonding coat and described base plate for packaging; Described base plate for packaging is electrically connected to external circuit by described interface arrangement.
Preferably, described semiconductor display unit also comprises:
Diaphragm, has optical grating structure, is covered on described a plurality of LED wafer.
Preferably, described semiconductor display unit also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
Preferably, described chip support specifically comprises:
The first groove of accommodating described fpga chip, constant-current driven chip and line scanning power tube, and a plurality of second grooves of accommodating described a plurality of LED wafers.
Preferably, described a plurality of LED wafer is specially:
The red wafer of a plurality of LED, the green wafer of a plurality of LED and the blue wafer of a plurality of LED; The synthetic many group wafer cells of the red wafer of described a plurality of LED, the green wafer of a plurality of LED and the blue wafer set of a plurality of LED, each group wafer cell comprises the red wafer of one or more LED, the green wafer of one or more LED and the blue wafer of one or more LED.
Further preferably, the red wafer of described a plurality of LED, the green wafer of described a plurality of LED and the blue wafer of described a plurality of LED are LED eutectic wafer.
Further preferably, between the center of described many group wafer cells, be equally spaced.
Preferably, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
Preferably, described base plate for packaging also comprises packaging solder ball.
Preferably, described interface arrangement is the USB interface of compatible power supply and data communication, by cementing and described base plate for packaging, is connected.
A kind of demonstration based on laminated substrate of the present utility model, control separated semiconductor display unit by adopt by the upside-down mounting of LED wafer eutectic in the pixel sides of base plate for packaging and by fpga chip, constant-current driven chip and the upside-down mounting of line scanning power tube in the circuit side of base plate for packaging, by base plate for packaging, realize the electrical connection between them, thereby in limited arrangement space, realized the integrated of LED demonstration.Make demonstration based on laminated substrate, control separated semiconductor display unit and there is good thermal stability and flatness; met high stability, image shows the demand of product large-scale production cheaply; and can carry out according to actual needs assembledly, meet the large screen display requirement of any size.
Accompanying drawing explanation
A kind of demonstration based on laminated substrate that Fig. 1 provides for the utility model embodiment, the sectional view of controlling separated semiconductor display unit;
The driving element that Fig. 2 provides for the utility model embodiment is installed in the schematic diagram of the bottom surface of described base plate for packaging;
A kind of demonstration based on laminated substrate that Fig. 3 provides for utility model embodiment, control the separated chip support of semiconductor display unit and the diagrammatic cross-section of base plate for packaging;
A kind of demonstration based on laminated substrate that Fig. 4 provides for the utility model embodiment, the front elevation of controlling separated semiconductor display unit;
A kind of demonstration based on laminated substrate that Fig. 5 provides for the utility model embodiment, the rear view of controlling separated semiconductor display unit.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
A kind of demonstration based on laminated substrate that the utility model provides, control separated semiconductor display unit, be mainly used in LED display, Ultra fine pitch LED display, super-high density LED display, the just luminous TV of LED, the just luminous monitor of LED, LED video wall, LED indication, LED special lighting etc.
Fig. 1 is a kind of demonstration based on laminated substrate of providing of the utility model embodiment, the sectional view of controlling separated semiconductor display unit.As shown in Figure 1, described semiconductor display unit comprises: base plate for packaging 4, chip support 3, bonding coat 11, interface arrangement 6, a plurality of LED wafer 2, driving element 9, heat dissipating layer 8 and heat-dissipating cover plate 10;
Base plate for packaging 4 is arranged in chip support 3, and a plurality of LED wafers 2 directly weld (Direct Attach, DA) eutectic upside-down mounting and are arranged at the end face of base plate for packaging 4, by bonding coat 11, are connected with base plate for packaging 4; Driving element 9 is installed in the bottom surface of base plate for packaging 4, by BGA technique or utilize bonding coat technique to be connected with base plate for packaging 4, and assists driving elements 9 heat radiations by heat dissipating layer 8 and heat-dissipating cover plate 10; Interface arrangement 6 is arranged in the bottom surface and the chip support 3 between heat-dissipating cover plate 10 of base plate for packaging 4, and by the opening 101 that has on heat-dissipating cover plate 10 to exposing outside; Concrete, driving element 9 comprises fpga chip 92, constant-current driven chip 93 and line scanning power tube 94 etc.
A plurality of LED wafers 2 are electrically connected to fpga chip 91, constant-current driven chip 92 and line scanning power tube 93 by bonding coat 11 and base plate for packaging 4; Base plate for packaging 4 is electrically connected to external circuit by interface arrangement 6.Interface arrangement 6 can be the USB interface of standard USB interface or compatible power supply and data communication.Interface arrangement 6 is connected with base plate for packaging 4 by cementing.
Shown in Fig. 2, the structure that driving element 9 is installed in to the bottom surface of described base plate for packaging 4 is elaborated.
Fpga chip 92, constant-current driven chip 93 and line scanning power tube 94 are welded in respectively the bottom surface of base plate for packaging 4, also have in addition signal/power access end 91 to be also welded in the bottom surface of base plate for packaging 4, in order to provide driving signal to a plurality of LED wafers 2.Wherein, in object lesson as shown in Figure 2, driving element comprises that 18 constant-current LEDs drive 93,27 line scanning power tubes 94 of chip and 1 fpga chip 92.
In conjunction with the diagrammatic cross-section of the chip support shown in Fig. 3 and base plate for packaging, chip support 3 is elaborated.
The silicones injection moulding that chip support 3 adopts high machinery and thermodynamic stability and has good dielectric properties is made, or uses other satisfactory die-casting material die casting to make.Specifically comprise: a plurality of the second grooves 32 and the packaging solder ball 5 of the first groove 31 of accommodating driving element 9, accommodating a plurality of LED wafers 2.
Concrete, LED wafer of the present utility model comprises the red wafer of LED, the green wafer of LED and the blue wafer of LED, they are preferably LED eutectic wafer, are welded on the pixel sides of PCB multilayer printed circuit board by eutectic.Because LED eutectic wafer does not re-use the integrated operations of traditional LED such as die bond, routing welding in its production technology, therefore can adopt disposable its dress on base plate for packaging 4 that completes of die bond ultrasonic seamless bonding machine to paste and welding sequence.Meanwhile, because the dustproof transparence of protection against the tide that LED eutectic wafer has completed in the processing procedure of itself is processed, so also saved traditional LED packaging process.Therefore, the demonstration based on laminated substrate of the present utility model that adopts LED eutectic wafer, control separated semiconductor display unit and can save a large amount of manufacturing costs, simultaneously also for display board yield rate, stability, non-maintaining in the long life provide good technology and technique to guarantee.
The accommodating one group of LED wafer set of each second groove 32.Concrete, above-mentioned the second groove 32 rules are arranged, preferred, are equidistant arrangement, and each group wafer at least comprises the red wafer of an eutectic LED, a green wafer of eutectic LED and a blue wafer of eutectic LED.In the front elevation shown in Fig. 4, provided the example that every group of wafer comprises the red wafer of an eutectic LED, a green wafer of eutectic LED and a blue wafer of eutectic LED.In other examples, also can have and comprise the redness of unnecessary or the possibility of green or blue led wafer, even can comprise the eutectic wafer of other color.Putting in order of LED eutectic wafer in every group of wafer can be identical with mode, can be also different.
Base plate for packaging 4 also has a plurality of packaging solder ball 5; The pad that packaging solder ball 5 is welded on base plate for packaging 4 for fpga chip 92, constant-current driven chip 93, line scanning power tube 94 and signal/power access end 91.
Base plate for packaging 4 comprises at least two circuit layer (not shown)s and at least one insulating medium layer (not shown), isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-tier circuit layer by insulating medium layer.
Concrete, the circuit layer of base plate for packaging 4 is that multilayer vapor deposition forms, and can be two-layer, four layers, six layers or other numbers of plies, insulation course is preferably highly purified resin medium, insulate bonding between adjacent circuit layer by insulation course.Between each circuit layer by various guide hole (not shown)s of arranging in advance or the staggered electric connection of blind hole (not shown).After crimping moulding, a side of base plate for packaging 4 be pixel sides for welding LED wafer, opposite side is circuit side, for welding other necessary circuit, data-interface and processing module.In the present embodiment, be preferably fpga chip 92, constant-current driven chip 93 and line scanning power tube 94 that welding has video communication control circuit and power circuit function.The base plate for packaging 4 of the present embodiment is high-density integrated, has good bending resistance tensile strength and flatness.
Again as shown in Figure 1, in interface arrangement 6, there is the electric connection line (not shown) that connects external circuit, for example electric wire, contact pin or the other forms of electric connection line for being electrically connected to.A plurality of LED wafers 2 of upside-down mounting on base plate for packaging 4 are connected with the electric connection line in interface arrangement 6 by base plate for packaging 4 with fpga chip 92, constant-current driven chip 93 and line scanning power tube 94, thereby realize and being electrically connected to of external circuit.
Between heat-dissipating cover plate 10 and fpga chip 92, constant-current driven chip 93 and line scanning power tube 94, also have heat dissipating layer 8, preferred, heat dissipating layer 8 is made for silicon thermal paste; Heat-dissipating cover plate 10 is aluminium cover plate.
Demonstration based on laminated substrate of the present utility model, control separated semiconductor display unit and also comprise fixture 7, preferred, this fixture 7 can be that magnetic is installed inserts, can certainly adopt the installation inserts of other modes as fixture 7.Heat-dissipating cover plate 10 is anchored on chip support 3 by fixture 7.
Demonstration based on laminated substrate of the present utility model, control separated semiconductor display unit and also comprise diaphragm 1, be covered on a plurality of LED wafers.
Concrete, protection mould 1 is preferably the diaphragm that has optical grating function concurrently.
When the above-mentioned semiconductor display unit of integrated the utility model, first on the chip support 3 that is cast with base plate for packaging 4, adopt surface mounting technology (Surface Mounted Technology burying, SMT) or adhesive bonding technique be pasted into a plurality of LED wafers 2 of eutectic upside-down mounting, replant into fpga chip 92, constant-current driven chip 93 and line scanning power tube 94 etc., after electrical detection is confirmed, silicon-coating thermal paste on fpga chip 92, constant-current driven chip 93 and line scanning power tube 94, form heat dissipating layer 8, heat-dissipating cover plate 10 is pasted in above-mentioned silicon thermal paste.Finally, after said modules is clean, in the one side with a plurality of LED wafers 2 and chip support 3, stick on the diaphragm 1 that has optical grating function concurrently.The demonstration based on laminated substrate after integrated, the front elevation of controlling separated semiconductor display unit and rear view are respectively as shown in Figure 4, Figure 5.
Demonstration based on laminated substrate of the present utility model, control separated semiconductor display unit by adopt by the upside-down mounting of LED wafer eutectic in the pixel sides of base plate for packaging and by driving element upside-down mountings such as fpga chip, constant-current driven chip and line scanning power tubes in the circuit side of base plate for packaging, by base plate for packaging, realize the electrical connection between them, thereby in limited arrangement space, realized the integrated of LED demonstration.Make semiconductor display unit there is good thermal stability and flatness, met high stability, image shows the demand of product large-scale production cheaply, and can carry out according to actual needs assembledly, meet the large screen display requirement of any size.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only embodiment of the present utility model; and be not used in and limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (10)
1. the demonstration based on laminated substrate, control a separated semiconductor display unit, it is characterized in that, comprising: base plate for packaging, chip support, bonding coat, interface arrangement, a plurality of LED wafer, driving element, heat dissipating layer and heat-dissipating cover plate; Wherein, described driving element comprises: fpga chip, constant-current driven chip and line scanning power tube;
Described base plate for packaging is arranged in described chip support, and described a plurality of LED flip-chip are arranged at the end face of described base plate for packaging, by described bonding coat, is connected with described base plate for packaging; Described fpga chip, constant-current driven chip and line scanning power tube are installed in the bottom surface of described base plate for packaging, by described heat dissipating layer and described heat-dissipating cover plate, are fixed in described chip support; Described interface arrangement is arranged in the bottom surface and the chip support between described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate;
Described a plurality of LED wafer is electrically connected to described fpga chip, constant-current driven chip and line scanning power tube by described bonding coat and described base plate for packaging; Described base plate for packaging is electrically connected to external circuit by described interface arrangement.
2. semiconductor display unit according to claim 1, is characterized in that, described semiconductor display unit also comprises:
Diaphragm, has optical grating structure, is covered on described a plurality of LED wafer.
3. semiconductor display unit according to claim 1, is characterized in that, described semiconductor display unit also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
4. semiconductor display unit according to claim 1, is characterized in that, described chip support specifically comprises:
The first groove of accommodating described fpga chip, constant-current driven chip and line scanning power tube, and a plurality of second grooves of accommodating described a plurality of LED wafers.
5. according to the semiconductor display unit described in claim 1, it is characterized in that, described a plurality of LED wafers are specially:
The red wafer of a plurality of LED, the green wafer of a plurality of LED and the blue wafer of a plurality of LED; The synthetic many group wafer cells of the red wafer of described a plurality of LED, the green wafer of a plurality of LED and the blue wafer set of a plurality of LED, each group wafer cell comprises the red wafer of one or more LED, the green wafer of one or more LED and the blue wafer of one or more LED.
6. semiconductor display unit according to claim 5, is characterized in that, the red wafer of described a plurality of LED, the green wafer of described a plurality of LED and the blue wafer of described a plurality of LED are LED eutectic wafer.
7. semiconductor display unit according to claim 5, is characterized in that, between the center of described many group wafer cells, is equally spaced.
8. semiconductor display unit according to claim 1, it is characterized in that, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected to by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
9. semiconductor display unit according to claim 1, is characterized in that, described base plate for packaging also comprises packaging solder ball.
10. semiconductor display unit according to claim 1, is characterized in that, described interface arrangement is the USB interface of compatible power supply and data communication, by cementing and described base plate for packaging, is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420070213.7U CN203760010U (en) | 2014-02-18 | 2014-02-18 | Semiconductor display unit based on lamination baseboard with separated display and control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420070213.7U CN203760010U (en) | 2014-02-18 | 2014-02-18 | Semiconductor display unit based on lamination baseboard with separated display and control |
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| Publication Number | Publication Date |
|---|---|
| CN203760010U true CN203760010U (en) | 2014-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420070213.7U Expired - Lifetime CN203760010U (en) | 2014-02-18 | 2014-02-18 | Semiconductor display unit based on lamination baseboard with separated display and control |
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| Country | Link |
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| CN (1) | CN203760010U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105303983A (en) * | 2015-10-03 | 2016-02-03 | 上海铁歌科技有限公司 | Small-spacing LED full-color display screen achieved by virtue of single-layer PCB board (printed circuit board) |
| CN105741695A (en) * | 2014-12-10 | 2016-07-06 | 程君 | Manufacture method of composite organic substrate epitaxy LED display module and display module |
| CN106782137A (en) * | 2017-03-31 | 2017-05-31 | 深圳市德彩光电有限公司 | The LED display of small spacing |
| CN115241171A (en) * | 2022-07-27 | 2022-10-25 | 北京数字光芯集成电路设计有限公司 | Micro-LED Micro display chip with double-layer packaging structure |
-
2014
- 2014-02-18 CN CN201420070213.7U patent/CN203760010U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105741695A (en) * | 2014-12-10 | 2016-07-06 | 程君 | Manufacture method of composite organic substrate epitaxy LED display module and display module |
| CN105303983A (en) * | 2015-10-03 | 2016-02-03 | 上海铁歌科技有限公司 | Small-spacing LED full-color display screen achieved by virtue of single-layer PCB board (printed circuit board) |
| CN106782137A (en) * | 2017-03-31 | 2017-05-31 | 深圳市德彩光电有限公司 | The LED display of small spacing |
| CN115241171A (en) * | 2022-07-27 | 2022-10-25 | 北京数字光芯集成电路设计有限公司 | Micro-LED Micro display chip with double-layer packaging structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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Effective date of registration: 20160808 Address after: 214100, Jiangsu, Wuxi Province, high road, Binhu District No. 999 (software R & D building) Patentee after: HUANSHI ADVANCED DIGITAL DISPLAY WUXI CO.,LTD. Address before: 100097 room B1F, unit four, building No. three, Far East Road, Haidian District, Beijing Patentee before: Yan Min Patentee before: Cheng Jun Patentee before: Zhou Mingbo |
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Granted publication date: 20140806 |