CN202352251U - High-density light emitting diode (LED) full-color lattice module - Google Patents
High-density light emitting diode (LED) full-color lattice module Download PDFInfo
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- CN202352251U CN202352251U CN2011204736425U CN201120473642U CN202352251U CN 202352251 U CN202352251 U CN 202352251U CN 2011204736425 U CN2011204736425 U CN 2011204736425U CN 201120473642 U CN201120473642 U CN 201120473642U CN 202352251 U CN202352251 U CN 202352251U
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- lattice module
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Abstract
The utility model discloses a high-density light emitting diode (LED) full-color lattice module, which comprises a multi-layer printed circuit board and a plurality of LED chips arranged on the printed circuit board, wherein plastic reflective outer frames used for reflecting lights are arranged on the peripheries of the LED chips, epoxide resin used for diffusing lights is filled inside the plastic reflective outer frames, and soldering pin headers are attached to the back of the multi-layer printed circuit board, so that current is introduced and the LED chips are lightened. Soldering pin headers are attached to the back of the multi-layer printed circuit board and the current is introduced, so that the problem that pins occupy front wiring spaces is avoided, front spaces are all used for meeting the requirements of LED chip die bond and bonding wire area wiring, and high-density wiring is achieved.
Description
Technical field
The utility model relates to LED and shows product, relates in particular to the full-color lattice module of a kind of high density LED.
Background technology
LED display has experienced from monochromatic, double-colored graphic display screen, to image display panel, and up till now the development course of full color display again.The pixel LED full color display is the plane formula display screen that utilizes LED lattice module or pixel cell to form.It has luminosity factor height, long service life, configuration flexibly, rich color and to advantages such as the indoor and outdoor surroundings adaptive faculty are strong, be able to widespread use on market.Range of application spreads all over various aspects such as traffic, advertisement, telecommunications, indoor stage and meeting room background.
Existing LED lattice module is combined by several LED full color pixel; Be electrically connected each other between each LED full color pixel; But be limited to factors such as encapsulation condition and the design of LED full color pixel, existing LED lattice module exists that volume is big, pixel is low and defective such as white balance difference.
Summary of the invention
For solving the defective that prior art exists; The utility model provides a kind of wiring density height, volume is little and be electrically connected the full-color lattice module of reliable high density LED; Comprise multilayer printed wiring board and establish a plurality of light-emitting diode chip for backlight unit above that; Said light-emitting diode chip for backlight unit periphery is provided with the plastic cement reflection housing that is used for reflection ray, and the epoxy resin that is used to spread light is filled in the inside of said plastic cement reflection housing, wherein; Weldering row pin is pasted at the back side of said multilayer printed wiring board, is used for electric current is imported to light said light-emitting diode chip for backlight unit.
According to embodiment, also can adopt following optimized technical scheme:
Said multilayer printed wiring board is a printed wiring board more than four layers.
Said subsides weldering row pin adopts the soldering mode, print solder paste layer before pad place, the back side subsides weldering row pin of said multilayer printed wiring board.
Said plastic cement reflection housing is processed with black or grey colorant.
The display pixel hole, front of said plastic cement reflection housing is square.
The beneficial effect of the utility model is:
Use the back side to paste weldering row pin electric current is imported, thereby avoid pin to take the front wiring space, make positive space of planes can all be used for the solid crystalline substance and the wire welding area wiring demand of light-emitting diode chip for backlight unit, and then realized high-density wiring.In addition, use the printed wiring board of multilayer (4 layers and more than), further expanded wiring space, make wiring route wideer, and help the LED heat radiation.
The display pixel hole, front of plastic cement reflection housing by traditional circle change be designed to square, solid brilliant, the bonding wire craft of more convenient binding site array module, its space utilization is better, is beneficial to the realization of high-density wiring.Simultaneously, the surface pixels point can maximize, the light-emitting zone spacing of display pixel littler (light-emitting zone is not littler), and the complementary fusion of pixel is better, can improve display effect.
The conventional point array module uses the white plastic material, and the utility model uses black or grey colorant, can promote the display screen picture contrast; When being applied to indoor stage or meeting room background; Can not produce the phenomenon of side or positive whiting,, can not see tangible white point phenomenon yet even when not lighting.
Description of drawings
Fig. 1 is the structural representation of the full-color lattice module of high density LED of an embodiment of the utility model.
Fig. 2 is the structural representation (the part parts that only show product) of product behind the full-color lattice module subsides of the high density LED of an embodiment of the utility model weldering row pin.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is done further detailed explanation.
The principle of the utility model is: through pasting weldering formula row pin foreign current is imported; Realize lighting of each regional light-emitting diode chip for backlight unit through multilayer printed wiring board; The reflection of each chip light emitting through plastic cement reflection and resin, spread after; Luminous equal can fully the diffusion and fusion of red, green, blue three color chips in each pixel finally realized the full-color demonstration application of perfect high definition.
As shown in Figure 1; It is the structural representation of the full-color lattice module of high density LED of an embodiment of the utility model; It comprises four layers of printed wiring board 2 and establishes a plurality of light-emitting diode chip for backlight unit 3 above that; Said light-emitting diode chip for backlight unit 3 peripheries are provided with the plastic cement reflection housing 4 that is used for reflection ray, and the epoxy resin 5 that is used to spread light is filled in the inside of said plastic cement reflection housing 4, wherein; Weldering row pin 1 is pasted at the back side of said multilayer printed wiring board 2, is used for electric current is imported to light said light-emitting diode chip for backlight unit 3.Pad place, the back side print solder paste layer 6 of said multilayer printed wiring board 2.Said subsides weldering row pin 1 realizes that through reflow machine molten soldering connects.
Said plastic cement reflection housing 4 usefulness black or grey colorant are processed.The conventional point array module uses the white plastic material, uses black or grey colorant in the present embodiment, can promote the display screen picture contrast; When being applied to indoor stage or meeting room background; Can not produce the phenomenon of side or positive whiting,, can not see tangible white point phenomenon yet even when not lighting.
In the present embodiment, the display pixel hole, front of said plastic cement reflection housing 4 is square, and pixel aperture is designed to square advantage and is: can consolidate brilliant, bonding wire craft by the binding site array module; Its space utilization is better; Be beneficial to the realization of high density technology, the surface pixels point can maximize the light-emitting zone spacing of display pixel littler (light-emitting zone is not littler) simultaneously; The complementary fusion of pixel is better, can improve display effect.
One skilled in the art will appreciate that said multilayer printed wiring board 2 also can be four layers or surpass four layers, and, more wiring space can be arranged with the increase of the number of plies.
As shown in Figure 2, the structural representation (the part parts that only show product) of product behind the full-color lattice module subsides of the high density LED of an embodiment of the utility model weldering row pin.Wherein, corresponding pad place of pasting weldering formula row pin 1, multilayer printed wiring board 2 back sides is brushed with one deck tin cream 6, pastes weldering formula row pin 1 and adopts the soldering mode to be welded on the multilayer printed wiring board 2.
This structure makes pin not take the front wiring space, and positive space of planes can all be used for solid crystalline substance, the wire welding area wiring demand of light-emitting diode chip for backlight unit; Thereby can realize the possibility of high-density wiring; Thereby can realize the production of the full-color lattice module of spacing 3mm, and prior art constructions, because of external pin must regularity be arranged; Need take the wiring space on positive and negative two sides, so can only realize pel spacing 4mm and above PCB layout demand.In addition, the utility model external pin adopts the soldering mode to connect, and makes electric conductivity more reliable, and dashing the riveter skill and in punching course, can causing PCB hole inner metal layer to destroy of prior art causes poor flow.
Above content is the further explain that combines concrete preferred implementation that the utility model is done, and can not assert that the practical implementation of the utility model is confined to these explanations.For the those of ordinary skill of technical field under the utility model, make some substituting or obvious modification under the prerequisite of the utility model design not breaking away from, and performance or purposes are identical, all should be regarded as belonging to the protection domain of the utility model.
Claims (5)
1. full-color lattice module of high density LED; Comprise multilayer printed wiring board and establish a plurality of light-emitting diode chip for backlight unit above that; Said light-emitting diode chip for backlight unit periphery is provided with the plastic cement reflection housing that is used for reflection ray; The epoxy resin that is used to spread light is filled in the inside of said plastic cement reflection housing, it is characterized in that: weldering row pin is pasted at the back side of said multilayer printed wiring board, is used for electric current is imported to light said light-emitting diode chip for backlight unit.
2. the full-color lattice module of high density LED as claimed in claim 1 is characterized in that: said multilayer printed wiring board is a printed wiring board more than four layers.
3. the full-color lattice module of high density LED as claimed in claim 1 is characterized in that: pad place, the back side print solder paste layer of said multilayer printed wiring board, said subsides weldering row pin is placed in corresponding pad place and adopts the soldering mode to connect.
4. like the full-color lattice module of arbitrary described high density LED among the claim 1-3, it is characterized in that: said plastic cement reflection housing is processed with black or grey colorant.
5. the full-color lattice module of high density LED as claimed in claim 4 is characterized in that: the display pixel hole, front of said plastic cement reflection housing is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204736425U CN202352251U (en) | 2011-11-24 | 2011-11-24 | High-density light emitting diode (LED) full-color lattice module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204736425U CN202352251U (en) | 2011-11-24 | 2011-11-24 | High-density light emitting diode (LED) full-color lattice module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202352251U true CN202352251U (en) | 2012-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204736425U Expired - Lifetime CN202352251U (en) | 2011-11-24 | 2011-11-24 | High-density light emitting diode (LED) full-color lattice module |
Country Status (1)
| Country | Link |
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| CN (1) | CN202352251U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102394034A (en) * | 2011-11-24 | 2012-03-28 | 深圳市丽晶光电科技股份有限公司 | High-density LED (light emitting diode) full-color dot matrix module and making method thereof |
| WO2014139189A1 (en) * | 2013-03-11 | 2014-09-18 | 深圳市奥拓电子股份有限公司 | High-definition led display screen and surface-mounted led composite lamp with super-small point distance thereof |
-
2011
- 2011-11-24 CN CN2011204736425U patent/CN202352251U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102394034A (en) * | 2011-11-24 | 2012-03-28 | 深圳市丽晶光电科技股份有限公司 | High-density LED (light emitting diode) full-color dot matrix module and making method thereof |
| WO2014139189A1 (en) * | 2013-03-11 | 2014-09-18 | 深圳市奥拓电子股份有限公司 | High-definition led display screen and surface-mounted led composite lamp with super-small point distance thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 518103 Guangdong, Shenzhen City, Guangdong Province, Baoan District Fuyong street oyyip road Xu Yuchang Industrial Park, B2 Patentee after: Shenzhen Lightking Technology Co., Ltd. Address before: 518103 Shenzhen, Guangdong, Fuyong street and the Far East Industrial Zone, the new building of the third Baoan District Patentee before: Shenzhen Lightking Technology Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120725 |