CN206921861U - A kind of upside-down mounting red-light LED chip - Google Patents
A kind of upside-down mounting red-light LED chip Download PDFInfo
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- CN206921861U CN206921861U CN201720451773.0U CN201720451773U CN206921861U CN 206921861 U CN206921861 U CN 206921861U CN 201720451773 U CN201720451773 U CN 201720451773U CN 206921861 U CN206921861 U CN 206921861U
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- silicon substrate
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- conduction post
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Abstract
The utility model discloses a kind of upside-down mounting red-light LED chip, including silicon substrate, it is arranged at the luminescent layer of silicon substrate upper surface and is arranged at the positive electrode and negative electrode of silicon substrate lower surface, wherein, the positive metallic conduction post and a negative metallic conduction post for being respectively connecting to luminescent layer are provided with the silicon substrate, the positive metallic conduction post lower end is connected with positive electrode, and the negative metallic conduction post lower end is connected with negative electrode.The utility model is reasonable in design, and bonding wire difficulty is greatly reduced, and makes bonding wire become more to simplify, meanwhile, improve light utilization and luminous efficiency.
Description
Technical field
It the utility model is related to a kind of LED illumination lamp field, more particularly to a kind of upside-down mounting red-light LED chip.
Background technology
LED lamp tube is also commonly called as light pipe, fluorescent tube, and its light source is using LED as illuminator.LED is the half of a kind of solid-state
Conductor luminescent device, as light source of new generation, just in fast development.Electricity directly can be converted into light by it, have low-voltage power supply,
Power consumption less, strong applicability, stability height, the response time short (switching characteristic is good), environmentally safe, multicolor luminous, colour rendering
Can be good the advantages that, be the new light sources being worthy to be popularized.
LED wafer is LED main raw material(s), and LED relies primarily on chip to light.Traditional LED wafer structure is mostly
Formal dress chip, production and assembling are inconvenient, raise the production cost of LED lamp, therefore, occur flip LED crystalline substance on the market
Piece.
Existing red-light LED chip, red light chips are directly welded on substrate, and positive pole is located on substrate lower surface,
Negative pole is located on substrate upper surface, and feux rouges gold thread directly passes from red light chips, such structure design, causes bonding wire very numb
Tired complexity.
It is affected by environment big meanwhile existing LED wafer is typically directly exposed in environment, influence luminous efficiency, life-span
Reduce；Moreover, LED wafer luminous efficiency is low, light is easily reflected or reflexed on substrate, causes light utilization low, energy damage
Lose big.
Utility model content
For above-mentioned deficiency, the purpose of this utility model is to provide a kind of upside-down mounting red-light LED chip, and structure design is closed
Reason, is greatly reduced bonding wire difficulty, makes bonding wire become more to simplify, meanwhile, improve light utilization and luminous efficiency.
The utility model is that technical scheme is used by reaching above-mentioned purpose：
A kind of upside-down mounting red-light LED chip, it is characterised in that including silicon substrate, be arranged at silicon substrate upper surface luminescent layer,
And the positive electrode and negative electrode of silicon substrate lower surface are arranged at, wherein, it is provided with the silicon substrate and is respectively connecting to luminescent layer
One positive metallic conduction post and a negative metallic conduction post, the positive metallic conduction post lower end are connected with positive electrode, the negative metallic conduction post
Lower end is connected with negative electrode.
As further improvement of the utility model, two through silicon substrate upper and lower surface are offered on the silicon substrate
Individual through hole, wherein pass through aperture insert for positive metallic conduction post, and another through hole inserts for negative metallic conduction post.
As further improvement of the utility model, the positive electrode is uniformly coated with one respectively with negative electrode lower surface
Granular tin paste layer, and protection insulation glue-line has been respectively coated in two sides of the positive electrode and negative electrode.
As further improvement of the utility model, the luminous layer surface is coated with an encapsulation glue-line.
As further improvement of the utility model, a glass glaze coating is coated between the silicon substrate and luminescent layer.
The beneficial effects of the utility model are：
(1) by opening up the metallic conduction post being connected between positive and negative electrode and luminescent layer on a silicon substrate, it is greatly reduced
Bonding wire difficulty, bonding wire is set to become more to simplify, and it is more reasonable to obtain overall construction design；
(2) by coating encapsulation glue-line in luminous layer surface, safety guarantor is provided for the luminescent layer of upside-down mounting red-light LED chip
Shield, avoid luminescent layer from being polluted by the dust impurity in external environment condition, influence luminous efficiency；
(3) by the coating glass glaze coating between silicon substrate and luminescent layer, to strengthen the reflecting effect of silicon substrate, glass
Glass glaze coating can reflect back the light for reflecting or reflexing on silicon substrate, to further enhance whole lighting efficiency, subtract
Few energy loss, light utilization are high.
Above-mentioned is the general introduction of utility model technical scheme, below in conjunction with accompanying drawing and embodiment, to the utility model
It is described further.
Brief description of the drawings
Fig. 1 is the profile of the utility model embodiment one；
Fig. 2 is the profile of the utility model embodiment two.
Embodiment
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose taken, below in conjunction with
Accompanying drawing and preferred embodiment, specific embodiment of the present utility model is described in detail.
Embodiment one：
It refer to Fig. 1, the utility model embodiment provides a kind of upside-down mounting red-light LED chip, including silicon substrate 1, is arranged at
The luminescent layer 2 of the upper surface of silicon substrate 1 and the positive electrode 3 and negative electrode 4 for being arranged at the lower surface of silicon substrate 1, wherein, the silicon substrate 1
In be provided with the positive 5 and one negative metallic conduction post 6 of metallic conduction post for being respectively connecting to luminescent layer 2, under the positive metallic conduction post 5
End is connected with positive electrode 3, and the negative lower end of metallic conduction post 6 is connected with negative electrode 4.
In the present embodiment, two through holes through the upper and lower surface of silicon substrate 1 are offered on the silicon substrate 1, its
Middle pass through aperture inserts for positive metallic conduction post 5, and another through hole inserts for negative metallic conduction post 6.
The present embodiment on silicon substrate 1 by opening up the metallic conduction post being connected between positive and negative electrode and luminescent layer 2, greatly
Width reduces bonding wire difficulty, makes bonding wire become more to simplify, and it is more reasonable to obtain overall construction design.
Embodiment two：
Fig. 2 is refer to, the present embodiment and the main distinction of embodiment one are：The positive electrode 3 and the lower surface of negative electrode 4
A graininess tin paste layer 7 is uniformly coated with respectively, and protection insulation has been respectively coated in two sides of the positive electrode 3 and negative electrode 4
Glue-line 8；The surface of luminescent layer 2 is coated with an encapsulation glue-line 21；A glass is coated between the silicon substrate 1 and luminescent layer 2
Glaze coating 9.
The present embodiment is carried by coating encapsulation glue-line 21 on the surface of luminescent layer 2 for the luminescent layer 2 of upside-down mounting red-light LED chip
For safeguard protection, avoid luminescent layer 2 from being polluted by the dust impurity in external environment condition, influence luminous efficiency.By silicon substrate 1 with
Coating glass glaze coating 9 between luminescent layer 2, glass glaze coating 9 are glass glaze coated on the glass glaze formed on silicon substrate 1
Coating 9, to strengthen the reflecting effect of silicon substrate 1, glass glaze coating 9 can will reflect or reflex to light on silicon substrate 1
Reflect back, to further enhance whole lighting efficiency, reduce energy loss.
It is described above, only it is preferred embodiment of the present utility model, not technical scope of the present utility model is made
Any restrictions, therefore identical with the utility model above-described embodiment or approximate technical characteristic is used, and obtained other structures,
Within the scope of protection of the utility model.
Claims (5)
- A kind of 1. upside-down mounting red-light LED chip, it is characterised in that including silicon substrate, be arranged at silicon substrate upper surface luminescent layer and The positive electrode and negative electrode of silicon substrate lower surface are arranged at, wherein, it is provided with the silicon substrate and is respectively connecting to the one of luminescent layer Positive metallic conduction post is connected with a negative metallic conduction post, the positive metallic conduction post lower end with positive electrode, under the negative metallic conduction post End is connected with negative electrode.
- 2. upside-down mounting red-light LED chip according to claim 1, it is characterised in that offered on the silicon substrate through Two through holes of silicon substrate upper and lower surface, wherein pass through aperture insert for positive metallic conduction post, and another through hole is for negative metal Conductive pole inserts.
- 3. upside-down mounting red-light LED chip according to claim 1 or 2, it is characterised in that the positive electrode and negative electrode following table Face is uniformly coated with a graininess tin paste layer respectively, and protection insulating cement has been respectively coated in two sides of the positive electrode and negative electrode Layer.
- 4. upside-down mounting red-light LED chip according to claim 1 or 2, it is characterised in that the luminous layer surface is coated with one Encapsulate glue-line.
- 5. upside-down mounting red-light LED chip according to claim 1 or 2, it is characterised in that between the silicon substrate and luminescent layer Coated with a glass glaze coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720451773.0U CN206921861U (en) | 2017-04-27 | 2017-04-27 | A kind of upside-down mounting red-light LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720451773.0U CN206921861U (en) | 2017-04-27 | 2017-04-27 | A kind of upside-down mounting red-light LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206921861U true CN206921861U (en) | 2018-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720451773.0U Active CN206921861U (en) | 2017-04-27 | 2017-04-27 | A kind of upside-down mounting red-light LED chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN206921861U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114488655A (en) * | 2022-03-21 | 2022-05-13 | 浙江水晶光电科技股份有限公司 | Gray filtering lens, preparation method thereof and camera module |
-
2017
- 2017-04-27 CN CN201720451773.0U patent/CN206921861U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114488655A (en) * | 2022-03-21 | 2022-05-13 | 浙江水晶光电科技股份有限公司 | Gray filtering lens, preparation method thereof and camera module |
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