CN204481043U - LED COB encapsulating structure - Google Patents
LED COB encapsulating structure Download PDFInfo
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- CN204481043U CN204481043U CN201420837994.8U CN201420837994U CN204481043U CN 204481043 U CN204481043 U CN 204481043U CN 201420837994 U CN201420837994 U CN 201420837994U CN 204481043 U CN204481043 U CN 204481043U
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- led
- flip chip
- reflector layer
- fluorescent powder
- encapsulating structure
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Abstract
The utility model discloses a kind of LED COB encapsulating structure, comprising: insulated substrate; Some LED flip chip, some described LED flip chip are arranged on described insulated substrate, and are enclosed by box dam, are formed and enclose region; Reflector layer, described reflector layer reflectorized material enclosed in region described in being filled in is formed, and the either flush of the end face of described reflector layer and described LED flip chip; And fluorescent powder membrane, described fluorescent powder membrane covers on the end face of described LED flip chip and described reflector layer.LED COB encapsulating structure of the present utility model, adopts flip-chip, can avoid formal dress chip wiring problem, improve unfailing performance; Adopt fluorescent powder membrane mode, enhance productivity and product yield; And the thickness of whole technical process phosphor powder layer and the controllability of shape high, have good uniformity, fluorescent material utilance is high; In addition, by enclosing reflector layer in flip-chip surrounding, light extraction efficiency is improved.
Description
Technical field
The utility model relates to technical field of semiconductors, particularly relates to a kind of LED COB encapsulating structure.
Background technology
LED, as a forth generation lighting source, has energy-conservation and life-span advantage significantly.
LED is the key link obtaining high-quality LED illumination light source, compared with the SMD paster type encapsulation of traditional LED and high-power encapsulation, multiple chips can directly be encapsulated on MCPCB substrate by COB encapsulation, directly dispelled the heat by substrate, manufacturing process and the cost thereof of support can not only be reduced, also there is the heat radiation advantage reducing thermal resistance.The COB encapsulation of prior art generally adopts metal-based circuit board, above must by carry out circuit printing after first carrying out insulation processing, and the insulating barrier link that to be thermal resistance in integral heat sink system maximum, be unfavorable for the overall high efficiency and heat radiation of LED COB encapsulating structure.Meanwhile, adopt a some glue mode, easily cause the problems such as the uneven and fluorescent material precipitation of a glue, production efficiency and the rate of pass low.
Summary of the invention
For above-mentioned prior art present situation, technical problem to be solved in the utility model is, provides the LED COB encapsulating structure that a kind of structure is simple, excellent in heat dissipation effect, the rate of pass are high.
In order to solve the problems of the technologies described above, a kind of LED COB encapsulating structure provided by the utility model, comprising:
Insulated substrate;
Some LED flip chip, some described LED flip chip are arranged on described insulated substrate, and are enclosed by box dam, are formed and enclose region;
Reflector layer, described reflector layer reflectorized material enclosed in region described in being filled in is formed, and the either flush of the end face of described reflector layer and described LED flip chip; And
Fluorescent powder membrane, described fluorescent powder membrane covers on the end face of described LED flip chip and described reflector layer.
Wherein in an embodiment, described insulated substrate is ceramic substrate.
Wherein in an embodiment, described insulated substrate is provided with circuit conductor layer, the positive and negative electrode end of some described LED flip-chips and described insulated substrate are by eutectic bonding and be connected described circuit conductor layer.
Wherein in an embodiment, described insulated substrate is the fluorescence ceramics substrate of transparent ceramic and fluorescent material sintering.
Wherein in an embodiment, described fluorescent powder membrane is covered on the end face of described LED flip chip and described reflector layer by mold pressing.
Wherein in an embodiment, described fluorescent powder membrane comprises at least two-layer fluorescent powder membrane unit.
Wherein in an embodiment, farthest away from described LED flip chip one deck described in fluorescent powder membrane unit be red fluorescence powder film.
Compared with prior art, LED COB encapsulating structure of the present utility model has following beneficial effect:
(1) adopt flip-chip, formal dress chip wiring problem can be avoided, improve unfailing performance, solve wire rosin joint, sealing-off phenomenon;
(2) adopt fluorescent powder membrane mode to avoid conventional point glue mode to cause a problem such as glue inequality and fluorescent material precipitation, enhance productivity and product yield; And the thickness of whole technical process phosphor powder layer and the controllability of shape high, have good uniformity, fluorescent material utilance is high.
(3) by enclosing reflector layer in flip-chip surrounding, light extraction efficiency is improved.
The beneficial effect that the utility model additional technical feature has will be described in this specification embodiment part.
Accompanying drawing explanation
Fig. 1 is the LED COB encapsulating structure profile of the utility model embodiment one;
Fig. 2 is the LED COB encapsulating structure profile of the utility model embodiment two.
Above in each figure, 10-insulated substrate; 20-LED flip-chip; 30-fluorescent powder membrane; 31-first fluorescent powder membrane unit; 32-second fluorescent powder membrane unit; 33-the 3rd fluorescent powder membrane unit; 40-reflector layer; 50-box dam.
Embodiment
And the utility model is described in detail below with reference to the accompanying drawings in conjunction with the embodiments.It should be noted that, when not conflicting, the feature in following embodiment and embodiment can combine mutually.
Embodiment one
As shown in Figure 1, LED COB encapsulating structure in the present embodiment comprises: insulated substrate 10, some LED flip chip 20, reflector layer 40 and fluorescent powder membrane 30, wherein, the circuit conductor layer of series/parallel structure required for ceramic substrate 10 is formed by printing, installs multiple LED flip chip linkage unit being positioned on the upside of the ceramic substrate 10 of heat radiation; The positive and negative electrode end of some LED flip chip 20 and ceramic substrate 10 are by eutectic bonding and be connected to circuit conductor layer, and the connection in series-parallel of chip chamber is realized by the circuit configuration on substrate.Some LED flip chip 20 are enclosed by box dam 50, are formed and enclose region.Fill reflectorized material form described reflector layer 40 described enclosing in region, and described reflector layer 40 end face and described LED flip chip 20 either flush.Described fluorescent powder membrane 30 is covered on the end face of described LED flip chip 20 and described reflector layer 40 by mold pressing.
More preferably, described insulated substrate 10 is ceramic substrate, good heat dissipation effect.Further more preferably, described insulated substrate 10 is the fluorescence ceramics substrate of transparent ceramic and fluorescent material sintering, and reliability is high, can realize 360 degree of luminescences.
The LED COB encapsulating structure of the utility model embodiment has following beneficial effect:
1 adopts flip-chip, can avoid formal dress chip wiring problem, improve unfailing performance, solve wire rosin joint, sealing-off phenomenon;
2 adopt fluorescent powder membrane mode to avoid conventional point glue mode to cause a problem such as glue inequality and fluorescent material precipitation, enhance productivity and product yield; And the thickness of whole technical process phosphor powder layer and the controllability of shape high, have good uniformity, fluorescent material utilance is high.
3 by enclosing reflector layer in flip-chip surrounding, improves light extraction efficiency.
Embodiment two
As shown in Figure 2, LED COB encapsulating structure in the present embodiment is substantially identical with the LED COB encapsulating structure in embodiment one, and difference is: described fluorescent powder membrane 30 comprises the first fluorescent powder membrane unit 31, second fluorescent powder membrane unit 32 and the 3rd fluorescent powder membrane unit 33.Multilayered fluorescent film thickness and phosphor concentration control realization is utilized to control LED colour temperature and development index.More preferably, farthest away from described LED flip chip 20 one deck described in fluorescent powder membrane unit 33 be red fluorescence powder film, make red fluorescence rete away from chip, promote rouge and powder reliability.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (6)
1. a LED COB encapsulating structure, is characterized in that, comprising:
Insulated substrate (10);
Some LED flip chip (20), some described LED flip chip (20) are arranged on described insulated substrate (10), and are enclosed by box dam (50), are formed and enclose region;
Reflector layer (40), described reflector layer (40) reflectorized material enclosed in region described in being filled in is formed, and the either flush of the end face of described reflector layer (40) and described LED flip chip (20); And
Fluorescent powder membrane (30), described fluorescent powder membrane (30) covers on the end face of described LED flip chip (20) and described reflector layer (40).
2. LED COB encapsulating structure according to claim 1, is characterized in that, described insulated substrate (10) is ceramic substrate.
3. LED COB encapsulating structure according to claim 2, it is characterized in that, described insulated substrate (10) is provided with circuit conductor layer, and the positive and negative electrode end of some described LED flip chip (20) and described insulated substrate (10) are by eutectic bonding and be connected described circuit conductor layer.
4. LED COB encapsulating structure according to claim 1, is characterized in that, described fluorescent powder membrane (30) is covered on the end face of described LED flip chip (20) and described reflector layer (40) by mold pressing.
5. LED COB encapsulating structure as claimed in any of claims 1 to 4, is characterized in that, described fluorescent powder membrane (30) comprises at least two-layer fluorescent powder membrane unit (31,32,33).
6. LED COB encapsulating structure according to claim 5, is characterized in that, farthest away from described LED flip chip (20) one deck described in fluorescent powder membrane unit (33) be red fluorescence powder film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420837994.8U CN204481043U (en) | 2014-12-25 | 2014-12-25 | LED COB encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420837994.8U CN204481043U (en) | 2014-12-25 | 2014-12-25 | LED COB encapsulating structure |
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| Publication Number | Publication Date |
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| CN204481043U true CN204481043U (en) | 2015-07-15 |
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| CN201420837994.8U Active CN204481043U (en) | 2014-12-25 | 2014-12-25 | LED COB encapsulating structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613268A (en) * | 2022-03-09 | 2022-06-10 | 深圳市南极光电子科技股份有限公司 | Backlight source, backlight module and display |
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2014
- 2014-12-25 CN CN201420837994.8U patent/CN204481043U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613268A (en) * | 2022-03-09 | 2022-06-10 | 深圳市南极光电子科技股份有限公司 | Backlight source, backlight module and display |
| CN114613268B (en) * | 2022-03-09 | 2024-01-23 | 深圳市南极光电子科技股份有限公司 | Backlight source, backlight module and display |
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