CN102891141A - Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same - Google Patents
Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same Download PDFInfo
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- CN102891141A CN102891141A CN2012104151302A CN201210415130A CN102891141A CN 102891141 A CN102891141 A CN 102891141A CN 2012104151302 A CN2012104151302 A CN 2012104151302A CN 201210415130 A CN201210415130 A CN 201210415130A CN 102891141 A CN102891141 A CN 102891141A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 27
- 238000009413 insulation Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000006185 dispersion Substances 0.000 title abstract description 5
- 238000005260 corrosion Methods 0.000 title abstract 4
- 239000000084 colloidal system Substances 0.000 claims abstract description 10
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 62
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 230000003287 optical Effects 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 10
- 241000218202 Coptis Species 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- 229920000591 gum Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 229910001884 aluminium oxide Inorganic materials 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- 230000000875 corresponding Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and a manufacturing method thereof. The waterproof anti-corrosion high-heat dispersion and high-insulation LED ceramic integrated light source comprises an enclosure frame, a base plate, multiple LED crystal particles arranged on the base plate, and a fluorescent powder colloid poured in the enclosure frame and covering the multiple LED crystal particles, wherein the base plate and the enclosure frame both are made of ceramic materials, the base plate is embedded in the enclosure frame, and the embedding connection part between the base plate and the enclosure frame and the lead holes of an LED anode and an LED cathode are sealed by thermal conductive insulation paste. The base plate and the enclosure frame are made of ceramic materials, are more excellent in waterproofness, corrosion resistance, heat dispersion performance and insulation performance, can be suitable for illumination of coastline pier lamps and various underwater operation lamps in freshwater, seawater and various severe environments, and have long service life. The manufacturing method provided by the invention is simple in technology, low in manufacturing cost and high in production efficiency.
Description
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Technical field
The present invention relates to a kind of LED technical field, relate in particular to LED pottery integrated optical source and preparation method thereof.
Background technology
Light-emitting diode (LED) is as a kind of novel luminescent device, has the plurality of advantages such as energy-saving and environmental protection, long service life, toggle speed are fast, can be applicable to the various fields such as telecommunications, luminous plate and liquid crystal display.LED is as light source, and its manufacturing process comprises chip preparation and two stages of chip package, substantially takes at present individual particle encapsulation and integration encapsulation dual mode aspect chip package.The existing LED integrated optical source that makes by integration packaging generally all comprises metal substrate, be attached on the metal substrate and the plurality of LEDs crystal grain that connects with gold thread with metal substrate, be arranged on the fluorescent powder colloid that plastics around the plurality of LEDs crystal grain enclose frame (with the metal lead frame injection mo(u)lding) and encapsulating in plastics enclose frame and cover all LED crystal grain.
Existing LED integrated optical source has following defective: substrate adopts metal material to make, because the thermal coefficient of expansion of metal material and LED crystal grain is widely different, when variations in temperature very large or packaging operation not at that time substrate very easily to produce heat crooked, cause the chip flaw and also cause luminous efficiency to reduce; There are potential safety hazard in the anti-corrosive properties of metal substrate, thermal diffusivity, poor insulativity during use; Therefore the connection of metal substrate is finished by the metal lead frame that plastics enclose in the frame, and lead frame is stamping forming, has limited the flexibility of line connection, and plastics enclose the frame poor radiation, and is restricted the useful life of LED integrated optical source.
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Summary of the invention
The object of the invention is to provide the LED pottery integrated optical source of a kind of waterproof, anticorrosion, high heat radiation and high insulating property.
In order to achieve the above object, the technical solution adopted in the present invention is: the high insulation of a kind of water-tight corrosion-proof heat radiation LED pottery integrated optical source, comprise and enclose frame, substrate, be arranged on plurality of LEDs crystal grain on the substrate and encapsulating in the described fluorescent powder colloid that encloses in the frame and plurality of LEDs crystal grain is covered, described substrate with enclose frame and make by ceramic material, described substrate is embedded described and encloses in the frame, and described substrate with enclose that frame is embedded the junction and LED positive and negative lead wires hole seals by thermal conductive insulation glue.
To technique scheme further the mode of conversion or optimization comprise:
Described substrate with enclose frame preferential oxidation aluminium and aluminium nitride ceramics material is made.
It also comprises the metal film electrode circuit that is arranged on the described substrate surface, and described plurality of LEDs crystal grain is fixed on the metal film electrode circuit and with the metal film electrode circuit and is connected.
The bottom of described substrate and the described mutually concordant setting in bottom of enclosing frame.
Described metal film electrode circuit is the argent material, and the surface is smooth mirror surface.
The present invention also provides the high insulation of a kind of water-tight corrosion-proof heat radiation LED pottery integrated optical source manufacture method, and it comprises the steps:
A. substrate and enclose frame and make: the Ceramics material is made substrate, makes potteries according to the various shape and size sizes of ceramic substrate and encloses frame, at substrate or enclose and offer in advance LED positive and negative lead wires hole in the frame;
B. the metal film electrode circuit is made: the mode by silk screen printing requires to stamp the electrode circuit metal paste according to electrode pattern design on the ceramic substrate making, by oven dry and the metal film electrode circuit of high temperature sintering system, and this metal film electrode wiring board carried out mirror finish;
C. die bond: at LED crystal grain back side gum, the LED crystal grain after adopting the SMT mode with gum is attached on the assigned address of described metal film electrode wiring board and by high temperature and fixes by back-gluing machine;
D. gold thread bonding: LED crystal grain is connected by the bonding equipment routing with the metal film electrode circuit;
E. ceramic substrate and pottery enclose frame and are embedded and are connected: ceramic substrate is embedded in enclosing frame, is embedded junction and positive and negative lead wires with the sealing of heat conductive insulating colloid;
F. encapsulating moulding: pour into phosphor gel in the frame to described enclosing, get final product by the high temperature sintering curing molding.
Further, among the step a, described substrate with enclose frame preferential oxidation aluminium and aluminium nitride ceramics material is made.
Among the step b, metal film electrode circuit sintering approximately 15 minutes under the temperature about 800 ℃.
Among the step e, the mutually concordant setting of frame bottom is enclosed with pottery in the bottom of described ceramic substrate.
Because the utilization of technique scheme, the advantage of the relative prior art of the present invention: the substrate of LED of the present invention pottery integrated optical source and enclose frame Ceramics material and make, compare with the existing LED integrated optical source of metal substrate of using, water proofing property, anti-corrosive properties, thermal diffusivity, insulating properties are better, applicable coastal dock lamp, fresh water, seawater and the illumination of all kinds of underwater task light in various adverse circumstances, longer service life is applicable to making varying environment, especially high power LED integrated light source; In addition, the present invention uses the ceramic material substrate and encloses frame, and the same thermal coefficient of expansion of material is also just the same, so its waterproof sealing is also just better.Employing is embedded structure in pottery encloses frame with substrate, has overcome to use plastics to enclose the deficiencies such as poor radiation that frame exists, and substrate and enclose frame and can dispel the heat has simultaneously increased area of dissipation, and thermal diffusivity is also better.It is simple that the manufacture method of LED waterproof of the present invention, anticorrosion, heat radiation, high insulating ceramics integrated optical source has technique, and cost of manufacture is low, the advantage that production efficiency is high.
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Description of drawings
Fig. 1 is the vertical view of LED integrated optical source of the present invention;
Fig. 2 is the A-A directional profile schematic diagram of Fig. 1;
Wherein: 1, substrate; 2, enclose frame; 3, metal film electrode circuit; 4, LED crystal grain; 5, fluorescent powder colloid; 6, gold thread; 7, positive and negative lead wires hole.
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Embodiment
Below in conjunction with accompanying drawing the preferred embodiment for the present invention is described in further detail:
Embodiment 1:
Referring to Fig. 1 and 2, the LED integrated optical source of the present embodiment comprises substrate 1, encloses frame 2, is arranged on the plurality of LEDs crystal grain 4 on the substrate 1, and the fluorescent powder colloid 5 that covers in enclosing frame 2 and with described plurality of LEDs crystal grain 4 of encapsulating.Wherein, substrate 1 and enclose frame 2 and make by ceramic material, substrate 1 is embedded in enclosing frame 2, and it is embedded the junction and LED positive and negative lead wires hole 7 seals by thermal conductive insulation glue.And the bottom surface of substrate 1 is with to enclose frame 2 mutually concordant.
In the present embodiment, LED pottery integrated optical source also comprises sintering at the metal film electroplax circuit 3 on substrate 1 surface, and described plurality of LEDs crystal grain 4 namely is fixed on the metal film electrode circuit 3, and is connected by gold thread 6 between plurality of LEDs crystal grain 4 and the metal film electrode circuit 3.Described metal film electrode circuit is the argent material, and the surface is minute surface, has the light reflectivity more than 90%, can further improve the luminous efficiency of LED integrated optical source.
The present embodiment LED pottery integrated optical source water proofing property, anti-corrosive properties, thermal diffusivity, insulating properties are better, longer service life, and metal film electrode circuit surface is minute surface, more can improve the luminous efficiency of LED integrated optical source.
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Embodiment 2:
The present embodiment is introduced the method for packing of the LED pottery integrated optical source of embodiment 1, specifically adopts following steps:
(1), substrate manufacture: selection ceramic material ceramic substrate, but preferential oxidation aluminium or aluminium nitride ceramics.
(2), the making of metal film electrode circuit: the mode by silk screen printing on ceramic substrate requires to stamp the electrode circuit metal paste according to electrode pattern design, make the metal film electrode circuit by oven dry and high temperature sintering, and this metal film electrode circuit is carried out mirror finish; Specifically can be further referring to the patent No.: ZL201220013909.7.
(3), die bond: by back-gluing machine at LED crystal grain back side gum, then adopt SMT technology (being surface mounting technology) to pick up and be attached on the assigned address of metal film electrode circuit by the LED crystal grain of vacuum slot after with gum, mount finish after, sintering approximately 2 hours under the temperature about 150 ℃ makes LED crystal grain fix at the metal film electrode circuit again.
(4), gold thread combination: LED crystal grain is connected by the bonding equipment routing with the metal film electrode circuit;
(5), add and enclose frame: make in advance pottery according to the various shapes of ceramic substrate and size dimension and enclose frame; According to specification requirement, at substrate or enclose and offer in advance LED positive and negative lead wires hole in the frame;
(6), substrate and enclose frame and be embedded junction sealing: ceramic substrate is embedded in enclosing frame, is embedded junction and positive and negative lead wires hole with heat conductive insulating colloid waterproof sealing; It is concordant that the bottom of ceramic substrate and pottery enclose frame; Substrate and enclose frame and dispel the heat has simultaneously increased area of dissipation, has improved heat dispersion; And pottery encloses the thickness of frame and can determine according to the preset thickness of fluorescent powder colloid.
(7), encapsulating moulding: enclose toward pottery and to pour into phosphor gel in the frame, after the temperature sintering curing moulding about 120 ℃, make described LED waterproof, anticorrosion, heat radiation, high insulating ceramics integrated optical source.
The manufacture method technique of above-mentioned integrated optical source is simple, and cost of manufacture is low, and production efficiency is higher.
The present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence; those skilled in the art can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the scope of claim protection of the present invention.
Claims (9)
1. the high insulation of water-tight corrosion-proof heat radiation LED pottery integrated optical source, comprise and enclose frame (2), substrate (1), be arranged on the plurality of LEDs crystal grain (4) on the substrate (1), and encapsulating is in the described fluorescent powder colloid (5) that encloses in the frame (2) and plurality of LEDs crystal grain (4) is covered, it is characterized in that: described substrate (1) with enclose frame (2) and make by ceramic material, described substrate (1) is embedded described and encloses in the frame (2), and described substrate (1) with enclose that frame (2) is embedded the junction and LED positive and negative lead wires hole (7) seals by thermal conductive insulation glue.
2. the high insulation of water-tight corrosion-proof according to claim 1 heat radiation LED pottery integrated optical source is characterized in that: described substrate (1) with enclose frame (2) and select aluminium oxide and aluminium nitride ceramics material to make.
3. the high insulation of water-tight corrosion-proof according to claim 1 and 2 heat radiation LED pottery integrated optical source, it is characterized in that: it also comprises and is arranged on the lip-deep metal film electrode wiring board of described substrate (1) (3), and it is upper and be connected with the metal film electrode circuit that described plurality of LEDs crystal grain (4) is fixed on metal film electrode circuit (3).
4. the high insulation of water-tight corrosion-proof heat radiation according to claim 3 LED pottery integrated optical source is characterized in that: the bottom of described substrate (1) and the described mutually concordant setting in bottom of enclosing frame (2).
5. the high insulation of water-tight corrosion-proof according to claim 3 heat radiation LED pottery integrated optical source, it is characterized in that: described metal film electrode circuit (3) is the argent material, and the surface is smooth mirror surface.
6. the high insulation of water-tight corrosion-proof heat radiation LED pottery integrated optical source manufacture method, it is characterized in that: it comprises the steps:
A. substrate and enclose frame and make: the Ceramics material is made substrate, make potteries according to the various shape and size sizes of ceramic substrate and enclose frame, according to specification requirement at substrate or enclose and offer in advance LED positive and negative lead wires hole in the frame;
B. the metal film electrode circuit is made: the mode by silk screen printing requires to stamp the electrode circuit metal paste according to electrode pattern design on the ceramic substrate making, make the metal film electrode circuit by oven dry and high temperature sintering, and this metal film electrode circuit base plate is carried out mirror finish;
C. die bond: at LED crystal grain back side gum, the LED crystal grain after adopting the SMT mode with gum is attached on the assigned address of described metal film electrode circuit and by high temperature and fixes by back-gluing machine;
D. gold thread bonding: LED crystal grain is connected by the bonding equipment routing with the metal film electrode circuit;
E. substrate with enclose frame and be embedded and be connected: ceramic substrate is embedded in enclosing frame, is embedded junction and positive and negative lead wires with the sealing of heat conductive insulating colloid;
F. encapsulating moulding: pour into phosphor gel in the frame to described enclosing, get final product by the high temperature sintering curing molding.
7. the high insulation of water-tight corrosion-proof according to claim 6 heat radiation LED pottery integrated optical source manufacture method is characterized in that: among the step a, described substrate with enclose frame preferential oxidation aluminium and aluminium nitride ceramics material is made.
8. the high insulation of water-tight corrosion-proof according to claim 6 heat radiation LED pottery integrated optical source manufacture method is characterized in that: among the step b, and metal film electrode circuit sintering approximately 15 minutes under the temperature about 800 ℃.
9. the high insulation of water-tight corrosion-proof according to claim 6 heat radiation LED pottery integrated optical source manufacture method, it is characterized in that: among the step e, the mutually concordant setting of frame bottom is enclosed with pottery in the bottom of described ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104151302A CN102891141A (en) | 2012-10-26 | 2012-10-26 | Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104151302A CN102891141A (en) | 2012-10-26 | 2012-10-26 | Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same |
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| Publication Number | Publication Date |
|---|---|
| CN102891141A true CN102891141A (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012104151302A Pending CN102891141A (en) | 2012-10-26 | 2012-10-26 | Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103390715A (en) * | 2013-07-16 | 2013-11-13 | 华南理工大学 | Light-emitting diode (LED) packaged with AlSiC composite substrate |
| CN104600037A (en) * | 2014-12-30 | 2015-05-06 | 中国电子科技集团公司第五十五研究所 | Multi-die high-power diode shell and manufacturing method thereof as well as chip packaging method |
| CN108767101A (en) * | 2018-05-25 | 2018-11-06 | 苏州市汇涌进光电有限公司 | A kind of LED die-bonding methods |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544325A (en) * | 2012-02-14 | 2012-07-04 | 张家港市金港镇东南电子厂 | Light emitting diode (LED) integrated module and method for manufacturing same |
| CN203085528U (en) * | 2012-10-26 | 2013-07-24 | 张家港东能电子科技有限公司 | Waterproof anticorrosion heat radiation high insulation LED ceramic integrated light source |
-
2012
- 2012-10-26 CN CN2012104151302A patent/CN102891141A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544325A (en) * | 2012-02-14 | 2012-07-04 | 张家港市金港镇东南电子厂 | Light emitting diode (LED) integrated module and method for manufacturing same |
| CN203085528U (en) * | 2012-10-26 | 2013-07-24 | 张家港东能电子科技有限公司 | Waterproof anticorrosion heat radiation high insulation LED ceramic integrated light source |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103390715A (en) * | 2013-07-16 | 2013-11-13 | 华南理工大学 | Light-emitting diode (LED) packaged with AlSiC composite substrate |
| CN104600037A (en) * | 2014-12-30 | 2015-05-06 | 中国电子科技集团公司第五十五研究所 | Multi-die high-power diode shell and manufacturing method thereof as well as chip packaging method |
| CN108767101A (en) * | 2018-05-25 | 2018-11-06 | 苏州市汇涌进光电有限公司 | A kind of LED die-bonding methods |
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Application publication date: 20130123 |