CN103151434A - Method for improving distribution uniformity of LED (Light Emitting Diode) encapsulated fluorescent powder - Google Patents
Method for improving distribution uniformity of LED (Light Emitting Diode) encapsulated fluorescent powder Download PDFInfo
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- CN103151434A CN103151434A CN2013100590837A CN201310059083A CN103151434A CN 103151434 A CN103151434 A CN 103151434A CN 2013100590837 A CN2013100590837 A CN 2013100590837A CN 201310059083 A CN201310059083 A CN 201310059083A CN 103151434 A CN103151434 A CN 103151434A
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Abstract
The invention belongs to the field of semiconductor illumination and particularly relates to a method for improving LED (Light Emitting Diode) encapsulation. The method for improving the LED encapsulation comprises the following steps that LED chips are fixedly arranged on a substrate containing a printed circuit layer; cathodes of the chips are connected with the cathode of the printed circuit layer of the substrate; anodes of the chips are connected with the anode of the printed circuit layer of the substrate; the anode of the printed circuit layer of the substrate is connected with the cathode of the printed circuit layer; the anode and the cathode of the printed circuit layer are connected in a short-circuit way; a mixture of well-proportioned fluorescent powder and silica gel is stirred and then coated onto the chips; and a light source semi-finished product is put in a roaster for roasting. With the adoption of the method for improving LED light source encapsulation provided by the invention, through the short-circuit connection between the anode and the cathode of the substrate, the anodes and the cathodes of the chips are located on the same potential difference, so that an external electric field resulting from LED intrinsic absorption is eliminated; and therefore, the purpose of evenly distributing the fluorescent powder is realized, and the light color yield of a light source product is further improved.
Description
Technical field
The invention belongs to field of semiconductor illumination, be specifically related to a kind of LED encapsulation improvement method.
Background technology
Semiconductor light emitting diode (LED) has the characteristics such as high brightness, energy-saving and environmental protection, long-life, fast response time, as a kind of novel solid light source, in the lighting field extensive use---and bulb lamp, fluorescent lamp, Down lamp etc.
The principle of luminosity of Light-Emitting Diode is: under External Electrical Field, the electron transition of conduction band is to valence band and hole-recombination, produce spontaneous emission light, characteristic according to semiconductive luminescent materials is known, there is an inverse process----Intrinsic Gettering in transition radiation light, the semi-conducting material energy gap is Eg, its peak wavelength λ ≈ 1240/Eg(mm), under the irradiation of λ＜1240/Eg light, Light-Emitting Diode begins Intrinsic Gettering, can produce accordingly one " external electric field ", λ is less, and this " external electric field " is stronger; Separately, fluorescent material is in the process of mixing with encapsulation glue, because the reason of friction and material polarity, the fluorescent material positively charged, encapsulation glue is electronegative; White light LEDs conventional package method is die bond, bonding wire, test at present, and the product with test passes after being completed directly applies fluorescent glue, baking; There is a drawback in this conventional method, can be dissociated by initiation fluorescent material by " external electric field " that the Light-Emitting Diode Intrinsic Gettering produces, fluorescent material phenomenon pockety occurs, chip series connection number is more, this phenomenon is more obvious, near and between the product individuality light, look parameter differences also just more obvious.
Summary of the invention
Technical problem to be solved by this invention is: because of the free fluorescent material skewness that occurs of fluorescent material.The invention provides a kind of method of improvement, improved product optical color parameter yield.Concrete technical scheme is:
A kind of method of improving LED encapsulation fluorescent material distributing homogeneity comprises the steps:
S1: chip is fixed on the substrate that contains layer printed circuit board;
S2: the chip negative pole is connected with the layer printed circuit board negative pole of substrate, and the positive pole of chip is connected with the layer printed circuit board of substrate is anodal;
S3: with positive pole and the negative pole short circuit of layer printed circuit board;
S4: the mixture of preparation fluorescent material and encapsulation glue after stirring, is coated on chip, as the light source semi-finished product;
S5: described light source semi-finished product are put into baking box toast.
principle of the present invention is: in the mixed process of fluorescent material and silica gel, because needs constantly stir, fluorescent material and the constantly friction of encapsulation glue, and a little less than the fluorescent material electronegativity, packaging plastic water power negativity is strong, like this in the process of friction, fluorescent material can be positively charged, and encapsulation glue can be electronegative, be distribution of particles in silica gel due to fluorescent material, therefore if this adds an electric field on the whole at fluorescent material and silica gel, fluorescent material will move in electric field, concrete manifestation is to assemble or diffusion in encapsulation glue, because " external electric field " that the Light-Emitting Diode Intrinsic Gettering produces can dissociate by initiation fluorescent material, fluorescent material phenomenon pockety appears.When chip is anodal and the mutual short circuit of negative pole, make it be in same potential difference, eliminated " external electric field " that the Light-Emitting Diode Intrinsic Gettering produces, realized the equally distributed purpose of fluorescent material, closely improved the photochromic yield of light source product.
For said method, when being 2, the number of chips described in step S1 can adopt conventional bonding wire craft that chip is connected with chip when above, and the connected mode between chip and chip is series, parallel or series-parallel connection.
For said method, the material of substrate can be pottery or aluminium.
For said method, described fluorescent material is a kind of in yttrium-aluminium-garnet (YAG), silicate, nitride.For example: the YAG powder of the YAG-04 of Ying Temei, the BG201 silicate powder of Mitsubishi.
For said method, described encapsulation glue is silica gel or epoxy resin, and range of viscosities is preferably at 100～10000 CPS.
For said method, in step S5, baking temperature is higher than 50 ℃, and stoving time is greater than 5min.
Beneficial effect
Compare with existing general packaging technology, LED light source encapsulation improvement method provided by the invention, by short circuit substrate both positive and negative polarity, make it be in same potential difference, eliminated " external electric field " that the Light-Emitting Diode Intrinsic Gettering produces, realize the equally distributed purpose of fluorescent material, closely improved the photochromic yield of light source product.
Description of drawings
Fig. 1 is traditional sealing schematic top plan view;
Fig. 2 is sealing schematic top plan view of the present invention.
Wherein, the 1st, glue-dropping tool; The 2nd, light source substrate; The 3rd, layer printed circuit board is anodal; The 4th, the light source coating area; The 5th, chip; The 6th, the layer printed circuit board negative pole; The 7th, the probe short circuit device; The 8th, metal probe.
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Embodiment
The traditional LED method for packing of embodiment 1
As Fig. 1, the basic technology of COB encapsulation at present is: a, die bond, chip 5 is fixed on light source substrate 2, and wherein be provided with routinely circuit layer and reflector layer on substrate, chip is fixed on reflector layer; B, bonding wire, according to design requirement, with the circuit communication between chip, circuit connecting mode is series connection or parallel connection or series-parallel connection with gold thread, and the positive pole of layer printed circuit board on chip circuit and substrate is connected with negative pole; C, coating fluorescent material are placed on the qualified light source semi-finished product of bonding wire on glue-dropping tool 1, then at coating area 4 places coating fluorescent glue; D, baking-curing are put into the baking box baking with the light source semi-finished product that applied fluorescent glue; In the glue coated process, because the Light-Emitting Diode Intrinsic Gettering produces one " external electric field ", under electric field action, the fluorescent material of positively charged is free to the chip of layer printed circuit board negative pole 6 directions, caused the phenomenon of fluorescent material skewness, the near and corresponding reduction of photochromic yield of product.
For overcoming above-mentioned technical problem, a kind of LED light source encapsulation provided by the present invention improves way, comprises the steps: a, die bond, and chip 5 is fixed on light source substrate 2, wherein substrate 2 is provided with circuit layer and reflector layer routinely, and chip 5 is fixed on reflector layer; B, bonding wire, according to design requirement, with the circuit communication between chip 5, circuit connecting mode is series connection or parallel connection or series-parallel connection with gold thread, and the positive pole 3 of layer printed circuit board on chip circuit and substrate and the negative pole 6 of layer printed circuit board are connected; C, short circuit both positive and negative polarity arrange grounding probe 8 on the negative pole 6 of the positive pole 3 of layer printed circuit board and layer printed circuit board, with grounding probe 8 short circuits, short-circuiting means 7 and grounding probe 8 are all conductor by short-circuiting means 7; D, coating fluorescent glue, 4 places apply fluorescent glue at coating area; E, baking-curing are put into the baking box baking with the light source semi-finished product that applied fluorescent glue.In the present embodiment, substrate is ceramic substrate.
In the present embodiment, steps d applies fluorescent glue and comprises the steps: d1, fluorescent material and encapsulation glue are mixed; D2, by point glue equipment, fluorescent glue is coated in coating area 4 places.In the present embodiment, fluorescent material adopts the YAG-04 of Ying Temei; Packaging plastic hydromining silica gel.
In the present embodiment, step e baking-curing comprises the steps: e1, baking temperature is set is 50 ℃; E2, fluorescent glue is shakeout rear product put into baking box baking 10 min.
In sum, the main characteristics of the present invention are by grounding probe short circuit light source both positive and negative polarity, make it be in same potential difference, namely eliminate " external electric field " that produce due to the Light-Emitting Diode Intrinsic Gettering, avoid occurring the phenomenon by the free fluorescent material skewness that causes of fluorescent material, near and reached the equally distributed purpose of fluorescent material.
Be with the difference of embodiment 1: substrate adopts aluminium base; Fluorescent material adopts the BG201 silicate powder of Mitsubishi; Packaging plastic hydromining epoxy resin; Baking temperature is 60 ℃; Stoving time is 5 min.
Claims (7)
1. a method of improving LED encapsulation fluorescent material distributing homogeneity, comprise the steps:
S1: chip is fixed on the substrate that contains layer printed circuit board;
S2: the chip negative pole is connected with the layer printed circuit board negative pole of substrate, and the positive pole of chip is connected with the layer printed circuit board of substrate is anodal;
S3: with positive pole and the negative pole short circuit of layer printed circuit board;
S4: the mixture of preparation fluorescent material and encapsulation glue after stirring, is coated on chip, as the light source semi-finished product;
S5: described light source semi-finished product are put into baking box toast.
2. the method for improving LED encapsulation fluorescent material distributing homogeneity according to claim 1, it is characterized in that: described chip is more than 2, by wire soldering method, chip is connected with chip; Connected mode between chip and chip is series, parallel or series-parallel connection.
3. the method for improving LED encapsulation fluorescent material distributing homogeneity according to claim 1, it is characterized in that: the material of described substrate is pottery or aluminium.
4. the method for improving LED encapsulation fluorescent material distributing homogeneity claimed in claim 1 is characterized in that: described fluorescent material is a kind of in yttrium-aluminium-garnet, silicate, nitride.
5. the method for improving LED encapsulation fluorescent material distributing homogeneity claimed in claim 1, it is characterized in that: described encapsulation glue is silica gel or epoxy resin.
6. the method for improving LED encapsulation fluorescent material distributing homogeneity claimed in claim 1, it is characterized in that: described encapsulation glue viscosity is at 100～10000 CPS.
7. the method for improving LED encapsulation fluorescent material distributing homogeneity claimed in claim 1, it is characterized in that: in described step S5, baking temperature is higher than 50 ℃, and stoving time is greater than 5min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310059083.7A CN103151434B (en) | 2013-02-25 | 2013-02-25 | A kind of method improving LED fluorescent material distributing homogeneity |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310059083.7A CN103151434B (en) | 2013-02-25 | 2013-02-25 | A kind of method improving LED fluorescent material distributing homogeneity |
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| CN103151434A true CN103151434A (en) | 2013-06-12 |
| CN103151434B CN103151434B (en) | 2016-04-27 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428503A (en) * | 2015-12-16 | 2016-03-23 | 江苏稳润光电有限公司 | Packaging device for enabling light emission of SMD light source to be uniform and packaging method thereof |
| WO2019095463A1 (en) * | 2017-11-14 | 2019-05-23 | 广东金源照明科技股份有限公司 | Magnetic fluorescent powder composite and plane coating method therefor |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN112730366A (en) * | 2020-12-29 | 2021-04-30 | 湖北富邦新材料有限公司 | Method for rapidly judging wrapping uniformity of fully water-soluble liquid anti-caking agent on fertilizer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050184651A1 (en) * | 2004-02-19 | 2005-08-25 | Hong-Yuan Technology Co., Ltd. | Light emitting device and fabrication method thereof |
| CN102120212A (en) * | 2010-12-09 | 2011-07-13 | 惠州雷曼光电科技有限公司 | LED and dispensing method of LED fluorescent powder |
| CN102856473A (en) * | 2012-08-17 | 2013-01-02 | 上舜照明（中国）有限公司 | Packaging adjustment method of LED (light-emitting diode) light source |
-
2013
- 2013-02-25 CN CN201310059083.7A patent/CN103151434B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050184651A1 (en) * | 2004-02-19 | 2005-08-25 | Hong-Yuan Technology Co., Ltd. | Light emitting device and fabrication method thereof |
| CN102120212A (en) * | 2010-12-09 | 2011-07-13 | 惠州雷曼光电科技有限公司 | LED and dispensing method of LED fluorescent powder |
| CN102856473A (en) * | 2012-08-17 | 2013-01-02 | 上舜照明（中国）有限公司 | Packaging adjustment method of LED (light-emitting diode) light source |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428503A (en) * | 2015-12-16 | 2016-03-23 | 江苏稳润光电有限公司 | Packaging device for enabling light emission of SMD light source to be uniform and packaging method thereof |
| WO2019095463A1 (en) * | 2017-11-14 | 2019-05-23 | 广东金源照明科技股份有限公司 | Magnetic fluorescent powder composite and plane coating method therefor |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN112705915B (en) * | 2020-01-21 | 2022-07-01 | 深圳市佳康捷科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN112730366A (en) * | 2020-12-29 | 2021-04-30 | 湖北富邦新材料有限公司 | Method for rapidly judging wrapping uniformity of fully water-soluble liquid anti-caking agent on fertilizer |
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| CN103151434B (en) | 2016-04-27 |
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