CN114613268B - Backlight source, backlight module and display - Google Patents

Backlight source, backlight module and display Download PDF

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Publication number
CN114613268B
CN114613268B CN202210236486.3A CN202210236486A CN114613268B CN 114613268 B CN114613268 B CN 114613268B CN 202210236486 A CN202210236486 A CN 202210236486A CN 114613268 B CN114613268 B CN 114613268B
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China
Prior art keywords
led lamp
transparent substrate
adhesive layer
layer
backlight
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CN202210236486.3A
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CN114613268A (en
Inventor
潘连兴
周福新
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Shenzhen Australis Electronic Technology Co Ltd
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Shenzhen Australis Electronic Technology Co Ltd
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Abstract

The invention discloses a backlight source, a backlight module and a display, which comprise a PCB, a plurality of LED lamp beads arranged on one side of the PCB, a transparent substrate and an optical transparent adhesive layer arranged on one side of the transparent substrate; a plurality of grooves are formed in the optical transparent adhesive layer, and each groove is correspondingly provided with one LED lamp bead; and one side of the optical transparent adhesive layer, which is far away from the transparent substrate, is attached to the PCB. The optical transparent glue layer is used for generating a certain light condensation effect on the LED lamp beads, so that light rays emitted by the LED lamp beads gather and exit towards the direction of the transparent substrate as much as possible, the brightness of the light rays emitted by the LED lamp bead array towards the direction of the transparent substrate is improved, the phenomenon that the light rays emitted by the LED lamp beads overflow to the side is weakened, and the interference of the LED lamp beads on the light emission of adjacent LED lamp beads is effectively reduced.

Description

Backlight source, backlight module and display
Technical Field
The present invention relates to the field of display devices, and in particular, to a backlight source, a backlight module and a display.
Background
The display screen size of the current display is large, in order to match the display screen size and ensure normal display brightness, the number of LED lamp beads arranged on the backlight light source is large, and the arrangement is dense. Because the light that the LED lamp pearl sent overflows, easily produce harmful effect to its light luminance that is close to the LED lamp pearl display area.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
The invention aims to solve the technical problem of providing a backlight source, a backlight module and a display aiming at the defects in the prior art and aims to reduce the overflow phenomenon of the pearl line of an LED lamp.
The technical scheme adopted for solving the technical problems is as follows:
the backlight light source comprises a PCB, a plurality of LED lamp beads arranged on one side of the PCB in an array manner, a transparent substrate and an optical transparent adhesive layer arranged on one side of the transparent substrate; a plurality of grooves are formed in the optical transparent adhesive layer, and each groove is correspondingly provided with one LED lamp bead; and one side of the optical transparent adhesive layer, which is far away from the transparent substrate, is attached to the PCB.
The backlight source is characterized in that the grooves are arc-shaped grooves.
The backlight source, wherein, LED lamp pearl with have the clearance between the inner wall of recess, be provided with transparent glue film in the clearance, transparent glue film respectively with LED lamp pearl's light emitting area, the PCB board reaches the inner wall of recess is laminated mutually.
The backlight light source, wherein the refractive index of the transparent glue layer is smaller than that of the optical transparent glue layer.
The backlight light source is characterized in that a plurality of reflecting layers are arranged on the optical transparent adhesive layer in an array manner; one end of the reflecting layer is attached to the PCB, and the other end of the reflecting layer penetrates through the optical transparent adhesive layer and is attached to the transparent substrate; the reflecting layer is arranged around the periphery of the groove and forms a closed loop.
The area of the area surrounded by the reflecting layer on the transparent substrate is smaller than the area of the reflecting area projected by the LED lamp beads on the transparent substrate.
The backlight light source further comprises a heat dissipation layer, and the heat dissipation layer is arranged on one side, away from the LED lamp beads, of the PCB.
A backlight module comprising a backlight source according to any one of the above.
A display comprises the backlight module.
The beneficial effects are that: the optical transparent glue layer is used for generating a certain light condensation effect on the LED lamp beads, so that light rays emitted by the LED lamp beads gather and exit towards the direction of the transparent substrate as much as possible, the brightness of the light rays emitted by the LED lamp bead array towards the direction of the transparent substrate is improved, the phenomenon that the light rays emitted by the LED lamp beads overflow to the side is weakened, and the interference of the LED lamp beads on the light emission of adjacent LED lamp beads is effectively reduced.
Drawings
FIG. 1 is a schematic view of a backlight source according to the present invention;
fig. 2 is a schematic structural view of the PCB board according to the present invention;
FIG. 3 is a first view of a transparent substrate according to the present invention;
fig. 4 is a second view of the transparent substrate according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clear and clear, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1-4, the present invention provides a backlight source, as shown in fig. 1, comprising: a PCB board 1, a plurality of LED lamp beads 2, a transparent substrate 3 and an optical transparent adhesive layer 4; as shown in fig. 2, a plurality of LED lamp beads 2 are disposed on one side of the PCB board 1, and the plurality of LED lamp beads 2 are arranged in an array; the optical transparent adhesive layer 4 is arranged on one side of the transparent substrate 3; as shown in fig. 4, the optical transparent adhesive layer 4 is provided with a plurality of grooves 5, and the grooves 5 are in one-to-one correspondence with the LED lamp beads 2; the optically transparent adhesive layer 4 is located at one side of the light emitting surface of the LED lamp bead 2, and each groove 5 correspondingly accommodates one LED lamp bead 2.
One side of the optical transparent adhesive layer 4, which is far away from the transparent substrate 3, is attached to the PCB board 1, so that the light-emitting surface of the LED lamp bead 2 is surrounded in the groove 5, the light emitted by the light-emitting surface of the LED lamp bead 2 can be reflected and refracted by the optical transparent adhesive layer 4, so that a certain focusing effect is generated on the LED lamp bead 2 through the optical transparent adhesive layer 4, so that as much light emitted by the LED lamp bead 2 as possible is gathered and emitted towards the direction of the transparent substrate 3, the brightness of the light emitted by the LED lamp bead 2 array towards the direction of the transparent substrate 3 is improved, the phenomenon that the light emitted by the LED lamp bead 2 overflows to the side is weakened, and the interference generated by the light emitted by the LED lamp bead 2 to the adjacent LED lamp bead 2 is effectively reduced.
In one embodiment of the present invention, the transparent substrate 3 is a transparent glass substrate; the transparent glass substrate has large area and is easy to produce in mass production, and the manufacturing cost of the backlight source can be effectively reduced. The transparent glass substrate has strong light transmittance, and does not greatly interfere the light emitted after passing through the optical transparent adhesive layer 4.
In a specific embodiment of the present invention, the LED lamp beads 2 are MINI LED lamp beads 2; the PCB board 1 is an FR4 base material board or a flexible PCB board 1.
In a specific embodiment of the present invention, the thickness of the optically transparent adhesive layer 4 is 0.8 mm-1 mm, and the thickness of the optically transparent adhesive layer 4 is greater than the height of the LED lamp beads 2; the depth of the groove 5 is smaller than the thickness of the optical transparent adhesive layer 4; the groove 5 is an arc-shaped groove 5, namely, the inner wall of the groove 5 is arc-shaped; in the invention, the arc-shaped groove 5 is used for accommodating the LED lamp beads 2, so that the light condensation effect on the LED lamp beads 2 can be improved; but also can ensure that the phenomenon that the optical transparent adhesive layer 4 collapses at the edge of the groove 5 can not occur when the groove 5 is manufactured on the optical transparent adhesive layer 4.
Further, as shown in fig. 1, the backlight source further includes a plurality of transparent adhesive layers 8; the transparent adhesive layers 8 are in one-to-one correspondence with the LED lamp beads 2; gaps are formed between each LED lamp bead 2 and the inner wall of the groove 5; the transparent glue layer 8 is located in the gap. The transparent adhesive layer 8 is respectively attached to the light emitting surface of the LED lamp bead 2, the part of the PCB 1 corresponding to the groove 5 and the inner wall of the groove 5; namely, the inner wall of the groove 5 and the LED lamp beads 2 are completely filled by the transparent adhesive layer 8, no gap is reserved, so that the stability of the attachment of the LED lamp beads 2 in the groove 5 is improved, grating interference can be effectively avoided, the LED lamp beads 2 can be protected, and damage to the LED lamp beads 2 after vibration or collision is avoided.
The refractive index of the transparent adhesive layer 8 is smaller than that of the optical transparent adhesive layer 4, so that the light transmittance of the transparent adhesive layer 8 is ensured, excessive adverse interference of the transparent adhesive layer 8 on emergent light rays of the LED lamp beads 2 is avoided, and loss of light rays is avoided.
Further, as shown in fig. 1, 3 and 4, the optically transparent adhesive layer 4 is provided with a plurality of reflective layers 6; the light reflecting layers 6 are arranged in an array according to the arrangement mode of the grooves 5, namely, the light reflecting layers 6 are in one-to-one correspondence with the grooves 5. One end of the reflecting layer 6 is attached to the PCB board 1, and the other end passes through the optically transparent adhesive layer 4 and is attached to the transparent substrate 3, that is, the reflecting layer 6 is attached to the optically transparent adhesive layer 4, the transparent substrate 3 and the PCB board 1 respectively. The light reflecting layer 6 is circumferentially arranged at the periphery of the groove 5 and forms a closed loop, so that a closed loop light reflecting area is formed at the periphery of the groove 5.
The reflective layer 6 encloses into the reflective area in the periphery of recess 5, thereby reflects the side outgoing light of LED lamp pearl 2, makes as far as possible light can be to transparent substrate 3 direction outgoing, promotes the spotlight effect to the outgoing light of LED lamp pearl 2.
In a specific embodiment of the present invention, the light reflecting area is a rectangular light reflecting area, that is, the light reflecting layer 6 is a rectangular light reflecting layer formed by surrounding four sides. Two adjacent rectangular reflecting layers share one edge; the part of the reflecting layer 6 between the two adjacent grooves 5, namely the shared edge of the two adjacent rectangular reflecting layers is positioned at the overlapping position of the reflecting areas of the two adjacent LED lamp beads 2; the light rays at the overlapping positions of the light reflecting areas of the two adjacent LED lamp beads 2 are reflected through the light reflecting layer 6, so that the brightness of the boundary of the light reflecting areas of the LED lamp beads 2 is uniform, and the light source surface of the backlight lamp panel is prevented from generating local bright spots.
The area of the area surrounded by the reflecting layer 6 on the transparent substrate 3 is smaller than the area of the reflecting area projected by the LED lamp beads 2 on the transparent substrate 3, so that the reflecting layer 6 can reflect light emitted by the sides of the LED lamp beads 2 as much as possible, the emergent brightness of the light in the direction of the transparent substrate 3 is further improved, and the light overflow is reduced.
In one embodiment of the present invention, the reflective layer 6 is a specular silver reflective layer.
In addition, the reflective layer 6 is used for forming a dam at the periphery of the groove 5, so as to facilitate the manufacture of the groove 5 on the optically transparent adhesive layer 4 located in the rectangular reflective area, and avoid the collapse of the periphery of the groove 5.
The manufacturing process of the backlight light source in the invention specifically comprises the following steps:
a plurality of LED lamp beads 2 are arranged in an array mode and are mounted on one side of the PCB 1 by using a surface assembly technology;
silk-screen printing the light reflecting layer 6 on the transparent substrate 3, and forming a plurality of rectangular light reflecting areas; wherein, each rectangular reflecting area corresponds to one LED lamp bead 2;
exposing and stamping an optical transparent adhesive layer 4 in each rectangular reflecting area on the transparent substrate 3, and manufacturing an arc-shaped groove 5 on the optical transparent adhesive layer 4, wherein each rectangular reflecting area is internally provided with an arc-shaped groove 5, and the position of the arc-shaped groove 5 corresponds to the position of the LED lamp beads 2;
a transparent adhesive layer 8 is filled in the arc-shaped groove 5;
the PCB 1 is buckled on the transparent substrate 3 to form one side of the rectangular reflecting area, so that the LED lamp beads 2 are inserted into the corresponding arc-shaped grooves 5, the transparent adhesive layer 8, the optical transparent adhesive layer 4 and the reflecting layer 6 are attached to the PCB 1, and the transparent adhesive layer 8 covers the luminous surface of the corresponding LED lamp beads 2.
As shown in fig. 1 and 2, the backlight light source further includes a heat dissipation layer 7, where the heat dissipation layer 7 is disposed on the PCB board 1 and is located at a side of the PCB board 1 facing away from the LED lamp beads 2. Further, the heat dissipation layer 7 also has waterproof performance, and helps to dissipate heat of the PCB 1 and protect the PCB 1 from water.
The invention also provides a backlight module, which comprises the backlight light source.
The invention also provides a display, which comprises the backlight module.
In summary, the invention provides a backlight source, a backlight module and a display, which comprises a PCB board, a plurality of LED lamp beads arranged on one side of the PCB board, a transparent substrate, and an optical transparent adhesive layer arranged on one side of the transparent substrate; a plurality of grooves are formed in the optical transparent adhesive layer, and each groove is correspondingly provided with one LED lamp bead; and one side of the optical transparent adhesive layer, which is far away from the transparent substrate, is attached to the PCB. The optical transparent glue layer is used for generating a certain light condensation effect on the LED lamp beads, so that light rays emitted by the LED lamp beads gather and exit towards the direction of the transparent substrate as much as possible, the brightness of the light rays emitted by the LED lamp bead array towards the direction of the transparent substrate is improved, the phenomenon that the light rays emitted by the LED lamp beads overflow to the side is weakened, and the interference of the LED lamp beads on the light emission of adjacent LED lamp beads is effectively reduced.
It is to be understood that the invention is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (8)

1. The backlight light source comprises a PCB board, a plurality of LED lamp beads arranged on one side of the PCB board in an array manner, and is characterized by further comprising a transparent substrate and an optical transparent adhesive layer arranged on one side of the transparent substrate; a plurality of grooves are formed in the optical transparent adhesive layer, and each groove is correspondingly provided with one LED lamp bead; one side of the optical transparent adhesive layer, which is far away from the transparent substrate, is attached to the PCB; a plurality of reflecting layers are arranged on the optical transparent adhesive layer in an array manner; one end of the reflecting layer is attached to the PCB, and the other end of the reflecting layer penetrates through the optical transparent adhesive layer and is attached to the transparent substrate; the reflecting layer is arranged around the periphery of the groove and forms a closed loop; the light reflecting layer is a rectangular light reflecting layer formed by surrounding four sides; two adjacent rectangular reflecting layers share one edge; the shared edge of two adjacent rectangular reflecting layers is positioned at the overlapping position of the reflecting areas of two adjacent LED lamp beads; the area of the area surrounded by the reflecting layer on the transparent substrate is smaller than the area of the reflecting area transmitted by the LED lamp beads on the transparent substrate; the reflective layer is also used for forming a dam at the periphery of the groove so as to manufacture the groove on the optical transparent adhesive layer in the reflective area.
2. A backlight as claimed in claim 1, wherein the recess is an arcuate recess.
3. The backlight source according to claim 1, wherein a gap is formed between the LED lamp beads and the inner wall of the groove, and a transparent adhesive layer is disposed in the gap and is respectively attached to the light emitting surface of the LED lamp beads, the PCB board and the inner wall of the groove.
4. A backlight as claimed in claim 3, wherein the refractive index of the transparent glue layer is smaller than the refractive index of the optically transparent glue layer.
5. The backlight of claim 1, wherein the area of the reflective layer enclosed on the transparent substrate is smaller than the area of the reflective area projected by the LED beads on the transparent substrate.
6. The backlight of claim 1, further comprising a heat dissipation layer disposed on a side of the PCB facing away from the LED light beads.
7. A backlight module comprising a backlight source according to any one of claims 1-6.
8. A display comprising the backlight module of claim 7.
CN202210236486.3A 2022-03-09 2022-03-09 Backlight source, backlight module and display Active CN114613268B (en)

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Application Number Priority Date Filing Date Title
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CN114613268B true CN114613268B (en) 2024-01-23

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Citations (14)

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CN108019625A (en) * 2018-01-12 2018-05-11 安徽芯瑞达科技股份有限公司 A kind of down straight aphototropism mode set matrix light source
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CN110515241A (en) * 2019-08-30 2019-11-29 厦门天马微电子有限公司 A kind of backlight module, display device and production method
CN110543048A (en) * 2019-07-19 2019-12-06 惠州伟志电子有限公司 Direct type backlight module comprising perforated layer
CN210835519U (en) * 2019-10-30 2020-06-23 深圳市晶腾光电有限公司 Display screen backlight module
CN111812890A (en) * 2020-08-06 2020-10-23 惠州视维新技术有限公司 Light-emitting structure, backlight module and display device
CN214745120U (en) * 2021-05-24 2021-11-16 熊卫 Optical lens lamp strip
CN113671751A (en) * 2021-08-18 2021-11-19 安徽芯瑞达科技股份有限公司 Near-zero OD backlight module and Mini LED lamp bead manufacturing method thereof
WO2022001048A1 (en) * 2020-06-30 2022-01-06 惠州视维新技术有限公司 Bead, backlight module, and display device
CN114035379A (en) * 2021-11-30 2022-02-11 康佳集团股份有限公司 Backlight module, display and television

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102147074A (en) * 2010-02-10 2011-08-10 深圳帝光电子有限公司 Direct type ultrathin LED backlight module
CN204481043U (en) * 2014-12-25 2015-07-15 大连德豪光电科技有限公司 LED COB encapsulating structure
CN206601921U (en) * 2017-02-14 2017-10-31 深圳市联建光电股份有限公司 A kind of LED display of low power consuming
CN206620213U (en) * 2017-04-11 2017-11-07 四川长虹电器股份有限公司 Down straight aphototropism mode set structure for LCD TV
CN108019625A (en) * 2018-01-12 2018-05-11 安徽芯瑞达科技股份有限公司 A kind of down straight aphototropism mode set matrix light source
CN108488693A (en) * 2018-03-28 2018-09-04 武汉华星光电技术有限公司 The production method of Mini LED backlights module and phosphor film layer
CN110543048A (en) * 2019-07-19 2019-12-06 惠州伟志电子有限公司 Direct type backlight module comprising perforated layer
CN110515241A (en) * 2019-08-30 2019-11-29 厦门天马微电子有限公司 A kind of backlight module, display device and production method
CN210835519U (en) * 2019-10-30 2020-06-23 深圳市晶腾光电有限公司 Display screen backlight module
WO2022001048A1 (en) * 2020-06-30 2022-01-06 惠州视维新技术有限公司 Bead, backlight module, and display device
CN111812890A (en) * 2020-08-06 2020-10-23 惠州视维新技术有限公司 Light-emitting structure, backlight module and display device
CN214745120U (en) * 2021-05-24 2021-11-16 熊卫 Optical lens lamp strip
CN113671751A (en) * 2021-08-18 2021-11-19 安徽芯瑞达科技股份有限公司 Near-zero OD backlight module and Mini LED lamp bead manufacturing method thereof
CN114035379A (en) * 2021-11-30 2022-02-11 康佳集团股份有限公司 Backlight module, display and television

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