CN113671751A - Near-zero OD backlight module and Mini LED lamp bead manufacturing method thereof - Google Patents
Near-zero OD backlight module and Mini LED lamp bead manufacturing method thereof Download PDFInfo
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- CN113671751A CN113671751A CN202110946477.9A CN202110946477A CN113671751A CN 113671751 A CN113671751 A CN 113671751A CN 202110946477 A CN202110946477 A CN 202110946477A CN 113671751 A CN113671751 A CN 113671751A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
- G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Physics & Mathematics (AREA)
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- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
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- Engineering & Computer Science (AREA)
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Abstract
The invention discloses a near-zero OD backlight module and a MiniLED lamp bead manufacturing method thereof, wherein the backlight module comprises a PCB (printed Circuit Board), a lens processing adsorption hole, a MiniLED lamp bead, reflecting paper, a diffusion sheet, a diffusion plate, a quantum dot film, a prism sheet and a liquid crystal screen; the back of the PCB is provided with a back plate, and a diffusion sheet, a diffusion plate, a quantum dot film, a prism sheet and a liquid crystal screen are sequentially arranged above the PCB; the MiniLED lamp bead comprises a MiniLED chip and a lens, the MiniLED chip is welded on an LED chip bonding pad of the PCB, and the MiniLED chip is wrapped by the lens; the top end of the lens is directly contacted with the diffusion sheet; the lens is prepared by curing organic silicon gel, the viscosity of the organic silicon gel is 4000-22000 Pa.s, and the hardness of the cured organic silicon gel is Shore D60. The invention has the characteristics of reducing the thickness of the backlight module, reducing the process steps, lowering the production cost, simultaneously improving the productivity, realizing the molding of the lens with different structural shapes, realizing the modular production and simultaneously lowering the replacement and maintenance cost.
Description
Technical Field
The invention relates to a near-zero OD backlight module and a Mini LED lamp bead manufacturing method thereof, in particular to a near-zero OD backlight module and a Mini LED lamp bead manufacturing method thereof, which have the advantages of reducing the thickness of the backlight module, reducing the process steps, reducing the production cost, improving the productivity, realizing the molding of lenses with different structural shapes, realizing the modular production and reducing the replacement and maintenance cost.
Background
With the development of display panel technology, people are increasingly pursuing lighter, thinner and larger flexible display screens. The conventional TFT-LCD is a rigid backlight using a glass substrate and a fixed curvature, and thus it cannot satisfy a flexible display. The OLED is a self-luminous device and does not have liquid crystal, so it is easy to implement a flexible display, but it has disadvantages of short lifespan, poor reliability, and high cost, so it cannot implement a large-sized flexible display. Therefore, the Mini LED has come into play, inherits the advantages of high color gamut and high contrast of the OLED, and simultaneously has the advantages of long service life, high reliability, light weight, thinness, large splicing size and the like,
however, the conventional Mini LED backlight module has high processing difficulty, low productivity and high processing cost; in addition, the light intensity at the top end of the Mini LED lamp bead is larger, the light mixing distance OD (optical distance) is usually 10mm, and the light mixing distance can not be further reduced, so that the thickness of the backlight module can not be further reduced. The near-zero OD approaches to 0, so that the utilization rate of light can be improved, light leakage is avoided, curved surface display can be realized, and the development requirement of lightness and thinness is met.
Disclosure of Invention
The invention aims to provide a near-zero OD backlight module and a Mini LED lamp bead manufacturing method thereof, wherein the thickness of the backlight module is reduced, the process steps are reduced, the production cost is reduced, the productivity is improved, the lens forming of different structural shapes is realized, the modular production is realized, and the replacement and maintenance cost is reduced.
The purpose of the invention can be realized by the following technical scheme:
a near-zero OD backlight module comprises a PCB, a lens processing adsorption hole, a Mini LED lamp bead, reflecting paper, a diffusion sheet, a diffusion plate, a quantum dot film, a prism sheet and a liquid crystal screen;
the back of the PCB is provided with a back plate, and a diffusion sheet, a diffusion plate, a quantum dot film, a prism sheet and a liquid crystal screen are sequentially arranged above the PCB;
the Mini LED lamp bead comprises a Mini LED chip and a lens, the Mini LED chip is welded on an LED chip bonding pad of the PCB, and the lens wraps the Mini LED chip; the top end of the lens is directly contacted with the diffusion sheet;
the lens is prepared by curing organic silicon gel, the viscosity of the organic silicon gel is 4000-22000 Pa.s, and the hardness of the cured organic silicon gel is Shore D60;
the Mini LED lamp beads are distributed on the front surface of the PCB in a matrix manner, and the distance between every two adjacent Mini LED lamp beads is 2-3 mm; the diameter of the Mini LED lamp bead is 1mm, and the height of the Mini LED lamp bead is 0.2-0.4 mm; the size of the Mini LED chip is 50-300 mu m;
the lens comprises an inner protection layer, a reflection dado, a diffusion layer, a shading top layer and an outer protection layer, wherein the Mini LED chip is wrapped by the inner protection layer, the reflection dado is arranged on two sides of the inner protection layer, and the reflection dado covers the inner protection layer and the upper surface of the PCB outside the inner protection layer; diffusion layers are arranged on the outer sides of the inner protection layer and the reflection dado, a shading top layer is arranged at the top end of the diffusion layers, and the shading top layer covers the top end of the diffusion layers; an outer protective layer is arranged on the outer sides of the diffusion layer and the shading top layer and wraps the Mini LED chip, the inner protective layer, the reflecting wall skirt, the diffusion layer and the shading top layer; TiO with different concentrations is doped in the reflecting dado, the diffusion layer and the shading top layer2Particles;
lens processing adsorption holes are formed in the surface of the PCB and penetrate through the front surface and the back surface of the PCB; a plurality of lens processing adsorption holes are uniformly distributed on the surface of the PCB according to matrix arrangement; the lens processing adsorption hole is positioned in the centers of four adjacent Mini LED lamp beads;
the front surface of the PCB is covered with reflection paper, a lamp bead through hole matched with the Mini LED lamp bead is arranged on the reflection paper, and the reflection paper passes through the Mini LED lamp bead through the lamp bead through hole and covers the surface of the PCB;
the backlight module comprises a plurality of PCB plates, and the edges of two adjacent PCB plates are spliced and fixed on a back plate; fluorescent ink is arranged on the upper surfaces of two adjacent PCBs at the splicing seam, and the fluorescent ink covers the upper surfaces of the PCBs in a spraying or brushing mode; the upper part of the fluorescent ink covering part of the PCB is provided with hollow reflection paper;
a method for manufacturing a Mini LED lamp bead of a near-zero OD backlight module comprises the following steps:
step one, jacking a PCB (printed Circuit Board) with a welded Mini LED chip and a shielding film into an adsorption overhead box from the lower part of the adsorption overhead box, and then installing a top cover of the overhead box to the bottom side of the adsorption overhead box from the lower part of the adsorption overhead box to enable the Mini LED chip on the PCB to leak out of an open groove at the bottom end of the adsorption overhead box; a top column below the top cover of the top-set box and a flange adsorbing the inner side of the bottom end of the top-set box clamp and fix the PCB;
the Mini LED chip penetrates through the through hole in the shielding film, and the lens processing adsorption hole is covered by the shielding film;
secondly, connecting a negative pressure pipe arranged on the adsorption overhead box with an air pump, adsorbing the shielding film on the front surface of the PCB by the air pump through the negative pressure pipe, and then turning over the adsorption overhead box to enable the front surface of the PCB to face downwards;
thirdly, selecting a lens curing mold matched with the inner protective layer to be installed in the mold integrated installation box, and sending the mold integrated installation box into a glue dispenser for glue dispensing;
step four, after the organic silica gel for manufacturing the inner protection layer is sprayed into a lens mold bowl on the lens curing mold by the glue dispenser, the mold integrated mounting box is taken out;
fifthly, placing the mold integrated mounting box on a lifting platform below the adsorption overhead box, lifting the mold integrated mounting box through the lifting platform, and pressing a lens mold bowl on the lens curing mold on the front surface of the PCB in the adsorption overhead box; then, continuously pressing the lens curing mold to the PCB, so that a cutting knife head at the top end of the cutting knife at the edge of the lens is in full contact with the surface of the PCB, and the cutting knife head cuts off organic silica gel overflowing from the lens mold bowl;
step six, closing an air valve on the negative pressure pipe, pulling out an exhaust pipe, fixing the adsorption overhead box, the lens curing mold and the mold integrated mounting box, and then integrally sending the whole into an oven for baking and curing;
seventhly, after the organic silica gel is cured, separating the adsorption overhead box and the lens curing mold, opening the adsorption overhead box, taking out the PCB, stripping the shielding film, and forming an inner protection layer on the Mini LED chip;
step eight, sequentially replacing the shielding films matched with the reflecting dado, the diffusion layer, the shading top layer and the outer protection layer, and replacing the lens curing mold matched with the reflecting dado, the diffusion layer, the shading top layer, the outer protection layer, the lens mold bowl and the lens edge cutting knife, and repeating the steps one to seven to finish the manufacture of the Mini LED lamp bead;
the lens curing mold comprises a telescopic column, a limiting clamping edge, a lens mold bowl, a lens edge cutting knife and a cutting knife head, wherein the limiting clamping edge is arranged at the bottom end of the telescopic column; the top end of the lens curing mold is provided with a lens mold bowl and a lens edge cutting knife, and the lens mold bowl is arranged at the center of the telescopic column; the lens edge cutting knife is of a cylindrical structure, the lens edge cutting knife is positioned outside the lens mold bowl, and the lens edge cutting knife is superposed with the central axis of the lens mold bowl; the lens edge cutting knife is provided with an elastic telescopic structure;
the edge of the lens is provided with a cutting knife head at the top end of the cutting knife, and the inner side wall of the cutting knife head is attached to the outer side wall of the lens mold bowl;
the upper surface of the integrated mounting box of the mold is provided with a mold through hole, the mold through hole is matched with the bottom end of a telescopic column, the telescopic column is mounted in the mold through hole through the mold through hole, a limiting clamping edge is clamped on the integrated mounting box of the mold on the inner side of the mold through hole, and the bottom of the integrated mounting box of the mold is fixedly provided with a lens curing mold through a top plate.
The invention provides a near-zero OD backlight module and a Mini LED lamp bead manufacturing method thereof, which have the characteristics of reducing the thickness of the backlight module, reducing the process steps, reducing the production cost, simultaneously improving the productivity, realizing the lens molding of different structural shapes, realizing the modular production and simultaneously reducing the replacement and maintenance cost. The invention has the beneficial effects that: the PCB is not provided with a bracket, and the thickness of the backlight module is further reduced by the bracket-free design;
the traditional support is replaced by the lens material with higher hardness, so that the process steps are reduced, the production cost is reduced, and the productivity is improved;
the near-zero OD light mixing distance of trial assembly with the high-hardness lens on the Mini LED lamp beads as a support is reduced by adopting the high-density Mini LED lamp beads, so that the ultrathin backlight module is realized;
light received by the adsorption overhead box is uniform; meanwhile, the outer protective layer has a protective effect on the Mini LED chip, the inner protective layer, the reflecting dado, the diffusion layer and the shading top layer, and the service life of the Mini LED lamp bead is prolonged;
organic silica gel overflowing from the lens mold bowl is cut off by pressing the cutter head of the cutting knife on the surface of the PCB, so that the organic silica gel residue generated by glue overflowing is avoided while the shape and the structure of the lens are ensured;
through the lens curing mould of changing different structure lens die bowls, realize the lens shaping of different structural shapes, realize the modularization production, reduce simultaneously and change the maintenance cost.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a near zero OD backlight module according to the present invention;
FIG. 2 is a schematic diagram of a Mini LED lamp bead structure of a near-zero OD backlight module of the present invention;
FIG. 3 is a schematic diagram of a PCB structure of a near-zero OD backlight module according to the present invention;
FIG. 4 is a partially enlarged view of a PCB of a near zero OD backlight module of the present invention;
FIG. 5 is a schematic structural view of a Mini LED lamp bead manufacturing device of a near-zero OD backlight module of the present invention;
FIG. 6 is a schematic structural view of a lens curing mold of a near-zero OD backlight module according to the present invention;
FIG. 7 is a schematic structural view of a lens curing mold of a near-zero OD backlight module according to the present invention;
FIG. 8 is a schematic structural view of a lens curing mold of a near-zero OD backlight module according to the present invention;
FIG. 9 is a schematic cross-sectional view of a lens curing mold of a near-zero OD backlight module according to the present invention.
In the figure: 1. a PCB board; 2. processing an adsorption hole on the lens; 3. a Mini LED lamp bead; 31. a Mini LED chip; 32. an inner protective layer; 33. a reflective dado; 34. a diffusion layer; 35. a light-shielding top layer; 36. an outer protective layer; 4. a reflective paper; 5. adsorbing the overhead box; 51. a top box top cover; 52. a negative pressure tube; 6. a lens curing mold; 61. a telescopic column; 62. limiting and clamping edges; 63. a lens mold bowl; 64. a lens edge cutting knife; 65. a cutting knife head; 7. a mould integrated mounting box; 71. a through hole of the mold; 8. a diffusion sheet; 9. a diffusion plate; 10. a quantum dot film; 11. a prism sheet; 12. a liquid crystal screen; 13. and (3) a shielding film.
Detailed Description
The purpose of the invention can be realized by the following technical scheme:
a near zero OD backlight module is disclosed, referring to fig. 1-4, and comprises a PCB (printed circuit board) 1, a lens processing adsorption hole 2, Mini LED lamp beads 3, reflecting paper 4, a diffusion sheet 8, a diffusion plate 9, a quantum dot film 10, a prism sheet 11 and a liquid crystal screen 12;
a back plate is arranged at the back of the PCB (printed circuit board) 1, and a diffusion sheet 8, a diffusion plate 9, a quantum dot film 10, a prism sheet 11 and a liquid crystal screen 12 are sequentially arranged above the PCB 1; the PCB 1 is not provided with a bracket, and the thickness of the backlight module is further reduced by the bracket-free design;
the Mini LED lamp bead 3 comprises a Mini LED chip 31 and a lens, the Mini LED chip 31 is welded on an LED chip bonding pad of the PCB 1, and the lens wraps the Mini LED chip 31; the top of the lens is in direct contact with the diffusion sheet 8;
the lens is prepared by curing organic silicon gel, the viscosity of the organic silicon gel is 4000-22000 Pa.s, and the hardness of the cured organic silicon gel is Shore D60; the traditional support is replaced by the lens material with higher hardness, so that the process steps are reduced, the production cost is reduced, and the productivity is improved;
the Mini LED lamp beads 3 are distributed on the front surface of the PCB 1 in a matrix manner, and the distance between every two adjacent Mini LED lamp beads 3 is 2-3 mm; the diameter of the Mini LED lamp bead 3 is 1mm, and the height of the Mini LED lamp bead 3 is 0.2-0.4 mm; the size of the Mini LED chip 31 is 50-300 mu m; adopting a high-density Mini LED lamp bead to reduce the near-zero OD light mixing distance of a trial matched with a Mini LED lamp bead 3 and a high-hardness lens as a support, and realizing the ultrathin backlight module;
the lens comprises an inner protective layer 32, a reflective dado 33, a diffusion layer 34, a shading top layer 35 and an outer layerThe protective layer 36, the Mini LED chip 31 is wrapped by the inner protective layer 32, the reflective dado 33 is arranged on both sides of the inner protective layer 32, and the reflective dado 33 covers the inner protective layer 32 and the upper surface of the PCB 1 outside the inner protective layer 32; the outer sides of the inner protection layer 32 and the reflection dado 33 are provided with diffusion layers 34, the top ends of the diffusion layers 34 are provided with shading top layers 35, and the shading top layers 35 cover the top ends of the diffusion layers 34; an outer protection layer 36 is arranged on the outer sides of the diffusion layer 34 and the shading top layer 35, and the Mini LED chip 31, the inner protection layer 32, the reflection dado 33, the diffusion layer 34 and the shading top layer 35 are wrapped in the outer protection layer 36; TiO with different concentrations is doped in the reflecting dado 33, the diffusion layer 34 and the shading top layer 352Particles, reflective dado 33, diffusion layer 34, TiO in top light-blocking layer 352The concentration and the size are adjusted and optimized according to the size of the Mini LED chips 31, the arrangement mode of the Mini LED chips 31 and the height of the lens, so that the light emitted by the liquid crystal screen 12 is uniform; the Mini LED chip 31 is a bottom flip chip, and the light energy below and at the top of two sides of the Mini LED chip 31 is higher; the Mini LED chip 31 is easily corroded by moisture and air, and is easy to attenuate and lose efficacy; an inner protective layer 32 outside the Mini LED chip 31 wraps the Mini LED chip 31, and a protective layer is formed outside the Mini LED chip 31; the light rays at the bottom ends of the two sides of the light-emitting surface of the inner protection layer 32 are stronger, and the stronger light rays at the bottom ends of the two sides of the light-emitting surface of the inner protection layer 32 are further reflected and scattered by the reflection dado 33 and then pass through the diffusion layer 34 to further diffuse the mixed light; at this time, the light energy at the top of the light-emitting surface of the diffusion layer 34 is stronger, and passes through the high-concentration TiO in the light-shielding top layer 35 at the top of the diffusion layer 342Particle pairs are used for further reducing the brightness of light rays at the top end of the diffusion layer 34, and the light rays received by the adsorption overhead box 5 are uniform by matching with the light mixing distance of the outer protective layer 36 on the outermost layer of the Mini LED lamp bead 3; meanwhile, the outer protection layer 36 has a protection effect on the Mini LED chip 31, the inner protection layer 32, the reflection dado 33, the diffusion layer 34 and the shading top layer 35, and the service life of the Mini LED lamp bead 3 is prolonged;
the surface of the PCB 1 is provided with a lens processing adsorption hole 2, and the lens processing adsorption hole 2 penetrates through the front surface and the back surface of the PCB 1; a plurality of lens processing adsorption holes 2 are uniformly distributed on the surface of the PCB 1 according to matrix arrangement; the lens processing adsorption hole 2 is positioned in the center of four adjacent Mini LED lamp beads 3; the lens on the Mini LED chip 31 is cured and molded by an organic silicon rubber mold, if the mold is pressed on the surface of the PCB board 1 from the upper part, the organic silicon rubber is easy to be stripped from the mold under the action of gravity to generate bubbles or holes, so the curing and molding mode of inverting the PCB board 1 and pressing the mold is adopted; the shielding film 13 needs to be adsorbed on the front surface of the inverted PCB 1 through the lens processing adsorption hole 2 by setting negative pressure above the PCB 1, so that the operation is convenient; when the mold is pressed on the surface of the PCB (printed circuit board) 1, the Mini LED chip 31 occupies part of the space in the mold, so that part of organic silica gel in the mold overflows, organic silica gel residues are left at the edge of the mold, the organic silica gel overflowing at the edge of the mold is isolated from the PCB 1 by laying the shielding film 13 on the surface of the PCB 1 before molding, and after curing, the shielding film 13 is stripped from the PCB 1, so that the organic silica gel residues at the edge of the Mini LED lamp bead 3 are avoided;
the front surface of the PCB board 1 is covered with a reflecting paper 4, a lamp bead through hole matched with the Mini LED lamp bead 3 is formed in the reflecting paper 4, and the reflecting paper 4 penetrates through the Mini LED lamp bead 3 through the lamp bead through hole to cover the surface of the PCB board 1;
the backlight module comprises a plurality of PCB boards 1, and the edges of two adjacent PCB boards 1 are spliced and fixed on a back plate; fluorescent ink is arranged on the upper surfaces of two adjacent PCB boards 1 at the splicing seam, and the fluorescent ink covers the upper surfaces of the PCB boards 1 in a spraying or brushing way; the upper part of the fluorescent ink covering part of the PCB 1 is provided with a hollow reflection paper 4; the defect of color cast is easy to occur in the display above the splicing joint of two adjacent PCB boards 1, so that the fluorescent ink covers the upper surface of the joint of the PCB boards 1, partial blue light emitted by the Mini LED lamp beads 2 is absorbed by the fluorescent ink, the mixing ratio of the blue light above the joint of the PCB boards 1 and red light and green light which are excited out of the quantum dot film is adjusted, and the light emitting uniformity of the backlight module is improved;
a method for manufacturing a Mini LED lamp bead of a near-zero OD backlight module is disclosed, and referring to FIGS. 5-9, the method comprises the following steps:
step one, the PCB 1 welded with the Mini LED chip 31 and the shielding film 13 are jacked into the adsorption overhead box 5 from the lower part of the adsorption overhead box 5, and then the top cover 51 of the overhead box is installed at the bottom side of the adsorption overhead box 5 from the lower part of the adsorption overhead box 5, so that the Mini LED chip 31 on the PCB 1 leaks out of an open groove at the bottom end of the adsorption overhead box 5; a top column below the top cover 51 of the top-set box and a flange adsorbing the inner side of the bottom end of the top-set box 5 clamp and fix the PCB 1;
the Mini LED chip 31 penetrates through the through hole on the shielding film 13, and the lens processing adsorption hole 2 is covered by the shielding film 13;
secondly, connecting a negative pressure pipe 52 arranged on the adsorption overhead box 5 with an air extractor, adsorbing the shielding film 13 on the front surface of the PCB 1 through the negative pressure pipe 52 by the air extractor, and then turning over the adsorption overhead box 5 to enable the front surface of the PCB 1 to face downwards;
step three, selecting a lens curing mold 6 matched with the inner protection layer 32 to be installed in the mold integrated installation box 7, and sending the mold integrated installation box 7 into a glue dispenser for glue dispensing;
step four, after the organic silica gel for manufacturing the inner protection layer 32 is sprayed into the lens mold bowl 63 on the lens curing mold 6 by the glue dispenser, the mold integrated mounting box 7 is taken out;
fifthly, the mold integrated mounting box 7 is placed on a lifting platform below the adsorption overhead box 5, the lifting platform is lifted, and the lens mold bowl 63 on the lens curing mold 6 is pressed on the front surface of the PCB 1 in the adsorption overhead box 5; then, continuously pressing the lens curing mold 6 to the PCB 1 to ensure that a cutting knife head 65 at the top end of the cutting knife 64 along the edge of the lens is fully contacted with the surface of the PCB 1, and the cutting knife head 65 cuts off organic silica gel overflowing from the lens mold bowl 63;
step six, closing an air valve on the negative pressure pipe 52, pulling out an exhaust pipe, fixing the adsorption overhead box 5, the lens curing mold 6 and the mold integrated mounting box 7, and then integrally sending the whole into an oven for baking and curing;
seventhly, after the organic silicone adhesive is cured, separating the adsorption overhead box 5 and the lens curing mold 6, opening the adsorption overhead box 5, taking out the PCB 1, stripping the shielding film 13, and forming an inner protection layer 32 on the Mini LED chip 31;
step eight, sequentially replacing the shielding film 13 matched with the reflecting dado 33, the diffusion layer 34, the shading top layer 35 and the outer protection layer 36, replacing the lens curing mold 6 matched with the reflecting dado 33, the diffusion layer 34, the shading top layer 35, the outer protection layer 36, the lens mold bowl 63 and the lens edge cutting knife 64, and repeating the steps one to seven to finish the manufacture of the Mini LED lamp bead;
the lens curing mold 6 comprises a telescopic column 61, a limiting clamping edge 62, a lens mold bowl 63, a lens edge cutting knife 64 and a cutting knife head 65, wherein the limiting clamping edge 62 is arranged at the bottom end of the telescopic column 61; the top end of the lens curing mold 6 is provided with a lens mold bowl 63 and a lens edge cutting knife 64, and the lens mold bowl 63 is arranged at the center of the telescopic column 61; the lens edge cutting knife 64 is of a cylindrical structure, the lens edge cutting knife 64 is positioned outside the lens mold bowl 63, and the lens edge cutting knife 64 is superposed with the central axis of the lens mold bowl 63; the lens edge cutting blade 64 has an elastic expansion structure;
the top end of the cutting knife 64 at the edge of the lens is provided with a cutting knife head 65, and the inner side wall of the cutting knife head 65 is attached to the outer side wall of the lens mold bowl 63; the cutter head 65 is pressed on the surface of the PCB 1 to cut off organic silica gel overflowing from the lens mold bowl 63, so that the organic silica gel residue generated by glue overflowing is avoided while the shape and structure of the lens are ensured;
the upper surface of the mold integrated mounting box 7 is provided with a mold through hole 71, the mold through hole 71 is matched with the bottom end of the telescopic column 61, the telescopic column 61 is mounted in the mold through hole 71 through the mold through hole 71, the limiting clamping edge 62 is clamped on the mold integrated mounting box 7 on the inner side of the mold through hole 71, and the bottom of the mold integrated mounting box 7 is fixedly provided with the lens curing mold 6 through a top plate; through the lens curing mould 6 of changing different structure lens die bowls 63, realize the lens shaping of different structural shapes, realize the modular production, reduce simultaneously and change the maintenance cost.
The working principle of the invention is as follows:
the back of the PCB board 1 is provided with a back plate, and a diffusion sheet 8, a diffusion plate 9, a quantum dot film 10, a prism sheet 11 and a liquid crystal screen 12 are sequentially arranged above the PCB board 1; the PCB 1 is not provided with a bracket, and the thickness of the backlight module is further reduced by the bracket-free design;
the traditional support is replaced by the lens material with higher hardness, so that the process steps are reduced, the production cost is reduced, and the productivity is improved;
adopting a high-density Mini LED lamp bead to reduce the near-zero OD light mixing distance of a trial matched with a Mini LED lamp bead 3 and a high-hardness lens as a support, and realizing the ultrathin backlight module;
TiO with different concentrations is doped in the reflecting dado 33, the diffusion layer 34 and the shading top layer 352Particles, reflective dado 33, diffusion layer 34, TiO in top light-blocking layer 352The concentration and the size are adjusted and optimized according to the size of the Mini LED chips 31, the arrangement mode of the Mini LED chips 31 and the height of the lens, so that the light emitted by the liquid crystal screen 12 is uniform; the Mini LED chip 31 is a bottom flip chip, and the light energy below and at the top of two sides of the Mini LED chip 31 is higher; the Mini LED chip 31 is easily corroded by moisture and air, and is easy to attenuate and lose efficacy; an inner protective layer 32 outside the Mini LED chip 31 wraps the Mini LED chip 31, and a protective layer is formed outside the Mini LED chip 31; the light rays at the bottom ends of the two sides of the light-emitting surface of the inner protection layer 32 are stronger, and the stronger light rays at the bottom ends of the two sides of the light-emitting surface of the inner protection layer 32 are further reflected and scattered by the reflection dado 33 and then pass through the diffusion layer 34 to further diffuse the mixed light; at this time, the light energy at the top of the light-emitting surface of the diffusion layer 34 is stronger, and passes through the high-concentration TiO in the light-shielding top layer 35 at the top of the diffusion layer 342Particle pairs are used for further reducing the brightness of light rays at the top end of the diffusion layer 34, and the light rays received by the adsorption overhead box 5 are uniform by matching with the light mixing distance of the outer protective layer 36 on the outermost layer of the Mini LED lamp bead 3; meanwhile, the outer protection layer 36 has a protection effect on the Mini LED chip 31, the inner protection layer 32, the reflection dado 33, the diffusion layer 34 and the shading top layer 35, and the service life of the Mini LED lamp bead 3 is prolonged;
the lens on the Mini LED chip 31 is cured and molded by an organic silicon rubber mold, if the mold is pressed on the surface of the PCB board 1 from the upper part, the organic silicon rubber is easy to be stripped from the mold under the action of gravity to generate bubbles or holes, so the curing and molding mode of inverting the PCB board 1 and pressing the mold is adopted; the shielding film 13 needs to be adsorbed on the front surface of the inverted PCB 1 through the lens processing adsorption hole 2 by setting negative pressure above the PCB 1, so that the operation is convenient; when the mold is pressed on the surface of the PCB (printed circuit board) 1, the Mini LED chip 31 occupies part of the space in the mold, so that part of organic silica gel in the mold overflows, organic silica gel residues are left at the edge of the mold, the organic silica gel overflowing at the edge of the mold is isolated from the PCB 1 by laying the shielding film 13 on the surface of the PCB 1 before molding, and after curing, the shielding film 13 is stripped from the PCB 1, so that the organic silica gel residues at the edge of the Mini LED lamp bead 3 are avoided;
the cutter head 65 is pressed on the surface of the PCB 1 to cut off organic silica gel overflowing from the lens mold bowl 63, so that the organic silica gel residue generated by glue overflowing is avoided while the shape and structure of the lens are ensured;
through the lens curing mould 6 of changing different structure lens die bowls 63, realize the lens shaping of different structural shapes, realize the modular production, reduce simultaneously and change the maintenance cost.
The invention provides a near-zero OD backlight module and a Mini LED lamp bead manufacturing method thereof, which have the characteristics of reducing the thickness of the backlight module, reducing the process steps, reducing the production cost, simultaneously improving the productivity, realizing the lens molding of different structural shapes, realizing the modular production and simultaneously reducing the replacement and maintenance cost. The invention has the beneficial effects that: the PCB is not provided with a bracket, and the thickness of the backlight module is further reduced by the bracket-free design;
the traditional support is replaced by the lens material with higher hardness, so that the process steps are reduced, the production cost is reduced, and the productivity is improved;
the near-zero OD light mixing distance of trial assembly with the high-hardness lens on the Mini LED lamp beads as a support is reduced by adopting the high-density Mini LED lamp beads, so that the ultrathin backlight module is realized;
light received by the adsorption overhead box is uniform; meanwhile, the outer protective layer has a protective effect on the Mini LED chip, the inner protective layer, the reflecting dado, the diffusion layer and the shading top layer, and the service life of the Mini LED lamp bead is prolonged;
organic silica gel overflowing from the lens mold bowl is cut off by pressing the cutter head of the cutting knife on the surface of the PCB, so that the organic silica gel residue generated by glue overflowing is avoided while the shape and the structure of the lens are ensured;
through the lens curing mould of changing different structure lens die bowls, realize the lens shaping of different structural shapes, realize the modularization production, reduce simultaneously and change the maintenance cost.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.
Claims (10)
1. A near-zero OD backlight module comprises a PCB (1), a lens processing adsorption hole (2), Mini LED lamp beads (3), reflecting paper (4), a diffusion sheet (8), a diffusion plate (9), a quantum dot film (10), a prism sheet (11) and a liquid crystal screen (12), and is characterized in that;
the back of the PCB (1) is provided with a back plate, and a diffusion sheet (8), a diffusion plate (9), a quantum dot film (10), a prism sheet (11) and a liquid crystal screen (12) are sequentially arranged above the PCB (1);
the Mini LED lamp beads (3) comprise Mini LED chips (31) and lenses, the Mini LED chips (31) are welded on LED chip bonding pads of the PCB (1), and the lenses wrap the Mini LED chips (31); the top of the lens is directly contacted with the diffusion sheet (8);
the lens is prepared by curing organic silicon gel, the viscosity of the organic silicon gel is 4000-22000 Pa.s, and the hardness of the cured organic silicon gel is Shore D60.
2. The near-zero OD backlight module as claimed in claim 1, wherein a plurality of Mini LED lamp beads (3) are distributed in a matrix on the front surface of the PCB (1), and the distance between two adjacent Mini LED lamp beads (3) is 2-3 mm; the diameter of the Mini LED lamp bead (3) is 1mm, and the height of the Mini LED lamp bead (3) is 0.2-0.4 mm; the Mini LED chip (31) has a size of 50 to 300 μm.
3. The near-zero OD backlight module as claimed in claim 1, wherein the lens includes an inner protection layer (32), a reflective dado (33), a diffusion layer (34), a light-shielding top layer (35), and an outer protection layer (36), the Mini LED chip (31) is wrapped by the inner protection layer (32), the reflective dado (33) is disposed on two sides of the inner protection layer (32), and the reflective dado (33) covers the inner protection layer (32) and the upper surface of the PCB (1) outside the inner protection layer (32)(ii) a The outer sides of the inner protection layer (32) and the reflection dado (33) are provided with diffusion layers (34), the top ends of the diffusion layers (34) are provided with shading top layers (35), and the shading top layers (35) cover the top ends of the diffusion layers (34); an outer protection layer (36) is arranged on the outer sides of the diffusion layer (34) and the shading top layer (35), and the Mini LED chip (31), the inner protection layer (32), the reflection wall skirt (33), the diffusion layer (34) and the shading top layer (35) are wrapped in the outer protection layer (36); TiO with different concentrations are doped in the reflecting dado (33), the diffusion layer (34) and the shading top layer (35)2And (3) granules.
4. The near-zero OD backlight module as claimed in claim 1, wherein the surface of the PCB (1) is provided with lens processing suction holes (2), and the lens processing suction holes (2) penetrate through the front and back surfaces of the PCB (1); a plurality of lens processing adsorption holes (2) are uniformly distributed on the surface of the PCB (1) according to matrix arrangement; the lens processing adsorption hole (2) is positioned in the center of the four adjacent Mini LED lamp beads (3).
5. The near-zero OD backlight module as claimed in claim 1, wherein the front surface of the PCB (1) is covered with a reflective paper (4), a lamp bead through hole matched with the Mini LED lamp bead (3) is formed in the reflective paper (4), and the reflective paper (4) passes through the Mini LED lamp bead (3) through the lamp bead through hole and covers the surface of the PCB (1).
6. The near zero OD backlight module of claim 1, wherein the backlight module comprises a plurality of PCB boards (1), and two adjacent PCB boards (1) are connected to each other at their edges; fluorescent ink is arranged on the upper surfaces of two adjacent PCB boards (1) at the splicing seam, and the fluorescent ink covers the upper surfaces of the PCB boards (1) in a spraying or brushing way; the upper part of the fluorescent ink covering part of the PCB (1) is provided with hollow-out reflective paper (4).
7. A manufacturing method of a Mini LED lamp bead of a near-zero OD backlight module is characterized by comprising the following steps:
step one, jacking a PCB (1) welded with a Mini LED chip (31) and a shielding film (13) into an adsorption overhead box (5) from the lower part of the adsorption overhead box (5), and then installing a top cover (51) of the overhead box to the bottom side of the adsorption overhead box (5) from the lower part of the adsorption overhead box (5) to enable the Mini LED chip (31) on the PCB (1) to leak out of an open groove at the bottom end of the adsorption overhead box (5); a top column below the top cover (51) of the top-set box and a flange adsorbing the inner side of the bottom end of the top-set box (5) clamp and fix the PCB (1);
the Mini LED chip (31) penetrates through the through hole on the shielding film (13), and the lens processing adsorption hole (2) is covered by the shielding film (13);
secondly, connecting a negative pressure pipe (52) arranged on the adsorption overhead box (5) with an air pump, adsorbing the shielding film (13) on the front surface of the PCB (1) through the negative pressure pipe (52) by the air pump, and then turning over the adsorption overhead box (5) to enable the front surface of the PCB (1) to face downwards;
thirdly, selecting a lens curing mold (6) matched with the inner protective layer (32) to be installed in the mold integrated installation box (7), and sending the mold integrated installation box (7) into a glue dispenser for glue dispensing;
fourthly, after the organic silica gel for manufacturing the inner protection layer (32) is sprayed into a lens mold bowl (63) on the lens curing mold (6) by the glue dispenser, the mold integrated mounting box (7) is taken out;
fifthly, the mold integration mounting box (7) is placed on a lifting platform below the adsorption overhead box (5) and is lifted through the lifting platform, and a lens mold bowl (63) on the lens curing mold (6) is pressed on the front side of the PCB (1) in the adsorption overhead box (5); then, continuously pressing the lens curing mold (6) to the PCB (1) to enable a cutting knife head (65) at the top end of a cutting knife (64) at the edge of the lens to be in full contact with the surface of the PCB (1), and cutting off organic silica gel overflowing from the lens mold bowl (63) by the cutting knife head (65);
sixthly, closing an air valve on the negative pressure pipe (52), pulling out the exhaust pipe, and fixing the adsorption overhead box (5), the lens curing mold (6) and the mold integrated mounting box (7) and then integrally sending the whole into an oven for baking and curing;
seventhly, after the organic silica gel is cured, separating the adsorption overhead box (5) and the lens curing mold (6), opening the adsorption overhead box (5), taking out the PCB (1), stripping the shielding film (13), and forming an inner protection layer (32) on the Mini LED chip (31);
and step eight, sequentially replacing the shielding film (13) matched with the reflection dado (33), the diffusion layer (34), the shading top layer (35) and the outer protection layer (36), and replacing the lens curing mold (6) matched with the reflection dado (33), the diffusion layer (34), the shading top layer (35), the outer protection layer (36) and the lens mold bowl (63) and the lens edge cutting knife (64), repeating the step one to the step seven, and finishing the manufacture of the Mini LED lamp bead.
8. The manufacturing method of the near-zero OD backlight module Mini LED lamp bead as claimed in claim 7, wherein the lens curing mold (6) comprises a telescopic column (61), a limiting clamping edge (62), a lens mold bowl (63), a lens edge cutting knife (64) and a cutting knife head (65), and the limiting clamping edge (62) is arranged at the bottom end of the telescopic column (61); the top end of the lens curing mold (6) is provided with a lens mold bowl (63) and a lens edge cutting knife (64), and the lens mold bowl (63) is arranged at the center of the telescopic column (61); the lens edge cutting knife (64) is of a cylindrical structure, the lens edge cutting knife (64) is positioned at the outer side of the lens mold bowl (63), and the lens edge cutting knife (64) is superposed with the central axis of the lens mold bowl (63); the lens edge cutting blade (64) has an elastic telescopic structure.
9. The manufacturing method of the near-zero OD backlight module Mini LED lamp bead as claimed in claim 7, wherein the lens edge is provided with a cutting knife head (65) at the top end of a cutting knife (64), and the inner side wall of the cutting knife head (65) is attached to the outer side wall of the lens mold bowl (63).
10. The manufacturing method of the near-zero OD backlight module Mini LED lamp bead as claimed in claim 7, wherein the upper surface of the mold integrated mounting box (7) is provided with a mold through hole (71), the mold through hole (71) is matched with the bottom end of the telescopic column (61), the telescopic column (61) is mounted in the mold through hole (71) through the mold through hole (71), the limiting clamping edge (62) is clamped on the mold integrated mounting box (7) at the inner side of the mold through hole (71), and the bottom of the mold integrated mounting box (7) is fixedly provided with the lens curing mold (6) through a top plate.
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