CN116731555A - Fluorescent ink applied to MiniLED, miniLED module and use method thereof - Google Patents

Fluorescent ink applied to MiniLED, miniLED module and use method thereof Download PDF

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Publication number
CN116731555A
CN116731555A CN202310584096.XA CN202310584096A CN116731555A CN 116731555 A CN116731555 A CN 116731555A CN 202310584096 A CN202310584096 A CN 202310584096A CN 116731555 A CN116731555 A CN 116731555A
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China
Prior art keywords
miniled
fluorescent ink
fluorescent
organic
ink applied
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Pending
Application number
CN202310584096.XA
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Chinese (zh)
Inventor
赵雷
熊书明
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Huizhou Junengliang Electronic Technology Co ltd
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Huizhou Junengliang Electronic Technology Co ltd
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Priority to CN202310584096.XA priority Critical patent/CN116731555A/en
Publication of CN116731555A publication Critical patent/CN116731555A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/102Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

The application discloses fluorescent ink applied to a MiniLED, a MiniLED module and a use method thereof, belonging to the technical field of MiniLED, and comprising organic resin, an organic solvent, an organic fluorescent pigment, a thixotropic agent and a wetting dispersant, wherein specific organic resin and thixotropic agent are introduced, and the thixotropic property, the dispersibility and the storage stability of the prepared fluorescent ink can be effectively improved by matching with other components. In addition, the use method of the fluorescent ink applied to the MiniLED is simple, convenient to operate, environment-friendly and low in cost, the detected viscosity of the fluorescent ink applied to the MiniLED is 220-260 Pa.s (10 rmp,25 ℃), the detected viscosity of the fluorescent ink applied to the MiniLED is 30-56 Pa.s (20 rmp,25 ℃), the fineness is less than 8 mu m, the storage stability is more than 12 months, the fluorescent ink is accelerated after printing and does not turn yellow for 6 months, the fluorescent ink is added on a PCB around the LED of the MiniLED module, and the brightness is improved by exciting fluorescent particles by blue light of the LED, so that the MiniLED module improves the brightness and has better effect.

Description

Fluorescent ink applied to MiniLED, miniLED module and use method thereof
Technical Field
The application relates to the technical field of MiniLED, in particular to fluorescent ink applied to MiniLED, a MiniLED module and a using method thereof.
Background
With the rapid development of Light-emitting Diode (LED) technology, mini Light-emitting diodes (Mini LEDs) have been developed, and have been the focus of research in recent years.
The Mini light emitting diode (Mini LED) greatly optimizes the performances of resolution, power consumption, service life and the like of the display screen by shrinking the size of the light emitting diode to be less than millimeter. How to improve the Miniled brightness on the premise of equal power consumption is a problem to be solved.
In the prior art, white solder resist oil is arranged on a PCB substrate around an LED chip in a Mini light emitting diode (Mini LED), the reflectivity is about 90% at the highest, and the LED chip can only reflect through the white solder resist oil, so that the brightness is low and the effect is poor.
Chinese patent CN202110840141.4 discloses a brightness-enhancing MiniLED, which comprises a PCB substrate, an LED chip and a fixing layer, wherein the LED chip is disposed on the PCB substrate, the fixing layer is disposed on the PCB substrate, and the LED chip is disposed in the fixing layer; the PCB further comprises a BLT film and a QD film, wherein the BLT film is arranged on the fixed layer, and the QD film is arranged on one side of the BLT film away from the PCB substrate. The application has the effect of improving brightness. According to the application, blue light is transmitted through the set BLT film, so that the QD film is excited to emit white light, and light in other wave bands is reflected back, so that the brightness is increased, and the QD film in the technology is easy to yellow or fall off in long-time use, and the brightness enhancing effect is affected.
Disclosure of Invention
In order to overcome the technical problems, the embodiment of the application provides fluorescent ink applied to a MiniLED and a using method thereof, wherein the fluorescent ink is coated on a PCB substrate around the MiniLED, and the brightness of fluorescent particles in the fluorescent ink is excited by blue light of the MiniLED, so that the brightness can be improved in the prior art, and the application comprises the following steps:
the first object of the present application is to provide fluorescent ink for MiniLED, which is technically characterized by comprising, by weight, 70-90 parts of organic resin, 8-12 parts of organic solvent, 6-10 parts of organic fluorescent pigment, 2-5 parts of thixotropic agent and 3-7 parts of wetting dispersant.
In order to better realize the technical scheme, the organic resin in the formula system of the fluorescent ink applied to the MiniLED is at least one of epoxy resin, polyurethane resin, amino varnish and polyester resin.
In order to better realize the technical scheme, the organic solvent in the formula system of the fluorescent ink applied to the MiniLED is at least one of alcohols, ketones, esters, ethers, paraxylene and toluene.
In order to better realize the technical scheme, the organic fluorescent pigment in the formula system of the fluorescent ink applied to the MiniLED is zinc sulfide noctilucent powder.
In order to better realize the technical scheme, the thixotropic agent in the formula system of the fluorescent ink applied to the MiniLED is at least one of hydroxyethyl cellulose, polyvinyl alcohol and polyacrylate.
In order to better realize the technical scheme, the wetting dispersant in the formula system of the fluorescent ink applied to the MiniLED is at least one of polydimethylsiloxane, sodium didodecylphenyl ether disulfonate, sodium dodecyl benzene sulfonate, polyethylene glycol, cetyltrimethylammonium chloride and lignin sulfonate.
In order to better realize the technical scheme, the preparation method of the fluorescent ink applied to the MiniLED comprises the following steps: placing organic resin and an organic solvent into a container, adding a wetting dispersant, stirring, and sequentially adding a thixotropic agent and an organic fluorescent pigment in a stirring state; and (3) after the organic fluorescent pigment is added, the rotating speed is increased until the organic fluorescent pigment is uniformly dispersed in the ink, and the fluorescent ink of the MiniLED is prepared after filtration.
The MiniLED module comprises a MiniLED module body, wherein the fluorescent ink applied to the MiniLED is added on a PCB around the LED of the MiniLED module body.
A second object of the present application is to provide a method of using fluorescent ink for a MiniLED, which is technically characterized in that the fluorescent ink is printed or coated on a PCB substrate on the MiniLED.
Compared with the prior art, the fluorescent ink applied to the MiniLED and the use method thereof can achieve the following beneficial effects:
1. the fluorescent ink applied to the MiniLED comprises organic resin, an organic solvent, an organic fluorescent pigment, a thixotropic agent and a wetting dispersant, wherein the specific organic resin and the thixotropic agent are introduced, and the thixotropic agent and other components are matched to effectively improve the thixotropic property, the dispersibility and the storage stability of the prepared fluorescent ink.
2. The fluorescent ink applied to the MiniLED has the advantages of simple use method, convenient operation, environmental protection and low cost.
3. The brightness is improved by exciting fluorescent particles through the LED blue light, so that the brightness is improved by the MiniLED module, and the effect is better.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below in connection with specific embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Example 1
The fluorescent ink applied to the MiniLED comprises 80kg of organic resin, 10kg of organic solvent, 8kg of organic fluorescent pigment, 3.5kg of thixotropic agent and 5kg of wetting dispersant.
Furthermore, the organic resin in the formula system of the fluorescent ink applied to the MiniLED is epoxy resin.
Furthermore, the organic solvent in the formula system of the fluorescent ink applied to the MiniLED is alcohol (the mass ratio of methanol to ethanol to benzyl alcohol to glycol is 1:1:1).
Further, the organic fluorescent pigment in the formula system of the fluorescent ink applied to the MiniLED is zinc sulfide noctilucent powder.
Furthermore, the thixotropic agent in the formula system of the fluorescent ink applied to the MiniLED is hydroxyethyl cellulose.
Further, the wetting dispersant in the formula system of the fluorescent ink applied to the MiniLED is polydimethylsiloxane.
Further, the preparation method of the fluorescent ink applied to the MiniLED comprises the following steps: placing organic resin and an organic solvent into a container, adding a wetting dispersant, stirring, and sequentially adding a thixotropic agent and an organic fluorescent pigment in a stirring state; and (3) after the organic fluorescent pigment is added, the rotating speed is increased until the organic fluorescent pigment is uniformly dispersed in the ink, and the fluorescent ink of the MiniLED is prepared after filtration.
According to the above formulation, the method of using the fluorescent ink applied to the MiniLED in this embodiment is to print or coat the fluorescent ink on a PCB substrate on the MiniLED.
The fluorescent ink in the implementation has the viscosity of 240 Pa.s (10 rmp,25 ℃) and 43 Pa.s (20 rmp,25 ℃) detected, the fineness is less than 8 mu m, the storage stability is more than 12 months, and the fluorescent ink does not turn yellow after being printed in an accelerated aging test for 6 months.
Example 2
The fluorescent ink applied to the MiniLED comprises 70kg of organic resin, 8kg of organic solvent, 6kg of organic fluorescent pigment, 2kg of thixotropic agent and 3kg of wetting dispersant.
Furthermore, the organic resin in the formula system of the fluorescent ink applied to the MiniLED is polyurethane resin.
Furthermore, the organic solvent in the formula system of the fluorescent ink applied to the MiniLED is aliphatic ketone.
Further, the organic fluorescent pigment in the formula system of the fluorescent ink applied to the MiniLED is zinc sulfide noctilucent powder.
Further, the thixotropic agent in the formula system of the fluorescent ink applied to the MiniLED is polyvinyl alcohol.
Further, the wetting dispersant in the formula system of the fluorescent ink applied to the MiniLED is at least one of polydimethylsiloxane, sodium didodecylphenyl ether disulfonate, sodium dodecyl benzene sulfonate, polyethylene glycol, cetyltrimethylammonium chloride and lignosulfonate.
Further, the preparation method of the fluorescent ink applied to the MiniLED comprises the following steps: placing organic resin and an organic solvent into a container, adding a wetting dispersant, stirring, and sequentially adding a thixotropic agent and an organic fluorescent pigment in a stirring state; and (3) after the organic fluorescent pigment is added, the rotating speed is increased until the organic fluorescent pigment is uniformly dispersed in the ink, and the fluorescent ink of the MiniLED is prepared after filtration.
According to the above formulation, the method of using the fluorescent ink applied to the MiniLED in this embodiment is to print or coat the fluorescent ink on a PCB substrate on the MiniLED.
The detection shows that the viscosity of the fluorescent ink in the implementation is 220 Pa.s (10 rmp,25 ℃), 30 Pa.s (20 rmp,25 ℃), the fineness is less than 8 mu m, the storage stability is more than 12 months, and the fluorescent ink does not turn yellow after being subjected to an accelerated aging test after being printed for 6 months.
Example 3
The fluorescent ink applied to the MiniLED comprises 90kg of organic resin, 12kg of organic solvent, 10kg of organic fluorescent pigment, 5kg of thixotropic agent and 7kg of wetting dispersant.
Furthermore, the organic resin in the formula system of the fluorescent ink applied to the MiniLED is amino varnish.
Furthermore, the organic solvent in the formula system of the fluorescent ink applied to the MiniLED is methyl methacrylate.
Further, the organic fluorescent pigment in the formula system of the fluorescent ink applied to the MiniLED is zinc sulfide noctilucent powder.
Furthermore, the thixotropic agent in the formula system of the fluorescent ink applied to the MiniLED is polyacrylate.
Further, the wetting dispersant in the formula system of the fluorescent ink applied to the MiniLED is sodium dodecyl benzene sulfonate.
Further, the preparation method of the fluorescent ink applied to the MiniLED comprises the following steps: placing organic resin and an organic solvent into a container, adding a wetting dispersant, stirring, and sequentially adding a thixotropic agent and an organic fluorescent pigment in a stirring state; and (3) after the organic fluorescent pigment is added, the rotating speed is increased until the organic fluorescent pigment is uniformly dispersed in the ink, and the fluorescent ink of the MiniLED is prepared after filtration.
According to the above formulation, the method of using the fluorescent ink applied to the MiniLED in this embodiment is to print or coat the fluorescent ink on a PCB substrate on the MiniLED.
The detection shows that the viscosity of the fluorescent ink in the implementation is 260 Pa.s (10 rmp,25 ℃), 56 Pa.s (20 rmp,25 ℃), the fineness is less than 8 mu m, the storage stability is more than 12 months, and the fluorescent ink does not turn yellow after being printed in an accelerated aging test for 6 months.
Example 4
The MiniLED module comprises a MiniLED module body, wherein fluorescent ink applied to the MiniLED as described in embodiments 1-3 is added on a PCB around the LED of the MiniLED module body.
The fluorescent ink is added on the PCB around the LED of the MiniLED module, and fluorescent particles are excited by the blue light of the LED to improve the brightness, so that the MiniLED module improves the brightness, and the effect is better.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.

Claims (9)

1. The fluorescent ink applied to the MiniLED is characterized by comprising, by weight, 70-90 parts of organic resin, 8-12 parts of organic solvent, 6-10 parts of organic fluorescent pigment, 2-5 parts of thixotropic agent and 3-7 parts of wetting dispersant.
2. The fluorescent ink for MiniLED according to claim 1, wherein the organic resin is at least one of epoxy resin, polyurethane resin, amino varnish and polyester resin.
3. The fluorescent ink for MiniLED according to claim 1, wherein the organic solvent is at least one of alcohols, ketones, esters, ethers, paraxylene and toluene.
4. The fluorescent ink for MiniLED as claimed in claim 1, wherein the organic fluorescent pigment is zinc sulfide luminous powder.
5. The fluorescent ink for MiniLED of claim 1, wherein the thixotropic agent is at least one of hydroxyethylcellulose, polyvinyl alcohol and polyacrylate.
6. The fluorescent ink for MiniLED of claim 1, wherein the wetting dispersant is at least one of polydimethylsiloxane, sodium didodecylphenyl ether disulfonate, sodium dodecylbenzene sulfonate, polyethylene glycol, cetyltrimethylammonium chloride and lignin sulfonate.
7. The fluorescent ink for MiniLED according to claim 1, wherein the preparation method of the fluorescent ink for MiniLED is as follows: placing organic resin and an organic solvent into a container, adding a wetting dispersant, stirring, and sequentially adding a thixotropic agent and an organic fluorescent pigment in a stirring state; and (3) after the organic fluorescent pigment is added, the rotating speed is increased until the organic fluorescent pigment is uniformly dispersed in the ink, and the fluorescent ink of the MiniLED is prepared after filtration.
A MiniLED module comprising a MiniLED module body, wherein the fluorescent ink for minileds of claims 1-7 is added to the PCB surrounding the MiniLED module body LEDs.
9. The using method of the fluorescent ink applied to the MiniLED is characterized in that the fluorescent ink is printed or coated on a PCB substrate on the MiniLED.
CN202310584096.XA 2023-05-23 2023-05-23 Fluorescent ink applied to MiniLED, miniLED module and use method thereof Pending CN116731555A (en)

Priority Applications (1)

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Publication number Priority date Publication date Assignee Title
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CN103725084A (en) * 2012-10-15 2014-04-16 深圳市丰捷电子材料有限公司 Pad pasting capable of changing blue light of LED nixie tube into white light, and manufacturing method thereof
CN104004407A (en) * 2013-02-27 2014-08-27 上海祥羚光电科技发展有限公司 Coating printed by using yellow fluorescent powder composite ink specialized for white LED remote excitation
CN113671751A (en) * 2021-08-18 2021-11-19 安徽芯瑞达科技股份有限公司 Near-zero OD backlight module and Mini LED lamp bead manufacturing method thereof
CN113721385A (en) * 2021-08-18 2021-11-30 安徽芯瑞达科技股份有限公司 Mini LED chip backlight module capable of emitting light uniformly
CN113721386A (en) * 2021-08-18 2021-11-30 安徽芯瑞达科技股份有限公司 Backlight module for increasing Mini LED light-emitting angle and manufacturing method thereof
CN113791507A (en) * 2021-09-23 2021-12-14 京东方科技集团股份有限公司 Backlight module and display device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080001124A1 (en) * 2006-06-29 2008-01-03 Idemitsu Kosan Co., Ltd. Fluorescent composition and fluorescence conversion substrate using the same
CN103725084A (en) * 2012-10-15 2014-04-16 深圳市丰捷电子材料有限公司 Pad pasting capable of changing blue light of LED nixie tube into white light, and manufacturing method thereof
CN104004407A (en) * 2013-02-27 2014-08-27 上海祥羚光电科技发展有限公司 Coating printed by using yellow fluorescent powder composite ink specialized for white LED remote excitation
CN113671751A (en) * 2021-08-18 2021-11-19 安徽芯瑞达科技股份有限公司 Near-zero OD backlight module and Mini LED lamp bead manufacturing method thereof
CN113721385A (en) * 2021-08-18 2021-11-30 安徽芯瑞达科技股份有限公司 Mini LED chip backlight module capable of emitting light uniformly
CN113721386A (en) * 2021-08-18 2021-11-30 安徽芯瑞达科技股份有限公司 Backlight module for increasing Mini LED light-emitting angle and manufacturing method thereof
CN215599469U (en) * 2021-08-18 2022-01-21 安徽芯瑞达科技股份有限公司 Mini LED chip backlight module capable of emitting light uniformly
CN113791507A (en) * 2021-09-23 2021-12-14 京东方科技集团股份有限公司 Backlight module and display device

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