CN111754887A - Display module, manufacturing method thereof and display - Google Patents
Display module, manufacturing method thereof and display Download PDFInfo
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- CN111754887A CN111754887A CN202010589703.8A CN202010589703A CN111754887A CN 111754887 A CN111754887 A CN 111754887A CN 202010589703 A CN202010589703 A CN 202010589703A CN 111754887 A CN111754887 A CN 111754887A
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Abstract
The application belongs to the technical field of display equipment, and particularly relates to a display module, a manufacturing method of the display module and a display. The display module comprises a PCB, a plurality of pixel units arranged on the PCB and a blocking plate used for blocking light, wherein the blocking plate is arranged on the PCB, the blocking plate is provided with openings corresponding to the positions of the pixel units, a first sealant layer is contained in each opening, and the pixel units are contained in the corresponding openings and are packaged in the corresponding first sealant layers. Compared with the blocking layer formed by dispensing in the prior art, the blocking plate serving as the integral plate is simpler in assembly process relative to a PCB (printed circuit board), and the pixel units are integrally accommodated in the corresponding through holes, so that different LED light-emitting units of one pixel unit cannot be separated, and the light color mixing uniformity among the LED light-emitting units of the pixel unit is improved.
Description
Technical Field
The application belongs to the technical field of display equipment, and particularly relates to a display module, a manufacturing method of the display module and a display.
Background
In recent years, with the increasing requirements of consumers on the performance of LED display screens, the distances and sizes of LED light emitting units in the LED display screens are also gradually reduced to improve the display definition and display brightness of the LED display screens.
In the prior art, along with the reduction of the distance between the LED light-emitting units in the LED display screen, the optical crosstalk phenomenon between adjacent pixel units and the bright line problem at the splicing seams of the LED display screen are aggravated. To solve the above problem, it is a common practice in the industry to provide a barrier layer between adjacent pixel units to prevent optical crosstalk between the adjacent pixel units and to reduce bright lines at the seams of the display screen. However, most of the conventional blocking layers are formed between adjacent pixel units by dispensing, so that the blocking layers easily intrude between different LED light emitting units of the same pixel unit, thereby causing uneven light and color mixing of the pixel unit.
Disclosure of Invention
An object of the present invention is to provide a display module, which aims to solve the technical problem in the prior art that a blocking layer between adjacent pixel units is easy to intrude between different LED light emitting units of the same pixel unit, resulting in uneven light color mixing of the pixel unit.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
the first aspect provides a display module assembly, including PCB board, a plurality of pixel unit that set up on the PCB board and the baffler that is used for the separation light, the baffler sets up on the PCB board, and the baffler corresponds the position of each pixel unit and has all seted up the opening, has all held first glue sealing layer in each opening, and the pixel unit holding is in the opening that corresponds, and encapsulates in the first glue sealing layer that corresponds.
The display module assembly that this application embodiment provided, through set up the baffler that is used for the separation light on the PCB board of display module assembly, and make the pixel unit holding that sets up on the PC board in seting up the through-hole on the baffler, set up each through-hole on the baffler like this and alright separate each pixel unit on the PCB board each other, thereby can reduce the optical crosstalk phenomenon between the pixel unit, the bright line phenomenon of display screen piece seam department that has display module assembly has been weakened, and the baffler of whole plate compares the barrier layer of formation in the gluing among the prior art, it is simpler for the assembly process of PCB board, and because the pixel unit is whole holding in the through-hole that corresponds, can not separated between the different LED luminescence units of such a pixel unit, and then the photochromic mixing homogeneity between each LED luminescence unit of pixel unit has been promoted.
Optionally, the barrier plate is a plate body containing a black light absorbing material;
or, the separation plate comprises a transparent plate body, and a black light absorption layer is formed on the surface of one side of the PCB, which is back to the transparent plate body.
Optionally, the black light absorbing layer is an epoxy resin layer, a silica gel layer or a silica rubber layer containing black ink.
Optionally, scattering particle particles are dispersed in the transparent plate.
Optionally, the scattering particles are TiO2Particles, Al2O3Particles or SiO2Particles.
Optionally, the transparent plate is a polycarbonate plate, an epoxy plate, an acrylic plate, a polyphthalamide plate, or a polytetrafluoroethylene plate.
Optionally, the opening is the bell mouth, the lower extreme opening and the upper end opening of bell mouth are towards respectively and are dorsad the PCB board sets up, just lower extreme open-ended radial dimension is less than upper end open-ended radial dimension.
Optionally, a reflecting surface for reflecting light emitted by the pixel unit to the outside of the upper end opening is formed on a hole wall of the tapered hole, and the reflecting surface is a plane;
or the reflecting surface is a curved surface, and the curved surface is back to the central axis of the tapered hole in the bending direction.
Optionally, a side surface of the first sealant layer opposite to the PCB is flush with an edge of the upper end opening;
or, the surface of one side of the first sealing adhesive layer, which is back to the PCB, protrudes out of the upper end opening.
Optionally, the display module further includes a second adhesive layer, the second adhesive layer is disposed on a side surface of the PCB, which is opposite to the blocking plate, and the second adhesive layer and the first adhesive layer are integrally formed.
Optionally, the first encapsulation adhesive layer and the second encapsulation adhesive layer are both epoxy resin layers or silica gel layers.
Optionally, a surface of one side of the first packaging adhesive layer or the second packaging adhesive layer, which faces away from the PCB, is a rough surface.
Optionally, a preset pattern is formed on a surface of one side, opposite to the PCB, of the first packaging adhesive layer or the second packaging adhesive layer.
Optionally, a functional film is attached to the surface of one side, back to the PCB, of the first packaging adhesive layer or the second packaging adhesive layer.
In a second aspect, a method for manufacturing a display module is provided, which includes the following steps:
providing a PCB and a plurality of pixel units, and arranging each pixel unit on the PCB;
providing a blocking plate and a mould, wherein the blocking plate is provided with a through hole at a position corresponding to each pixel unit, and the mould is provided with a detachable upper cover plate and a detachable lower bottom plate;
placing the barrier plate into a mold, removing an upper cover plate of the mold, and filling first packaging glue into each through opening;
after the first packaging glue is filled in each through opening, covering an upper cover plate of the mold, and enabling the upper cover plate to be arranged on the surface of the first packaging glue, which is back to the PCB in a pressing mode;
inverting the module, removing a lower bottom plate of the module, and arranging the PCB provided with the pixel units on the barrier plate, so that each pixel unit extends into each through hole and is packaged in the corresponding first packaging adhesive;
after each pixel unit is packaged in the corresponding first packaging adhesive, a lower base plate is arranged, and the first packaging adhesive packaged with the pixel units is cured;
and after the curing treatment is finished, the die is disassembled.
According to the manufacturing method of the display module, after the opening of the through hole in the blocking plate is completed, the through hole can be filled with the first packaging glue, then the PCB is arranged on the blocking plate, the pixel units stretch into the through holes and are packaged in the corresponding first packaging glue, and then the first packaging glue is cured, so that the packaging of the pixel units in the through hole is achieved, the manufacturing of the display module is completed, the manufacturing process flow of the display module is simplified, the manufacturing efficiency of the display module is improved, and the pixel units are integrally contained in the corresponding through holes, so that different LED light-emitting units of one pixel unit cannot be separated, and further the light and color mixing uniformity among the LED light-emitting units of the pixel unit is improved. Through setting up the mould, like this under the extrusion of the upper cover plate of mould, fill in the island structure that the first encapsulation of each opening glues just wholly has formed mutual independence or connection, can effectively extrude the bubble in each first encapsulation glue on the one hand, on the other hand also can make the surface planarization of first encapsulation glue one side of being opposite to the PCB board.
In a third aspect, a display is provided, which includes the above display module.
The display provided by the embodiment of the application comprises the display module, the assembly process of the display module is simple, the optical crosstalk phenomenon among the pixel units is reduced, and simultaneously, the light and color mixing uniformity among the LED light-emitting units of the pixel units is improved, so that the overall display effect of the display is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a first top view structural diagram of a display module according to an embodiment of the present disclosure;
fig. 2 is a second top view structural diagram of a display module according to an embodiment of the present disclosure;
fig. 3 is a first cross-sectional view of a display module provided in an embodiment of the present application;
fig. 4 is a second cross-sectional view of the display module according to the embodiment of the present disclosure;
fig. 5 is a third cross-sectional view of the display module provided in the embodiment of the present application;
fig. 6 is a cross-sectional view of a display module according to an embodiment of the present application;
fig. 7 is a display module manufacturing sequence diagram of a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 8 is a process flow chart of a manufacturing method of a display module according to an embodiment of the present disclosure.
Wherein, in the figures, the respective reference numerals:
10-display module 11-pixel unit 12-barrier plate
13-through opening 14-first adhesive layer 15-second adhesive layer
16-transparent plate body 17-black light absorption layer 18-functional film
19-LED luminous unit 20-mould 21-lower base plate
22-side wall 23-upper cover plate 111-PCB board.
Detailed Description
Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to fig. 1-8 are exemplary and intended to be used to illustrate the present application and should not be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
As shown in fig. 1 to 3, the present embodiment provides a display module 10, which is applied to a display, especially an LED display. Specifically, the display module 10 includes a PCB 111, a plurality of pixel units 11 disposed on the PCB 111, and a blocking plate 12 for blocking light.
The pixel unit 11 is composed of a plurality of LED light-emitting units 19 with different light-emitting colors, for example, the pixel unit 11 may be composed of a red LED light-emitting unit 19, a green LED light-emitting unit 19, and a blue LED light-emitting unit 19. Each LED light emitting unit 19 may be packaged by a chip type or TOP type SMD, or may be packaged by a COB, and may be fixed to the PCB 111 by means of a die bonding or soldering.
Specifically, the blocking plate 12 is disposed on the PCB 111, wherein the blocking plate 12 and the PCB 111 can be fixed by bolting, riveting or gluing. The blocking plate 12 is provided with through holes 13 corresponding to the pixel units 11, each through hole 13 is provided with a first adhesive sealing layer 14, and the pixel units 11 are accommodated in the corresponding through holes 13 and are packaged in the corresponding first adhesive sealing layers 14.
The display module 10 provided in the embodiments of the present application is further described as follows: in the display module 10 of the present embodiment, the blocking plate 12 for blocking light is disposed on the PCB 111 of the display module 10, and the pixel cells 11 provided on the PC board are accommodated in the through holes 13 opened on the barrier plate 12, the pixel units 11 on the PCB 111 are separated from each other by the through holes 13 on the barrier plate 12, thereby reducing the crosstalk between the pixel units 11, reducing the bright lines at the seams of the display panel with the display module 10, and compared with the barrier layer formed by dispensing in the prior art, the barrier plate 12 as a whole plate, which is simpler than the assembly process of the PCB board 111, and since the pixel units 11 are integrally received in the corresponding through holes 13, such that different LED lighting units 19 of one pixel unit 11 are not separated from each other, thereby improving the light color mixing uniformity among the LED light emitting units 19 of the pixel unit 11.
In other embodiments of the present application, barrier plate 12 is a plate body containing a black light absorbing material. Specifically, the black light absorbing material may be black ink, so that the blocking plate 12 is a black plate, thereby effectively isolating light rays emitted between the pixel units 11 and avoiding crosstalk between the pixel units 11.
In other embodiments of the present application, as shown in fig. 4, the barrier plate 12 includes a transparent plate body 16, and a black light absorbing layer 17 is formed on a surface of the transparent plate body 16 opposite to the PCB board 111. Specifically, by providing the black light absorbing layer 17 on the surface of the side of the blocking plate 12 opposite to the PCB 111, it is equivalent to providing the black light absorbing layer 17 on the light emitting side of the blocking plate 12, so that effective isolation of light emitted between the pixel units 11 can be achieved, and crosstalk of light between the pixel units 11 is avoided. It is not necessary to make the whole barrier plate 12 black, so that the amount of black ink is reduced, and the manufacturing cost of the barrier plate 12 is saved.
In other embodiments of the present application, the black light absorbing layer 17 is an epoxy layer, a silicone layer, or a silicone rubber layer containing black ink. Specifically, through making black light-absorbing layer 17 be the epoxy layer, the silica gel layer or the silastic layer that contain black printing ink, just so make black light-absorbing layer 17 when setting up on separation plate 12, can pave separation plate 12 when liquid, resolidify on separation plate 12 to promote the combination compactness of black light-absorbing layer 17 and separation plate 12, and make black light-absorbing layer 17 can pave separation plate 12, promoted separation plate 12's light blocking performance.
In other embodiments of the present application, scattering particles are dispersed within the transparent plate body 16. Specifically, scattering particles are dispersed in the transparent plate 16, so that the scattering performance of light in the barrier plate 12 is improved, the light emitting path of light emitted from the through hole 13 is expanded, and the dodging performance of the display module 10 is improved.
In other embodiments of the present application, the scattering particles are TiO2Particles, Al2O3Particles or SiO2Particles. In particular, by selecting the scattering particles as TiO2Particles, Al2O3Particles or SiO2The particles have a high refractive index, so that light is reflected when it is incident on the particles, thereby forming diffused reflection of light in the barrier plate 12 and further enriching the light exit path of light finally emitted from the through hole 13.
In other embodiments of the present application, the transparent plate 16 is a polycarbonate plate, an epoxy plate, an acrylic plate, a polyphthalamide plate, or a polytetrafluoroethylene plate. Specifically, the transparent plate 16 is made of the above materials, so that the transparent plate 16 has a better transmittance, the light loss of light in the blocking plate 12 is reduced, and the light extraction efficiency of the display module 10 is improved.
In other embodiments of the present application, as shown in fig. 3 to 5, the through opening 13 is a tapered hole, a lower end opening and an upper end opening of the tapered hole are respectively disposed toward and away from the PCB board 111, and a radial dimension of the lower end opening is smaller than a radial dimension of the upper end opening.
Specifically, the radial dimension of the lower opening of the tapered hole is smaller than the radial dimension of the upper opening, so that the tapered hole has a better light gathering characteristic, and the light emitting efficiency of the display module 10 can be further improved.
In other embodiments of the present application, the wall of the tapered hole is formed with a reflective surface for reflecting light emitted from the pixel unit 11 to the outside of the upper end opening. Wherein, the reflecting surface is an inclined surface. Meanwhile, the reflecting surface can also be a plane or a curved surface, and when the reflecting surface is the curved surface, the curved direction of the curved surface is back to the central axis of the tapered hole.
Specifically, since the wall of the tapered hole is formed with a reflection surface, the light emitted from each LED light-emitting unit 19 of the pixel unit 11 can be emitted out of the through hole 13 by the reflection of the reflection surface. And the reflective surface may be formed as a diffuse reflective surface by a combination of the transparent plate 16 and scattering particles. Through being the curved surface with the plane of reflection design to make the crooked direction of curved surface the central axis of bell mouth dorsad, the curved surface can gather together the effect to the light production that jets out through hole 13 like this.
In other embodiments of the present application, as shown in fig. 5, a surface of the first sealant layer 14 facing away from the PCB 111 is flush with an edge of the upper opening; or, the surface of the first adhesive layer 14 opposite to the PCB 111 protrudes out of the upper opening. The display module 10 further includes a second adhesive layer 15, the second adhesive layer 15 is disposed on a side surface of the separation plate 12 opposite to the PCB 111, and the second adhesive layer 15 and the first adhesive layer 14 are integrally formed.
Specifically, the first packaging adhesive layer and the second packaging adhesive layer are both epoxy resin layers or silica gel layers. Through setting up first encapsulation glue film and second encapsulation glue film into epoxy layer or silica gel layer, just so promoted the light transmittance of first encapsulation glue film and second encapsulation glue film, also improved display module assembly 10's display effect simultaneously.
The surface of the first adhesive layer 14 opposite to the PCB 111 is flush with the edge of the upper opening, so that the surface of the barrier plate 12 opposite to the PCB 111 is flat, and a second adhesive layer is easily formed on the surface of the barrier plate 12 opposite to the PCB 111. Or, the surface of one side of the first encapsulation adhesive layer opposite to the PCB 111 protrudes out of the upper opening, so that the light emitted by the LED light emitting unit 19 of the pixel unit 11 can be emitted from the partial sidewall 22 of the first encapsulation adhesive layer, thereby further improving the light uniformity of the display module 10.
In other embodiments of the present application, a surface of the first or second encapsulant layer opposite to the PCB 111 is a rough surface. Specifically, the surface of one side of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB 111 is set to be a rough surface, so that the scattering performance of light emitted from the LED light-emitting unit 19 on the surface of one side of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB 111 is further improved, and the light-emitting uniformity and the display effect of the display module 10 are improved.
In other embodiments of the present application, a predetermined pattern is formed on a surface of the first or second encapsulant layer opposite to the PCB 111. Specifically, through the side surface that is back to PCB board 111 at first encapsulation glue film or second encapsulation glue film, the light that display module assembly 10 sent like this can project out above-mentioned pattern on the display, realizes specific function, promotes the user experience including the display of this display module assembly 10.
In other embodiments of the present application, as shown in fig. 6, a functional film 18 is attached to a surface of the first or second encapsulant layer opposite to the PCB 111. Specifically, the functional film 18 may be an anti-moire film to eliminate the moire defect generated during the development of the display module 10.
As shown in fig. 7 and 8, an embodiment of the present application further provides a method for manufacturing a display module 10, including the following steps:
providing a PCB (printed circuit board) 111 and a plurality of pixel units 11, and arranging each pixel unit 11 on the PCB 111;
a barrier plate 12 and a mold 20 are provided, and a through hole 13 is formed at a position of the barrier plate 12 corresponding to each pixel unit 11, wherein the barrier plate 12 may be made by injection molding or 3D printing, and may be a polycarbonate plate, an epoxy resin plate, an acrylic plate, a polyphthalamide plate, or a teflon plate to which a black light absorbing component (such as black ink) is added. The through holes 13 may be formed on the barrier plate 12 by photolithography or machining.
The mold 20 is provided with a detachable upper cover plate 23 and a detachable lower cover plate 21, the blocking plate 12 is placed in the mold 20, the upper cover plate 23 of the mold 20 is detached, and each through opening 13 is filled with first packaging glue which can be injected into the through opening 13 from the upper end opening of the through opening 13 in a glue filling, mold pressing or dispensing mode; the blocking plate 12 is disposed in the mold 20, and the surface of the blocking plate with the opening 13 is upward, so that the opening 13 is filled with the liquid first packaging adhesive. The mold 20 is composed of a lower bottom plate 21, side walls 22 and an upper cover plate 23, and the bottom plate and the side walls 22 and the cover plate and the side walls 22 can be fixed by screws or other common methods.
After the first packaging adhesive is filled in each through hole 13, the upper cover plate 23 of the mold 20 is covered, and the upper cover plate 23 is pressed on the surface of the first packaging adhesive, which is opposite to the PCB 111;
inverting the mold 20, removing the lower bottom plate 21 of the mold 20, and arranging the PCB board 111 provided with the pixel units 11 on the barrier plate 12, so that each pixel unit 11 extends into each through opening 13 and is encapsulated in the corresponding first encapsulation adhesive; thus, the pixel units 11 can extend into the through holes 13 and are packaged in the first packaging adhesive, after each pixel unit 11 is packaged in the corresponding first packaging adhesive, the lower base plate 21 is arranged, and the first packaging adhesive packaged with the pixel units 11 is cured; wherein, the curing can be photo-curing or thermal curing, etc., and the mold 20 is removed after the curing process is finished.
In the method for manufacturing the display module 10 according to the embodiment of the present application, after the through holes 13 on the barrier plate 12 are opened, the through opening 13 may be filled with a first packaging adhesive, and then the PCB 111 may be disposed on the barrier plate 12, and each pixel unit 11 extends into each through hole 13 and is packaged in the corresponding first packaging adhesive, and then the first packaging adhesive is cured, this achieves the encapsulation of the pixel cell 11 within the through opening 13, completing the manufacture of the display module 10, thus, the manufacturing process of the display module 10 is simplified, the manufacturing efficiency of the display module 10 is improved, and since the pixel units 11 are integrally accommodated in the corresponding through holes 13, different LED light emitting units 19 of one pixel unit 11 are not separated, thereby improving the light color mixing uniformity among the LED light emitting units 19 of the pixel unit 11. By arranging the mold 20, the first packaging adhesive filled in each through opening 13 forms an island-shaped structure which is independent or connected with each other on the whole under the extrusion action of the upper cover plate 23 of the mold 20, so that on one hand, air bubbles in each first packaging adhesive can be effectively extruded, and on the other hand, the surface of the first packaging adhesive on the side opposite to the PCB 111 can be flattened.
The embodiment of the present application further provides a display, which includes the display module 10.
The display provided in the embodiment of the application includes the display module 10, and the assembly process of the display module 10 is relatively simple, and the light crosstalk phenomenon between the pixel units 11 is reduced, and at the same time, the light and color mixing uniformity between the LED light emitting units 19 of the pixel units 11 is improved, so that the overall display effect of the display is improved.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (16)
1. The utility model provides a display module assembly which characterized in that: the LED packaging structure comprises a PCB, a plurality of pixel units arranged on the PCB and a blocking plate used for blocking light, wherein the blocking plate is arranged on the PCB, through holes are formed in positions, corresponding to the pixel units, of the blocking plate, first sealant layers are contained in the through holes, and the pixel units are contained in the corresponding through holes and are packaged in the corresponding first sealant layers.
2. The display module according to claim 1, wherein: the barrier plate is a plate body containing a black light absorption material;
or, the separation plate comprises a transparent plate body, and a black light absorption layer is formed on the surface of one side of the PCB, which is back to the transparent plate body.
3. The display module according to claim 2, wherein: the black light absorption layer is an epoxy resin layer, a silica gel layer or a silica rubber layer containing black printing ink.
4. The display module according to claim 2, wherein: scattering particle particles are dispersed and distributed in the transparent plate body.
5. The display module according to claim 4, wherein: the scattering particles are TiO2Particles, Al2O3Particles or SiO2Particles.
6. The display module according to claim 2, wherein: the transparent plate body is a polycarbonate plate body, an epoxy resin plate body, an acrylic plate body, a polyphthalamide plate body or a polytetrafluoroethylene plate body.
7. The display module according to any one of claims 1 to 6, wherein: the opening is the bell mouth, the lower extreme opening and the upper end opening of bell mouth are towards respectively and are dorsad the PCB board sets up, just lower extreme open-ended radial dimension is less than upper end open-ended radial dimension.
8. The display module according to claim 7, wherein: the wall of the conical hole is provided with a reflecting surface used for reflecting the light rays emitted by the pixel unit to the outside of the upper end opening, and the reflecting surface is a plane;
or the reflecting surface is a curved surface, and the curved surface is back to the central axis of the tapered hole in the bending direction.
9. The display module according to claim 7, wherein: the surface of one side of the first adhesive layer, which is back to the PCB, is flush with the edge of the upper end opening;
or, the surface of one side of the first sealing adhesive layer, which is back to the PCB, protrudes out of the upper end opening.
10. The display module according to any one of claims 1 to 6, wherein: the display module assembly still includes the second sealing glue layer, the second sealing glue layer set up in the baffler dorsad a side surface of PCB board, just the second sealing glue layer with first sealing glue layer integrated into one piece.
11. The display module according to claim 10, wherein: the first packaging adhesive layer and the second packaging adhesive layer are epoxy resin layers or silica gel layers.
12. The display module according to claim 10, wherein: the surface of one side, back to the PCB, of the first packaging adhesive layer or the second packaging adhesive layer is a rough surface.
13. The display module according to claim 10, wherein: and a preset pattern is formed on the surface of one side, back to the PCB, of the first packaging adhesive layer or the second packaging adhesive layer.
14. The display module according to claim 10, wherein: and a functional film is adhered to the surface of one side of the first packaging adhesive layer or the second packaging adhesive layer, which faces back to the PCB.
15. A manufacturing method of a display module is characterized in that: the method comprises the following steps:
providing a PCB and a plurality of pixel units, and arranging each pixel unit on the PCB;
providing a blocking plate and a mould, wherein through holes are formed in the blocking plate corresponding to the positions of the pixel units, and the mould is provided with a detachable upper cover plate and a detachable lower bottom plate;
placing the barrier plate into the mold, removing an upper cover plate of the mold, and filling first packaging glue into each through opening;
after the first packaging glue is filled in each through hole, covering an upper cover plate of the mold, and enabling the upper cover plate to be pressed on the surface, back to the PCB, of the first packaging glue;
inverting the mold, removing a lower bottom plate of the mold, and arranging the PCB provided with the pixel units on the blocking plate, so that each pixel unit extends into each through hole and is packaged in the corresponding first packaging adhesive;
after each pixel unit is packaged in the corresponding first packaging adhesive, the lower base plate is installed, and the first packaging adhesive packaged with the pixel units is cured;
and after the curing treatment is finished, the mould is dismantled.
16. A display, characterized by: the display module comprises the display module of any one of claims 1 to 14.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010589703.8A CN111754887B (en) | 2020-06-24 | 2020-06-24 | Display module, manufacturing method thereof and display |
| PCT/CN2021/078919 WO2021258769A1 (en) | 2020-06-24 | 2021-03-03 | Display module and manufacturing method therefor, and display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010589703.8A CN111754887B (en) | 2020-06-24 | 2020-06-24 | Display module, manufacturing method thereof and display |
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| CN111754887A true CN111754887A (en) | 2020-10-09 |
| CN111754887B CN111754887B (en) | 2022-08-02 |
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| CN202010589703.8A Active CN111754887B (en) | 2020-06-24 | 2020-06-24 | Display module, manufacturing method thereof and display |
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| WO (1) | WO2021258769A1 (en) |
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| CN112908188A (en) * | 2021-02-05 | 2021-06-04 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
| CN113421507A (en) * | 2021-07-14 | 2021-09-21 | 深圳市雷迪奥视觉技术有限公司 | Floor tile display screen and manufacturing method |
| WO2021258769A1 (en) * | 2020-06-24 | 2021-12-30 | 深圳市艾比森光电股份有限公司 | Display module and manufacturing method therefor, and display |
| CN114220900A (en) * | 2021-11-16 | 2022-03-22 | 深圳市佑明光电有限公司 | LED packaging structure and method, lighting device and display backlight device |
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| CN112908188A (en) * | 2021-02-05 | 2021-06-04 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
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| CN111754887B (en) | 2022-08-02 |
| WO2021258769A1 (en) | 2021-12-30 |
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