CN109741685A - A kind of LED display module and preparation method thereof - Google Patents
A kind of LED display module and preparation method thereof Download PDFInfo
- Publication number
- CN109741685A CN109741685A CN201910120610.8A CN201910120610A CN109741685A CN 109741685 A CN109741685 A CN 109741685A CN 201910120610 A CN201910120610 A CN 201910120610A CN 109741685 A CN109741685 A CN 109741685A
- Authority
- CN
- China
- Prior art keywords
- pcb substrate
- display module
- line
- led
- pixel chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The present invention discloses a kind of LED display module and preparation method thereof, belongs to LED display technical field.The LED display module includes LED lamp panel and encapsulation glue-line, LED lamp panel include PCB substrate and along the equally distributed several pixel chip units in the upper surface of PCB substrate；It encapsulates glue-line to be laid with along the upper surface of PCB substrate, to encapsulate several pixel chip units；Several optical windows are offered on encapsulation glue-line, and each optical window is set to the surface of pixel chip unit.The technical program, its one side is separated each pixel chip unit by encapsulation glue-line, to ensure display module colour brightness uniformly and effectively improve the contrast of display module, the problems such as going out light, reduce fever and reduce light infiltration between pixel, crosstalk of each pixel chip unit is on the other hand ensured by opening up optical window.
Description
Technical field
The present invention relates to LED display technical field, in particular to a kind of LED display module and preparation method thereof.
Background technique
With the development of indoor small spacing LED display technique, in order to realize smaller pixel spacing and meet higher
Reliability requirement, the indoor small spacing LED of integration packaging show that product comes into being, these products will using integrated packaging technology
LED chip is directly encapsulated into LED drive board, eliminates SMD encapsulation reflux link, these are by using overall package
Technology realizes integrated product, simple with structure, be easily achieved high density, high reliability, the technology of low packaging cost
Feature.Thus, product has just obtained industry and has widely paid close attention to once appearance.But since high-density packages substrate surface is intensive
Route and LED chip arrangement cause so that after module packaging show the yellow on pcb board surface or the Bluish white of chip more
The contrast of integration packaging mould group is not generally high.
To solve the above-mentioned problems, there is manufacturer to propose to adulterate degree of blackness material directly in packing colloid, realize high comparison
Degree, but since pigment is with ratio uniformity due to difficult to control, thickness deviation of pcb board etc., the production of actual interpolation melanin scheme
Product are difficult to the effect of the colour consistency between different masses, thus, after Ye You manufacturer uses transparent enclosure, one is pasted on surface
The semi-permeable film of layer PVC or PET solves the problems, such as contrast and color difference.But this method complex process, higher cost, to table
Surface evenness processing requirement is stringent, and unlike material bonds together, and is easy to appear bubble at high temperature, and edge is shunk, binding force
The problems such as variation.It proposes to coat or spray one layer of semi-permeable coating on transparent mould group surface there are also manufacturer to realize high comparison
Degree, which coat uniformity and are difficult to control, and non-similar material is during prolonged use, under light and heat continuous action
Easily there is the problems such as de-, colour stability changes, and realizability is not high, maintenance is inconvenient.It is all to pass through addition with upper type
Melanin or semipermeable membrane improve contrast to absorb part light, and the part light of absorption produces a large amount of heat, in this way meeting again
Light decay and the aging for accelerating screen body, reduce reliability.Therefore, how to propose that one kind both can solve integration packaging contrast,
It is uniform to can be realized color again, durable reliable, low-cost manufacturing method becomes the new project of industry.
Summary of the invention
It is a primary object of the present invention to propose a kind of LED display module and preparation method thereof, aim to solve the problem that traditional
The manufacturing method of LED display module, which not can be implemented simultaneously, not only can solve integration packaging contrast, but also can ensure display module face
Colour brightness is uniform, durable reliable, low in cost technical problem.
To achieve the above object, a kind of LED display module provided by the invention, the LED display module includes LED lamp panel
And encapsulation glue-line, the LED lamp panel include PCB substrate and along the equally distributed several pictures in the upper surface of the PCB substrate
Plain chip unit；The encapsulation glue-line is laid with along the upper surface of the PCB substrate, to encapsulate several pixel chip units；
Several optical windows are offered on the encapsulation glue-line, and each optical window is being set to the pixel chip unit just
Top.
Optionally, the LED lamp panel further includes lamp plate drive module, and the lamp plate drive module is set to the PCB substrate
Lower surface, to drive several pixel chip cell operations.
Optionally, the pixel chip unit includes red LED chips, green LED chip and blue led chip, institute
It states red LED chips, the green LED chip and the blue LED die and is arranged successively setting.
Optionally, the section of the optical window is isosceles trapezoidal structure or semicircular structure or rectangular configuration or arc knot
Structure or parabolic structure.
In addition, to achieve the above object, the production method that the present invention also proposes a kind of LED display module, the production side
Method is the following steps are included: assemble several pixel chip units in the upper surface of PCB substrate, so that several pixel chip units
Upper surface along the PCB substrate is uniformly distributed；Sealing is carried out to the upper surface of the PCB substrate, in the PCB substrate
Encapsulation glue-line is formed on upper surface；Windowing processing is carried out to the encapsulation glue-line, to form several light on the encapsulation glue-line
Window is learned, and then completes the encapsulation of LED display module.
Optionally, several pixel chip units are assembled in the upper surface in PCB substrate, so that several pixel chips
It is further comprising the steps of before the step of unit is uniformly distributed along the upper surface of the PCB substrate: under the PCB substrate
Surface-mounted lamp plate drive module.
Optionally, the step of lamp plate drive module is assembled in the lower surface in the PCB substrate specifically includes: passing through weldering
Tin fixed form assembles the lamp plate drive module in the lower surface of the PCB substrate.
Optionally, the step of several pixel chip units are assembled in the upper surface in PCB substrate specifically includes: passing through weldering
Tin fixed form is by several pixel chip unit assembly in the upper surface of the PCB substrate.
Optionally, described the step of carrying out windowing processing to the encapsulation glue-line, specifically includes: calculating each picture
The position of plain chip unit；The encapsulation glue-line is opened by laser or etching in the surface of the pixel chip unit
Window processing, to form the corresponding optical window.
Optionally, described that windowing processing is carried out to the encapsulation glue-line, to form several optics on the encapsulation glue-line
Window, and then after the step of completing the encapsulation of LED display module, it is further comprising the steps of: the packaged LED is shown
Mould group is carried out except the processing of processing side, to obtain the finished product of the LED display module.
LED display module provided by the invention and preparation method thereof, the encapsulation glue-line of LED display module is along PCB substrate
Upper surface be laid with, to encapsulate several pixel chip units.Meanwhile it encapsulating and offering several optical windows, Mei Yiguang on glue-line
Learn the surface that window is set to pixel chip unit.So, one side is by encapsulating glue-line for each pixel chip list
Member separates, to ensure that display module colour brightness is uniform and effectively improves the contrast of display module, on the other hand by opening up
Optical window is asked come the light infiltration gone out between light, reduction fever and reduction pixel, the crosstalk etc. for ensuring each pixel chip unit
Topic.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is the floor map of one LED display module of the embodiment of the present invention.
Fig. 2 is the schematic cross-section of LED display module shown in Fig. 1.
Fig. 3 is the floor map of two LED display module of the embodiment of the present invention.
Fig. 4 is the flow diagram of the production method of three LED display module of the embodiment of the present invention.
Fig. 5 is the idiographic flow block diagram of the step S140 of the production method of LED display module shown in Fig. 4.
Specific embodiment
Specific embodiments of the present invention will be further explained with reference to the accompanying drawing.It should be noted that for
The explanation of these embodiments is used to help understand the present invention, but and does not constitute a limitation of the invention.In addition, disclosed below
The each embodiment of the present invention involved in technical characteristic can be combined with each other as long as they do not conflict with each other.
Embodiment one
As shown in Figures 1 and 2, the embodiment of the present invention one provides a kind of LED display module 100, the LED display module 100
Including LED lamp panel 110 and encapsulation glue-line 120, wherein LED lamp panel 110 is including PCB substrate 111 and along PCB substrate 111
The equally distributed several pixel chip units 112 in upper surface.Glue-line 120 is encapsulated to be laid with along the upper surface of PCB substrate 111, with
Encapsulate several pixel chip units 1112.Several optical windows 121, and each optical window 121 are offered on encapsulation glue-line 120
It is set to the surface of pixel chip unit 112.
In the present embodiment, as shown in Figure 1, several optical windows 121 and several pixel chip units 112 correspond
Setting, i.e., each optical window 121 are set to the surface of respective pixel chip unit 112.As shown in Fig. 2, the LED lamp panel
110 further include lamp plate drive module 113, and lamp plate drive module 113 is set to the lower surface of PCB substrate 111, to drive several pictures
Plain chip unit 112 works.Specifically, as shown in Figure 1, the pixel chip unit 112 includes red LED chips, green LED core
Piece and blue LED die, red LED chips, green LED chip and blue LED die are arranged successively setting.When work,
By the various combination of several pixel chip units 112, realize that the image of 100 various colors of this LED display module is shown.
As shown in Fig. 2, the section of the optical window 121 in the present embodiment preferably uses isosceles trapezoidal structure in this way
Light extraction mode more favorably improves corresponding 112 light emission rate of pixel chip unit, reduces its fever, can also reduce between pixel
The problems such as light infiltration, crosstalk, reaches and improves contrast, ensures the uniform display effect of colour brightness.For those skilled in the art
For member, LED chip mentioned above (including red LED chip, green LED chip and blue LED die) assembly method
Formal dress chip form, flip-chip or formal dress and flip bonded mode can be used.The material for encapsulating glue-line 120 can be with
It is any encapsulating materials such as epoxy resin, silicone resin, silica gel, UV glue, the form of encapsulation glue-line 12 can be black, transparent or half
Transparent mode, it is preferred to use black or translucent mode are more advantageous to and separate each pixel chip unit, to ensure display module
Colour brightness is uniform and effectively improves the contrast of display module, and bondline thickness can be arbitrary dimension.Optical window 121 is cut
Other shapes substitution also can be used in face, such as semicircular structure or rectangular configuration or arcuate structure or parabolic structure.
Embodiment two
As shown in figure 3, being shown second embodiment of the present invention provides a kind of LED display module 200 with the LED in embodiment one
Mould group 200 is compared, and difference is only that, the optical window 221 in the present embodiment opens up mode using following, each perpendicular column
Multiple pixel chip units 212 only correspond to an optical window 221, i.e. optics all on same perpendicular column shown in script Fig. 1
Window 221 is connected together, and forms integral type optical window 221 as shown in Figure 3.
Embodiment three
As shown in figure 3, the production method that the embodiment of the present invention three also proposes a kind of LED display module, above-mentioned for making
LED display module 100 in embodiment one, the production method specifically includes the following steps:
Step S110: lamp plate drive module is assembled in the lower surface of PCB substrate.
Specifically, as shown in Fig. 2, the lower surface of PCB substrate 111 is equipped with lamp plate drive module 113, specifically when assembly,
Lamp plate drive module 113 can be assembled in the lower surface of PCB substrate 111, so that lamp plate drive module by scolding tin fixed form
113 are electrically connected with the related circuit lead on the lower surface of PCB substrate 111.
Step S120: several pixel chip units are assembled in the upper surface of PCB substrate, so that several pixel chip units edge
The upper surface of PCB substrate is uniformly distributed.
Specifically, as shown in Figures 1 and 2, the upper surface of PCB substrate 111 is equipped with several pixel chip units 112, and
Several pixel chip units 112 are uniformly distributed along the upper surface of PCB substrate 111.With the assembly method phase of lamp plate drive module 113
Together, several pixel chip units 112 can equally be assembled in the upper surface of PCB substrate 111 by scolding tin fixed form, so that
Several pixel chip units 112 are electrically connected with the related circuit lead on the upper surface of PCB substrate 111 respectively.
Step S130: carrying out sealing to the upper surface of PCB substrate, to form encapsulation glue-line on the upper surface of PCB substrate.
Specifically, as shown in Fig. 2, after the completion of lamp plate drive module 113 and several pixel chip units 112 are welded,
It can carry out sealing and form colloid protective layer, i.e., sealing be carried out to the upper surface of PCB substrate 111, in the upper of PCB substrate 111
Encapsulation glue-line 120 is formed on surface.
To those skilled in the art, the material for encapsulating glue-line 120 can be epoxy resin, silicone resin, silica gel, UV
The form of any encapsulating material such as glue, encapsulation glue-line 12 can be black, transparent or semitransparent mode, it is preferred to use black or half
Transparent mode is more advantageous to and separates each pixel chip unit, to ensure display module colour brightness uniformly and effectively improve aobvious
Show the contrast of mould group, bondline thickness can be arbitrary dimension.
Step S140: carrying out windowing processing to encapsulation glue-line, to form several optical windows on encapsulation glue-line, so that it is complete
At the encapsulation of LED display module.
It specifically, can be to encapsulation as shown in Fig. 2, after forming encapsulation glue-line 120 on the upper surface of PCB substrate 111
Glue-line carries out windowing processing, to form several optical windows 121 on encapsulation glue-line, and then completes the envelope of LED display module 100
Dress, it is preferable that as shown in Figure 1, several optical windows 121 and several pixel chip units 112 in the present embodiment correspond
Setting, i.e., each optical window 121 are set to the surface of respective pixel chip unit 112.As shown in figure 5, to encapsulation glue-line
120 specifically include the step of carrying out windowing processing:
Step S141: the position of each pixel chip unit is calculated.
Step S142: carrying out windowing processing to encapsulation glue-line by laser or etching in the surface of pixel chip unit,
To form corresponding optical window.
I.e. specifically can be using a certain mark point as contraposition reference, by the gerber file of PCB substrate, (Gerber file is
A computer software is that wiring board development describes wiring board (line layer, solder mask, character layer etc.) image and drilling and milling
The document format set of data is the reference format of wiring board industry image conversion, and it comprises the complete of each tomographic image of wiring board
Whole description, with circuit board pattern imaging need all elements) or other modes calculate each pixel chip unit 112
Position is then opened a window above each pixel chip unit 112 by modes such as laser or etchings, the shape of windowing
It is obtained by optical design software, the section of optical window 121 preferably uses isosceles trapezoidal structure, or other shapes also can be used
Shape substitution, such as semicircular structure or rectangular configuration or arcuate structure or parabolic structure.
Step S150: to packaged LED display module carry out except processing side processing, with obtain LED display module at
Product.
Specifically, since packaged LED display module can have some flashes, thus, packaged LED need to be shown
Mould group is carried out except the processing of processing side, to obtain the finished product of LED display module.
LED display module in the embodiment of the present invention and preparation method thereof, the encapsulation glue-line of LED display module is along PCB
The upper surface of substrate is laid with, to encapsulate several pixel chip units.Meanwhile encapsulating and offering several optical windows on glue-line, often
One optical window is set to the surface of pixel chip unit.So, one side is by encapsulating glue-line for each pixel core
Blade unit separates, and to ensure that display module colour brightness is uniform and effectively improve the contrast of display module, on the other hand passes through
Optical window is opened up to ensure going out light, reduce fever and reducing light infiltration, the crosstalk between pixel for each pixel chip unit
The problems such as.
In conjunction with attached drawing, the embodiments of the present invention are described in detail above, but the present invention is not limited to described implementations
Mode.For a person skilled in the art, in the case where not departing from the principle of the invention and spirit, to these embodiments
A variety of change, modification, replacement and modification are carried out, are still fallen in protection scope of the present invention.
Claims (10)
1. a kind of LED display module, which is characterized in that the LED display module includes LED lamp panel and encapsulates glue-line, described
LED lamp panel includes PCB substrate and along the equally distributed several pixel chip units in the upper surface of the PCB substrate；The envelope
It fills glue-line to be laid with along the upper surface of the PCB substrate, to encapsulate several pixel chip units；It is opened up on the encapsulation glue-line
There are several optical windows, and each optical window is set to the surface of the pixel chip unit.
2. LED display module according to claim 1, which is characterized in that the LED lamp panel further includes lamp plate driving mould
Block, the lamp plate drive module is set to the lower surface of the PCB substrate, to drive several pixel chip cell operations.
3. LED display module according to claim 1, which is characterized in that the pixel chip unit includes red LED core
Piece, green LED chip and blue LED die, the red LED chips, the green LED chip and the blue led
Chip is arranged successively setting.
4. LED display module according to claim 1, which is characterized in that the section of the optical window is isosceles trapezoid
Structure or semicircular structure or rectangular configuration or arcuate structure or parabolic structure.
5. a kind of production method of LED display module, which is characterized in that the production method the following steps are included:
Several pixel chip units are assembled in the upper surface of PCB substrate, so that several pixel chip units are along the PCB base
The upper surface of plate is uniformly distributed；
Sealing is carried out to the upper surface of the PCB substrate, to form encapsulation glue-line on the upper surface of the PCB substrate；
Windowing processing is carried out to the encapsulation glue-line, to form several optical windows on the encapsulation glue-line, and then completes LED
The encapsulation of display module.
6. production method according to claim 5, which is characterized in that assemble several pictures in the upper surface in PCB substrate
Plain chip unit, so that before the step of several pixel chip units are uniformly distributed along the upper surface of the PCB substrate, also
The following steps are included: assembling lamp plate drive module in the lower surface of the PCB substrate.
7. production method according to claim 6, which is characterized in that the lower surface assembling lamp in the PCB substrate
The step of plate drive module, specifically includes: being assembled the lamp plate drive module in the PCB substrate by scolding tin fixed form
Lower surface.
8. production method according to claim 5, which is characterized in that assemble several pictures in the upper surface in PCB substrate
The step of plain chip unit, specifically includes: by scolding tin fixed form by several pixel chip unit assembly in the PCB
The upper surface of substrate.
9. production method according to claim 5, which is characterized in that described to carry out windowing processing to the encapsulation glue-line
Step specifically includes:
Calculate the position of each pixel chip unit；
Windowing processing is carried out to the encapsulation glue-line by laser or etching in the surface of the pixel chip unit, to be formed
The corresponding optical window.
10. according to any production method of claim 5-9, which is characterized in that described to open the encapsulation glue-line
Window processing, to form several optical windows on the encapsulation glue-line, and then the step of encapsulation of completion LED display module it
Afterwards, further comprising the steps of: the packaged LED display module shown except the processing of processing side with obtaining the LED
The finished product of mould group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910120610.8A CN109741685B (en) | 2019-02-18 | 2019-02-18 | LED display module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910120610.8A CN109741685B (en) | 2019-02-18 | 2019-02-18 | LED display module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109741685A true CN109741685A (en) | 2019-05-10 |
| CN109741685B CN109741685B (en) | 2021-11-02 |
Family
ID=66367712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910120610.8A Active CN109741685B (en) | 2019-02-18 | 2019-02-18 | LED display module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109741685B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110649011A (en) * | 2019-09-10 | 2020-01-03 | 深圳雷曼光电科技股份有限公司 | Cell board and manufacturing method thereof |
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
| CN110911391A (en) * | 2019-11-21 | 2020-03-24 | 东莞市中麒光电技术有限公司 | Small-space display screen module and manufacturing method thereof |
| CN111754887A (en) * | 2020-06-24 | 2020-10-09 | 深圳市艾比森光电股份有限公司 | Display module, manufacturing method thereof and display |
| CN112489588A (en) * | 2019-08-24 | 2021-03-12 | 华源智信半导体(深圳)有限公司 | Dynamic address allocation to drivers in a display device |
| CN112543551A (en) * | 2020-11-27 | 2021-03-23 | 信丰迅捷兴电路科技有限公司 | Processing technology for COB Mini/Micro LED printed circuit board delta E color difference management and control |
| CN112863361A (en) * | 2021-02-05 | 2021-05-28 | 惠州视维新技术有限公司 | Display panel, display screen and electronic equipment |
| WO2021203690A1 (en) * | 2020-04-06 | 2021-10-14 | 深圳市洲明科技股份有限公司 | Cob packaging method and led lamp panel |
| CN113724607A (en) * | 2020-05-26 | 2021-11-30 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display module |
| US11217153B1 (en) | 2020-09-18 | 2022-01-04 | Huayuan Semiconductor (Shenzhen) Limited Company | Display device with distributed driver circuits and shared multi-wire communication interface for dimming data |
Citations (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070290328A1 (en) * | 2006-06-16 | 2007-12-20 | Gigno Technology Co., Ltd. | Light emitting diode module |
| US20100295070A1 (en) * | 2009-05-20 | 2010-11-25 | Intematix Corporation | Light emitting device |
| CN201885056U (en) * | 2010-09-19 | 2011-06-29 | 深圳帝光电子有限公司 | LED backlight module and display terminal |
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| CN103178192A (en) * | 2013-03-11 | 2013-06-26 | 深圳市奥拓电子股份有限公司 | High-definition LED display screen and surface-mounted LED composite lamp with super-small point distance |
| EP2672533A2 (en) * | 2012-06-06 | 2013-12-11 | Nitto Denko Corporation | Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting member |
| CN103531108A (en) * | 2013-10-30 | 2014-01-22 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display screen and packaging method thereof |
| CN103544887A (en) * | 2013-09-29 | 2014-01-29 | 长春希达电子技术有限公司 | Display unit for splicing LED display module with smooth surface and consistent color |
| CN203659924U (en) * | 2013-12-31 | 2014-06-18 | 广州市鸿利光电股份有限公司 | LED packaging substrate |
| CN104064655A (en) * | 2013-03-22 | 2014-09-24 | 光宝电子(广州)有限公司 | LED package and manufacturing method thereof |
| CN104167412A (en) * | 2014-08-25 | 2014-11-26 | 广东威创视讯科技股份有限公司 | LED packaging structure and manufacturing method thereof |
| CN105720179A (en) * | 2016-02-04 | 2016-06-29 | 吴冬梅 | Anti-static LED display screen and manufacturing method thereof |
| WO2016108636A1 (en) * | 2014-12-30 | 2016-07-07 | 주식회사 세미콘라이트 | Semiconductor light emitting device and method for manufacturing same |
| CN106205401A (en) * | 2016-07-21 | 2016-12-07 | 长春希达电子技术有限公司 | A kind of integration packaging LED display module and preparation method thereof |
| CN106297571A (en) * | 2015-05-15 | 2017-01-04 | 弘凯光电(深圳)有限公司 | Modularized limit emitting diode (LED) display panel and LED luminous plaque |
| US9728523B2 (en) * | 2010-11-05 | 2017-08-08 | Rohm Co., Ltd. | Semiconductor light emitting device |
| CN107146789A (en) * | 2017-05-27 | 2017-09-08 | 惠州雷曼光电科技有限公司 | LED encapsulation method and LED display |
| CN107272317A (en) * | 2017-05-31 | 2017-10-20 | 深圳市光峰光电技术有限公司 | The preparation method and display system of Fluorescence chip and its Wavelength converter |
| CN206806363U (en) * | 2017-04-27 | 2017-12-26 | 新月光电（深圳）股份有限公司 | LED lamp bead with light mixing effect |
| CN107742667A (en) * | 2017-09-30 | 2018-02-27 | 深圳雷曼光电科技股份有限公司 | LED encapsulation method and display device |
| CN107968101A (en) * | 2017-12-26 | 2018-04-27 | 上海得倍电子技术有限公司 | A kind of high definition LED display modular structure and its manufacture method |
| CN108019625A (en) * | 2018-01-12 | 2018-05-11 | 安徽芯瑞达科技股份有限公司 | A kind of down straight aphototropism mode set matrix light source |
| US10032972B2 (en) * | 2015-08-07 | 2018-07-24 | Nichia Corporation | Lead frame, package, light emitting device, and method for producing the same |
| CN207868224U (en) * | 2018-01-09 | 2018-09-14 | 王定锋 | A kind of more glasss of LED COB display screen modules |
| US20180269366A1 (en) * | 2017-03-17 | 2018-09-20 | Nichia Corporation | Light-emitting device |
| CN109004077A (en) * | 2018-07-30 | 2018-12-14 | 深圳市洲明科技股份有限公司 | The LED module of LED module glue-pouring method and display surface encapsulating |
| CN109119523A (en) * | 2018-10-09 | 2019-01-01 | 大连德豪光电科技有限公司 | The preparation method of backlight, liquid crystal display and backlight |
| CN109244220A (en) * | 2018-08-30 | 2019-01-18 | 上海九山电子科技有限公司 | A kind of LED luminescent panel and preparation method thereof, LED display |
| EP1814151B1 (en) * | 2006-01-31 | 2019-01-30 | Stanley Electric Co., Ltd. | Method for manufacturing a surface mount semiconductor device |
| US20190044040A1 (en) * | 2017-08-03 | 2019-02-07 | Cree, Inc. | High density pixelated-led chips and chip array devices |
-
2019
- 2019-02-18 CN CN201910120610.8A patent/CN109741685B/en active Active
Patent Citations (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1814151B1 (en) * | 2006-01-31 | 2019-01-30 | Stanley Electric Co., Ltd. | Method for manufacturing a surface mount semiconductor device |
| US20070290328A1 (en) * | 2006-06-16 | 2007-12-20 | Gigno Technology Co., Ltd. | Light emitting diode module |
| US20100295070A1 (en) * | 2009-05-20 | 2010-11-25 | Intematix Corporation | Light emitting device |
| CN201885056U (en) * | 2010-09-19 | 2011-06-29 | 深圳帝光电子有限公司 | LED backlight module and display terminal |
| US9728523B2 (en) * | 2010-11-05 | 2017-08-08 | Rohm Co., Ltd. | Semiconductor light emitting device |
| CN102306700A (en) * | 2011-06-22 | 2012-01-04 | 浙江英特来光电科技有限公司 | Light and color regulable COBLED structure |
| EP2672533A2 (en) * | 2012-06-06 | 2013-12-11 | Nitto Denko Corporation | Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting member |
| CN103178192A (en) * | 2013-03-11 | 2013-06-26 | 深圳市奥拓电子股份有限公司 | High-definition LED display screen and surface-mounted LED composite lamp with super-small point distance |
| CN104064655A (en) * | 2013-03-22 | 2014-09-24 | 光宝电子(广州)有限公司 | LED package and manufacturing method thereof |
| CN103544887A (en) * | 2013-09-29 | 2014-01-29 | 长春希达电子技术有限公司 | Display unit for splicing LED display module with smooth surface and consistent color |
| CN103531108A (en) * | 2013-10-30 | 2014-01-22 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display screen and packaging method thereof |
| CN203659924U (en) * | 2013-12-31 | 2014-06-18 | 广州市鸿利光电股份有限公司 | LED packaging substrate |
| CN104167412A (en) * | 2014-08-25 | 2014-11-26 | 广东威创视讯科技股份有限公司 | LED packaging structure and manufacturing method thereof |
| WO2016108636A1 (en) * | 2014-12-30 | 2016-07-07 | 주식회사 세미콘라이트 | Semiconductor light emitting device and method for manufacturing same |
| CN106297571A (en) * | 2015-05-15 | 2017-01-04 | 弘凯光电(深圳)有限公司 | Modularized limit emitting diode (LED) display panel and LED luminous plaque |
| US10032972B2 (en) * | 2015-08-07 | 2018-07-24 | Nichia Corporation | Lead frame, package, light emitting device, and method for producing the same |
| CN105720179A (en) * | 2016-02-04 | 2016-06-29 | 吴冬梅 | Anti-static LED display screen and manufacturing method thereof |
| CN106205401A (en) * | 2016-07-21 | 2016-12-07 | 长春希达电子技术有限公司 | A kind of integration packaging LED display module and preparation method thereof |
| US20180269366A1 (en) * | 2017-03-17 | 2018-09-20 | Nichia Corporation | Light-emitting device |
| CN206806363U (en) * | 2017-04-27 | 2017-12-26 | 新月光电（深圳）股份有限公司 | LED lamp bead with light mixing effect |
| CN107146789A (en) * | 2017-05-27 | 2017-09-08 | 惠州雷曼光电科技有限公司 | LED encapsulation method and LED display |
| CN107272317A (en) * | 2017-05-31 | 2017-10-20 | 深圳市光峰光电技术有限公司 | The preparation method and display system of Fluorescence chip and its Wavelength converter |
| US20190044040A1 (en) * | 2017-08-03 | 2019-02-07 | Cree, Inc. | High density pixelated-led chips and chip array devices |
| CN107742667A (en) * | 2017-09-30 | 2018-02-27 | 深圳雷曼光电科技股份有限公司 | LED encapsulation method and display device |
| CN107968101A (en) * | 2017-12-26 | 2018-04-27 | 上海得倍电子技术有限公司 | A kind of high definition LED display modular structure and its manufacture method |
| CN207868224U (en) * | 2018-01-09 | 2018-09-14 | 王定锋 | A kind of more glasss of LED COB display screen modules |
| CN108019625A (en) * | 2018-01-12 | 2018-05-11 | 安徽芯瑞达科技股份有限公司 | A kind of down straight aphototropism mode set matrix light source |
| CN109004077A (en) * | 2018-07-30 | 2018-12-14 | 深圳市洲明科技股份有限公司 | The LED module of LED module glue-pouring method and display surface encapsulating |
| CN109244220A (en) * | 2018-08-30 | 2019-01-18 | 上海九山电子科技有限公司 | A kind of LED luminescent panel and preparation method thereof, LED display |
| CN109119523A (en) * | 2018-10-09 | 2019-01-01 | 大连德豪光电科技有限公司 | The preparation method of backlight, liquid crystal display and backlight |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112489588A (en) * | 2019-08-24 | 2021-03-12 | 华源智信半导体(深圳)有限公司 | Dynamic address allocation to drivers in a display device |
| US11289011B2 (en) | 2019-08-24 | 2022-03-29 | Huayuan Semiconductor (Shenzhen) Limited Company | Power line communication in a display device with distributed driver circuits |
| US11257421B2 (en) | 2019-08-24 | 2022-02-22 | Huayuan Semiconductor (Shenzhen) Limited Company | Display device with single package light emitting diode and driver circuit |
| CN112489587A (en) * | 2019-08-24 | 2021-03-12 | 华源智信半导体(深圳)有限公司 | Power line communication in a display device with distributed driver circuits |
| CN110649011A (en) * | 2019-09-10 | 2020-01-03 | 深圳雷曼光电科技股份有限公司 | Cell board and manufacturing method thereof |
| CN110911391B (en) * | 2019-11-21 | 2020-11-06 | 东莞市中麒光电技术有限公司 | Small-space display screen module and manufacturing method thereof |
| CN110911391A (en) * | 2019-11-21 | 2020-03-24 | 东莞市中麒光电技术有限公司 | Small-space display screen module and manufacturing method thereof |
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
| CN110880497B (en) * | 2019-11-21 | 2024-01-26 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
| WO2021203690A1 (en) * | 2020-04-06 | 2021-10-14 | 深圳市洲明科技股份有限公司 | Cob packaging method and led lamp panel |
| CN113724607A (en) * | 2020-05-26 | 2021-11-30 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display module |
| CN111754887A (en) * | 2020-06-24 | 2020-10-09 | 深圳市艾比森光电股份有限公司 | Display module, manufacturing method thereof and display |
| CN111754887B (en) * | 2020-06-24 | 2022-08-02 | 深圳市艾比森光电股份有限公司 | Display module, manufacturing method thereof and display |
| US11217153B1 (en) | 2020-09-18 | 2022-01-04 | Huayuan Semiconductor (Shenzhen) Limited Company | Display device with distributed driver circuits and shared multi-wire communication interface for dimming data |
| CN112543551A (en) * | 2020-11-27 | 2021-03-23 | 信丰迅捷兴电路科技有限公司 | Processing technology for COB Mini/Micro LED printed circuit board delta E color difference management and control |
| CN112863361A (en) * | 2021-02-05 | 2021-05-28 | 惠州视维新技术有限公司 | Display panel, display screen and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109741685B (en) | 2021-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109741685A (en) | A kind of LED display module and preparation method thereof | |
| CN103208241B (en) | Double-face composite LED (light-emitting diode) display unit plate and packaging method thereof | |
| CN110098306A (en) | A kind of integration packaging display module | |
| CN107968101A (en) | A kind of high definition LED display modular structure and its manufacture method | |
| JPH1187414A (en) | Semiconductor device and manufacturing method therefor | |
| CN106205401A (en) | A kind of integration packaging LED display module and preparation method thereof | |
| CN209561408U (en) | A kind of full-color LED packaging of microminiature | |
| CN108091644A (en) | A kind of encapsulating structure of the highly dense display light source devices of LED | |
| CN107946292A (en) | A kind of method for packing that LED display modules are realized by inkjet printing technology | |
| CN112885236A (en) | Conductive wiring, display panel, preparation method of display panel and spliced screen | |
| CN110808244A (en) | LED display unit surface packaging method based on modeling technology | |
| CN207651486U (en) | A kind of high definition LED display modular structure | |
| US20110014732A1 (en) | Light-emitting module fabrication method | |
| US20070018189A1 (en) | Light emitting diode | |
| JP4503950B2 (en) | Method for manufacturing phosphor-integrated LED lamp | |
| CN108133929A (en) | A kind of high contrast LED light source encapsulating structure | |
| CN107146787A (en) | A kind of production technology of integrated Surface Mount luminescent device | |
| CN107256921A (en) | COB LED encapsulation methods, display device and lighting device | |
| CN114447189A (en) | Hole array forming method, light emitting structure, display module manufacturing method and display module | |
| CN114023777A (en) | Circuit board assembly, light-emitting assembly and manufacturing method thereof | |
| CN113053868A (en) | Method for reducing color difference of display unit and Mini LED display unit | |
| TWI469392B (en) | Carrier and optical semiconductor device based on such a carrier | |
| CN207868197U (en) | A kind of LED lamp bead of wiring board | |
| CN207181896U (en) | A kind of backlight source module and display device based on quantum film | |
| CN212461714U (en) | LED lamp bead and LED display structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |