CN112885236A - Conductive wiring, display panel, preparation method of display panel and spliced screen - Google Patents
Conductive wiring, display panel, preparation method of display panel and spliced screen Download PDFInfo
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- CN112885236A CN112885236A CN202110030651.5A CN202110030651A CN112885236A CN 112885236 A CN112885236 A CN 112885236A CN 202110030651 A CN202110030651 A CN 202110030651A CN 112885236 A CN112885236 A CN 112885236A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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Abstract
The invention provides a wire routing, a display panel, a manufacturing method of the display panel and a spliced screen. The light absorption layer is additionally arranged in the wire routing, and light irradiated on the metal conducting layer on the side surface of the display panel is absorbed through the light absorption layer, so that metal reflection of a splicing seam between two adjacent display panels in the splicing screen can be eliminated, and the display effect is improved.
Description
Technical Field
The invention relates to the field of display equipment, in particular to a conductive wiring, a display panel, a preparation method of the display panel and a splicing screen.
Background
With the improvement of display taste of consumers, narrow-frame or full-screen display is an important development direction of novel display technology. However, a key problem that the conventional panel technology cannot achieve a narrow border is the limitation of the Bonding area, that is, the Bonding area of the display area and the external drive occupies the border position on the front surface of the panel. Therefore, an important strategy to achieve a narrow bezel is to make the Bonding area on the Side or Back of the panel, i.e., Side Bonding or Back Bonding, to expand the area of the AA area (display area) to the entire panel. An important process for realizing the Side Bonding or Back Bonding technology is to print conductive traces on the Side of the panel,
in the experimental process, the fact that the conductive wires have metallic luster and easily reflect ambient light is found, particularly in the manufacturing process of the spliced screen, the splicing seams are obvious due to the reflection of the conductive wires, and the normal display effect is affected.
Disclosure of Invention
The invention aims to provide a conductive wire, a display panel, a preparation method of the display panel and a spliced screen, and aims to solve the problems that the normal display effect is influenced and the splicing seam of the spliced screen is obvious and the like due to the reflection of the conductive wire in the prior art.
In order to achieve the above object, the present invention provides a conductive trace, which includes a metal conductive layer and a light absorption layer, wherein the light absorption layer covers the entire surface of the metal conductive layer or a part of the surface of the metal conductive layer.
Further, the light absorption layer comprises at least one of organic materials and carbon black, and is of a nanometer-scale thickness and black in color.
Further, the metal trace is made of silver, and the thickness of the metal trace is less than 20 micrometers.
The invention also provides a display panel, which is provided with a display area and a binding area connected with the display area, wherein the binding area extends to the side surface of the display panel. The display panel further comprises a metal trace extending from the display area to the bonding area, where the metal trace is the conductive trace according to claim 1.
Further, the bonding region extends from a side surface of the display panel to a rear surface of the display panel. The metal traces also extend from the sides of the display panel to the back of the display panel. The part of the metal wire on the side surface of the display panel is the conductive wire.
Furthermore, the display panel further comprises a chip on film, an array substrate and a color film substrate. The flip chip film is arranged on the back of the display panel and electrically connected with the metal wires. The array substrate and the color film substrate are arranged in a laminated mode, the color film substrate is arranged on one surface, close to the display surface, of the array substrate, and the metal wiring is electrically connected with the array substrate.
The invention also provides a preparation method of the display panel, which is used for preparing the display panel, and the preparation method comprises the following steps:
providing a base layer, wherein the base layer is provided with a display area and a binding area connected with the display area, and the binding area extends to the side surface of the display panel. Forming metal routing on the side face of the display panel: and forming a metal conductive layer on the side surface of the display panel, and forming a light absorption layer on the side surface of the display panel and the metal conductive layer.
Further, the step of forming the light shielding layer on the side surface of the display panel and the metal trace includes: spraying a solution containing an organic material or carbon black toward a side of the display panel such that the organic material or the carbon black covers a surface of the metal conductive layer.
Further, the forming the metal conductive layer at the side of the display panel includes: providing a mould, and forming the initial layer of the metal conducting layer in the mould. And dipping the initial layer of the metal conducting layer out of the mould by using a silica gel pad. And transferring the initial layer of the metal conducting layer on the silica gel pad to the side surface of the display panel. And curing the initial layer of the metal conducting layer on the display panel to form the metal conducting layer.
The invention also provides a spliced screen which comprises at least two display panels, wherein the two adjacent display panels are spliced with each other.
The invention has the advantages that: according to the invention, the light rays irradiated on the metal wires on the side surfaces of the display panels are absorbed by the light absorption layer, so that the metal reflection of the splicing seam between two adjacent display panels in the splicing screen can be eliminated, and the display effect is improved. Moreover, the thickness of the light absorption layer is nano-scale, so that the seamless splicing effect of the spliced screen cannot be influenced. In addition, the preparation method of the display panel is easy to operate, simple in steps and convenient for workers to operate.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic perspective view of a display panel according to embodiment 1 of the present invention;
fig. 2 is a schematic back side perspective view of a display panel in embodiment 1 of the present invention;
fig. 3 is a schematic view of a layered structure of a first trace in embodiment 1 of the present invention;
FIG. 4 is a front view of a tiled display according to embodiments 1-2 of the present invention;
fig. 5 is a schematic perspective view of a display panel of the display panel according to embodiment 2 of the present invention;
fig. 6 is a schematic back side perspective view of a display panel in embodiment 2 of the present invention;
fig. 7 is a schematic diagram of a layered structure of a metal trace in embodiment 2 of the present invention.
The components in the figures are represented as follows:
splicing the screen 1; a display panel 10;
a display area 11; a binding region 12;
a display surface 13; a side surface 14; a back surface 15;
an array substrate 100; a color film substrate 200;
a chip on film (300); a metal trace 400;
a first trace 410; a second trace 420;
a metal conductive layer 411; a light absorbing layer 412.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, which are included to demonstrate that the invention can be practiced, and to provide those skilled in the art with a complete description of the invention so that the technical content thereof will be more clear and readily understood. The present invention may be embodied in many different forms of embodiments and should not be construed as limited to the embodiments set forth herein.
Example 1
In an embodiment of the present invention, a display panel 10 is provided, as shown in fig. 1, where the display panel 10 has a display area 11 and a binding area 12, and the binding area 12 is connected to the display area 11. In the embodiment of the present invention, the display panel 10 is a frameless display panel, and the display area 11 covers an entire surface of the display panel 10, which is a display surface 13 of the display panel 10, so that the bonding area 12 connected to the display area 11 is located on a side surface 14 connected to the display surface 13, and the bonding area 12 extends from the side surface 14 of the display panel 10 to a back surface 15 of the display panel 10.
As shown in fig. 2, the display panel 10 further includes a color film substrate 200, an array substrate 100, a flip chip 300, and metal traces 400.
The array substrate 100 and the color filter substrate 200 are stacked, wherein a surface of the array substrate 100 away from the color filter substrate 200 is a back surface 15 of the display panel 10, and a surface of the color filter substrate 200 away from the array substrate 100 is a display surface 13 of the display panel 10.
The array substrate 100 is provided with a plurality of thin film transistors and light emitting devices, and the thin film transistors are used for controlling the light emitting devices to be turned on or off. Light emitted by the light emitting device is emitted toward one surface of the color film substrate 200 through the array substrate 100, and enters the color film substrate 200.
The color film substrate 200 is provided with a plurality of red color resistors, green color resistors and blue color resistors, and light entering the color film substrate 200 is filtered through the red color resistors, the green color resistors and the blue color resistors to change the color of the light, so that the display panel 10 can realize full-color display.
The metal trace 400 is disposed in the bonding region 12 of the display panel 10, i.e., on the side 14 of the display panel 10, and extends from the side 14 of the display panel 10 to the back 15 of the display panel 10. The metal trace 400 includes a first trace 410 and a second trace 420, the first trace 410 is located on the side surface 14 of the display panel 10, the second trace 420 is located on the back surface 15 of the display panel 10, and the first trace 410 is electrically connected to the second trace 420.
The first trace 410 is a conductive trace having a light absorbing structure, and as shown in fig. 3, the conductive trace includes a metal conductive layer 411 and a light absorbing layer 412.
The metal conductive layer 411 is disposed on the side surface 14 of the display panel 10 and electrically connected to the array substrate 100. The metal conductive layer 411 is made of silver with excellent conductivity, and the thickness of the silver is less than 20 micrometers, and preferably, the thickness of the metal conductive layer 411 is 3-10 micrometers.
The light absorbing layer 412 covers an exposed surface of the metal conductive layer 411. The light absorbing layer 412 is black, which may be an organic material or a carbon black material, and the thickness of the light absorbing layer 412 is smaller than that of the metal conductive layer 411, which is a nano-scale thickness.
Since the metal conductive layer 411 reflects light to affect the display of the display panel 10, the light absorbing layer 412 covers the metal conductive layer 411, and the black light absorbing layer 412 can absorb light of all bands, so as to prevent the metal conductive layer 411 from reflecting external light to affect the display of the display panel 10.
The second trace 420 has a single-layer trace structure and only has one conductive layer, one end of the conductive layer is electrically connected to the metal conductive layer 411 in the first trace 410, and the other end of the conductive layer is electrically connected to the flip-chip film 300.
The flip chip 300 is disposed on the back surface 15 of the display panel 10 and electrically connected to the metal traces 400. The chip on film 300 includes an integrated circuit, a driving circuit, and a flexible circuit board. The flexible circuit board is electrically connected with the second trace 420 of the metal trace 400. The integrated circuit and the driving circuit are both disposed on the flexible circuit board, and are connected to the array substrate 100 through the flexible circuit board and the metal traces 400, and transmit a control signal to the array substrate 100, so as to control a display image of the display panel 10.
The embodiment of the invention also provides a spliced screen 1, as shown in fig. 4, the spliced screen 1 comprises 4 display panels 10 as described above, the display panels 10 are arranged in an array and spliced together, and the display surface 13 of each display panel 10 faces the same direction.
The embodiment of the present invention further provides a method for manufacturing the display panel 10, which is used for manufacturing the display panel 10, and includes the following steps:
step S10) provides a base layer:
the base layer comprises an array substrate 100 and a color film substrate 200 which are arranged in a laminated manner. A surface of the color filter substrate 200 away from the array substrate 100 is a display surface 13, and the display surface 13 corresponds to the display area 11 of the display panel 10. The display panel 10 further has a bonding region 12, the bonding region 12 is connected to the display region 11 and extends from a side surface 14 of the display panel 10 to a back surface 15 of the display panel 10, where the back surface 15 is a surface of the array substrate 100 away from the color filter substrate 200.
Step S20) forming the metal trace 400:
preparing a patterned mold in advance, and pouring silver paste into the mold to form the initial layer of the metal conductive layer. And dipping the initial layer of the metal conducting layer from the die by using a silica gel pad, and then transferring the initial layer of the metal conducting layer on the silica gel pad to the side surface 14 of the display surface 13. And then, placing the base layer into a baking oven, and curing and baking the initial layer of the metal conductive layer for 10-30 minutes at the temperature of 80-120 ℃ to form the metal conductive layer 411. A black organic material or carbon black material is sprayed on the side surface 14 of the display panel 10 to form a light absorption layer 412. The metal conductive layer 411 and the light absorbing layer 412 form the first trace 410 in combination.
A layer of conductive material is deposited on the back surface 15 of the display panel 10, and the layer of conductive material is patterned to form a second trace 420 connected to the metal conductive layer 411 of the first trace 410.
The first trace 410 and the second trace 420 are combined to form the metal trace 400.
Step S30) bonding the flip chip film 300:
a chip on film 300 is provided, wherein the chip on film 300 includes a flexible circuit board, and an integrated circuit and a driving circuit disposed on the flexible circuit board. The flexible circuit board is connected to the second traces 420 in the metal traces 400, and the flip chip 300 is fixed on the back surface 15 of the display panel 10, so as to complete the preparation of the display panel 10.
In the display panel 10 provided in the embodiment of the present invention, the light absorbing layer 412 absorbs the light irradiated on the metal trace 400 on the side surface 14 of the display panel 10, so that the metal reflection of the joint seam between two adjacent display panels 10 in the tiled display 1 can be eliminated, and the display effect is improved. Moreover, the thickness of the light absorption layer 412 is nanometer, so that the seamless splicing effect of the spliced screen 1 is not affected. Moreover, the preparation method of the display panel 10 is easy to operate, has simple steps, and is convenient for operators to operate.
Example 2
In the embodiment of the present invention, a display panel 10 is provided, as shown in fig. 5, the display panel 10 has a display area 11 and a binding area 12, and the binding area 12 is connected to the display area 11. In the embodiment of the present invention, the display panel 10 is a frameless display panel 10, and the display area 11 covers an entire surface of the display panel 10, which is a display surface 13 of the display panel 10, so that the binding area 12 connected to the display area 11 is located on a side surface 14 connected to the display surface 13.
As shown in fig. 6, the display panel 10 further includes a color film substrate 200, an array substrate 100, a flip-chip film 300, and metal traces 400.
The array substrate 100 and the color filter substrate 200 are stacked, wherein a surface of the array substrate 100 away from the color filter substrate 200 is a back surface 15 of the display panel 10, and a surface of the color filter substrate 200 away from the array substrate 100 is a display surface 13 of the display panel 10.
The array substrate 100 is provided with a plurality of thin film transistors and light emitting devices, and the thin film transistors are used for controlling the light emitting devices to be turned on or off. Light emitted by the light emitting device is emitted toward one surface of the color film substrate 200 through the array substrate 100, and enters the color film substrate 200.
The color film substrate 200 is provided with a plurality of red color resistors, green color resistors and blue color resistors, and light entering the color film substrate 200 is filtered through the red color resistors, the green color resistors and the blue color resistors to change the color of the light, so that the display panel 10 can realize full-color display.
The chip on film 300 is electrically connected to the metal trace 400, and includes an integrated circuit, a driving circuit, and a flexible circuit board. One end of the chip on film 300 electrically connected to the metal trace 400 is disposed on the side surface 14 of the display panel 10, and a main body thereof provided with an integrated circuit and a driving circuit is fixed on the back surface 15 of the display panel 10. The integrated circuit and the driving circuit are both disposed on the flexible circuit board, and the flexible circuit board is electrically connected to the metal trace 400. The chip on film 300 is connected to the array substrate 100 through the flexible circuit board and the metal traces 400, and transmits a control signal to the array substrate 100, thereby controlling a display screen of the display panel 10.
The metal trace 400 is disposed in the bonding region 12 of the display panel 10, i.e., on the side surface 14 of the display panel 10. As shown in fig. 7, the metal trace 400 is a conductive trace having a light absorbing structure, and the conductive trace includes a metal conductive layer 411 and a light absorbing layer 412.
The metal conductive layer 411 is located between the array substrate 100 and the chip on film 300 on the side surface 14 of the display panel 10, and is electrically connected to the array substrate 100 and the chip on film 300. The metal conductive layer 411 is made of silver with excellent conductivity, and the thickness of the silver is less than 20 micrometers, and preferably, the thickness of the metal conductive layer 411 is 3-10 micrometers.
The light absorbing layer 412 covers an exposed surface of the metal conductive layer 411. The light absorbing layer 412 is black, which may be an organic material or a carbon black material, and the thickness of the light absorbing layer 412 is smaller than that of the metal conductive layer 411, which is a nano-scale thickness.
Since the metal conductive layer 411 reflects light to affect the display of the display panel 10, the light absorbing layer 412 covers the metal conductive layer 411, and the black light absorbing layer 412 can absorb light of all bands, so as to prevent the metal conductive layer 411 from reflecting external light to affect the display of the display panel 10.
The embodiment of the invention also provides a spliced screen 1, as shown in fig. 4, the spliced screen 1 comprises 4 display panels 10 as described above, the display panels 10 are arranged in an array and spliced together, and the display surface 13 of each display panel 10 faces the same direction.
The embodiment of the present invention further provides a method for manufacturing the display panel 10, which is used for manufacturing the display panel 10, and includes the following steps:
step S10) provides a base layer:
the base layer comprises an array substrate 100 and a color film substrate 200 which are arranged in a laminated manner. A surface of the color filter substrate 200 away from the array substrate 100 is a display surface 13, a surface of the array substrate 100 away from the color filter substrate 200 is a back surface 15, and the display surface 13 corresponds to the display area 11 of the display panel 10. The display panel 10 further has a bonding area 12, and the bonding area 12 is located on a side surface 14 of the display panel 10 and is connected to the display area 11.
Step S20) forming the metal trace 400:
preparing a patterned mold in advance, and pouring silver paste into the mold to form the initial layer of the metal conductive layer. And dipping the initial layer of the metal conducting layer from the die by using a silica gel pad, and then transferring the initial layer of the metal conducting layer on the silica gel pad to the side surface 14 of the display surface 13. And then, placing the base layer into a baking oven, and curing and baking the initial layer of the metal conductive layer for 10-30 minutes at the temperature of 80-120 ℃ to form the metal conductive layer 411.
A black organic material or carbon black material is sprayed on the side surface 14 of the display panel 10 to form a light absorption layer initial layer. The light absorption layer initial layer is patterned to expose the connection portion between the metal conductive layer 411 and the flip chip film 300, thereby forming a light absorption layer 412. The metal conductive layer 411 and the light absorbing layer 412 are combined to form the metal trace 400.
Step S30) bonding the flip chip film 300:
a chip on film 300 is provided, wherein the chip on film 300 includes a flexible circuit board, and an integrated circuit and a driving circuit disposed on the flexible circuit board. The flexible circuit board is connected to the exposed surface of the metal conductive layer 411 in the metal trace 400, and the flip chip 300 is bent and fixed to the back surface 15 of the display panel 10, so as to complete the preparation of the display panel 10.
In the display panel 10 provided in the embodiment of the present invention, the light absorbing layer 412 absorbs the light irradiated on the metal trace 400 on the side surface 14 of the display panel 10, so that the metal reflection of the joint seam between two adjacent display panels 10 in the tiled display 1 can be eliminated, and the display effect is improved. Moreover, the thickness of the light absorption layer 412 is nanometer, so that the seamless splicing effect of the spliced screen 1 is not affected. Moreover, the preparation method of the display panel 10 is easy to operate, has simple steps, and is convenient for operators to operate.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the original rights may be varied. The described ways are claimed in combination with the features described in the different dependent claims and herein. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (10)
1. A conductive trace includes
A metal conductive layer; and
and the light absorption layer covers the whole surface of the metal conducting layer or part of the surface of the metal conducting layer.
2. The conductive trace of claim 1, wherein the light absorbing layer comprises at least one of an organic material and carbon black; the light absorption layer is nano-scale in thickness and black in color.
3. The conductive trace of claim 1, wherein the metal trace is silver and has a thickness of less than 20 microns.
4. A display panel having a display area and a binding area connected to the display area, wherein the binding area extends to a side of the display panel; the display panel further comprises a metal trace extending from the display area to the bonding area, where the metal trace is the conductive trace according to claim 1.
5. The display panel of claim 4, wherein the bonding region extends from a side of the display panel to a back of the display panel; the metal routing also extends from the side surface of the display panel to the back surface of the display panel; the part of the metal wire on the side surface of the display panel is the conductive wire.
6. The display panel of claim 4, further comprising:
the chip on film is arranged on the back of the display panel and is electrically connected with the metal wire;
the color film substrate is arranged on one surface, close to the display surface, of the array substrate, and the metal wiring is electrically connected with the array substrate.
7. A preparation method of a display panel is characterized by comprising the following steps:
providing a base layer, wherein the base layer is provided with a display area and a binding area connected with the display area, and the binding area extends to the side surface of the display panel;
forming metal routing on the side face of the display panel: forming a metal conductive layer on a side surface of the display panel; and forming a light absorption layer on the side surface of the display panel and the metal conductive layer.
8. The method for manufacturing a display panel according to claim 7, wherein the step of forming the light shielding layer on the side surface of the display panel and the metal traces includes: spraying a solution containing an organic material or carbon black toward a side of the display panel such that the organic material or the carbon black covers a surface of the metal conductive layer.
9. The method for manufacturing a display panel according to claim 7, wherein the step of forming the metal conductive layer on the side surface of the display panel includes: providing a mould, and forming a metal conducting layer initial layer in the mould; dipping the initial layer of the metal conducting layer from the mold by using a silica gel pad and taking out the initial layer of the metal conducting layer; transferring the metal conducting layer initial layer on the silica gel pad to the side face of the display panel; and curing the initial layer of the metal conducting layer on the display panel to form the metal conducting layer.
10. A tiled screen comprising at least two display panels according to any of claims 4-6, wherein adjacent display panels are tiled with respect to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110030651.5A CN112885236A (en) | 2021-01-11 | 2021-01-11 | Conductive wiring, display panel, preparation method of display panel and spliced screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110030651.5A CN112885236A (en) | 2021-01-11 | 2021-01-11 | Conductive wiring, display panel, preparation method of display panel and spliced screen |
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| CN112885236A true CN112885236A (en) | 2021-06-01 |
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| CN202110030651.5A Pending CN112885236A (en) | 2021-01-11 | 2021-01-11 | Conductive wiring, display panel, preparation method of display panel and spliced screen |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437025A (en) * | 2021-06-10 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method for array substrate side routing and spliced display panel |
| CN113488497A (en) * | 2021-06-24 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN114429735A (en) * | 2022-01-27 | 2022-05-03 | Tcl华星光电技术有限公司 | Arc display device and electronic equipment |
| CN116068795A (en) * | 2023-04-06 | 2023-05-05 | 深圳铭创智能装备有限公司 | Processing method of liquid crystal display screen, liquid crystal display screen and large-format spliced screen |
| WO2023178725A1 (en) * | 2022-03-21 | 2023-09-28 | Tcl华星光电技术有限公司 | Manufacturing method for display panel and display panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047550A (en) * | 2015-07-27 | 2015-11-11 | 京东方科技集团股份有限公司 | Conductive module, preparation method thereof, substrate and display device |
| CN107371363A (en) * | 2015-08-13 | 2017-11-21 | 株式会社Lg化学 | Conducting structures and preparation method thereof |
| CN108957880A (en) * | 2018-08-01 | 2018-12-07 | 京东方科技集团股份有限公司 | Array substrate, display panel and preparation method thereof |
| CN109671868A (en) * | 2019-02-25 | 2019-04-23 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display panel |
| CN111357113A (en) * | 2017-10-25 | 2020-06-30 | 三星电子株式会社 | LED panel and display device having the same |
-
2021
- 2021-01-11 CN CN202110030651.5A patent/CN112885236A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047550A (en) * | 2015-07-27 | 2015-11-11 | 京东方科技集团股份有限公司 | Conductive module, preparation method thereof, substrate and display device |
| CN107371363A (en) * | 2015-08-13 | 2017-11-21 | 株式会社Lg化学 | Conducting structures and preparation method thereof |
| CN111357113A (en) * | 2017-10-25 | 2020-06-30 | 三星电子株式会社 | LED panel and display device having the same |
| CN108957880A (en) * | 2018-08-01 | 2018-12-07 | 京东方科技集团股份有限公司 | Array substrate, display panel and preparation method thereof |
| CN109671868A (en) * | 2019-02-25 | 2019-04-23 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display panel |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437025A (en) * | 2021-06-10 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method for array substrate side routing and spliced display panel |
| CN113488497A (en) * | 2021-06-24 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN114429735A (en) * | 2022-01-27 | 2022-05-03 | Tcl华星光电技术有限公司 | Arc display device and electronic equipment |
| WO2023178725A1 (en) * | 2022-03-21 | 2023-09-28 | Tcl华星光电技术有限公司 | Manufacturing method for display panel and display panel |
| CN116068795A (en) * | 2023-04-06 | 2023-05-05 | 深圳铭创智能装备有限公司 | Processing method of liquid crystal display screen, liquid crystal display screen and large-format spliced screen |
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Application publication date: 20210601 |