CN107256921A - COB LED encapsulation methods, display device and lighting device - Google Patents
COB LED encapsulation methods, display device and lighting device Download PDFInfo
- Publication number
- CN107256921A CN107256921A CN201710388368.3A CN201710388368A CN107256921A CN 107256921 A CN107256921 A CN 107256921A CN 201710388368 A CN201710388368 A CN 201710388368A CN 107256921 A CN107256921 A CN 107256921A
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- Prior art keywords
- led
- encapsulating material
- cob
- nib
- mould
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The invention discloses a kind of COB LED encapsulation methods, display device and lighting device, wherein, the COB LED encapsulation methods include：LED lamp panel is provided, LED lamp panel includes the multiple pixels of circuit board and array in the side plate face of the circuit board, wherein, each pixel includes an at least LED chip；A mould is provided, the mould has opens up spaced multiple nibs in a plane, the plane；Encapsulating material is filled in multiple nibs；The plate face of LED lamp panel is fitted with the plane of mould, and each pixel in LED lamp panel is poured into the encapsulating material in a nib, so that the encapsulating material in a nib coats a pixel.COB LED encapsulation methods of the present invention simplify the encapsulation of dot spacing LED display modules, reduce encapsulation difficulty, improve packaging efficiency, save packaging cost, and without carrying out dispensing or injection on circuit boards.
Description
Technical field
The present invention relates to LED technology field, more particularly to a kind of COB-LED method for packing, display device and lighting device.
Background technology
LED display modules are according to whether having bowl and being divided into bowl type and without bowl type, according to pixel spacing
Size and be divided into a little bigger spacing type and dot spacing type.Wherein, band bowl type, a little bigger spacing LED display modules can pass through
Point gum machine pointwise dispensing mode is packaged, and its glue amount and light type are easy to control；Band bowl type, dot spacing LED show mould
It is high that the bowl layer of group makes precision, it is difficult to controls, then be difficult to realize.Accordingly, it would be desirable to using COB (on Chip on Board, plate
Chip) packaged type to realize the manufacture of smaller point spacing LED display modules, and then make its be applied to as large size TV,
Commercialization display etc. is indoor closely to watch LED display.
Further, the LED display modules that COB packaged types are made are divided into band bowl type and without bowl type, wherein, no
Glue dispensing and packaging mode or injection (molding) packaged type is taken to realize on circuit board with bowl type LED display modules
The protection of LED chip and gold thread.Glue dispensing and packaging mode must use thixotrope, to ensure that the light type uniformity for luminous point is good, but
Due to the mobility of colloid on circuit boards, colloid shape has deviation, and the photochromic adjustment requirement for LED display is higher；
Injection molding packaging mode needs to use the high mould of precision, while needing to be equipped with injection machine, its cost is higher.
The content of the invention
It is a primary object of the present invention to provide a kind of COB-LED method for packing, it is intended to simplify dot spacing LED and show mould
The encapsulation of group, reduces encapsulation difficulty, improves packaging efficiency, saves packaging cost, and without dispensing or injection on circuit boards.
To achieve the above object, a kind of COB-LED method for packing of present invention offer, including step are as follows：
LED lamp panel is provided, the LED lamp panel includes circuit board and array in the side plate face of the circuit board
Multiple pixels, wherein, each pixel includes an at least LED chip；
A mould is provided, the mould has opens up spaced multiple nibs in a plane, the plane；
Encapsulating material is filled in the multiple nib；
The plate face of the LED lamp panel is fitted with the plane of the mould, and will be every in the LED lamp panel
Pixel described in one is poured into the encapsulating material in nib described in one, so that the encapsulating material in nib described in one
Pixel described in cladding one.
Preferably, in the step of encapsulating material is filled in the multiple nib, specifically include：
Placed in the plane of the mould and spaced multiple hollow-out parts opened up on mask plate, the mask plate,
Nib described in each hollow-out parts correspondence one is set；
The encapsulating material is printed on the mask plate, and the encapsulating material is filled by the multiple hollow-out parts
The multiple nib.
Preferably, by strip scraper on the surface of the mask plate encapsulating material described in wiper, and print the envelope
Package material.
Preferably, in the step of encapsulating material is filled in the multiple nib, specifically include：
Point gum machine is provided；
The point gum machine in the multiple nib of the mould one by one dispensing and fill the encapsulating material.
Preferably, the COB-LED method for packing is also as follows including step：
The LED lamp panel and the mould after laminating is inserted into oven for baking；
It is baked to after the encapsulating material solidification, takes out and separate the mould and the LED lamp panel.
Preferably, the COB-LED method for packing is also as follows including step：
Before the encapsulating material is filled, the multiple nib of the mould is cleaned；
Injection or coating releasing agent in the multiple nib after cleaning.
Preferably, each nib is the encapsulating material cladding one in asymmetrical shape, and each nib
The package lens of the pixel shaping are set on a reference plane in asymmetric, wherein, the reference plane is the pixel
The shared normal plane of a normal plane or multiple LED chips for an only LED chip.
Preferably, the spacing between pixel described in adjacent two is 0.6mm~2mm.
In addition, to achieve the above object, the present invention also provides a kind of display device, including mounting structure and is installed in institute
The LED encapsulation structure of mounting structure is stated, the LED encapsulation structure is made using COB-LED method for packing as described above.
In addition, to achieve the above object, the present invention also provides a kind of lighting device, including fixed structure and is installed in institute
The LED encapsulation structure of fixed structure is stated, the LED encapsulation structure is made using COB-LED method for packing as described above.
Technical solution of the present invention, first fill encapsulating material in multiple nibs of mould, then by the plate face of LED lamp panel with
The plane laminating of mould, and multiple pixels in LED lamp panel are poured into the encapsulating material in multiple nibs, make each mould
Encapsulating material cladding one pixel of encapsulation in hole；Packaging technology of the present invention is simplified without dispensing or injection on circuit boards
The encapsulation of dot spacing LED display modules, reduces encapsulation difficulty, improves packaging efficiency, save packaging cost；And this hair
Bright packaging technology can realize the encapsulation that minimum image vegetarian refreshments spacing is 0.6mm, and dot space distance LED display screen can be met completely
Demand.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the principle schematic of COB-LED method for packing first embodiment of the present invention；
Fig. 2 is the FB(flow block) of COB-LED method for packing in Fig. 1；
Fig. 3 is the principle schematic of COB-LED method for packing 3rd embodiment of the present invention；
Fig. 4 is the partial enlarged drawing of a-quadrant in Fig. 3；
Fig. 5 is the schematic diagram of the normal plane of LED chip in Fig. 3.
The object of the invention is realized, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
It is to be appreciated that institute is directional in the embodiment of the present invention indicates that (such as up, down, left, right, before and after ...) is only used
In explaining relative position relation, motion conditions under a certain particular pose (as shown in drawings) between each part etc., if should
When particular pose changes, then directionality indicates also correspondingly therewith to change.
In addition, in the present invention such as relating to the description of " first ", " second " etc. be only used for describe purpose, and it is not intended that
Indicate or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ",
At least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the technical side between each embodiment
Case can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical scheme
It will be understood that the combination of this technical scheme is not present, also not in the guarantor of application claims when appearance is conflicting or can not realize
Within the scope of shield.
The present invention provides a kind of COB-LED method for packing, referring to Fig.1 and 2, in the first embodiment, the COB-LED
It is as follows that method for packing includes step：
S1, offer LED lamp panel 1, the LED lamp panel 1 includes circuit board 10 and array is located at the side plate face of circuit board 10
On multiple pixels 11, wherein, each pixel 11 include an at least LED chip；
S2, one mould 12 of offer, the mould 12 has opens up spaced multiple nibs in a plane 13, the plane 13
14；
S3, the filling encapsulating material 15 in multiple nibs 14；
S4, the plate face of LED lamp panel 1 fitted with the plane 13 of mould 12, and by each pixel 11 in LED lamp panel 1
Pour into the encapsulating material 15 in a nib 14, so that the encapsulating material 15 in a nib 14 coats a pixel 11.
The present embodiment COB-LED method for packing first fills encapsulating material 15 in multiple nibs 14 of mould 12, then will
The plate face of LED lamp panel 1 is fitted with the plane 13 of mould 12, and multiple pixels 11 in LED lamp panel 1 are poured into multiple nibs
In encapsulating material 15 in 14, the encapsulating material 15 in each nib 14 is set to coat one pixel 11 of encapsulation；Present invention encapsulation work
Skill simplifies the encapsulation of dot spacing LED display modules, reduces encapsulation difficulty without dispensing or injection on the circuit board 10,
Packaging efficiency is improved, packaging cost is saved；And the present embodiment COB-LED method for packing can be realized between minimum image vegetarian refreshments
Away from the encapsulation for 0.6mm, the demand of dot space distance LED display screen can be met completely.
It should be noted that in the present invention, LED chip is positioned at by die bond on circuit board 10, when LED chip is
, it is necessary to carry out bonding wire to it during positive cartridge chip, its positive and negative electrode is electrically connected with the pad on circuit board 10 respectively；When
When LED chip is flip-chip, the electric connection of its positive and negative electrode and the pad on circuit board 10, nothing can be completed by die bond
Need bonding wire.As for the LED chip quantity of single pixel point 11, it can be configured according to the actual requirements, for example, single pixel point
11 can be only with white light (W) chip；Three LEDs chips, respectively feux rouges (R) chip, green glow (G) core can also be used
Piece and blue light (B) chip；Four LEDs chips, respectively feux rouges (R) chip, green glow (G) chip, blue light (B) core can also be used
Piece and white light (W) chip, can also use five LEDs chips.Encapsulating material 15 can pass through printing, pin hole injection or dispensing
Etc. the nib 14 that mode fills mould 12.
In the present embodiment, further, the COB-LED method for packing is also as follows including step：
S5, the LED lamp panel 1 and mould 12 after laminating inserted into oven for baking；
S6, be baked to encapsulating material 15 solidify after, take out and separate mould 12 and LED lamp panel 1.
By toasting encapsulating material 15, accelerate the solidification of encapsulating material 15, reduce hardening time, shorten processing procedure and taken
Between.
In the present embodiment, further, the COB-LED method for packing is also as follows including step：
S2.1, filling encapsulating material 15 before, clean mould 12 multiple nibs 14；
Injection or coating releasing agent in S2.2, multiple nibs 14 after cleaning.
Influence of the impurity on the surface of mould 12 to encapsulating material 15 can be avoided by cleaning, and releasing agent is conducive to solidification
The separation of encapsulating material 15 afterwards and mould 12.
In the present embodiment, further, step S1 is specifically included：
S10, die bond is carried out on the circuit board 10, wherein, feux rouges (R) chip, green glow (G) chip and blue light (B) chip are
One group and form a pixel 11；
Pad on the electrode of LED chip and circuit board 10, is electrically connected with by S11, bonding wire by aluminum steel or gold thread.
Because single pixel point 11 is made up of feux rouges (R) chip, green glow (G) chip and blue light (B) chip, full-color hair is realized
Light, it can be used as full-color LED display screen application.
In the present embodiment, further, step S3 is specifically included：
Spaced multiple hollow-out parts are opened up on S30, the placement mask plate 16 in the plane 13 of mould 12, mask plate 16
17, one nib 14 of each correspondence of hollow-out parts 17 is set；
S31, the printing encapsulating material 15 on mask plate 16, and encapsulating material 15 is filled multiple by multiple hollow-out parts 17
Nib 14.
Encapsulating material 15 is packed into nib 14 by way of printing, simplified in the injection nib 14 of encapsulating material 15
Mode, improve production efficiency；Printed simultaneously using mask plate 16, it is possible to achieve repeatedly printing, and avoid package material
The situation that material 15 sticks to the surface of mould 12 and cause circuit board 10 to be not readily separated with mould 12 in printing.
In the present embodiment, further, by strip scraper on the surface of mask plate 16 wiper encapsulating material 15, and
Print encapsulating material 15.
Strip scraper can realize uniform wiper of the encapsulating material 15 on mask plate 16, improve printing efficiency and filler
Uniformity.
In the present embodiment, further, each nib 14 is symmetric shape, and in hemisphere shape.In other embodiment
In, the nib 14 can also be in billiard table body shape, cylindrical shape, round estrade shape, ellipsoid shaped or cube shape etc..
In the present embodiment, further, the spacing between two adjacent pixels 11 is 0.6mm~2mm.
Because pixel spacing is 0.6mm~2mm, the application requirement of dot space distance LED display screen can be met.It is preferred that
Spacing between ground, two adjacent pixels 11 is 0.8mm~1.2mm.Most preferably, between two adjacent pixels 11
Away from for 0.8mm.In other embodiments, the spacing between two adjacent pixels 11 can be 0.9mm, 1.0mm, 1.1mm or
Person 1.2mm.
The present invention also provides the second embodiment of COB-LED method for packing, this second embodiment and above-mentioned first embodiment
Difference be：
Step S3 is specifically included：
S30 ', offer point gum machine；
S31 ', the point gum machine in multiple nibs 14 of mould 12 one by one dispensing and fill encapsulating material 15.
Relative to encapsulating material 15 is printed in multiple nibs 14 of mould 12, using point gum machine directly in the mould of mould 12
Dispensing in hole 14, without using printing equipment, further simplify the filling work procedure of encapsulating material 15.
Fig. 3 to Fig. 5 is refer to, Fig. 3 is the principle schematic of COB-LED method for packing 3rd embodiment of the present invention；Fig. 4 is
The partial enlarged drawing of a-quadrant in Fig. 3；Fig. 5 is the schematic diagram of the normal plane of LED chip in Fig. 3.This third embodiment and above-mentioned the
The difference of one embodiment or second embodiment is：
Each nib 14 is that the encapsulating material 15 in asymmetrical shape, and each nib 14 coats a pixel 11 shaping
Package lens are set on a reference plane S in asymmetric, wherein, reference plane S is the only LED chip 110 of pixel 11
A normal plane P1 (P2) or the shared normal plane P1 (P2) of multiple LED chips 110.As shown in figure 5, normal plane P1 (P2) is
Normal L by LED chip 110 and with the plane of the upper surface orthogonal vertical of LED chip 110, in other words, a LED chip
110 have two normal plane P1 (P2), and one is parallel with one side, secondly parallel with adjacent another side.
Because nib 14 is set in asymmetric, and the package lens of its shaping are to be set on normal plane P1 (P2) in asymmetric
Put, and then LED chip is luminous after package lens are handled, and lights and is concentrated towards side, can meet it is luminous laterally toward
To demand.
In the present embodiment, further, another normal plane parting package lens vertical with reference plane S and form one and cut open
Face, the section has the first curved section 150 and the second curved section 151, wherein the first curved section 150 and the second curved section 151
Intersection I is located at reference plane S side, it is preferable that the intersection I is located at reference plane S left side, and then the light court that package lens are sent
Concentrate to the right, realize that Right deviation angle lights.In other embodiments, the intersection I can be located at reference plane S right side, Jin Erfeng
The light that dress lens are sent is concentrated towards left side, realizes that left-leaning angle lights；The intersection I can also be located at reference plane S upside, and then
The light that package lens are sent is concentrated towards downside, realizes that angle of declination lights.
The present invention also provides a kind of display device, and incorporated by reference to Fig. 1 and Fig. 3, in one embodiment, the display device includes peace
Assembling structure and the LED encapsulation structure for being installed in mounting structure, LED encapsulation structure use the COB-LED of as above all embodiments
Method for packing is made.Because the LED encapsulation structure of the present embodiment employs whole technical schemes of above-mentioned all embodiments, therefore
All beneficial effects that the same technical scheme with above-described embodiment is brought, this is no longer going to repeat them.Need explanation
It is that the display device includes but is not limited to LED display modules, LED display, LED mosaic screens and LED floor tile screens.It is aobvious with LED
Show exemplified by module, the mounting structure is housing, and then LED encapsulation structure is among housing.
The present invention also provides a kind of lighting device, and incorporated by reference to Fig. 1 and Fig. 3, in one embodiment, the lighting device includes solid
Determine structure and be installed in the LED encapsulation structure of fixed structure, LED encapsulation structure uses the COB-LED of as above all embodiments
Method for packing is made.Because the LED encapsulation structure of the present embodiment employs whole technical schemes of above-mentioned all embodiments, therefore
All beneficial effects that the same technical scheme with above-described embodiment is brought, this is no longer going to repeat them.Need explanation
It is that the lighting device includes but is not limited to LED street lamp, LED ceiling lamp, LED spotlight and LED pendent lamps.Using LED ceiling lamp as
Example, the fixed structure is lamp housing, and then LED encapsulation structure is among lamp housing.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every at this
Under the inventive concept of invention, the equivalent structure transformation made using description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical fields in the scope of patent protection of the present invention.
Claims (10)
1. a kind of COB-LED method for packing, it is characterised in that as follows including step：
LED lamp panel is provided, it is multiple in the side plate face of the circuit board that the LED lamp panel includes circuit board and array
Pixel, wherein, each pixel includes an at least LED chip；
A mould is provided, the mould has opens up spaced multiple nibs in a plane, the plane；
Encapsulating material is filled in the multiple nib；
The plate face of the LED lamp panel is fitted with the plane of the mould, and by each institute in the LED lamp panel
State pixel to pour into the encapsulating material in nib described in one, so that the encapsulating material cladding in nib described in one
Pixel described in one.
2. COB-LED method for packing as claimed in claim 1, it is characterised in that fill package material in the multiple nib
In the step of material, specifically include：
Placed in the plane of the mould and spaced multiple hollow-out parts are opened up on mask plate, the mask plate, it is each
Nib described in the hollow-out parts correspondence one is set；
The encapsulating material is printed on the mask plate, and the encapsulating material is filled described by the multiple hollow-out parts
Multiple nibs.
3. COB-LED method for packing as claimed in claim 2, it is characterised in that by strip scraper in the mask plate
Encapsulating material described in wiper on surface, and print the encapsulating material.
4. COB-LED method for packing as claimed in claim 1, it is characterised in that fill package material in the multiple nib
In the step of material, specifically include：
Point gum machine is provided；
The point gum machine in the multiple nib of the mould one by one dispensing and fill the encapsulating material.
5. COB-LED method for packing as claimed in claim 1, it is characterised in that also as follows including step：
The LED lamp panel and the mould after laminating is inserted into oven for baking；
It is baked to after the encapsulating material solidification, takes out and separate the mould and the LED lamp panel.
6. COB-LED method for packing as claimed in claim 1, it is characterised in that also as follows including step：
Before the encapsulating material is filled, the multiple nib of the mould is cleaned；
Injection or coating releasing agent in the multiple nib after cleaning.
7. COB-LED method for packing as claimed in claim 1, it is characterised in that each nib is asymmetrical shape, and
The package lens of pixel shaping described in encapsulating material cladding one in each nib are on a reference plane in non-right
Claim to set, wherein, the reference plane is common for a normal plane or multiple LED chips for the only LED chip of the pixel
Some normal planes.
8. the COB-LED method for packing as described in claim 1 to 7 any one, it is characterised in that pixel described in adjacent two
Spacing between point is 0.6mm~2mm.
9. a kind of display device, including mounting structure and the LED encapsulation structure for being installed in the mounting structure, its feature exist
In the LED encapsulation structure is made using the COB-LED method for packing described in claim 1 to 8 any one.
10. a kind of lighting device, including fixed structure and the LED encapsulation structure for being installed in the fixed structure, its feature exist
In the LED encapsulation structure is made using the COB-LED method for packing described in claim 1 to 8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710388368.3A CN107256921A (en) | 2017-05-27 | 2017-05-27 | COB LED encapsulation methods, display device and lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710388368.3A CN107256921A (en) | 2017-05-27 | 2017-05-27 | COB LED encapsulation methods, display device and lighting device |
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| CN107256921A true CN107256921A (en) | 2017-10-17 |
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| CN201710388368.3A Pending CN107256921A (en) | 2017-05-27 | 2017-05-27 | COB LED encapsulation methods, display device and lighting device |
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| CN108109533A (en) * | 2017-12-15 | 2018-06-01 | 深圳市晶台股份有限公司 | A kind of method for packing for realizing LED display modules |
| CN109256448A (en) * | 2018-08-07 | 2019-01-22 | 广州市巨宏光电有限公司 | A kind of LED light moulding process |
| CN111331677A (en) * | 2020-03-30 | 2020-06-26 | 镇江锆源传感科技有限公司 | Blanking and filling method of cast membrane |
| CN111754887A (en) * | 2020-06-24 | 2020-10-09 | 深圳市艾比森光电股份有限公司 | Display module, manufacturing method thereof and display |
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Application publication date: 20171017 |