CN109244220A - A kind of LED luminescent panel and preparation method thereof, LED display - Google Patents
A kind of LED luminescent panel and preparation method thereof, LED display Download PDFInfo
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- CN109244220A CN109244220A CN201811000515.6A CN201811000515A CN109244220A CN 109244220 A CN109244220 A CN 109244220A CN 201811000515 A CN201811000515 A CN 201811000515A CN 109244220 A CN109244220 A CN 109244220A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 125000006850 spacer group Chemical group 0.000 claims abstract description 51
- 239000011241 protective layer Substances 0.000 claims abstract description 32
- 239000003292 glue Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 230000035699 permeability Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 210000000145 septum pellucidum Anatomy 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of LED luminescent panels and preparation method thereof, LED display.The LED luminescent panel includes: transparent circuit substrate, multiple LED bare chips, transparent spacer layer, reflecting layer, transparent refractive glue-line and transparent protective layer；Transparent spacer layer is located in transparent circuit substrate, and transparent spacer layer includes multiple through-holes, and through-hole exposes the part of the surface of transparent circuit substrate through transparent spacer layer, is equipped with a LED bare chip in the transparent circuit substrate that each through-hole exposes；Reflecting layer is set on the side wall of through-hole；Transparent refractive glue-line is filled in through-hole and side of the transparent spacer layer far from transparent circuit substrate；Transparent protective layer is located at side of the transparent refractive glue-line far from transparent circuit substrate；Wherein, the refractive index of transparent refractive glue-line is greater than 1.5.Technical solution provided in an embodiment of the present invention increases the permeability of LED display, improves the display effect of LED display.
Description
Technical field
The present embodiments relate to transparency LED display screen technology more particularly to a kind of LED luminescent panel and its preparation sides
Method, LED display.
Background technique
The display effect of transparency LED display screen is good, and has the advantages that not block vision, increasingly the blueness by market
It looks at, is widely used in the high-end occasions such as market, airport, bank, luxury goods shop.
In the prior art transparency LED display screen include transparent circuit substrate, multiple envelopes for being installed in transparent circuit substrate
The LED bare chip and transparent protective layer installed.Due to being packaged without additional encapsulating structure to LED bare chip,
Therefore transparent protective layer can be directly arranged at multiple sides of the LED bare chip far from transparent substrate, so that transparent circuit substrate
There are air layers between transparent protective layer, and the refractive index of air is lower, and reflective phenomenon easily occurs for transparent protective layer, lead to LED
The permeability of display screen declines, and influences its display effect.
Summary of the invention
The present invention provides a kind of LED luminescent panel and preparation method thereof, LED display, to increase the logical of LED display screen
Permeability promotes the display effect of LED display.
In a first aspect, the embodiment of the invention provides a kind of LED luminescent panel, the LED luminescent panel includes:
Transparent circuit substrate, multiple LED bare chips, transparent spacer layer, reflecting layer, transparent refractive glue-line and transparency protected
Layer；
The transparent spacer layer is located in the transparent circuit substrate, and the transparent spacer layer includes multiple through-holes, described
Through-hole exposes the part of the surface of the transparent circuit substrate through the transparent spacer layer, and each through-hole exposes described
One LED bare chip is installed on bright circuit substrate；
The reflecting layer is set on the side wall of the through-hole；
The transparent refractive glue-line is filled in the through-hole and the transparent spacer layer is far from the transparent circuitry base
The side of plate；
The transparent protective layer is located at the side of the transparent refractive glue-line far from the transparent circuit substrate；
Wherein, the refractive index of the transparent refractive glue-line is greater than 1.5.
Second aspect, the embodiment of the invention also provides a kind of LED display, the LED display includes above-mentioned first
LED luminescent panel described in aspect.
The third aspect, the embodiment of the invention also provides a kind of preparation method of LED luminescent panel, the preparation method packet
It includes:
One transparent circuit substrate is provided；
At least one LED bare chip is installed in the transparent circuit substrate；
One transparent insulation film is provided, the LED bare chip is corresponded on the transparent insulation film and forms multiple through-holes,
To obtain transparent spacer layer；
The transparent spacer layer is attached at the transparent circuit substrate to be equipped on the surface of LED bare chip, so that respectively
The LED bare chip exposes from the corresponding through-hole；
Reflecting layer is formed on the side wall of the through-hole；
In the through-hole and the transparent spacer layer far from the transparent circuit board side formed transparent refractive glue
Layer；
Transparent protective layer is covered far from the side of the transparent substrate in the transparent refractive glue-line.
LED luminescent panel provided in an embodiment of the present invention includes transparent circuit substrate, multiple LED bare chips, transparent isolation
Layer, reflecting layer, transparent refractive glue-line and transparent protective layer, transparent spacer layer are located in transparent circuit substrate, transparent spacer layer
Including multiple through-holes, through-hole exposes the part of the surface of transparent circuit substrate through transparent spacer layer, and each through-hole exposes transparent
One LED bare chip is installed, reflecting layer is set on the side wall of through-hole, and transparent refractive glue-line is filled in through-hole on circuit substrate
Side of the interior and transparent spacer layer far from transparent circuit substrate, transparent protective layer are located at transparent refractive glue-line far from transparent circuitry
The side of substrate, wherein the refractive index of transparent refractive glue-line is greater than 1.5.Above-mentioned LED light emitting panel structure transparent spacer layer with
Transparent refractive glue-line is formed between transparent protective layer, which is filled with for accommodating the logical of installation LED bare chip
On the one hand hole encapsulates LED bare chip, on the other hand make do not have air between transparent spacer layer and transparent protective layer
Presence, reduce the reflective amount of transparent protective layer, and then increase the permeability of LED display, improve LED display
Display effect.
Detailed description of the invention
In order to more clearly illustrate the technical scheme of the exemplary embodiment of the present invention, below to required in description embodiment
The attached drawing to be used does a simple introduction.Obviously, the attached drawing introduced is present invention a part of the embodiment to be described
Attached drawing, rather than whole attached drawings without creative efforts, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of schematic top plan view of LED luminescent panel provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of the section structure of the dotted line AB along Fig. 1；
Fig. 3 is the schematic top plan view of another LED luminescent panel provided in an embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of LED display provided in an embodiment of the present invention；
Fig. 5 is a kind of flow diagram of the preparation method of LED luminescent panel provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
In description, only some but not all contents related to the present invention are shown in the drawings.Exemplary reality is being discussed in greater detail
It should be mentioned that some exemplary embodiments are described as the processing or method described as flow chart before applying example.Although
Operations (or step) are described as the processing of sequence by flow chart, but many of these operations can be by concurrently, concurrently
Ground is implemented simultaneously.In addition, the sequence of operations can be rearranged.The processing when its operations are completed can be by
It terminates, it is also possible to have the additional step being not included in attached drawing.It is described processing can correspond to method, function, regulation,
Subroutine, subprogram etc..
Fig. 1 is a kind of schematic top plan view of LED luminescent panel provided in an embodiment of the present invention.Fig. 2 is the dotted line along Fig. 1
The schematic diagram of the section structure of AB.It should be noted that for guarantee attached drawing clarity, Fig. 1 be not shown transparent spacer layer 200 with
And transparent protective layer 400.As depicted in figs. 1 and 2, LED luminescent panel includes transparent circuit substrate 100, multiple LED bare chips
500, transparent spacer layer 200, reflecting layer 600, transparent refractive glue-line 300 and transparent protective layer 400, the transparent spacer layer
200 are located in the transparent circuit substrate 100, and the transparent spacer layer 200 includes multiple through-holes 201, and the through-hole 201 runs through
The transparent spacer layer 200 exposes the part of the surface of the transparent circuit substrate 100, and each through-hole 201 exposes described
One LED bare chip 500 is installed, the reflecting layer 600 is set to the through-hole 201 in transparent circuit substrate 100
On side wall, the transparent refractive glue-line 300 is filled in the through-hole 201 and the transparent spacer layer 200 is far from described
The side of bright circuit substrate 100, the transparent protective layer 400 are located at the transparent refractive glue-line 300 far from the transparent circuitry
The side of substrate 100, wherein the refractive index of the transparent refractive glue-line 300 is greater than 1.5.
It should be noted that unencapsulated LED bare chip 500 is small-sized, visually it is difficult to differentiate, therefore can intensively pacifies
Dress, greatly improves the pixel density of LED display.
It should also be noted that, transparent refractive glue-line 300 can be packaged LED bare chip 500, steam is avoided to influence
The performance of LED bare chip 500, and the space between transparent refractive glue-line 300 and transparent protective layer 400 is occupied, so that transparent
There is no air between refraction glue-line 300 and transparent protective layer 400, improves the permeability of LED display.
In addition, being used to form the refraction of transparent refractive glue-line 300 when the refractive index of transparent refractive glue-line 300 is greater than 1.5
Glue is high refraction glue, so that the light that LED bare chip 500 issues can be from transparent protective layer 400 after reflecting layer 600 is reflected
It projects, without being reflected back in transparent refractive glue-line 300 at the interface that transparent refractive glue-line 300 is contacted with transparent protective layer 400,
It ensure that the light output rating with higher that LED bare chip 500 issues.
LED luminescent panel provided in this embodiment includes transparent circuit substrate 100, multiple LED bare chips 500, septum pellucidum
Absciss layer 200, reflecting layer 600, transparent refractive glue-line 300 and transparent protective layer 400, transparent spacer layer 200 are located at transparent circuitry
On substrate 100, transparent spacer layer 200 includes multiple through-holes 201, and through-hole 201 exposes transparent circuitry base through transparent spacer layer 200
The part of the surface of plate 100 is equipped with a LED bare chip 500 in the transparent circuit substrate 100 that each through-hole 201 exposes, instead
It penetrates layer 600 to be set on the side wall of through-hole 201, transparent refractive glue-line 300 is filled in through-hole 201 and transparent spacer layer 200
Side far from transparent circuit substrate 100, transparent protective layer 400 are located at transparent refractive glue-line 300 far from transparent circuit substrate 100
Side, wherein the refractive index of transparent refractive glue-line 300 be greater than 1.5.Above-mentioned LED light emitting panel structure is in transparent spacer layer
Transparent refractive glue-line 300 is formed between 200 and transparent protective layer 400, which is filled with for accommodating installation
The through-hole 201 of LED bare chip 500, on the one hand encapsulates LED bare chip 500, on the other hand makes transparent spacer layer
There is no the presence of air between 200 and transparent protective layer 400, reduce the reflective amount of transparent protective layer 400, and then increases
The permeability of LED display improves the display effect of LED display.
Optionally, the Thickness in the reflecting layer 600 may range from 10-20 μm.It should be noted that guarantee
LED bare chip 500 can expose from through-hole 201, and setting a certain distance is needed between LED bare chip 500 and reflecting layer 600,
Therefore, the blocked up meeting of the thickness in reflecting layer 600 is so that the increase of 201 size of through-hole, is unfavorable for transparent refractive layer in transparent circuit substrate
Attaching on 100, on the other hand, the thickness in reflecting layer 600 it is excessively thin and will lead to can not effectively reflect LED bare chip 500 sending
Light, so preferably setting reflecting layer 600 Thickness range be 10-20 μm.
Illustratively, the reflecting layer 600 can be formed using reflection glue.Specifically, reflection glue can be coated on logical
On 201 side wall of hole, the thickness in reflecting layer 600 is relatively easy to control when forming reflecting layer 600 using reflection glue.In other of the present embodiment
In embodiment, reflecting layer 600, this reality can also be formed with the structure of reflective character using reflective film or reflecting plate etc.
It applies example and this is not especially limited.
With continued reference to Fig. 1, the orientation of the transparent circuit substrate 100 and the transparent protective layer 400 is first party
To the through-hole 201 can be circle perpendicular to the cross sectional shape of the first direction.Optionally, the through-hole 201 perpendicular to
The cross sectional shape of the first direction may be quadrangle, as shown in Figure 3.
It it should be noted that circuit substrate is generally rectangular in shape in LED bare chip 500, therefore is so that LED naked core
More uniformly, through-hole 201 is preferably arranged perpendicular to the section of first direction in the distance between 500 edge of piece and reflecting layer 600
Shape be round or quadrangle.It is understood that through-hole 201 is perpendicular in the other embodiments of the present embodiment
The section in one direction can also be other shapes.
With continued reference to Fig. 2, the transparent spacer layer 200 is first close to the surface of 100 side of transparent circuit substrate
Surface, the side wall of the through-hole 201 and the angle α value range of the first surface are 45 ° -90 °.
It should be noted that the light that such design enables LED bare chip 500 to issue is after reflecting layer 600 is reflected
It projects from 400 side of transparent protective layer, and will not be interfered with each other between the light of the sending of adjacent LED bare chip 500, ensure that LED
Display screen has good display effect.
Optionally, as shown in Fig. 2, the distance between the edge of the LED bare chip 500 and the reflecting layer 600 K value
It may range from being greater than 0 less than or equal to 90 μm.It should be noted that between the edge and reflecting layer 600 of LED bare chip 500
The excessive light that will lead to the sending of LED bare chip 500 of distance K is penetrated from transparent circuit substrate 100 far from the side of transparent protective layer 400
Out, the effective rate of utilization of light source is reduced, therefore, the edge and reflecting layer 600 of LED bare chip 500 is preferably arranged in the present embodiment
The distance between K value range be greater than 0 be less than or equal to 90 μm.
Illustratively, the material of the transparent spacer layer 200 can be PET or PC.It is understood that transparent spacer layer
200 for separating each 500 region of LED bare chip, therefore transparent and insulation solid material can be used in being formed
Bright separation layer 200, the present embodiment is not especially limited this.
Optionally, the Thickness of the transparent spacer layer 200 may range from 0.2-0.6mm.Transparent spacer layer 200
Thickness will increase the integral thickness of LED display later, and the excessively thin size that will lead to reflecting layer 600 is smaller, can not effectively reflect
The light that LED bare chip 500 issues, therefore, the Thickness range that transparent spacer layer 200 is preferably arranged in the present embodiment is 0.2-
0.6mm。
Fig. 4 is a kind of structural schematic diagram of LED display provided in an embodiment of the present invention.As shown in figure 4, LED display
10 include LED luminescent panel 20 described in any embodiment of that present invention.
Fig. 5 is a kind of flow diagram of the preparation method of LED luminescent panel provided in an embodiment of the present invention.Such as Fig. 5 institute
Show, the preparation method of LED luminescent panel can specifically include as follows:
Step 1 provides a transparent circuit substrate.
At least one LED bare chip is installed in the transparent circuit substrate by step 2.
Step 3, provide a transparent insulation film, corresponded on the transparent insulation film LED bare chip formed it is more
A through-hole, to obtain transparent spacer layer.
Illustratively, multiple through-holes can be formed using laser cutting technique.
The transparent spacer layer is attached at the transparent circuit substrate and is equipped on the surface of LED bare chip by step 4,
So that each LED bare chip exposes from the corresponding through-hole.
Step 5 forms reflecting layer on the side wall of the through-hole.
Illustratively, refracting layer can be formed using reflection glue, specifically, can will be reflected using techniques such as inkjet printings
Glue is coated on through-hole side wall.
Step 6, in the through-hole and the transparent spacer layer formed far from the side of the transparent circuit board it is transparent
Reflect glue-line.
Step 7 covers transparent protective layer far from the side of the transparent substrate in the transparent refractive glue-line.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of LED luminescent panel characterized by comprising
Transparent circuit substrate, multiple LED bare chips, transparent spacer layer, reflecting layer, transparent refractive glue-line and transparent protective layer；
The transparent spacer layer is located in the transparent circuit substrate, and the transparent spacer layer includes multiple through-holes, the through-hole
Expose the part of the surface of the transparent circuit substrate, the transparent electricity that each through-hole exposes through the transparent spacer layer
One LED bare chip is installed on base board；
The reflecting layer is set on the side wall of the through-hole；
The transparent refractive glue-line is filled in the through-hole and the transparent spacer layer is far from the transparent circuit substrate
Side；
The transparent protective layer is located at the side of the transparent refractive glue-line far from the transparent circuit substrate；
Wherein, the refractive index of the transparent refractive glue-line is greater than 1.5.
2. LED luminescent panel according to claim 1, which is characterized in that the Thickness range in the reflecting layer is 10-
20μm。
3. LED luminescent panel according to claim 1, which is characterized in that the reflecting layer is formed using reflection glue.
4. LED luminescent panel according to claim 1, which is characterized in that the transparent circuit substrate and the transparent guarantor
The orientation of sheath is first direction, and the through-hole is round or quadrangle perpendicular to the cross sectional shape of the first direction.
5. LED luminescent panel according to claim 1, which is characterized in that the transparent spacer layer 200 is close to described transparent
The surface of circuit substrate side is first surface, the angle value range of the side wall of the through-hole and the first surface is 45 °-
90°。
6. LED luminescent panel according to claim 1, which is characterized in that the edge of the LED bare chip and the reflection
The distance between layer value range is to be less than or equal to 90 μm greater than 0.
7. LED luminescent panel according to claim 1, which is characterized in that the material of the transparent spacer layer be PET or
PC。
8. LED luminescent panel according to claim 1, which is characterized in that the Thickness range of the transparent spacer layer
For 0.2-0.6mm.
9. a kind of LED display, which is characterized in that including the described in any item LED luminescent panels of claim 1-8.
10. a kind of preparation method of LED luminescent panel characterized by comprising
One transparent circuit substrate is provided；
At least one LED bare chip is installed in the transparent circuit substrate；
One transparent insulation film is provided, the LED bare chip is corresponded on the transparent insulation film and forms multiple through-holes, to obtain
Obtain transparent spacer layer；
The transparent spacer layer is attached at the transparent circuit substrate to be equipped on the surface of LED bare chip, so that each described
LED bare chip exposes from the corresponding through-hole；
Reflecting layer is formed on the side wall of the through-hole；
In the through-hole and the transparent spacer layer far from the transparent circuit board side formed transparent refractive glue-line；
Transparent protective layer is covered far from the side of the transparent substrate in the transparent refractive glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811000515.6A CN109244220A (en) | 2018-08-30 | 2018-08-30 | A kind of LED luminescent panel and preparation method thereof, LED display |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811000515.6A CN109244220A (en) | 2018-08-30 | 2018-08-30 | A kind of LED luminescent panel and preparation method thereof, LED display |
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| CN109244220A true CN109244220A (en) | 2019-01-18 |
Family
ID=65069829
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| CN201811000515.6A Pending CN109244220A (en) | 2018-08-30 | 2018-08-30 | A kind of LED luminescent panel and preparation method thereof, LED display |
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Cited By (5)
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| CN109741685A (en) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | A kind of LED display module and preparation method thereof |
| CN109920335A (en) * | 2019-04-16 | 2019-06-21 | 鸿创柔幕光电科技有限公司 | COF flexible display screen |
| CN110136595A (en) * | 2019-05-17 | 2019-08-16 | 上海九山电子科技有限公司 | A kind of display panel and preparation method thereof, display device |
| CN113078180A (en) * | 2021-06-07 | 2021-07-06 | 苏州华星光电技术有限公司 | Display panel and display device |
| CN114023866A (en) * | 2021-10-19 | 2022-02-08 | 武汉大学 | Mini-LED chip array for automobile illumination and manufacturing method thereof |
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