CN207868224U - A kind of more glasss of LED COB display screen modules - Google Patents
A kind of more glasss of LED COB display screen modules Download PDFInfo
- Publication number
- CN207868224U CN207868224U CN201820056863.4U CN201820056863U CN207868224U CN 207868224 U CN207868224 U CN 207868224U CN 201820056863 U CN201820056863 U CN 201820056863U CN 207868224 U CN207868224 U CN 207868224U
- Authority
- CN
- China
- Prior art keywords
- display screen
- cup
- wiring board
- chip
- glasss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 21
- 238000005538 encapsulation Methods 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910010272 inorganic material Inorganic materials 0.000 claims description 2
- 239000011147 inorganic material Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 229910052573 porcelain Inorganic materials 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The utility model is related to a kind of more glasss of LED COB display screen modules,Specifically,On two-sided or multilayer video screen wiring board,Control element is welded overleaf by SMT,By multigroup R,G,The LED chip of B carries out die bond bonding wire on display screen wiring board,Or by multigroup R,G,B flip-chips flip chip bonding is on display screen wiring board,It is applied with glue in the back with multiple holes,The chip gap location being attached on display screen wiring board,Multiple hole cups are formed after solidification,In the chip that hole bottom of a cup portion has had and wiring board is connected,Then apply encapsulation glue in cup again,After being heating and curing,More glasss of LED COB display screen modules have been made,The utility model is after first die bond bonding wire by the way of patch cup,Solves the cup very little in die bond bonding wire,Not the problem of not gone under die bond mouth and bonding wire porcelain mouth,It is made with the packaged type of COB apparent,More high density display screen.
Description
Technical field
The utility model is related to LED application fields, and in particular to a kind of more glasss of LED COB display screen modules.
Background technology
Existing display screen COB modules are all to encapsulate chip with the mode on mould top, and equipment investment is big, and packaging plastic is expensive.
For the defect and deficiency more than overcoming, the utility model takes the method for pasting cup with adhesive, first by multigroup R,
G, the LED chip of B carries out die bond bonding wire on display screen wiring board, and pasting a plate with holes in contraposition forms hole cup, R, G, B's
LED chip is on the wiring board in the cup of hole, then applies encapsulation glue in cup, avoids the high cost with high investment on mould top, and energy
Apparent, more high density display screen is made with the packaged type of COB, while by the way of pasting cup again after packaging and die bonding bonding wire,
It solves and has pasted cup before die bond bonding wire, in cup very little, the problem of not gone under die bond mouth and bonding wire porcelain mouth.
Utility model content
The utility model is related to a kind of more glasss of LED COB display screen modules, specifically, in two-sided or Multi-level display
Shield on wiring board, control element is welded overleaf by SMT, the LED chip of multigroup R, G, B, which are carried out die bond bonding wire, to be shown
Shield on wiring board, or by multigroup R, G, B flip-chip flip chip bonding on display screen wiring board, is applied in the back with multiple holes
In addition glue, the chip gap location being attached on display screen wiring board, form multiple hole cups, have had in hole bottom of a cup portion after solidification
With the chip of wiring board conducting, then applies encapsulation glue in cup again, after being heating and curing, that is, more glasss of LED COB have been made
Display screen module, the utility model by the way of patch cup, solve cup very little, die bond in die bond bonding wire after first die bond bonding wire
The problem of not gone under mouth and bonding wire porcelain mouth makes apparent, more high density display screen with the packaged type of COB.
A kind of more glasss of LED COB display screen modules are provided according to the utility model, specifically, two-sided or more
On layer display screen wiring board, control element is welded overleaf by SMT, the LED chip of multigroup R, G, B are subjected to die bond bonding wire
On display screen wiring board, or by multigroup R, G, B flip-chip flip chip bonding on display screen wiring board, in the plate with multiple holes
The back side is applied with glue, the chip gap location being attached on display screen wiring board, and multiple holes cup is formed after solidification, hole bottom of a cup portion
Then chip through having and wiring board is connected applies encapsulation glue in cup, after being heating and curing, that is, has been made more glasss again
LED COB display screen modules.
A kind of more glasss of LED COB display screen modules are additionally provided according to the utility model, including：Display screen control member
Part；Display screen pcb board；Paste the cured adhesive of hole cup plate；Paste the hole cup that plate with holes is formed；It is encapsulated in bottom of a cup
R, G, B LED chip；Cured encapsulation glue；It is characterized in that, the cured adhesive for pasting hole cup plate is to use
Light transmission glue or be lighttight glue, the resin material for pasting the hole cup light transmission that plate with holes is formed is made
Or be made of lighttight resin material or be made of metal material or be use nonmetallic inorganic material
Made of material, one group of R, G, B chip or be to have multigroup R.G.B chips in a cup in a cup, chip be positive cartridge chip or
Person is flip-chip, and the display screen control element is welded on the display screen pcb board back side by SMT.
A preferred embodiment according to the present utility model, a kind of more glasss of the LED COB display screen modules, feature
It is, the display screen pcb board is the wiring board of two-sided wiring board or multilayer.
A preferred embodiment according to the present utility model, a kind of more glasss of the LED COB display screen modules, feature
It is, the cured encapsulation glue is the encapsulation glue of epoxy or is silica gel.
Below in the description of the drawings and specific embodiments, will illustrate one or more embodiments of the utility model
Details.
Description of the drawings
By reading this specification in conjunction with the following drawings, the feature, objects and advantages of the utility model will become more to show
And be clear to, it is as follows to the brief description of accompanying drawing.
Fig. 1 is that control element is welded on to the section on display screen wiring board by SMT at the back side of display screen wiring board
Schematic diagram.
Fig. 2 is section by the LED chip die bond bonding wire of multigroup R, G, B on display screen wiring board on display screen wiring board
Face schematic diagram.
Fig. 3 is on display screen wiring board that the LED chip die bond bonding wire of multigroup R, G, B is flat on display screen wiring board
Face schematic diagram.
Fig. 4 is the floor map of the more glasss of cup plates made.
Fig. 5 is that more glasss of cup plates align the floor map being pasted together with the display screen wiring board after die bond bonding wire.
Fig. 6 is that more glasss of cup plates align the schematic cross-section being pasted together with the display screen wiring board after die bond bonding wire.
The schematic cross-section for the LED COB display screen modules that Fig. 7 is more glasss.
Specific implementation mode
The utility model will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some preferred implementation sides
Formula, claim to the utility model simultaneously do not have any restrictions.
Control element 2 is welded on by display screen line using traditional SMT patch modes at the back side of display screen wiring board 1
On the back side of road plate 1 (as shown in Figure 1).
By the display screen wiring board 1 for having welded control element 2 as shown in Figure 1, it is placed on the fixture for helping light DB382 bonders
On, by 3 die bond of LED chip of multigroup R, G, B on display screen wiring board 1, then baking-curing passes through ASM-AB350 bonding wires
For machine with metal wire 4 by the LED chip 2 of multigroup R, G, B, bonding wire connects (such as Fig. 2, Fig. 3 in the correspondence pad in assist side 1
It is shown).
With the glass-fiber-plate 5 of the FR4 black resins of 0.4~0.6mm thickness, according to the position of design black resin glass-fiber-plate
It drills on 5, forms hole cup 5.1, lighttight more glasss of cup plates (as shown in Figure 4) have thus been made.
Lighttight more glasss of cups plate one side dispenser point is encapsulated into glue on cup plate, then with it is aobvious after die bond bonding wire
The contraposition of display screen wiring board 1 is pasted together, and more glasss of cup plates have been attached on the gap of every group of chip, and being formed in a cup 5.1 has
The LED chip 3 of one group of R, G, B, then the baking-curing in oven, keeps glue that cup plate and display screen wiring board 1 is strong bonded
It cements (as shown in Figure 5, Figure 6), then encapsulation glue 6 is uniformly put in each cup 5.1 with dispenser, baking-curing makes
At more glasss as shown in FIG. 6 of LED COB display screen modules.
The utility model takes the method for pasting cup with adhesive, and the LED chip of multigroup R, G, B, which are first carried out die bond bonding wire, exists
On display screen wiring board, to paste a plate with holes in contraposition and form hole cup, the LED chip of R, G, B is on the wiring board in the cup of hole,
Again in cup apply encapsulation glue, avoid the high cost with high investment on mould top, but can be made with the packaged type of COB it is apparent,
More high density display screen, while by the way of pasting cup again after packaging and die bonding bonding wire, solving and having pasted cup before die bond bonding wire,
When cup very little, the problem of not gone under die bond mouth and bonding wire porcelain mouth.
The specific embodiment of a kind of more glasss of LED COB display screen modules carries out the utility model above in association with attached drawing
Detailed description.It will be understood by those skilled in the art, however, that the above is merely illustrative and describes some specifically
Embodiment to this with novel range, especially the scope of the claims, and does not have any restrictions.
Claims (3)
1. a kind of more glasss of LED COB display screen modules, including：
Display screen control element；
Display screen pcb board；
Paste the cured adhesive of hole cup plate；
Paste the hole cup that plate with holes is formed；
It is encapsulated in R, G, B LED chip of bottom of a cup；
Cured encapsulation glue；
It is characterized in that, the glue of the cured adhesive light transmission that is for pasting hole cup plate or be lighttight glue,
It is described paste the hole cup that plate with holes is formed be made of the resin material of light transmission or be with lighttight resin material system
At or be made of metal material or be one group of R, G, B core in a cup with made of non-metal inorganic material
Piece or be to have multigroup R.G.B chips in a cup, chip are positive cartridge chip either flip-chip, the display screen control
Element processed is welded on the display screen pcb board back side by SMT.
2. a kind of more glasss of LED COB display screen modules according to claim 1, which is characterized in that the display screen
Pcb board is the wiring board of two-sided wiring board or multilayer.
3. a kind of more glasss of LED COB display screen modules according to claim 1, which is characterized in that described is cured
Encapsulation glue be the encapsulation glue of epoxy or be silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820056863.4U CN207868224U (en) | 2018-01-09 | 2018-01-09 | A kind of more glasss of LED COB display screen modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820056863.4U CN207868224U (en) | 2018-01-09 | 2018-01-09 | A kind of more glasss of LED COB display screen modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207868224U true CN207868224U (en) | 2018-09-14 |
Family
ID=63461636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820056863.4U Expired - Fee Related CN207868224U (en) | 2018-01-09 | 2018-01-09 | A kind of more glasss of LED COB display screen modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207868224U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109741685A (en) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | A kind of LED display module and preparation method thereof |
| CN110021693A (en) * | 2018-01-09 | 2019-07-16 | 王定锋 | A kind of more glasss LED COB display screen module and preparation method thereof |
-
2018
- 2018-01-09 CN CN201820056863.4U patent/CN207868224U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021693A (en) * | 2018-01-09 | 2019-07-16 | 王定锋 | A kind of more glasss LED COB display screen module and preparation method thereof |
| CN109741685A (en) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | A kind of LED display module and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180914 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |