CN101474947A - Plastic packaging technique of automobile tire pressure sensor based on system-in-package - Google Patents
Plastic packaging technique of automobile tire pressure sensor based on system-in-package Download PDFInfo
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- CN101474947A CN101474947A CNA2009100366356A CN200910036635A CN101474947A CN 101474947 A CN101474947 A CN 101474947A CN A2009100366356 A CNA2009100366356 A CN A2009100366356A CN 200910036635 A CN200910036635 A CN 200910036635A CN 101474947 A CN101474947 A CN 101474947A
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- pcb board
- lead frame
- pressure sensor
- chip
- tire pressure
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Abstract
The invention discloses a plastic packaging process for an automobile tire pressure sensor of system level packaging. The pressure sensor is combined with a lead wire frame by leading in a PCB board. Chips can be simultaneously placed at both sides of the PCB board, and the chips on the front surface and the back surface are connected through a printing circuit of the PCB board so as to expand space in a packaging body and achieve higher integration. The process specifically comprises: utilizing welding materials to fix the PCB board on the lead wire frame, and utilizing an injection molding process to carry out first dam packaging on the welding material part of the PCB board contacting the lead wire frame so as to further fix the PCB board and the lead wire frame; then, placing different components on both surfaces of the PCB board respectively, such as passive elements of MUC chips, RF chips, sensors, resonators, resistors and the like; and finally dispensing COB soft glue so as to carry out second packaging.
Description
Technical field
The present invention relates to the packaging technology of tire pressure monitoring device, specifically refer to the plastic package process of tire pressure sensor.
Background technology
Because four inductions and the emitting module of tire pressure sensor are installed in four tires of automobile, and installation reliability is had high requirement, generally all adopt the packing forms of SOP, pin is welded on inside tires.The product SP of Infineon series adopts the encapsulation external form of SOP, yet the lead frame that uses the SOP packing forms has certain restriction to the quantity of inner interconnecting line; And the advantage of BGA encapsulation is to have used multilager base plate, and most interconnecting line is imbedded in the substrate, can realize complex inner structure more, but the soldering reliability of BGA encapsulation is low than the SOP encapsulation, so the applicability in the TPMS product is very low.Therefore, all factors have restricted the volume and the function of existing TPMS product, are difficult to the integrated level that reaches higher.
Summary of the invention
The invention discloses and use lead frame to combine with pcb board, mount the plastic packaging method of components and parts at tow sides, purpose is with placing one times of the space enlargement of chip and components and parts in the encapsulation, with the higher integrated level of realization.
Traditional SOP encapsulating products uses metal lead wire frame, and chip is installed in a side, interconnects by bonding wire again.So just limit the number of built-in chip and the bar number of interconnecting line, wanted to realize higher integrated level, will solve the breakthrough of inner structure earlier.For the TPMS product that can realize that integrated level is higher, the present invention introduces the method for secondary encapsulation, by introducing pcb board, utilize the printed wire on the PCB to come the instead of part pin interconnection, meanwhile, can place chip simultaneously in the both sides of pcb board, realize interconnection between the tow sides chip, expand the space in the packaging body by the printed wire of pcb board.
For achieving the above object, the automobile tire pressure sensor plastic package process of system in package of the present invention, by introducing pcb board it is combined with lead frame, both sides at pcb board can be placed chip simultaneously, realize interconnection between the tow sides chip by the printed wire of pcb board, with expansion encapsulation intracorporeal space, thereby realize higher integrated level, step is as follows:
(1). utilize scolder that pcb board is fixed on the lead frame, utilize particular manufacturing craft that the scolder that pcb board contacts with lead frame is partly carried out the encapsulation first time with LCP glue injection molding way, with further fixedly pcb board and lead frame.
(2). after utilizing scolder that pcb board is fixed,, enclose the plastic cement box dam of building about 1mm for cooperating the printed wire on the pcb board;
(3). after the PCB two sides is placed MCU chip, RF chip and sensor, resonator respectively, re-use COB flexible glue point glue and carry out sealing the second time then.
The further technical measures of the present invention are, can firmly fix pcb board and lead frame in order to guarantee a spot of scolder, on the lead frame also by some patterns of design to strengthen adhesiving effect.
Compare with traditional plastic package process, the present invention is by introducing pcb board, utilize the printed wire on the PCB to come the instead of part pin interconnection, and by the interconnection between the printed wire realization tow sides chip of pcb board, with placing one times of the space enlargement of chip and components and parts in the encapsulation, realize higher integrated level.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the present invention's flow scheme of plastic packaging for the first time;
Fig. 2 is the structural representation behind the present invention's plastic packaging first time;
Fig. 3 is integrated artistic realization flow figure of the present invention.
The specific embodiment
Referring to Fig. 1 and shown in Figure 2, utilize scolder 2 that pcb board 3 is fixed on the lead frame 1, by the design-calculated particular manufacturing craft, scolder 2 parts that pcb board 3 contact with lead frame 1 are carried out encapsulating the first time with LCP glue injection molding way then, purpose is further fixedly pcb board 3 and lead frame 1.In order to cooperate the printed wire on the pcb board 3, about 1mm, for guaranteeing to utilize a spot of plastic cement just can secure pcb board 3 and lead frame 1, some patterns of design be with the enhancing adhesiving effect on the lead frame 1 simultaneously with the thickness limits of plastic cement box dam 4.
Then, after the PCB two sides is placed MCU chip 5, RF chip 6 and sensor 8, resonator 9 respectively, re-use 7 glue of COB flexible glue and carry out sealing the second time.This special framework needs improved track could realize mounting of MCU chip 5 and RF chip 6, otherwise the heat transfer of framework is not enough or irregular, can influence the bond strength of chip.The present invention is by the special frame rail of design, and pcb board that can either the centre of support can conduct heat to pcb board again.
Adopt the advantage of plastic packaging mode of the present invention to be, can use the sensor that has had the plastic packaging external form, in the TPMS product that has in the market, the sensor chips that use bare chip more, make like this and in the encapsulation of road, back, must reserve and the extraneous passage that communicates to sensor, the manufacture difficulty of the encapsulating mould of Zeng Jiaing so greatly, also the precision to plastic package die has proposed very high request, because use the plastic packaging material plastic packaging, pressure is very big, and the mould that precision is not high is easy to allow sensor chip stain plastic packaging material when plastic packaging, and according to plastic package process of the present invention, can use the sensor of QFN encapsulation, and can not increase the size after the encapsulation.
Claims (2)
1. the plastic package process of the automobile tire pressure sensor of a system in package, by introducing pcb board, after making it and lead frame combining, the both sides that are implemented in pcb board can be placed chip simultaneously, realize interconnection between the tow sides chip by the printed wire of pcb board,, thereby realize higher integrated level with expansion encapsulation intracorporeal space, it is characterized in that described plastic package process comprises the following steps: at least
A, utilize scolder (2) that pcb board (3) is fixed on the lead frame 1, utilize particular manufacturing craft that the scolder that pcb board (3) contacts with lead frame (1) is partly carried out the encapsulation first time with LCP glue injection molding way, with further fixedly pcb board (3) and lead frame (1);
B, utilize scolder with pcb board fixing after, for cooperating the printed wire on the pcb board (3), enclose the plastic cement box dam of building about 1mm (4);
C, place MCU chip (5), RF chip (6) in the one side of PCB then, place sensor (8) and resonator (9), re-use COB flexible glue (7) some glue and carry out sealing the second time at the another side of PCB.
2. the plastic package process of the automobile tire pressure sensor of system in package according to claim 1, it is characterized in that, described scolder (2) can firmly fix pcb board (3) and lead frame (1) for guaranteeing it, and also designing on lead frame (1) further has pattern to strengthen adhesiving effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100366356A CN101474947A (en) | 2009-01-14 | 2009-01-14 | Plastic packaging technique of automobile tire pressure sensor based on system-in-package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100366356A CN101474947A (en) | 2009-01-14 | 2009-01-14 | Plastic packaging technique of automobile tire pressure sensor based on system-in-package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101474947A true CN101474947A (en) | 2009-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009100366356A Pending CN101474947A (en) | 2009-01-14 | 2009-01-14 | Plastic packaging technique of automobile tire pressure sensor based on system-in-package |
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| CN (1) | CN101474947A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101927669A (en) * | 2010-09-19 | 2010-12-29 | 广东省粤晶高科股份有限公司 | Packaging process for tire pressure monitoring device |
| CN104052244A (en) * | 2013-03-14 | 2014-09-17 | 珠海格力电器股份有限公司 | Power module |
| CN107820566A (en) * | 2015-06-15 | 2018-03-20 | Itm半导体有限公司 | Pressure sensor apparatus and its manufacture method |
| CN110687431A (en) * | 2019-10-09 | 2020-01-14 | 航天科工防御技术研究试验中心 | Monitoring assembly, system and method based on system-in-package device running state |
| CN117316786A (en) * | 2023-11-24 | 2023-12-29 | 华羿微电子股份有限公司 | Method for controlling poor insulation of fully encapsulated product |
-
2009
- 2009-01-14 CN CNA2009100366356A patent/CN101474947A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101927669A (en) * | 2010-09-19 | 2010-12-29 | 广东省粤晶高科股份有限公司 | Packaging process for tire pressure monitoring device |
| CN101927669B (en) * | 2010-09-19 | 2012-08-15 | 广东省粤晶高科股份有限公司 | Packaging process for tire pressure monitoring device |
| CN104052244A (en) * | 2013-03-14 | 2014-09-17 | 珠海格力电器股份有限公司 | Power module |
| CN104052244B (en) * | 2013-03-14 | 2019-12-13 | 珠海格力电器股份有限公司 | Power module |
| CN107820566A (en) * | 2015-06-15 | 2018-03-20 | Itm半导体有限公司 | Pressure sensor apparatus and its manufacture method |
| US10648880B2 (en) | 2015-06-15 | 2020-05-12 | Itm Semiconductor Co., Ltd. | Pressure sensor device and manufacturing method thereof |
| CN110687431A (en) * | 2019-10-09 | 2020-01-14 | 航天科工防御技术研究试验中心 | Monitoring assembly, system and method based on system-in-package device running state |
| CN117316786A (en) * | 2023-11-24 | 2023-12-29 | 华羿微电子股份有限公司 | Method for controlling poor insulation of fully encapsulated product |
| CN117316786B (en) * | 2023-11-24 | 2024-03-12 | 华羿微电子股份有限公司 | Method for controlling poor insulation of fully encapsulated product |
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Open date: 20090708 |