CN201345361Y - Lead wire frame - Google Patents
Lead wire frame Download PDFInfo
- Publication number
- CN201345361Y CN201345361Y CN 200820236953 CN200820236953U CN201345361Y CN 201345361 Y CN201345361 Y CN 201345361Y CN 200820236953 CN200820236953 CN 200820236953 CN 200820236953 U CN200820236953 U CN 200820236953U CN 201345361 Y CN201345361 Y CN 201345361Y
- Authority
- CN
- China
- Prior art keywords
- slide holder
- lead frame
- pin
- frame body
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a lead wire frame, which comprises a frame body. The frame body is formed by at least two units, each frame body unit is provided with a slide holder, the slide holder is engaged with a pin, one end of the pin is equipped with a welding portion, the pin is connected with the slide holder and the adjacent unit respectively via connecting structures. The lead wire frame is characterized in that a pit array is distributed on each slide holder, and each pit in the pit array is a structure with wide upper portion and narrow lower portion. The pit arrays are disposed on the slider holders of the lead frame, thereby enabling silver paste to melt more sufficiently, increasing combination property of the slide holder with semi-conductor elements, and guaranteeing the quality of the semi-conductor elements.
Description
Technical field
The utility model relates to a kind of parts that are used for semiconductor element, is specifically related to a kind of lead frame that is used for the semiconductor element encapsulation.
Background technology
In the last few years, the integrated level of semiconductor device was more and more higher, and its memory space, conversion speed and power increases rapidly, but volume is more and more littler.This trend has been quickened the development of semiconductor device packaging technique, and therefore, the importance of semiconductor device packaging technique has been subjected to people's attention.The high integration of semiconductor device and the increase of memory also make the quantity of input and output binding post also correspondingly increase, and make also that then the number of lead-in wire increases accordingly, and this layout that just requires to go between also must be meticulous.
Lead frame be in the semiconductor packages skeleton, it mainly is made up of two parts: slide holder and pin.Wherein for chip provides mechanical support, pin then is to connect chip to the outer electric path of encapsulation to slide holder in encapsulation process.The function of framework is conspicuous, and at first it has played the supporting role of encasing electronic components, prevent simultaneously resin the lead-in wire between gush out suddenly, for plastics provide support; Secondly it makes chip be connected to substrate, and the electricity and the passage of heat of chip to wiring board is provided.
At present the packaged type of the semiconductor device that generally adopts is, the semiconductor element that integrates with circuitous pattern is bonded on the slide holder of the lead frame of being made by iron-nickel alloy by bonding agent, Here it is so-called chip bonding process; The bonding weld zone of semiconductor element and the lead of lead frame are coupled together Here it is wire bonding technique with bonding line; Having lead frame utilization such as the epoxy resin mould of semiconductor element to annotate insulator die the compound to joint then annotates compound and carries out resin-encapsulated, lead and semiconductor element are sealed.Yet serious problems that face in encapsulation process are, associativity is bad between the slide holder part of chip and lead frame, and final consequence is exactly the inefficacy that may cause electronic product.In encapsulation process,, can add the silver slurry between the slide holder of lead frame and the chip for both can be bonded together more closely.But in the practical operation,, after the silver slurry splashes into, the existence of air may be arranged between the two, beat chip then, beat gold thread and use resin-encapsulated again because the slide holder surface of lead frame is smoother.In case behind such product turnout, can be assembled in various electronics produces in the sheet, as computer, game machine, mains switch and automobile component, in use, the product heating is because the coefficient of expansion of the air of the thermal coefficient of expansion of resin and the inside is different, thereby can destroy product, the braking automobile parts influence the operation of product, if more can cause serious consequences such as brake failure.
The problem that how better to improve associativity between the slide holder of lead frame and the chip has become problem anxious to be solved in the industry.
Summary of the invention
The utility model purpose provides a kind of lead frame, by the improvement of structure, has improved the slide holder of lead frame and the associativity between the chip, has guaranteed the quality of semiconductor element.
For achieving the above object, the technical solution adopted in the utility model is: a kind of lead frame, comprise a frame body, described frame body is made of at least 2 unit, and each frame body unit is provided with slide holder, cooperates with described slide holder to be provided with pin, described pin one end is provided with weld part, between pin and slide holder, be connected through syndeton respectively between adjacent cells, be distributed with array of depressions on the described slide holder, each depression in this array is the narrow structure in wide bottom, top.
Optimized technical scheme, the cross sectional shape that intersect on described depression and slide holder surface is the colored shape with 3～5 petals.
Perhaps, described depression and intersection, slide holder surface are circular, and the bottom is square.
In the technique scheme, the overall structure of described lead frame is an existing structure, is provided with array of depressions on the slide holder of lead frame, and described depression is the narrow structure in wide bottom, top, and the setting of array of depressions can one be finished in Sheet Metal Forming Technology.By the setting of array of depressions, can allow silver slurry fully merge, avoided having between the slide holder of chip and lead frame the existence of air.Array of depressions density is high more, helps encapsulation more, can arrange according to different demands during actual the manufacturing.
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1, since the utility model by on the slide holder of lead frame, array of depressions being set, described depression is the narrow structure in wide bottom, top, make that silver-colored slurry can fully merge in the encapsulation process, avoided the existence of air between chip and the slide holder, improve sealing, guaranteed the quality of semiconductor element;
2, the utility model is simple in structure, is convenient to make, and is fit to promote the use of.
Description of drawings
Accompanying drawing 1 is the cellular construction schematic diagram of the utility model embodiment one;
Accompanying drawing 3 is an A-A place cutaway view among Fig. 2;
Accompanying drawing 4 is the cellular construction schematic diagram of the utility model embodiment two.
Wherein: 1, frame body; 2, slide holder; 3, pin; 4, weld part; 5, depression.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: referring to accompanying drawing 1 to shown in the accompanying drawing 3, a kind of lead frame, comprise a frame body 1, described frame body is provided with slide holder 2, cooperates with described slide holder to be provided with pin 3, and described pin one end is provided with weld part 4, described slide holder is provided with depression 5 arrays, described depression is the narrow structure in wide bottom, top, and described depression and intersection, slide holder surface are circular, and the bottom is square.
In the encapsulation process, semiconductor element is bonded to by bonding agent on the slide holder of lead frame, in the bonding process, between semiconductor element and slide holder, add the silver slurry; With bonding line the bonding weld zone of semiconductor element and the lead of lead frame are coupled together again; Having lead frame utilization such as the epoxy resin mould of semiconductor element to annotate insulator die the compound to joint then annotates compound and carries out resin-encapsulated, lead frame and semiconductor element are encapsulated.
Embodiment two: shown in accompanying drawing 4, a kind of lead frame, comprise a frame body 1, described frame body is provided with slide holder 2, cooperate with described slide holder and to be provided with pin 3, described pin one end is provided with weld part 4, described slide holder is provided with depression 5 arrays, described depression is the narrow colored shape structure in wide bottom, top, 4 square and peripheral petals by the centre constitute, the thickness of slide holder is 1.27mm, and the lower dimension of each depression is 0.20 * 0.20mm, and upper dimension is 0.33 * 0.33mm, the degree of depth is 0.060mm, the spacing minimum that its minimum of accuracy can reach between adjacent two depressions can be 0.099mm, and minimum dimension is 0.063mm on the depression X-direction, and minimum dimension is 0.063mm on the Y direction.
In the encapsulation process, semiconductor element is bonded to by bonding agent on the slide holder of lead frame, in the bonding process, between semiconductor element and slide holder, add the silver slurry, because the setting of quincunx array of depressions makes bonding tightr; With bonding line the bonding weld zone of semiconductor element and the lead of lead frame are coupled together again; Having lead frame utilization such as the epoxy resin mould of semiconductor element to annotate insulator die the compound to joint then annotates compound and carries out resin-encapsulated, lead frame and semiconductor element are encapsulated.
Claims (3)
1. lead frame, comprise a frame body (1), described frame body (1) is made of at least 2 unit, each frame body unit is provided with slide holder (2), cooperate with described slide holder to be provided with pin (3), described pin one end is provided with weld part (4), between pin (3) and slide holder (2), be connected through syndeton respectively between adjacent cells, it is characterized in that: be distributed with array of depressions on the described slide holder, each depression (5) in this array is the narrow structure in wide bottom, top.
2. lead frame according to claim 1 is characterized in that: the cross sectional shape that intersect on described depression and slide holder surface is the colored shape with 3～5 petals.
3. lead frame according to claim 1 is characterized in that: described depression and intersection, slide holder surface are for circular, and the bottom is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820236953 CN201345361Y (en) | 2008-12-31 | 2008-12-31 | Lead wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820236953 CN201345361Y (en) | 2008-12-31 | 2008-12-31 | Lead wire frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201345361Y true CN201345361Y (en) | 2009-11-11 |
Family
ID=41276947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200820236953 Expired - Fee Related CN201345361Y (en) | 2008-12-31 | 2008-12-31 | Lead wire frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201345361Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610585A (en) * | 2011-12-19 | 2012-07-25 | 佛山市蓝箭电子有限公司 | Lead frame for silicon chip encapsulation, encapsulation method and formed electronic element |
| CN103617971A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Injection molding-facilitating lead frame |
-
2008
- 2008-12-31 CN CN 200820236953 patent/CN201345361Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610585A (en) * | 2011-12-19 | 2012-07-25 | 佛山市蓝箭电子有限公司 | Lead frame for silicon chip encapsulation, encapsulation method and formed electronic element |
| CN103617971A (en) * | 2013-11-08 | 2014-03-05 | 张轩 | Injection molding-facilitating lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091111 Termination date: 20171231 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |