CN212587519U - LED wafer packaging structure - Google Patents
LED wafer packaging structure Download PDFInfo
- Publication number
- CN212587519U CN212587519U CN202021161898.8U CN202021161898U CN212587519U CN 212587519 U CN212587519 U CN 212587519U CN 202021161898 U CN202021161898 U CN 202021161898U CN 212587519 U CN212587519 U CN 212587519U
- Authority
- CN
- China
- Prior art keywords
- conductive portion
- epoxy resin
- led
- led wafer
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The embodiment of the utility model provides a be applicable to LED encapsulation technical field, provide a LED wafer packaging structure. This LED wafer packaging structure includes first epoxy laminated board, second epoxy laminated board and a plurality of LED wafer, fretwork portion has been seted up to first epoxy laminated board, first epoxy laminated board laminates with second epoxy laminated board each other, the lower extreme opening of upper surface closing cap fretwork portion of second epoxy laminated board, the upper surface of second epoxy laminated board is provided with a plurality of pads, the one end of pad all extends to the edge of second epoxy laminated board, the edge of second epoxy laminated board is all kept away from to the other end, LED wafer electric connection is on some pads, and the LED wafer passes through the wire and connects on another part pad, the LED wafer all arranges in the fretwork portion with the wire, the sealed glue of intussuseption. The utility model discloses simple structure, the cost of manufacture is low, can realize the encapsulation of LED wafer fast.
Description
Technical Field
The utility model belongs to the technical field of LED (Light-Emitting Diode) encapsulation, especially, relate to a LED wafer packaging structure.
Background
The LED has the advantages of long service life, low energy consumption, quick start and the like, and is widely applied to the lighting industry. The existing LED wafer packaging structure is complex in manufacturing process, rapid packaging of the LED wafer cannot be achieved, and packaging manufacturing cost is increased. In addition, the existing LED wafer packaging structure is usually a horizontal patch, and a vertical patch cannot be effectively realized.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a technical problem that will solve provides a LED wafer packaging structure, and it is complicated to aim at the LED wafer packaging structure preparation technology who solves among the prior art, can not realize the quick encapsulation of LED wafer, problem that the cost of manufacture is high.
The embodiment of the utility model provides a realize like this, provide a LED wafer packaging structure, including first epoxy laminated board, second epoxy laminated board and a plurality of LED wafer, the fretwork portion that runs through first epoxy laminated board is seted up at the middle part of first epoxy laminated board, the upper end of second epoxy laminated board with the lower extreme of first epoxy laminated board is laminated each other, and the upper surface closing cap of second epoxy laminated board the lower extreme opening of fretwork portion, the upper surface of second epoxy laminated board is provided with a plurality of pads of mutual interval, the one end of pad all extends to the edge of second epoxy laminated board forms the pin position, the edge of second epoxy laminated board is all kept away from to the other end of pad, LED wafer electric connection is in part on the pad, and the LED wafer is connected to the other part of the bonding pad through a wire, the LED wafer and the wire are arranged in the hollow part, and the hollow part is filled with sealant.
Further, the pad includes first pad and the second pad of relative setting, the LED wafer is fixed through conducting resin on the first pad, the one end welding of wire is in the LED wafer, the other end welding of wire is in on the second pad.
Further, the surface area of the first pad is larger than the surface area of the second pad.
Further, the first pad includes a first conductive portion and a second conductive portion, one end of the first conductive portion is located at the edge of the first epoxy resin laminate board, the other end of the first conductive portion is connected to the second conductive portion, and the LED die is fixed to the second conductive portion.
Further, the area of the first conductive part is smaller than that of the second conductive part, and the area of the lower surface of the LED wafer is equal to that of the upper surface of the second conductive part.
Further, the second pad includes a third conductive portion and a fourth conductive portion, one end of the third conductive portion is located at the edge of the first epoxy resin laminate board, the other end of the third conductive portion is connected to the fourth conductive portion, and the LED die is fixed to the fourth conductive portion.
Further, the area of the third conductive portion is smaller than the area of the fourth conductive portion.
Compared with the prior art, the embodiment of the utility model, beneficial effect lies in:
the utility model discloses a fretwork portion is seted up at the middle part of first epoxy laminated board, and laminate first epoxy laminated board and second epoxy laminated board each other, the lower extreme opening of the upper surface closing cap fretwork portion that makes second epoxy laminated board, set up the pad that one end all extends to second epoxy laminated board edge at the upper surface of second epoxy laminated board, this pad forms the pin position at second epoxy laminated board edge, with LED wafer and wire electric connection on the pad, then pack sealed glue in fretwork portion, encapsulate LED wafer and wire, a structure is simple, the preparation is convenient, and is with low costs, can be according to the actual product demand, the size through changing the size of encapsulation changes the fretwork portion, realize the encapsulation of LED fretwork wafer fast, and can vertical paster.
Drawings
Fig. 1 is a schematic view of an LED die package structure provided in an embodiment of the present invention;
FIG. 2 is a schematic view of the first epoxy laminate of FIG. 1;
FIG. 3 is a schematic view of a solder pad structure on the second epoxy resin laminate of FIG. 1;
fig. 4 is a schematic longitudinal sectional structure view of the LED die package structure in fig. 1;
fig. 5 is a schematic structural diagram of a hollowed-out portion formed by hollowing out and punching on a first epoxy resin laminated plate in a manufacturing process of an LED wafer packaging structure provided by an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a bonding pad welded on the second epoxy resin laminate in the manufacturing process of the LED die package structure according to the embodiment of the present invention;
fig. 7 is a schematic structural view illustrating a first epoxy resin laminate and a second epoxy resin laminate bonded to each other in a manufacturing process of an LED die package structure according to an embodiment of the present invention;
fig. 8 is a schematic cross-sectional view of the LED chip and the lead mounted in the hollow portion and encapsulated in the epoxy resin laminate shown in fig. 7 after the first epoxy resin laminate and the second epoxy resin laminate are bonded to each other;
fig. 9 is a schematic diagram of the whole structure in fig. 8 being cut into a plurality of LED die package structures.
The figures are numbered: 1. a first epoxy resin laminate; 2. a second epoxy resin laminate; 3. an LED wafer; 4. a wire; 5. sealing glue; 6. a pad; 11. a hollow-out section; 61. a first pad; 62. a second pad; 100. an LED wafer packaging structure; 611. a first conductive portion; 612. a second conductive portion; 621. a third conductive portion; 622. a fourth conductive portion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 4, an LED die package structure 100 according to an embodiment of the present invention includes a first epoxy resin laminate 1, a second epoxy resin laminate 2 and a plurality of LED dies 3, wherein a hollow portion 11 penetrating through the first epoxy resin laminate 1 is formed in a middle portion of the first epoxy resin laminate 1, an upper end of the second epoxy resin laminate 2 is attached to a lower end of the first epoxy resin laminate 1, an upper surface of the second epoxy resin laminate 2 covers a lower end opening of the hollow portion 11, a plurality of pads 6 are disposed on an upper surface of the second epoxy resin laminate 2, one end of each pad 6 extends to an edge of the second epoxy resin laminate 2 to form a lead position, an edge of the second epoxy resin laminate 2 is kept away from the other end of each pad 6, the LED dies 3 are electrically connected to a portion of the pads 6, and LED wafer 3 passes through wire 4 to be connected on another part pad 6, and LED wafer 3 all arranges hollow portion 11 in with wire 4, and sealed glue 5 is filled in hollow portion 11 to encapsulate LED wafer 3 and wire 4 in hollow portion 11.
In the above embodiment, the bonding pads 6 include the first bonding pad 616 and the second bonding pad 626 which are oppositely disposed, the LED die 3 is fixed on the first bonding pad 616 through the conductive adhesive, one end of the wire 4 is soldered on the LED die 3, and the other end of the wire 4 is soldered on the second bonding pad 626, so that the LED die 3, the wire 4, the first bonding pad 616 and the second bonding pad 626 are electrically connected.
In the above embodiment, the surface area of the first bonding pad 616 is larger than that of the second bonding pad 626, which is beneficial to mounting the bottom of the LED die 3 on the first bonding pad 616, and on the other hand, the second bonding pad 626 is used for bonding the wire 4, so that a larger area is not needed, and the cost is saved. Specifically, the first pad 616 includes a first conductive portion 611 and a second conductive portion 612, one end of the first conductive portion 611 is located at the edge of the first epoxy resin laminate board 1 to form a pin position, the other end of the first conductive portion 611 is connected to the second conductive portion 612, and the LED die 3 is fixed on the second conductive portion 612. The area of the first conductive portion 611 is smaller than that of the second conductive portion 612, and the area of the lower surface of the LED die 3 is equal to that of the upper surface of the second conductive portion 612. The second pad 626 includes a third conductive portion 621 and a fourth conductive portion 622, one end of the third conductive portion 621 is located at the edge of the first epoxy resin laminate board 1 to form a pin position; the other end of the third conductive portion 621 is connected to the fourth conductive portion 622, the LED die 3 is fixed to the fourth conductive portion 622, and the area of the third conductive portion 621 is smaller than that of the fourth conductive portion 622.
Referring to fig. 5 to fig. 9, a manufacturing process of the LED die package structure 100 according to an embodiment of the present invention includes the following steps:
and S1, preparing a first epoxy resin laminated plate 1 and a second epoxy resin laminated plate 2 with the same surface area according to the application design of the finished product, wherein the thickness of the first epoxy resin laminated plate 1 is larger than that of the second epoxy resin laminated plate 2. And dividing cutting lines on the second epoxy resin laminated plate 2 according to the size of the packaging structure of the LED wafer 3 to form a plurality of areas according with the size of the packaging structure of the LED wafer 3, wherein each area forms a second epoxy resin laminated plate 2 unit.
S2, welding a plurality of pads 6 spaced from each other on each second epoxy resin laminated board 2 unit, wherein each of the pads 6 is welded at a position where one end thereof extends to the edge of the second epoxy resin laminated board 2 unit and the other end of the pad 6 extends to the middle of the second epoxy resin laminated board 2 unit, and the second epoxy resin laminated board 2 with the pad 6 constitutes a circuit layer.
S3, designing and dividing cutting lines on the first epoxy resin laminated plate 1 according to the size of the packaging structure of the LED wafer 3 to form a plurality of areas which accord with the size of the packaging structure of the LED wafer 3, wherein each area forms a first epoxy resin laminated plate 1 unit; performing hollow-out punching treatment on the first epoxy resin laminated plate 1 unit to form a plurality of hollow-out parts 11 penetrating through the first epoxy resin laminated plate 1 on the first epoxy resin laminated plate 1 unit; the first epoxy resin laminate sheet 1 having the hollow portion 11 constitutes a dam layer which connects the LED chip 3 and the bonding wire bonding region.
S4, bonding the lower surface of the first epoxy resin laminate 1 and the upper surface of the second epoxy resin laminate 2 to each other by high temperature and high pressure adhesive, so that the upper surface of the second epoxy resin laminate 2 covers the lower end opening of the hollow portion 11;
s5, fixing the LED wafer 3 on a part of the bonding pad 6 by using conductive adhesive, and connecting the LED wafer 3 on the other part of the bonding pad 6 by using the lead 4;
s6, pouring the sealant 5 into the hollow part 11, and packaging the LED wafer 3 and the lead 4 in the hollow part 11;
and S7, cutting the whole body molded in the step S6 into a plurality of LED wafer packaging structures 100 according to the cutting lines designed in the steps S1 and S3.
In the above embodiment, in step S2, the bonding pads 6 include the first bonding pads 616 and the second bonding pads 626 disposed oppositely, the ends of the first bonding pads 616 and the second bonding pads 626 extending to the edge of the second epoxy resin laminate 2 form the lead ends, the end of the first bonding pads 616 extending to the middle of the second epoxy resin laminate 2 forms the LED die 3 connection ends, and the end of the second bonding pads 626 extending to the middle of the second epoxy resin laminate 2 forms the bonding wire ends; the LED die 3 is fixed on the first bonding pad 616 by a conductive adhesive, one end of the wire 4 is soldered to the LED die 3, and the other end of the wire 4 is soldered to the second bonding pad 626. In step S4, the lower surface edge of the first epoxy resin laminate 1 and the upper surface edge of the second epoxy resin laminate 2 are overlapped with each other; in step S6, the sealant 5 is spread over the hollow portion 11, so that the upper surface of the sealant 5 is flush with the upper opening edge of the hollow portion 11.
To sum up, the utility model discloses a set up fretwork portion 11 at the middle part of first epoxy laminated board 1, and laminate first epoxy laminated board 1 and second epoxy laminated board 2 each other, make the lower extreme opening of the upper surface closing cap fretwork portion 11 of second epoxy laminated board 2, set up the pad 6 that one end all extends to the edge of second epoxy laminated board 2 at the upper surface of second epoxy laminated board 2, this pad 6 forms the pin position at the edge of second epoxy laminated board 2, connect LED wafer 3 and wire 4 electrical behavior on pad 6, then pack sealed glue 5 in fretwork portion 11, encapsulate LED wafer 3 and wire 4, its simple structure, the preparation is convenient, low cost, can be according to the actual product demand, change the overall dimension of encapsulation through changing the size of fretwork portion 11, realize the encapsulation of LED wafer 3 fast, and can be mounted vertically.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A LED wafer packaging structure is characterized by comprising a first epoxy resin laminated plate, a second epoxy resin laminated plate and a plurality of LED wafers, wherein a hollow part penetrating through the first epoxy resin laminated plate is formed in the middle of the first epoxy resin laminated plate, the upper end of the second epoxy resin laminated plate is mutually attached to the lower end of the first epoxy resin laminated plate, the lower end opening of the hollow part is covered by the upper surface of the second epoxy resin laminated plate, a plurality of mutually-spaced bonding pads are arranged on the upper surface of the second epoxy resin laminated plate, one ends of the bonding pads extend to the edge of the second epoxy resin laminated plate to form pin positions, the other ends of the bonding pads are far away from the edge of the second epoxy resin laminated plate, the LED wafers are electrically connected to some of the bonding pads, and the LED wafers are connected to the bonding pads of the other part through leads, the LED wafer with the wire is all arranged in the hollow portion, and the hollow portion is filled with sealant.
2. The LED die package structure of claim 1, wherein said bonding pads comprise a first bonding pad and a second bonding pad disposed opposite to each other, said LED die is fixed on said first bonding pad by a conductive adhesive, one end of said wire is soldered on said LED die, and the other end of said wire is soldered on said second bonding pad.
3. The LED die package structure of claim 2, wherein a surface area of said first pad is larger than a surface area of said second pad.
4. The LED die package structure of claim 3, wherein said first bonding pad comprises a first conductive portion and a second conductive portion, one end of said first conductive portion is located at an edge of said first epoxy resin laminate board, the other end of said first conductive portion is connected to said second conductive portion, and said LED die is fixed on said second conductive portion.
5. The LED die package structure of claim 4, wherein the area of said first conductive portion is smaller than the area of said second conductive portion, and the area of the lower surface of said LED die is equal to the area of the upper surface of said second conductive portion.
6. The LED die package structure of claim 3, wherein said second bonding pad comprises a third conductive portion and a fourth conductive portion, one end of said third conductive portion is located at the edge of said first epoxy resin laminate board, the other end of said third conductive portion is connected to said fourth conductive portion, and said LED die is fixed on said fourth conductive portion.
7. The LED die package structure of claim 6, wherein the area of said third conductive portion is smaller than the area of said fourth conductive portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021161898.8U CN212587519U (en) | 2020-06-19 | 2020-06-19 | LED wafer packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021161898.8U CN212587519U (en) | 2020-06-19 | 2020-06-19 | LED wafer packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212587519U true CN212587519U (en) | 2021-02-23 |
Family
ID=74651329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021161898.8U Active CN212587519U (en) | 2020-06-19 | 2020-06-19 | LED wafer packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212587519U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710769A (en) * | 2020-06-19 | 2020-09-25 | 深圳成光兴光电技术股份有限公司 | LED wafer packaging structure and manufacturing process thereof |
-
2020
- 2020-06-19 CN CN202021161898.8U patent/CN212587519U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710769A (en) * | 2020-06-19 | 2020-09-25 | 深圳成光兴光电技术股份有限公司 | LED wafer packaging structure and manufacturing process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105990265B (en) | The package module and its manufacturing method of circuit for power conversion | |
| CN206282838U (en) | The integrated encapsulation structure of passive device and active device | |
| CN101887886A (en) | Multi-chip package and manufacturing method | |
| WO2011163674A2 (en) | A led package and method of making the same | |
| CN101800184B (en) | Packaging base plate with cave structure and manufacture method thereof | |
| CN212587519U (en) | LED wafer packaging structure | |
| CN102403236B (en) | The semiconductor device of chip exposed and production method thereof | |
| CN202034361U (en) | Semiconductor packaging structure | |
| TW201407732A (en) | A package structure and the method to fabricate thereof | |
| CN111710769A (en) | LED wafer packaging structure and manufacturing process thereof | |
| CN217521994U (en) | High-density welding structure | |
| CN101295697A (en) | Semiconductor encapsulation construction | |
| CN105990298A (en) | Chip packaging structure and preparation method thereof | |
| CN104112811A (en) | LED (light emitting diode) packaging method | |
| CN211295075U (en) | Chip packaging structure | |
| CN210245488U (en) | Non-contact type upper and lower chip packaging structure | |
| CN210628280U (en) | Integrated chip packaging structure | |
| CN110648991B (en) | Adapter plate bonding structure for frame packaged chip and processing method thereof | |
| CN106298749B (en) | Light emitting diode, electronic device and manufacturing method thereof | |
| CN209232767U (en) | A kind of novel semi-conductor encapsulating structure | |
| CN201514940U (en) | Lead framework structure for packaging of integrated circuit | |
| CN201075390Y (en) | Photoreception crystal plate packaging module | |
| CN202196776U (en) | Flat carrier-free leadless pin exposed packaging part | |
| CN206789535U (en) | A kind of fan-out package structure of power electronic devices | |
| CN204464262U (en) | A kind of 3-D stacks encapsulating structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |