CN210628280U - Integrated chip packaging structure - Google Patents
Integrated chip packaging structure Download PDFInfo
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- CN210628280U CN210628280U CN201921915067.2U CN201921915067U CN210628280U CN 210628280 U CN210628280 U CN 210628280U CN 201921915067 U CN201921915067 U CN 201921915067U CN 210628280 U CN210628280 U CN 210628280U
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- Prior art keywords
- glue
- integrated chip
- wafer
- opening
- structure according
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract description 78
- 238000002347 injection Methods 0.000 claims description 29
- 239000007924 injection Substances 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 235000012431 wafers Nutrition 0.000 description 22
- 229920003023 plastic Polymers 0.000 description 12
- 239000004033 plastic Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000002349 favourable effect Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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Abstract
The utility model discloses an integrated chip packaging structure, including base plate, shell and the wafer of setting on the base plate, one side of relative wafer is provided with the injecting glue mouth on the shell, injecting glue mouth and base plate intercommunication, the injecting glue mouth is filled there is sealed glue. The utility model discloses can adapt to small-scale production, reduce the manufacturing cost of small-scale enterprise.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technology field specifically is an integrated chip packaging structure.
Background
The traditional package is also the most widely applicable package in the market, and the specific mode is that a wafer is pasted on a substrate of a lead frame, electrodes of the wafer are welded by leads, then solidification and glue fixation are carried out, and finally plastic package, rib punching, rib cutting and testing are carried out. Because the lead wire is very easy to break, and the requirement of the plastic packaging process on equipment and process precision is very high, the traditional packaging mode is not favorable for small-scale production, wherein the plastic packaging needs to be packaged by utilizing an electric heating mold film pressing process, and under the small-scale production, the efficiency is low, the energy consumption is large, the cost is high, and for an enterprise producing on a small scale, a third party is entrusted to produce, and the long-term development is not favorable.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide an integrated chip packaging structure can adapt to small-scale production, reduces the manufacturing cost of small-scale enterprise.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides an integrated chip packaging structure, includes base plate, shell and the wafer of setting on the base plate, one side of wafer relatively on the shell is provided with the injecting glue mouth, injecting glue mouth and base plate intercommunication, the injecting glue mouth is filled there is sealed glue.
As a further improvement of the utility model, the glue injection port is in the shape of a round table.
As a further improvement, the smaller end of the glue injection opening faces the substrate.
As a further improvement, the opening part of the glue injection port is provided with a sealing port, the sealing port and the glue injection port form a step structure, one end of the sealing port is communicated with the glue injection port, and the other end is communicated with the shell.
As a further improvement of the utility model, the sealing opening is cylindrical.
As a further improvement of the utility model, a baffle plate for separating the base plate is arranged on the base plate.
As a further improvement, the baffle is highly parallel and level with the height of the glue injection port.
As a further improvement of the present invention, the substrate is composed of a plurality of pins, and the wafer is attached to the pins.
As a further improvement of the utility model, the wafer is laminated on the pin with gluing admittedly.
As a further improvement, one side of the shell, which faces away from the glue injection port, is a binding surface welded with an external circuit.
The beneficial effects of the utility model, constitute the shell after the plastic envelope through earlier stage, the wafer of laminating again this moment encapsulates, and this encapsulation process only need carry on the point glue can, through pouring into sealed glue and encapsulate the shell in the injecting glue mouth, consequently can not touch the lead wire and lead to the lead wire disconnection, also need not high accuracy production facility and strict technology, to small-scale production this moment, saved the problem of senior talent and equipment acquisition cost, be favorable to small-scale production and development.
Drawings
FIG. 1 is a schematic sectional view of a part of the structure of the present invention;
fig. 2 is a schematic top view of the present invention.
Reference numerals: 1. a substrate; 2. a housing; 3. a wafer; 4. a glue injection port; 5. sealing glue; 6. sealing the opening; 7. a baffle plate; 8. and (7) a pin.
Detailed Description
The present invention will be described in further detail with reference to embodiments shown in the drawings.
Referring to fig. 1-2, the integrated chip package structure of the present embodiment includes a substrate 1, a housing 2, and a wafer 3 disposed on the substrate 1, wherein a glue injection port 4 is disposed on one side of the housing 2 opposite to the wafer 3, the glue injection port 4 is communicated with the substrate 1, and a sealant 5 is filled in the glue injection port 4.
The existing integrated circuit packaging is that a wafer 3 is firstly pasted on a substrate 1, then plastic packaging is directly carried out, at the moment, the plastic packaging needs to be carried out by using an electric heating mold film pressing process, the process requirement is high, the equipment requirement is high, and a large amount of electric energy needs to be consumed. And constitute shell 2 through plastic envelope earlier stage in this embodiment, laminate wafer 3 again this moment and encapsulate, and this encapsulation process only need go on some glue can, through pouring into sealed glue 5 and encapsulate shell 2 in injecting glue mouth 4, consequently can not touch the lead wire and lead to the disconnection, also need not high accuracy production facility and strict technology, to small-scale production this moment, saved the problem of senior talent and equipment acquisition cost, be favorable to small-scale production and development.
In another embodiment, the glue injection opening 4 is in a circular truncated cone shape.
The circular truncated cone-shaped glue injection port 4 in the embodiment can increase the glue injection capacity, so that the plastic packaging effect is better. The glue injection port 4 is in a circular truncated cone shape, so that the embodiment can be expanded into two implementation modes.
1. The bigger one side of injecting glue mouth 4 is towards base plate 1, and the injecting glue is and after sealed glue 5 condenses this moment, and sealed glue 5's fixed action is better, is difficult to more become flexible.
2. The smaller side of the glue injection opening 4 faces the substrate 1, the sealant 5 is injected more easily, the structure is in a bowl shape, the sealant 5 can be gathered and sealed from the bottom, and the wafer 3 can be attached to the substrate 1 more easily by equipment with a larger opening facing outwards.
In another embodiment, a sealing opening 6 is formed at an opening of the glue injection opening 4, the sealing opening 6 and the glue injection opening 4 form a step structure, one end of the sealing opening 6 is communicated with the glue injection opening 4, and the other end of the sealing opening 6 is communicated with the housing 2.
Through the opening part at injecting glue mouth 4 set up sealed mouthful 6 again, sealed mouthful 6 can carry out the plastic envelope through sealed 5 cooperation sealed glue 5 in the sealed glue mouth 4 that the intensity of pouring into is higher this moment, can increase plastic envelope intensity. In addition, through setting up sealed mouthful 6, even sealed mouthful 6 not mould plastics and also can let injecting glue mouth 4 have redundant space, avoid sealed glue 5 to spill over, can reduce the requirement to equipment precision to do not influence actual effect yet, can adapt to production on a small scale more.
In a further preferred embodiment, the sealing opening 6 is cylindrical.
This sealed mouthful 6 is cylindrically, the sealed shape of mouthful 6 of laminating more, and the while circular shape edge lets sealed glue 5 fill more easily, compares the structural scheme that has the edges and corners and can avoid sealed glue 5 because tension can't fill to the corner to influence sealed effect. Of course, the boundary cross section of the sealing port 6 may be in a shape without any edge such as an oval shape.
In another embodiment, the substrate 1 is provided with a baffle 7 for separating the substrate 1.
Preferably, the height of the baffle 7 is flush with that of the glue injection port 4.
Let baffle 7 and injecting glue mouth 4 high parallel and level, can avoid 7 both sides of baffle sealed glue 5 too early mix and influence the injecting glue effect this moment, can ensure 7 both sides of baffle injected sealed glue 5 plastic envelope effects through letting baffle 7 and injecting glue mouth 4 parallel and level.
In another embodiment, the substrate 1 is composed of a plurality of leads 8, and the wafer 3 is attached to the leads 8.
Wafer 3 directly laminates on pin 8, can carry out heat conduction and heat dissipation through pin 8 to because each pin 8 is mutually independent, directly laminate this moment on pin 8, arrange through the length of adjusting pin 8, and then adapt to different circuit connection, can be different from traditional base plate 1 from this, the production of being convenient for.
In an alternative scheme, the wafer 3 is adhered to the pins 8 by glue.
The glue can adopt conductive silver paste and insulating glue, wherein the conductive silver paste can not only directly paste the wafer 3 on the pins 8, but also directly carry out electric connection, and the connection steps are simplified.
The insulating glue can be formed by isolating the wafer from the pins 8, but can improve the heat dissipation effect of the wafer through the pins 8.
In a preferred embodiment, the side of the housing 2 facing away from the glue injection opening 4 is a bonding surface to be welded with an external circuit.
The follow-up needs rethread notes glue paste on the PCB board or on other circuit boards of shell 2, and consequently the user follow-up use of being convenient for is with injecting glue mouth 4 one side outside, avoids sealed 5 influences of glue in the injecting glue mouth 4 to paste the effect.
In addition, a marking angle is arranged on one side face, provided with the glue injection port 4, of the shell 2, and the orientation of the package is convenient to determine through the angle.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The utility model provides an integrated chip packaging structure, includes base plate (1), shell (2) and wafer (3) of setting on base plate (1), its characterized in that, one side relative wafer (3) is provided with injecting glue mouth (4) on shell (2), injecting glue mouth (4) and base plate (1) intercommunication, injecting glue mouth (4) are filled there is sealed glue (5).
2. The ic package structure according to claim 1, wherein the glue injection opening (4) is truncated cone-shaped.
3. The integrated chip package structure according to claim 2, wherein the end of the glue injection opening (4) with a smaller area faces the substrate (1).
4. The integrated chip packaging structure according to claim 2 or 3, wherein a sealing opening (6) is formed at an opening of the glue injection opening (4), the sealing opening (6) and the glue injection opening (4) form a step structure, one end of the sealing opening (6) is communicated with the glue injection opening (4), and the other end of the sealing opening (6) is communicated with the housing (2).
5. The integrated chip package structure according to claim 4, wherein the sealing opening (6) is cylindrical.
6. The integrated chip package structure according to claim 1, 2 or 3, wherein the substrate (1) is provided with a baffle (7) for separating the substrate (1).
7. The integrated chip package structure according to claim 6, wherein the height of the baffle (7) is flush with the height of the glue injection port (4).
8. The integrated chip package structure according to claim 1, 2 or 3, wherein the substrate (1) is formed by a plurality of leads (8), and the wafer (3) is attached to the leads (8).
9. The ic package structure according to claim 8, wherein the wafer (3) is fixedly attached to the leads (8) by glue.
10. The ic package structure according to claim 1, 2 or 3, wherein the side of the housing (2) facing away from the glue injection opening (4) is a bonding surface for bonding with an external circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921915067.2U CN210628280U (en) | 2019-11-07 | 2019-11-07 | Integrated chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921915067.2U CN210628280U (en) | 2019-11-07 | 2019-11-07 | Integrated chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210628280U true CN210628280U (en) | 2020-05-26 |
Family
ID=70765933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921915067.2U Active CN210628280U (en) | 2019-11-07 | 2019-11-07 | Integrated chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210628280U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111588985A (en) * | 2020-05-27 | 2020-08-28 | 微智医疗器械有限公司 | Implant device and method of assembling the same |
-
2019
- 2019-11-07 CN CN201921915067.2U patent/CN210628280U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111588985A (en) * | 2020-05-27 | 2020-08-28 | 微智医疗器械有限公司 | Implant device and method of assembling the same |
| CN111588985B (en) * | 2020-05-27 | 2021-02-19 | 微智医疗器械有限公司 | Implant device and method of assembling the same |
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