CN201732781U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN201732781U CN201732781U CN 201020141571 CN201020141571U CN201732781U CN 201732781 U CN201732781 U CN 201732781U CN 201020141571 CN201020141571 CN 201020141571 CN 201020141571 U CN201020141571 U CN 201020141571U CN 201732781 U CN201732781 U CN 201732781U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- double
- resin
- slide holder
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a lead frame, which comprises a frame body, wherein the frame body comprises at least one unit, and a chip holder is arranged on each frame body unit; pins are matched with the chip holder, and one end of each pin is provided with a welding part; and connecting structures are connected between the pins and the chip holder and between the adjacent units. The lead frame is characterized in that: double-V-groove structures are arranged around the chip holder, and middle grooves are also arranged between the double-V-groove structures. Since the double-V-groove structures and the middle grooves are arranged around the chip holder of the lead frame, the bonding area between packaging resin and the lead frame is increased, the bonding force is improved, the problem that the resin falls off due to inadequate bonding can be avoided, and the quality of semiconductor components is ensured.
Description
Technical field
The utility model relates to a kind of parts of semiconductor element, is specifically related to a kind of lead frame that is used for the semiconductor element encapsulation.
Background technology
In the last few years, the integrated level of semiconductor device was more and more higher, and its memory space, conversion speed and power increases rapidly, but volume is more and more littler.This trend has been quickened the development of semiconductor device packaging technique, so the importance of semiconductor device packaging technique has been subjected to people's attention.The high integration in the semiconductor device and the increase of memory also make the quantity of input and output binding post also increase accordingly, make also that then the number of lead-in wire increases accordingly, and this layout that just requires to go between also must be meticulous.
Lead frame is the skeleton in the semiconductor packages, and it mainly is made up of two parts: slide holder and pin.Wherein for chip provides mechanical support, pin then is to connect chip to the outer electric path of encapsulation to slide holder in encapsulation process.The function of lead frame is conspicuous, and at first it has played the supporting role of encasing electronic components, prevent simultaneously resin the lead-in wire between gush out suddenly, for plastics provide support; Secondly it makes chip be connected to substrate, and the electricity and the passage of heat of chip to wiring board is provided.
At present the packaged type of the semiconductor device that generally adopts is, the semiconductor element that integrates with circuitous pattern is bonded on the slide holder of the lead frame of being made by iron-nickel alloy by bonding agent, Here it is so-called chip bonding process; The bonding weld part of semiconductor element and the lead of lead frame are coupled together Here it is wire bonding technique with bonding line; Having lead frame utilization such as the epoxy resin mould of semiconductor element to annotate insulator die the compound to joint then annotates compound and carries out resin-encapsulated, lead and semiconductor element are sealed.Use this method for packing, have only the outer lead of lead frame to reach the outside that mould is annotated resin.Yet in the process of implementing resin-encapsulated, because the generation of the heat of resin-encapsulated, and the thermal contraction that partly produces at certain thickness, thereby cause between lead frame and the resin combine abundant inadequately, make resin come off easily, reduce the quality of semiconductor element encapsulation, finally influenced the normal use of semiconductor element.
In order to solve the above problems, lead frame structure is improved, by offering single V-type groove along the slide holder periphery of lead frame, thereby by increasing the bonding area increase adhesion between the two of lead frame and resin.Yet find in actual applications, though by the V-type groove is set, increased between resin and lead frame skew resistance, but little with the directive effect of Surface Vertical in the relative translation direction, thus the improvement of this structure can not fine solution between the two in conjunction with inadequate problem.
Summary of the invention
The utility model purpose provides a kind of lead frame, by the improvement of structure, has improved the adhesion between lead frame and the resin, has guaranteed the package quality of semiconductor element.
For achieving the above object, the technical solution adopted in the utility model is: a kind of lead frame, comprise a frame body, described frame body is made of at least one unit, and each frame body unit is provided with slide holder, cooperates with described slide holder to be provided with pin, described pin one end is provided with weld part, between pin and slide holder, be connected through syndeton respectively between adjacent cells, offer double V-shaped groove structure around the described slide holder, also establish intermediate groove between described double V-shaped groove structure.
During encapsulation, earlier bond to semiconductor element on the slide holder of lead frame by bonding agent, with bonding line the bonding weld part of semiconductor element is connected with the weld part of lead frame, there is the lead frame of semiconductor element to utilize epoxy resin to carry out resin-encapsulated to joint then, lead and semiconductor element are sealed.Because offering of the intermediate groove around the slide holder between double V-shaped groove structure and double V-shaped groove structure, increased the bonded area between resin and the slide holder, improved the adhesion between resin and the lead frame, avoided because of occurring in conjunction with insufficient situation of resin wear that causes.
Optimized technical scheme, described intermediate groove are low wide and up narrow trapezoidal shape, constitute overhead structure.Because intermediate groove is up-narrow and down-wide shape, constitute overhead structure, the resistance with the mating surface vertical direction is provided thus, avoided getting loose between resin and the lead frame better.
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1, because the utility model offers double V-shaped groove structure all around by the slide holder at lead frame, between double V-shaped groove structure, also offer intermediate groove, thereby increased the bonded area between potting resin and the lead frame, improved the adhesion between resin and the lead frame, avoided having guaranteed the quality of semiconductor element because of in conjunction with insufficient problem that causes resin wear;
2, the utility model is simple in structure, and is with low cost, is fit to promote the use of.
Description of drawings
Fig. 1 is the structural representation of a unit of the utility model embodiment one middle frame body;
Fig. 2 is the broken section enlarged drawing at Fig. 1 further groove structure place.
Wherein: 1, frame body; 2, slide holder; 3, pin; 4, weld part; 5, double V-shaped groove structure; 6, intermediate groove.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: shown in Fig. 1,2, a kind of lead frame, comprise a frame body 1, described frame body 1 is made of at least one unit, each frame body Unit 1 is provided with slide holder 2, cooperate with described slide holder 2 and to be provided with pin 3, described pin 3 one ends are provided with weld part 4, be connected through syndeton respectively between pin 3 and slide glass 2 interstations, adjacent cells, offer double V-shaped groove structure 5 around the described slide holder 2,5 of described double V-shaped groove structures are also established intermediate groove 6, and described intermediate groove 6 is low wide and up narrow trapezoidal shape, constitute overhead structure.
In the encapsulation process, earlier semiconductor element is bonded on the slide holder of lead frame, with gold thread the bonding weld part of semiconductor element is connected with the weld part of lead frame, there is the lead frame of semiconductor element to utilize resin to carry out resin-encapsulated to joint then, owing to offering of intermediate groove between double V-shaped groove structure around the slide holder and double V-shaped groove, resin can enter in double V-shaped groove and the intermediate groove when encapsulation, increased the bonded area of resin and lead frame, and because the setting of intermediate groove overhead structure, the resistance of translation direction both was provided, resistance with the Surface Vertical direction is provided again, thereby realized combining of resin and lead frame and semiconductor element better.
Claims (2)
1. lead frame, comprise a frame body (1), described frame body (1) is made of at least one unit, each frame body unit is provided with slide holder (2), cooperate with described slide holder (2) and to be provided with pin (3), described pin (3) one ends are provided with weld part (4), between pin (3) and slide holder (2), be connected through syndeton respectively between adjacent cells, it is characterized in that: described slide holder (2) offers double V-shaped groove structure (5) all around, also establishes intermediate groove (6) between described double V-shaped groove structure (5).
2. a kind of lead frame according to claim 1 is characterized in that: described intermediate groove (6) is low wide and up narrow trapezoidal shape, constitutes overhead structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020141571 CN201732781U (en) | 2010-03-16 | 2010-03-16 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020141571 CN201732781U (en) | 2010-03-16 | 2010-03-16 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201732781U true CN201732781U (en) | 2011-02-02 |
Family
ID=43523936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020141571 Expired - Fee Related CN201732781U (en) | 2010-03-16 | 2010-03-16 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201732781U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368492A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Triode lead frame with lead hole |
| CN102969297A (en) * | 2012-11-20 | 2013-03-13 | 无锡市威海达机械制造有限公司 | Pouring basin type lead frame structure |
-
2010
- 2010-03-16 CN CN 201020141571 patent/CN201732781U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368492A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Triode lead frame with lead hole |
| CN102969297A (en) * | 2012-11-20 | 2013-03-13 | 无锡市威海达机械制造有限公司 | Pouring basin type lead frame structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110202 Termination date: 20180316 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |