CN201904329U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN201904329U CN201904329U CN 201020674719 CN201020674719U CN201904329U CN 201904329 U CN201904329 U CN 201904329U CN 201020674719 CN201020674719 CN 201020674719 CN 201020674719 U CN201020674719 U CN 201020674719U CN 201904329 U CN201904329 U CN 201904329U
- Authority
- CN
- China
- Prior art keywords
- pin
- lead frame
- frame body
- hole
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a lead frame which comprises a lead frame body, wherein the lead frame body consists of at least one unit, a wafer carrying table is arranged on each lead frame body unit, a pin is matched with each wafer carrying table, a welding part is arranged at one end of each pin, and the connection between the pin and the wafer carrying table and the connection between the pin and adjacent units are achieved through connection structures. The lead frame is characterized in that a through-hole is formed on each welding part. As the through-hole is formed on the welding part of the pin of the lead frame, the packaging resin and the pin are completely bonded, the existence of air between the packaging resin and the pin is prevented, the bonding strength between the packaging resin and the pin is enhanced and the package quality of the semiconductor elements is ensured.
Description
Technical field
The utility model relates to a kind of parts that are used for semiconductor element, is specifically related to a kind of lead frame that is used for the semiconductor element encapsulation.
Background technology
In the last few years, the integrated level of semiconductor device was more and more higher, and its memory space, conversion speed and power increases rapidly, but volume is more and more littler.This trend has been quickened the development of semiconductor device packaging technique, so the importance of semiconductor device packaging technique has been subjected to people's attention.The high integration in the semiconductor device and the increase of memory also make the quantity of input and output binding post also increase accordingly, make also that then the number of lead-in wire increases accordingly, and this layout that just requires to go between also must be meticulous.
Lead frame is the skeleton in the semiconductor packages, and it mainly is made up of two parts: slide holder and pin.Wherein for chip provides mechanical support, pin then is to connect chip to the outer electric path of encapsulation to slide holder in encapsulation process.The function of lead frame is conspicuous, and at first it has played the supporting role of encasing electronic components, prevent simultaneously resin the lead-in wire between gush out suddenly, for plastics provide support; Secondly it makes chip be connected to substrate, and the electricity and the passage of heat of chip to wiring board is provided.
At present the packaged type of the semiconductor device that generally adopts is, the semiconductor element that integrates with circuitous pattern is bonded on the slide holder of the lead frame of being made by iron-nickel alloy by bonding agent, Here it is so-called chip bonding process; The interior pin of the bonding weld part of semiconductor element and lead frame is coupled together Here it is wire bonding technique with bonding line; Having lead frame utilization such as the epoxy resin mould of semiconductor element to annotate insulator die the compound to joint then annotates compound and carries out resin-encapsulated, lead and semiconductor element are sealed.Yet in the encapsulation process of reality, can face a serious problem, adherence between interior pin and the resin is not strong, in encapsulation, because the existence of air may be arranged between the interior pin of lead frame and the resin, this device can be assembled in various electronic products, as computer, game machine, mains switch and automobile component, in the process of using, a large amount of heats can be produced,, thereby product stability can be destroyed because the coefficient of expansion of the air of the thermal coefficient of expansion of resin and the inside is different, serious meeting can not move device, thereby influence the use of final products, if the braking automobile parts more can cause serious consequences such as brake failure.
Summary of the invention
The utility model purpose provides a kind of lead frame, by the improvement to structure, has improved the pin of lead frame and the adhesion between potting resin, has guaranteed the package quality of semiconductor element.
For achieving the above object, the technical solution adopted in the utility model is: a kind of lead frame, comprise a frame body, described frame body is made of at least one unit, each frame body unit is provided with slide holder, cooperates with described slide holder to be provided with pin, and described pin one end is provided with weld part, between pin and slide holder, be connected through syndeton respectively between adjacent cells, offer through hole on the described weld part.
In the technique scheme, described lead frame is an existing structure, offers through hole on the weld part of the pin of lead frame, and described through hole can be finished by instrument punching press on weld part in the lead frame manufacture process.During encapsulation, earlier bond to semiconductor element on the slide holder of lead frame by bonding agent, with bonding line the bonding weld part of semiconductor element and the weld part of lead frame are coupled together, there is the lead frame of semiconductor element to utilize epoxy resin to carry out resin-encapsulated to joint then, interior pin and semiconductor element are sealed.Owing to offer through hole on weld part, potting resin can flow in the through hole, thereby makes potting resin and interior pin fully merge, and has avoided the existence of air, has improved adhesion between the two.
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1, since the utility model by on the weld part of lead frame pin, offering through hole, the offering of described through hole makes that resin and pin fully merge in the encapsulation process, avoid the existence of air, improved the adhesion between pin and the potting resin, guaranteed the package quality of semiconductor element;
2, the utility model need not change on a large scale to present lead frame structure, is easy to realize;
3, the utility model is simple in structure, and is cheap, is fit to promote the use of.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one.
Wherein: 1, frame body; 2, slide holder; 3, pin; 4, weld part; 5, through hole.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: referring to shown in Figure 1, a kind of lead frame, comprise a frame body 1, described frame body 1 is made of at least one unit, each frame body unit is provided with slide holder 2, cooperates with described slide holder 2 to be provided with pin 3, and described pin 3 one ends are provided with weld part 4, be connected through syndeton respectively between pin 3 and 2 of slide holders, adjacent cells, offer through hole 5 on the described weld part.
In the encapsulation process, bond to semiconductor element on the slide holder 2 of lead frame by bonding agent, with bonding line the bonding weld zone of semiconductor element and the pin of lead frame are coupled together again, there is lead frame utilization such as the epoxy resin mould of semiconductor element to annotate compound to joint then and carries out resin-encapsulated, resin can flow in the through hole on the pin in the encapsulation, improved the adhesion of pin and interlaminar resin, lead frame and semiconductor element encapsulate the most at last, have guaranteed the quality of semiconductor element.
Claims (1)
1. lead frame, comprise a frame body (1), described frame body (1) is made of at least one unit, each frame body unit is provided with slide holder (2), cooperate with described slide holder (2) and to be provided with pin (3), described pin (3) one ends are provided with weld part (4), between pin (3) and slide holder (2), be connected through syndeton respectively between adjacent cells, it is characterized in that: offer through hole (5) on the described weld part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020674719 CN201904329U (en) | 2010-12-22 | 2010-12-22 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020674719 CN201904329U (en) | 2010-12-22 | 2010-12-22 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201904329U true CN201904329U (en) | 2011-07-20 |
Family
ID=44274922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020674719 Expired - Fee Related CN201904329U (en) | 2010-12-22 | 2010-12-22 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201904329U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760717A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | SOT223-3L packaging lead frame |
| CN102760716A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | TO-252 package lead framework structure |
| CN102956597A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN103000606A (en) * | 2012-12-03 | 2013-03-27 | 无锡红光微电子有限公司 | TO-252-3LB lead frame structure |
-
2010
- 2010-12-22 CN CN 201020674719 patent/CN201904329U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760717A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | SOT223-3L packaging lead frame |
| CN102760716A (en) * | 2012-07-19 | 2012-10-31 | 无锡红光微电子有限公司 | TO-252 package lead framework structure |
| CN102956597A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN102956597B (en) * | 2012-11-20 | 2016-05-11 | 无锡市威海达机械制造有限公司 | A kind of lead frame structure |
| CN103000606A (en) * | 2012-12-03 | 2013-03-27 | 无锡红光微电子有限公司 | TO-252-3LB lead frame structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206282838U (en) | The integrated encapsulation structure of passive device and active device | |
| CN201904329U (en) | Lead frame | |
| CN104112678B (en) | Manufacturing method for intelligent power module | |
| CN210182373U (en) | Double-base-island multi-chip multi-process packaging structure | |
| CN201629329U (en) | Lead frame | |
| CN207441685U (en) | A kind of new stack type chip packaging structure | |
| CN201699009U (en) | Semiconductor packaging structure | |
| CN208608194U (en) | A kind of semiconductor double-faced packaging structure | |
| CN201732781U (en) | Lead frame | |
| CN207637785U (en) | Novel high-frequency microwave high power limiter welding assembly structure | |
| CN201345361Y (en) | Lead wire frame | |
| CN201345362Y (en) | Lead wire frame | |
| TW201120968A (en) | Package on package method, structure and associated PCB system | |
| CN101826492B (en) | Chip-suspension-type packaging heat dissipation improved structure of semiconductor | |
| CN203536411U (en) | Semiconductor packaging structure | |
| CN110648991B (en) | Adapter plate bonding structure for frame packaged chip and processing method thereof | |
| CN101834163A (en) | Semiconductor flip-chip bonding packaging heat radiation improved structure | |
| CN101834162A (en) | Chip packaging structure and method | |
| CN203026498U (en) | Chip stacked layer packaging structure | |
| CN205319143U (en) | Be packaged with a plurality of audio power amplifier chip's circuit structure | |
| CN208478331U (en) | Lead frame for SOT/TSOT encapsulation | |
| CN201732780U (en) | Packaging radiation modified structure of semiconductor flip chip welding | |
| CN102376666B (en) | A kind of ball grid array package structure and manufacture method thereof | |
| CN206774534U (en) | A kind of dual-channel audio High-power amplifier circuit encapsulating structure | |
| CN208796985U (en) | A kind of semiconductor package structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20171222 |